Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the world’s largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between China’s IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is China’s #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. This report will also describe China’s semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese government’s approach to developing China’s IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in China’s fast-growing IC ecosystem, particularly in advanced packaging.
Design optimization of excavator bucket using Finite Element MethodIjripublishers Ijri
An excavator is a typical hydraulic heavy-duty human-operated machine used in general versatile construction operations,
such as digging, ground leveling, carrying loads, dumping loads and straight traction. Normally backhoe excavators
are working under worst working conditions. Due to severe working conditions, excavator parts are subjected to
high loads and must work reliably under unpredictable working conditions. Thus, it is necessary for the designers to
provide not only an equipment of maximum reliability but also of minimum weight and cost, keeping design safe under
all loading conditions.
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the world’s largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between China’s IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is China’s #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. This report will also describe China’s semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese government’s approach to developing China’s IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in China’s fast-growing IC ecosystem, particularly in advanced packaging.
Design optimization of excavator bucket using Finite Element MethodIjripublishers Ijri
An excavator is a typical hydraulic heavy-duty human-operated machine used in general versatile construction operations,
such as digging, ground leveling, carrying loads, dumping loads and straight traction. Normally backhoe excavators
are working under worst working conditions. Due to severe working conditions, excavator parts are subjected to
high loads and must work reliably under unpredictable working conditions. Thus, it is necessary for the designers to
provide not only an equipment of maximum reliability but also of minimum weight and cost, keeping design safe under
all loading conditions.
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
2012 Protection strategy for EOS (IEC 61000-4-5)Sofics
2012 Taiwan ESD and reliability conference
The standard IEC 61000-4-5 is used to characterize IC designs for EOS robustness. Each chip should achieve a minimum level of protection to withstand against EOS. Based on Long TLP and simulation, a strategy is developed to handle this requirement. The methodology has been applied for a T-con product in 130nm CMOS.
PLC and Industrial Automation - Technology OverviewNereus Fernandes
Basic Theory, PLC Types
SCADA-HMI
Drive Control using PLC
Protocols-Modbus, OPC UA
PLC Selection, Programming Guidelines
Industrial Automation Hierarchy
Other Closely Related Controllers and Networks
Safety Instrumented Systems
Building Automation Systems
Substation Automation Systems & Electrical SCADA
DCS (Distributed Control System)
RTU (Remote Terminal Unit)
Machine Vision
Position & Motion Systems
Robotics
CNC Machines
PAC (Programmable Automation Controller)
Emerging Technologies
MQTT Protocol & PLC intergation with (Industrial) IIoT and the Cloud
Assisted / Augmented Reality
Simulation & Virtual Reality
SCADA – support for Pharma Regulations, GeoSCADA
H/w & S/w to build a PLC, HMI and SCADA System
Industrial Cyber Security
Dual Use Technology
The purpose of this report is to provide management with a revised status of the Super Conveyer Belt project. The report is organized by the four phases of the project life cycle which include Defining / Initiating, Planning, Executing, and closing. The first phase, Defining, will incorporate high level activities such as goals, specifications, identifying key tasks, and roles and responsibilities. The second phase, Planning, includes creating schedules, defining budgets, determining resources available and requirements, assessing risks and staffing the team. The third phase, executing, involves the development of status reports, dealing with change, ensuring quality, and forecasting. All activities associated with “closing” will be projections as that phase has not yet occurred. Closure activities include, training the customer, transferring documents, release of resources, evaluations and lessons learned.
Synchronisation and Time Distribution in Modern Telecommunications Networks3G4G
By Sébastien Jobert & Kenneth Hann
The past decade has witnessed a race for networks to provide ever faster communications, interconnecting people via applications used every day by billions of users. Radio spectrum utilisation and synchronisation plays a key role here. But now that Ethernet has won the bandwidth and cost per bit wars, how are base stations being synchronised today?
*** Shared with Permission from ITP Journal Volume 10 | Part 1 - 2016 ***
MEMS microphone Patent Infringement April 2015 report published by Yole Devel...Yole Developpement
MEMS Microphone
Knowles, STMicroelectronics/OMRON, AAC Technologies/Infineon Technologies, InvenSense/Analog Devices
Market growth, challenged leader : patent battle can start
NOW IT’S TIME FOR PATENT BATTLE IN MEMS MICROPHONE BUSINESS
The MEMS Microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. According to Yole Développement, the market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing new players. Knowles is the dominant player with 61% market shares in 2013 and 58% in 2014. A decrease is again expected in the next years with new challengers entering the market: STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies and InvenSense(/ Analog Devices).
The global market share of these 6 players account for more than 80% of MEMS Microphone market in 2014. These players are all developing innovative technical and manufacturing solutions and, in parallel of course, the right patents to protect their inventions.
In a patent infringement action, the potential sales volume plays a major role for assessing the damage award. Thereby, this study is naturally focused on the last MEMS Microphone components supplied by these market leaders and challengers: Knowles (S1157, iPhone 5S/6), ST/OMRON (MP45DT01), AAC/Infineon (SR595, iPhone 5S/6), InvenSense/ADI (ICS-43432).
This raises interesting questions: What are the similarities and the differences in term of technical and manufacturing choices at the devices level? What is the related patent situation? Knowmade (specialized in patent analysis) and System Plus Consulting (specialized in reverse engineering and reverse costing) are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks of patent infringement between Knowles, STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies, Analog Devices and InvenSense in the field of MEMS Microphone. As the MEMS Microphone market is growing very fast, it is the right time now to understand what could happen between these companies and how to differentiate patents and claims compared to the other players.
This report provides an overview of technology data and manufacturing process of S1157, MP45DT01, SR595 and ICS-43432 MEMS Microphone components.
A comparative study of the technology and manufacturing process of these MEMS Microphone components has been performed in order to highlight the technical similarities and differences of the product features.
More information on that report at http://www.i-micronews.com/reports.html
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Team Drone - 2021 Technology, Innovation & Great Power CompetitionStanford University
Technology, Innovation and Great Power Competition,TIGPC, Gordian knot Center, DIME-FIL, department of defense, dod, intlpol 340, joe felter, ms&e296, raj shah, stanford, Steve blank, AI, ML, AI/ML, china, unmanned, autonomy, c3i, command and control
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
2012 Protection strategy for EOS (IEC 61000-4-5)Sofics
2012 Taiwan ESD and reliability conference
The standard IEC 61000-4-5 is used to characterize IC designs for EOS robustness. Each chip should achieve a minimum level of protection to withstand against EOS. Based on Long TLP and simulation, a strategy is developed to handle this requirement. The methodology has been applied for a T-con product in 130nm CMOS.
PLC and Industrial Automation - Technology OverviewNereus Fernandes
Basic Theory, PLC Types
SCADA-HMI
Drive Control using PLC
Protocols-Modbus, OPC UA
PLC Selection, Programming Guidelines
Industrial Automation Hierarchy
Other Closely Related Controllers and Networks
Safety Instrumented Systems
Building Automation Systems
Substation Automation Systems & Electrical SCADA
DCS (Distributed Control System)
RTU (Remote Terminal Unit)
Machine Vision
Position & Motion Systems
Robotics
CNC Machines
PAC (Programmable Automation Controller)
Emerging Technologies
MQTT Protocol & PLC intergation with (Industrial) IIoT and the Cloud
Assisted / Augmented Reality
Simulation & Virtual Reality
SCADA – support for Pharma Regulations, GeoSCADA
H/w & S/w to build a PLC, HMI and SCADA System
Industrial Cyber Security
Dual Use Technology
The purpose of this report is to provide management with a revised status of the Super Conveyer Belt project. The report is organized by the four phases of the project life cycle which include Defining / Initiating, Planning, Executing, and closing. The first phase, Defining, will incorporate high level activities such as goals, specifications, identifying key tasks, and roles and responsibilities. The second phase, Planning, includes creating schedules, defining budgets, determining resources available and requirements, assessing risks and staffing the team. The third phase, executing, involves the development of status reports, dealing with change, ensuring quality, and forecasting. All activities associated with “closing” will be projections as that phase has not yet occurred. Closure activities include, training the customer, transferring documents, release of resources, evaluations and lessons learned.
Synchronisation and Time Distribution in Modern Telecommunications Networks3G4G
By Sébastien Jobert & Kenneth Hann
The past decade has witnessed a race for networks to provide ever faster communications, interconnecting people via applications used every day by billions of users. Radio spectrum utilisation and synchronisation plays a key role here. But now that Ethernet has won the bandwidth and cost per bit wars, how are base stations being synchronised today?
*** Shared with Permission from ITP Journal Volume 10 | Part 1 - 2016 ***
MEMS microphone Patent Infringement April 2015 report published by Yole Devel...Yole Developpement
MEMS Microphone
Knowles, STMicroelectronics/OMRON, AAC Technologies/Infineon Technologies, InvenSense/Analog Devices
Market growth, challenged leader : patent battle can start
NOW IT’S TIME FOR PATENT BATTLE IN MEMS MICROPHONE BUSINESS
The MEMS Microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. According to Yole Développement, the market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing new players. Knowles is the dominant player with 61% market shares in 2013 and 58% in 2014. A decrease is again expected in the next years with new challengers entering the market: STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies and InvenSense(/ Analog Devices).
The global market share of these 6 players account for more than 80% of MEMS Microphone market in 2014. These players are all developing innovative technical and manufacturing solutions and, in parallel of course, the right patents to protect their inventions.
In a patent infringement action, the potential sales volume plays a major role for assessing the damage award. Thereby, this study is naturally focused on the last MEMS Microphone components supplied by these market leaders and challengers: Knowles (S1157, iPhone 5S/6), ST/OMRON (MP45DT01), AAC/Infineon (SR595, iPhone 5S/6), InvenSense/ADI (ICS-43432).
This raises interesting questions: What are the similarities and the differences in term of technical and manufacturing choices at the devices level? What is the related patent situation? Knowmade (specialized in patent analysis) and System Plus Consulting (specialized in reverse engineering and reverse costing) are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks of patent infringement between Knowles, STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies, Analog Devices and InvenSense in the field of MEMS Microphone. As the MEMS Microphone market is growing very fast, it is the right time now to understand what could happen between these companies and how to differentiate patents and claims compared to the other players.
This report provides an overview of technology data and manufacturing process of S1157, MP45DT01, SR595 and ICS-43432 MEMS Microphone components.
A comparative study of the technology and manufacturing process of these MEMS Microphone components has been performed in order to highlight the technical similarities and differences of the product features.
More information on that report at http://www.i-micronews.com/reports.html
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Team Drone - 2021 Technology, Innovation & Great Power CompetitionStanford University
Technology, Innovation and Great Power Competition,TIGPC, Gordian knot Center, DIME-FIL, department of defense, dod, intlpol 340, joe felter, ms&e296, raj shah, stanford, Steve blank, AI, ML, AI/ML, china, unmanned, autonomy, c3i, command and control
כמדי שנה, מחלקת מחקר אסטרטגי מסכמת את פסטיבל קאן בשנה החולפת.
המצגת מסכמת את הזכיות המרכזיות והבולטות השנה, בחלוקה לטרנדים שאפיינו את פעילותן השיווקית והפרסומית של החברות והמותגים המובילים בעולם.
במסגרת הרצאה שהעברנו בפורום השיווק של אחד מלקוחותינו הגדולים, התבקשנו לענות על הסוגיה האם פלטפורמות Crowdsourcing משמשות כלי יעיל לעסקים או שמא מדובר בגימיק שיווקי.
לקחנו את המצגת המקורית, שדרגנו אותה בדוגמאות נוספות ועדכניות ועל מנת "להוריד אותה אל קרקע המציאות", ייצרנו מודל/ כלי קונספטואלי שנועד להמחיש את היחס שקיים בין השקעה במשאבי החברה אל מול המשאבים ש'השותפים' בפלטפורמות משקיעים בכל אחד מהשלבים בשרשרת הערך.
מדריך להפצה ושיווק אפליקציה חינמית ב-3 שלביםJonathan Raveh
פיתחתם אפליקציה חדשה? ברכות! ומה עכשיו? עולם התוכן ושיווק האפליקציות הוא עולם גדול וסבוך, וההתמצאות בו נעשית קשה יותר ככך שעובר הזמן וכמות האפליקציות גדלה
המדריך לשיווק אפליקציה ייתן לכם מספר כללים וטיפים שיעזרו לכם לייצר את התוכן הנכון בחנויות היישומים ובשלב השני גם לשווק את האפליקציה שלכם בעזרת הכלים הנכונים ובהתאם לתקציב העומד ברשותכם
בהצלחה
יונתן רוה
הספר הזה מיועד לך:
• איש השיווק המתחיל או זה המתקדם שמעוניין לעשות סדר במחשבות….
• לבעל העסק, שמרגיש שמהפיכת השיווק באינטרנט מתנהלת בלעדיו
באמצעות הספר תוכלו להבין כי:
• השיווק החדש הוא בעל מאפיינים ייחודיים שיש להבינם ולנצלם לטובת העסק;
• הכנת תוכנית אסטרטגית לשיווק דיגיטלי היא הכרח אם רוצים הכנסות משמעותיות במינימום הוצאות;
• הבחירה הנכונה בערוצי השיווק, בהתאם למחזור החיים של הלקוח הינה קריטית;
• בכל ערוצי השיווק נדרשת הבנה מעמיקה, מומחיות והתמקצעות אך המדיה החברתית הינה ייחודיות – אך ניתן ללמוד כיצד לבחור את הרשתות החברתיות המתאימות ביותר.
הספר כולל את כל אלה ויספק לכם כלים והשראה כיצד להרוויח יותר משיווק דיגיטלי
המחקר מדגים את המגמות המרכזיות בשיווק דיגיטלי, וכיצד חברות מתאימות את השיווק שלהן לעידן הדיגיטלי המתחדש תדיר. גם בשנת 2016 משחק ה-Big Data תפקיד עצום בשיווק הדיגיטלי, וביכולתו לספר לנו כמעט הכל על הצרכנים שלנו – מי הם, מה מעניין אותם, מה הם אוהבים לקנות, לעשות או שתות, היכן הם נמצאים ועם מי. יתרה מזאת, למרות רצון הצרכנים לשמור על פרטיותם, הם נכונים למסור פרטים שיסייעו לחברות לפנות אליהם באופן מותאם אישית, כי הם מאמינים שהדבר יניב להם תועלת מוחשית.
כיום, יותר מתמיד, הכל מתקיים במקביל – 79% מהאנשים משתמשים ביותר ממכשיר אחד במהלך פעילות מקוונת, כשהשימוש באפליקציות וברשתות חברתיות לצורך שליחת וקבלת הודעות הולך וגדל ומייצר פלח משתמשים משמעותי. יישומים של טכנולוגיות מתרחבים גם לתחומים חדשים, דוגמת טכנולוגיות מבוססות מיקום המשמשות, נוסף לשיווק, גם לצרכים תפעוליים ומתן שירות.
למרות היתרונות העצומים בשימוש מקביל בערוצים שונים, משתמשים רבים חווים תסכול בשל היעדר סינכרון, והחברות צריכות לייצר מנגנון יעיל ומתואם היטב בין כל המכשירים והערוצים על-מנת לספק לצרכנים חוויה רציפה ואחידה. בנוסף, חברות רבות מבינות את חשיבות הנוכחות בערוצים שונים במקביל, ורובן מתכננות לקיים קמפיינים חוצי-ערוצים שישולבו במדיה חברתית, במיילים ובאפליקציות מובייל.
טכנולוגיות המציאות המדומה, המציאות הרבודה וטכנולוגיות מבוססות המיקום, מוסיפות להתפתח ולהגדיל את נוכחותן במרחב הדיגיטלי והפיסי, מתוך הבנה שצרכן שנמצא בחנות פיזית, עדיין נוכח גם במרחב הדיגיטלי. שימוש נכון בטכנולוגיות אלו יעניק לצרכן חוויה יוצאת דופן אשר תשפר את תדמית המותג בעיניו, אולם גם כאן חשוב להגדיר היטב מה מטרת השימוש בטכנולוגיות הללו ומי קהל היעד שאליו הן מכוונות.
כדי לדעת מה צופן העתיד, כדאי לבחון את בני דור המילניום, שהיו הראשונים לאמץ טכנולוגיות ומגמות אשר אומצו בהמשך גם בקרב קהלים נוספים. דוגמא בולטת לכ
מה הם המושגים הרלוונטיים והטכנולוגיות הקשורות לניתוח הנתונים. ההתמקדות של הפרק הזה הוא על תחומי היישום של כלכלת הממשקים
הבנקים יכולים למלא תפקיד מרכזי באיסוף, הגנה, שיתוף וניתוח נתונים בצורה מאובטחת ויעילה במערכת אקו-פיננסית "פתוחה".
הבנקים לא יכולים לבצע תהליכים אלו לבד אלא בעזרת מיזמים מובילים בתחום.