Kensington Labs 300mm single-arm atmospheric wafer handling robot, part of the Multilink robot family, is designed to meet the industry’s most rigorous 300mm performance standards. The Multilink Single Arm robot incorporates a host of unique, proprietary design features which combine to provide unsurpassed reliability, superior performance, and high throughput.

1. Kensington Laboratories’ 300mm single arm atmospheric wafer handling
robot, part of the MultiLink™ robot family, is designed to meet the
industry’s most rigorous 300mm performance standards. The MultiLink
Single Arm robot incorporates a host of unique, proprietary design features
which combine to provide unsurpassed reliability, superior performance,
and high throughput. Kensington Laboratories, a leader in advanced
robotics technology, is committed to developing and manufacturing the
highest quality and most cost effective atmospheric robots
in the industry – all backed by Kensington Laboratories’
global service and support network.
• Automated Self Teach™: The patented Automated Self Teach feature
reduces time required to bring systems online and provides faster time to
production ramp.
• High Throughput: Continuous rotation (i.e. no dead-zones) translates to
short, discrete theta moves less than 180 degrees, which significantly
increases throughput.
• Accurate Wafer Placement: High performance design provides precise
motion control and eliminates structural deflection and creep. All robot axes
are guided by preloaded bearings mounted on monolithic frames machined
from single ingots of highly stable aircraft-quality aluminum.
• Cleanliness: Patented edge grip technology provides better than ISO Class
1 particle performance. In addition, the side-mounted MultiLink robot,
combined with Kensington Laboratories’ side-mounted MultiLink robot track,
maximizes the exhaust opening of the equipment front end module allowing
uniform air flow from the fan filter unit through the perforated fab floor.
• High Reliability: The MultiLink robot achieves industry-leading MCBF
by employing direct-drive DC servo motors with real time force feedback and
non-contacting glass scale encoders that monitor actual drive train output.
• Precise Wafer Mapping: High performance through-beam wafer mapping
allows fast, accurate wafer detection.
• Zero Preventative Maintenance: Superior precision design requires no
periodic lubrication or adjustments under standard operating conditions.
MultiLink™
Robot
300mm Single Arm
Atmospheric Wafer Handling Robot
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2. DS-02032
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FM27207
Key Features
• Patented edge grip technology
• Patented Automated Self Teach
• Through-beam wafer mapping
• Advanced wafer cassette error detection
• Direct drive technology
• Continuous rotation
• State-of-the-art motion control
• Off center pick and place
• Machine tool quality construction
• High resolution optical encoders on all axes
• Reduced wear Z axis counter balance
Options
• 4th axis: supinator wafer flipper
• Vacuum end effectors (200mm and 300mm)
• Reflective mappers
• E-diagnostics with GUI
MultiLink Single Arm
with supinator
wafer flipper
Specifications are subject to change without notice.
Key Patents
• Robot Arm with Specimen Edge Gripping End
Effector, 6256555
• Robot Arm with Specimen Sensing and Edge
Gripping End Effector, 6275748
• Self-Teaching Robot Arm Position Method, 6360144
• Self-Teaching Robot Arm Position Method to
Compensate for Support Structure Component
Alignment Offset, 6366830
MultiLinkTM
Robot
Repeatability
Radial axis ±0.001" (±0.025 mm)
Theta axis ±0.01 degrees
Z axis ±0.001" (±0.025 mm)
Maximum Velocity
Radial axis 34 inches/sec (0.86 m/sec)
Theta axis 1000 degrees/sec
Z axis 24 inches/sec (0.46 m/sec)
Maximum Acceleration
Radial axis 400 inches/sec2 (10.16 m/sec2)
Theta axis 5000 degrees/sec2
Z axis 80 inches/sec2 (2.03 m/sec2)
Range of Motion
Radial axis Two links at 7.00" (177.80 mm), or three links at
5.25"-10.5"-5.25" (133.35 mm x 266.70 mm x 133.35 mm)
Theta axis Continuous
Z axis 14.25", 17.25", 20.25" (361.95 mm, 438.15 mm, 514.35 mm)
Reliability
MCBF 10 million cycles
Configurability
Single arm (3 axis) Standard
Single arm (4 axis) Supinator wafer flipper available
Arms (lengths) Two links at 7.00", or three links at 5.25"-10.5"-5.25"
(133.35 mm x 266.70 mm x 133.35 mm)
Compliance
S2 S2-93A
General Specifications
Maximum Z axis load 8 lbs (3.63 kg)
Z drop (distance and time) With vacuum <1 mil; without vacuum <7 mils
Cleanliness ISO Class 1
Weight Robot: 85 lbs (38.64 kg); Controller: 19 lbs (8.64 kg)
Vacuum required 10 l/min at 635 mm Hg (25 SCFH at 25" Hg)
Power required 100-220 VAC 47-63 Hz (600W PS)
Mapper Through-beam standard; reflective optional
Communications RS232, IEEE-488, or Device Net™
Mounting Specifications
Overall dimensions Robot can diameter: 9.72" (246.89 mm); robot hole diameter:
10.00" (254 mm)
Robot mounting type Side or top mount
Bolt pattern Top mount: 3 x 1/4-20 x 0.50" DP equally spaced on a
10.375" (263.53 mm) bolt circle
Minimum swept radius Wafer radius + end effector length + 1.175" (29.86 mm)
End effector 6 x #2-56 on a 1.625" (41.28 mm) bolt circle
Through-beam
wafer mapping
Specifications
300mm Single Arm
Atmospheric Wafer Handling Robot
510-620-0235 ext 718 or visit www.kensingtonlabs.com
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