SPICE MODEL of 2SJ537 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ537 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ537 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ334 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ349 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ349 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ349 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ349 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2410 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2410 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK30A06J3 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK30A06J3 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ537 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ537 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ334 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ334 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ349 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ349 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ349 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ349 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2410 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2410 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK30A06J3 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK30A06J3 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3669 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3905 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3905 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3670 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET and its internal body diode and ESD protection diode. It includes:
1) MOSFET model parameters and simulations of its transconductance, Vgs-Id, Rds(on), gate charge, and capacitance characteristics.
2) Body diode simulations of its forward current, reverse recovery, and I-V characteristics.
3) ESD protection diode simulations of its zener voltage characteristic.
4) Comparisons of measurement and simulation results with low error percentages.
SPICE MODEL of TK30A06J3 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK30A06J3 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6109-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6109-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3911 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3911 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4062LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a MOSFET transistor. It includes:
1) Details of the MOSFET part being modeled, including manufacturer, part number, and model parameters.
2) Results of circuit simulations characterizing key electrical properties of the MOSFET, including transconductance, capacitance, switching time, and forward/reverse current.
3) Comparisons of the simulation results to manufacturer measurements, showing good agreement within a few percent error.
4) Explanations of the evaluation circuits used in the simulations and definitions of recovery time parameters.
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3903 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3863 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage.
2) Simulation results showing characteristics like transconductance, drain current, and capacitance match measurements.
3) A body diode model with simulation of forward current matching measurements.
4) An ESD protection diode model with zener voltage characteristic simulation shown.
SPICE MODEL of 2SK3797 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3797 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6109-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6109-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ650 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage. Simulation results show characteristics like transconductance and switching time match measurements.
2) A body diode model with forward current characteristic matching measurements to within 0.1%.
3) An ESD protection diode zener voltage characteristic in simulation.
SPICE MODEL of 2SJ650 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a power MOSFET and its body diode. It includes:
1) Specifications and parameters for the MOSFET and diode SPICE models.
2) Simulation results comparing measurements and simulations for key characteristics like transconductance, capacitance, switching time.
3) Evaluation circuits used to simulate the characteristics.
4) References and specifications for the models to describe behavior in circuits.
SPICE MODEL of 2SK4063LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4063LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ494 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ494 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3906 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3906 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ657 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes SPICE models for the components in a power MOSFET and ESD protection diode device. It includes:
1) SPICE models and parameters for the power MOSFET, including its transconductance, capacitances, switching times, and body diode characteristics.
2) Simulation results comparing measurements to simulations for various characteristics.
3) SPICE models and parameters for the body diode and ESD protection diode.
4) Simulation results for the diodes' forward and reverse recovery characteristics and zener voltage.
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3669 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3669 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3905 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3905 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3670 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET and its internal body diode and ESD protection diode. It includes:
1) MOSFET model parameters and simulations of its transconductance, Vgs-Id, Rds(on), gate charge, and capacitance characteristics.
2) Body diode simulations of its forward current, reverse recovery, and I-V characteristics.
3) ESD protection diode simulations of its zener voltage characteristic.
4) Comparisons of measurement and simulation results with low error percentages.
SPICE MODEL of TK30A06J3 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK30A06J3 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6109-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6109-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3911 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3911 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4062LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a MOSFET transistor. It includes:
1) Details of the MOSFET part being modeled, including manufacturer, part number, and model parameters.
2) Results of circuit simulations characterizing key electrical properties of the MOSFET, including transconductance, capacitance, switching time, and forward/reverse current.
3) Comparisons of the simulation results to manufacturer measurements, showing good agreement within a few percent error.
4) Explanations of the evaluation circuits used in the simulations and definitions of recovery time parameters.
SPICE MODEL of 2SK3903 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3903 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3863 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage.
2) Simulation results showing characteristics like transconductance, drain current, and capacitance match measurements.
3) A body diode model with simulation of forward current matching measurements.
4) An ESD protection diode model with zener voltage characteristic simulation shown.
SPICE MODEL of 2SK3797 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3797 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3058 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6109-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6109-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ650 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of components in a device, including:
1) A power MOSFET model with parameters such as length, width, threshold voltage. Simulation results show characteristics like transconductance and switching time match measurements.
2) A body diode model with forward current characteristic matching measurements to within 0.1%.
3) An ESD protection diode zener voltage characteristic in simulation.
SPICE MODEL of 2SJ650 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a power MOSFET and its body diode. It includes:
1) Specifications and parameters for the MOSFET and diode SPICE models.
2) Simulation results comparing measurements and simulations for key characteristics like transconductance, capacitance, switching time.
3) Evaluation circuits used to simulate the characteristics.
4) References and specifications for the models to describe behavior in circuits.
SPICE MODEL of 2SK4063LS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4063LS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ494 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ494 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3906 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3906 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ657 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes SPICE models for the components in a power MOSFET and ESD protection diode device. It includes:
1) SPICE models and parameters for the power MOSFET, including its transconductance, capacitances, switching times, and body diode characteristics.
2) Simulation results comparing measurements to simulations for various characteristics.
3) SPICE models and parameters for the body diode and ESD protection diode.
4) Simulation results for the diodes' forward and reverse recovery characteristics and zener voltage.
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ657 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ657 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number, manufacturer, and model parameters.
2) Simulation results of the transistor's transconductance, voltage-current characteristics, gate charge, switching times and other properties.
3) Comparisons of the simulated results with measurement data showing good agreement.
4) Reference curves and evaluation circuits used in the simulations.
SPICE MODEL of TPC6107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6107 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6108 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6108 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ492 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ492 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ438 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a power MOSFET and includes:
1) Component details such as the part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Summaries of simulations and comparisons to measurement data for key MOSFET parameters and characteristics including transconductance, Vgs-Id, switching time, and more.
3) Summaries of simulations and comparisons to measurement data for the body diode's forward current, reverse recovery, and zener voltage characteristics.
4) References and example circuits used in the simulations.
SPICE MODEL of 2SJ654 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ654 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ492 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ492 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ464 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number and manufacturer.
2) Descriptions of the SPICE model parameters used to simulate the MOSFET.
3) Simulation results that compare measurements of the MOSFET's electrical characteristics to the model, such as transconductance, Vgs-Id curve, and switching times.
3) Circuit schematics used to perform the simulations and measure characteristics like output, forward current, and reverse recovery.
SPICE MODEL of 2SJ464 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ464 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ652 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ652 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ494 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ494 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ654 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ654 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
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This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
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The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
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This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-EfficiencyScyllaDB
Freshworks creates AI-boosted business software that helps employees work more efficiently and effectively. Managing data across multiple RDBMS and NoSQL databases was already a challenge at their current scale. To prepare for 10X growth, they knew it was time to rethink their database strategy. Learn how they architected a solution that would simplify scaling while keeping costs under control.
The Microsoft 365 Migration Tutorial For Beginner.pptxoperationspcvita
This presentation will help you understand the power of Microsoft 365. However, we have mentioned every productivity app included in Office 365. Additionally, we have suggested the migration situation related to Office 365 and how we can help you.
You can also read: https://www.systoolsgroup.com/updates/office-365-tenant-to-tenant-migration-step-by-step-complete-guide/
Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!
Introduction of Cybersecurity with OSS at Code Europe 2024Hiroshi SHIBATA
I develop the Ruby programming language, RubyGems, and Bundler, which are package managers for Ruby. Today, I will introduce how to enhance the security of your application using open-source software (OSS) examples from Ruby and RubyGems.
The first topic is CVE (Common Vulnerabilities and Exposures). I have published CVEs many times. But what exactly is a CVE? I'll provide a basic understanding of CVEs and explain how to detect and handle vulnerabilities in OSS.
Next, let's discuss package managers. Package managers play a critical role in the OSS ecosystem. I'll explain how to manage library dependencies in your application.
I'll share insights into how the Ruby and RubyGems core team works to keep our ecosystem safe. By the end of this talk, you'll have a better understanding of how to safeguard your code.
Your One-Stop Shop for Python Success: Top 10 US Python Development Providersakankshawande
Simplify your search for a reliable Python development partner! This list presents the top 10 trusted US providers offering comprehensive Python development services, ensuring your project's success from conception to completion.
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
Fueling AI with Great Data with Airbyte WebinarZilliz
This talk will focus on how to collect data from a variety of sources, leveraging this data for RAG and other GenAI use cases, and finally charting your course to productionalization.
Generating privacy-protected synthetic data using Secludy and MilvusZilliz
During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
5th LF Energy Power Grid Model Meet-up SlidesDanBrown980551
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
-Insightful presentations covering two practical applications of the Power Grid Model.
-An update on the latest advancements in Power Grid -Model technology during the first and second quarters of 2024.
-An interactive brainstorming session to discuss and propose new feature requests.
-An opportunity to connect with fellow Power Grid Model enthusiasts and users.
[OReilly Superstream] Occupy the Space: A grassroots guide to engineering (an...Jason Yip
The typical problem in product engineering is not bad strategy, so much as “no strategy”. This leads to confusion, lack of motivation, and incoherent action. The next time you look for a strategy and find an empty space, instead of waiting for it to be filled, I will show you how to fill it in yourself. If you’re wrong, it forces a correction. If you’re right, it helps create focus. I’ll share how I’ve approached this in the past, both what works and lessons for what didn’t work so well.
AppSec PNW: Android and iOS Application Security with MobSFAjin Abraham
Mobile Security Framework - MobSF is a free and open source automated mobile application security testing environment designed to help security engineers, researchers, developers, and penetration testers to identify security vulnerabilities, malicious behaviours and privacy concerns in mobile applications using static and dynamic analysis. It supports all the popular mobile application binaries and source code formats built for Android and iOS devices. In addition to automated security assessment, it also offers an interactive testing environment to build and execute scenario based test/fuzz cases against the application.
This talk covers:
Using MobSF for static analysis of mobile applications.
Interactive dynamic security assessment of Android and iOS applications.
Solving Mobile app CTF challenges.
Reverse engineering and runtime analysis of Mobile malware.
How to shift left and integrate MobSF/mobsfscan SAST and DAST in your build pipeline.
Discover top-tier mobile app development services, offering innovative solutions for iOS and Android. Enhance your business with custom, user-friendly mobile applications.
Northern Engraving | Nameplate Manufacturing Process - 2024Northern Engraving
Manufacturing custom quality metal nameplates and badges involves several standard operations. Processes include sheet prep, lithography, screening, coating, punch press and inspection. All decoration is completed in the flat sheet with adhesive and tooling operations following. The possibilities for creating unique durable nameplates are endless. How will you create your brand identity? We can help!
"Frontline Battles with DDoS: Best practices and Lessons Learned", Igor IvaniukFwdays
At this talk we will discuss DDoS protection tools and best practices, discuss network architectures and what AWS has to offer. Also, we will look into one of the largest DDoS attacks on Ukrainian infrastructure that happened in February 2022. We'll see, what techniques helped to keep the web resources available for Ukrainians and how AWS improved DDoS protection for all customers based on Ukraine experience
14. Reverse Recovery Characteristic (Body Diode) Reference
Trj= (33.6ns)
Trb= (58.4ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
15. ESD PROTECTION DIODE SPICE MODEL
Zener Voltage Characteristic
Circuit Simulation Result
10mA
9mA
8mA
7mA
6mA
5mA
4mA
3mA
2mA
1mA
0A
0V 5V 10V 15V 20V 25V 30V 35V 40V 45V 50V
I(R1)
V_V1
Evaluation Circuit
R1
0.01m
U20
2SJ537
V1
0Vdc
I1
0Adc
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006