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Design of gamma cleanroom compatible robots for wafer and mask handling in semiconductor industry

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Slide Share VDesign New robots

  1. 1. VDesign OEM SystemsAtmospheric wafer transfer robots ATR-300 SeriesDesign descriptionBased on detailed analysis of latest developments insemiconductor automation and robotics, the design ofatmospheric wafer handling robots ATR-300 series combinessimplicity and components with proven reliability andperformance with completely new modular concept to create anadvanced modular robot design that outperforms competition inthroughput, reliability, repeatability and cleanliness. Theseinnovative handling solutions are designed to handle wafers andmasks and feature extremely high precision and combinesreliability and performance.Robots from ATR-300 series utilize low inertia, quick responsebrushless servomotors coupled with zero-backlash HarmonicDrive® gear reducers and absolute encoders. The controllerassures accurate motion profiling along multiple path segments.The robot designs ATR-300 series meet or even exceedexpectations for wafer handling throughput and reliability. Themodular design concept guarantees a maximum of flexibility andcapability. Robot base is designed with fewer parts to improvereliability. The backbone frame design provides increasedstiffness and flexible mounting. Brushless DC motors eliminatebrush wear and assure higher MTBF. Its arm is made fromsingle piece cast aluminum housings. Direct-coupled drive armsystem provides better repeatability and independence of axescontrol. Advanced arm design assures superior planarity,stiffness, extended reach and motion flexibility by using ofadditional wrist axis, an end-effector exchanger, integrated laserwafer mapping, etc. The innovative robot design is ISOcleanroom class 3 compatible.Robots from ATR-300 series are designed with different radialreach capabilities. Standard is two-link 200-200 mm arm,making total available reach equal to 650 mm plus end-effectorlength. If longer reaches are required, three-link arm 150-300-150 mm with 600 mm reach is available. Standard Z-axisvertical travel is 340 mm. Also strokes of 188, 254 and 425 mmare available.Features• ISO class 3 cleanroom compatible design• Increased reliability, repeatability and enhanced kinematicparameters (speed, accelerations etc.)• High MTBF and low MTTR• Extended motion ranges in comparison with other competitiverobots• Modular construction for ease of maintenance• Brushless AC servomotors• Absolute or incremental encoders• Better performance and dynamic behavior• Full independence of axes control• Possibility for attachment of normal or heavy duty robot arm(for different applications)• Possibility for additional wrist (yaw) axis• Possibility for end effector exchanger mounting• Robot layout dimensions allowing possibility for “drop-in”replacement of competitive products• Integrated motion controller, servo-amplifier and power supplywithin the robot body
  2. 2. Applications • Wafer handling systems such as EFEM’s, wafer sorters, wafer packers etc. • Reticle (photomask) handling systems • Small glass, solar, FPD and LCD panels handling systems Options • Two-link or three-link robot arm • Vacuum or edge grip endeffectors • Independent wrist (Yaw) axis • External controller and interconnecting cabling Specifications Cleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E) Payload Max. 1.0 kg (heavy duty arm 3.0 kg )* Motion range Z axis 340 mm (200, 280, 440 mm) Motion range T axis 380° (no dead zone)** Motion range R axis ±400 mm (±600 mm) Repeatability Z axis ±0.05 mm Repeatability T axis ±0.1° Repeatability R axis ±0.05 mm Speed Z axis 300 mm/sec Speed T axis 360° /sec Speed R axis 1600 mm/sec Throughput 4 sec/wafer MTBF More than 50,000 hours MTTR < 2h Weight 28.5 kg (30.5 kg) Wafer presence sensing By vacuum sensor Wafer mapping sensor Laser (optionally) Power supply AC 110/230 V 50/60 Hz *** Vacuum Requirements 0.9 bar 2 l/minNote : * by reduced speed and acceleration ** motion range expandable up to 600° continuous rotation *** optionally 48 VDC (by using of external controller and supply) Layout drawings Two-link arm Three-link arm
  3. 3. VDesign OEM Systems Robot ATR-300/2LAtmospheric wafer transfer robotDesign elementsBased on detailed analysis of latest developments insemiconductor automation and robotics, the design ofatmospheric wafer handling robot ATR-300/2L combinessimplicity and components with proven reliability andperformance with completely new modular concept to create anadvanced modular robot design that outperforms competition inthroughput, reliability, repeatability and cleanliness. Theseinnovative handling solutions are designed to handle wafers andmasks and feature extremely high precision and combinesreliability and performance.ATR-300/2L robot is designed with low inertia, quick responsebrushless servomotors coupled with zero-backlash HarmonicDrive® gear reducers and absolute encoders. The controllerassures accurate motion profiling along multiple path segments.The ATR-300/2L robot design meets or even exceedsexpectations for wafer handling throughput and reliability. Themodular design concept guarantees a maximum of flexibility andcapability. Robot base is designed with fewer parts to improvereliability. The backbone frame design provides increasedstiffness and flexible mounting. Brushless DC motors eliminatebrush wear and assure higher MTBF. Its arm is made fromsingle piece cast aluminum housings. Direct-coupled drive armsystem provides better repeatability and axes controlindependence. Advanced arm design provides superiorplanarity, extended reach and flexibility using an end-effectorexchanger, integrated laser wafer mapping, additional wrist axisetc. The innovative robot design is ISO cleanroom class 3compatible.Standard design features two-link 200-200 mm arm, makingtotal available reach equal to 650 mm plus end-effector length.Z-axis standard vertical travel is 340 mm (extendable to 440mm).Features• Clean room compatible robot design• Increased reliability, repeatability and enhanced kinematicparameters (speed, accelerations etc.)• High MTBF and low MTTR• Extended motion ranges in comparison with other competitiverobots• Modular construction for ease of maintenance• Better performance and dynamic behavior• Full independence of axes control• Possibility for attachment of normal or heavy duty robot arm(for different load applications)• Possibility for additional wrist (yaw) axis• Possibility for end effector exchanger mounting• Robot layout dimensions allowing possibility for “drop-in”replacement of competitive products• Absolute or incremental encoders• Independent wrist (Yaw) axis• Integrated motion controller, servo-amplifier and power supplywithin the robot body• Optionally external controller and interconnecting cabling
  4. 4. Applications • Wafer handling systems such as EFEM’s, wafer sorters, wafer packers etc. • Reticle (photomask) handling systems. • Small glass, solar, FPD and LCD panels handling systems. Specifications Cleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E) Payload Max. 1.0 kg (heavy duty arm 3.0 kg ) * Motion range Z axis 340 mm (200, 280, 440 mm) Motion range T axis 380° (no dead zone) ** Motion range R axis ±400 mm Repeatability Z axis ±0.05 mm Repeatability T axis ±0.1° Repeatability R axis ±0.05 mm Speed Z axis 300 mm/sec Speed T axis 360° /sec Speed R axis 1600 mm/sec Throughput 4 sec/wafer MTBF More than 50,000 hours MTTR < 2h Weight 28.5 kg (30.5 kg) Wafer presence sensing By vacuum sensor Wafer mapping sensor Laser (optionally) Power supply AC 110/230 V 50/60 Hz *** Vacuum Requirements 0.9 bar 2 l/minNote : * by reduced speed and acceleration ** motion range expandable up to 600° continuous rotation *** optionally 48 VDC (by using of external controller and supply) Layout drawing ATR-3002L
  5. 5. VDesign OEM SystemsAtmospheric wafer transfer robot Robot ATR-300/3LDesign elementsBased on detailed analysis of latest developments insemiconductor automation and robotics, the design ofatmospheric wafer handling robot ATR-300/3L combinessimplicity and components with proven reliability andperformance with completely new modular concept to create anadvanced modular robot design that outperforms competition inthroughput, reliability, repeatability and cleanliness. Theseinnovative handling solutions are designed to handle wafers andmasks and feature extremely high precision and combinesreliability and performance.ATR-300/3L robot is designed with low inertia, quick responsebrushless servomotors coupled with zero-backlash HarmonicDrive® gear reducers and absolute encoders. The controllerassures accurate motion profiling along multiple path segments.The ATR-300/3L robot design should meet or even exceedexpectations for wafer handling throughput and reliability. Themodular design concept guarantees a maximum of flexibility andcapability. Robot base is designed with fewer parts to improvereliability. The backbone frame design provides increasedstiffness and flexible mounting. Brushless DC motors eliminatebrush wear and assure higher MTBF. Its arm housings aremade from single piece cast aluminum. Direct-coupled drivearm system provides better repeatability and axes controlindependence. Advanced arm design provides superiorplanarity, extended reach and flexibility using an end-effectorexchanger, integrated laser wafer mapping, additional wrist axisetc The innovative robot design is ISO cleanroom class 3compatible (class 1 at FED 209E).ATR-300/3L is designed with extended radial reach capabilities.Its three-link arm 150-300-150 mm assures total available reach600 mm plus end-effector length.Z-axis standard vertical travel is 340 mm (extendable to 440mm).Features• Clean room compatible robot design• Increased reliability, repeatability and enhanced kinematicparameters (speed, accelerations etc.)• High MTBF and low MTTR• Extended motion ranges in comparison with other competitiverobots• Modular construction for ease of maintenance• Better performance and dynamic behavior• Full independence of axes control• Possibility for attachment of normal or heavy duty robot arm(for different load applications)• Possibility for additional wrist (yaw) axis• Possibility for end effector exchanger mounting• Robot layout dimensions allowing possibility for “drop-in”replacement of competitive products• Absolute or incremental encoders• Independent wrist (Yaw) axis• Integrated motion controller, servo-amplifier and power supplywithin the robot body• Optionally external controller and interconnecting cabling
  6. 6. Applications • Wafer handling systems such as EFEM’s, wafer sorters, wafer packers etc. • Reticle (photomask) handling systems. • Small glass, solar, FPD and LCD panels handling systems. SpecificationsCleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E)Payload Max. 1.0 kg (heavy duty arm 3.0 kg ) *Motion range Z axis 340 mm (200, 280, 440 mm)Motion range T axis 380° (no dead zone) **Motion range R axis ±600 mmRepeatability Z axis ±0.05 mmRepeatability T axis ±0.1°Repeatability R axis ±0.05 mmSpeed Z axis 300 mm/secSpeed T axis 360° /secSpeed R axis 1600 mm/secThroughput 4 sec/waferMTBF More than 50,000 hoursMTTR < 2hWeight 28.5 kg (30.5 kg)Wafer presence sensing By vacuum sensorWafer mapping sensor Laser (optionally)Power supply AC 110/230 V 50/60 Hz ***Vacuum Requirements 0.9 bar 2 l/minNote : * by reduced speed and acceleration ** motion range expandable up to 600° continuous rotation *** optionally 48 VDC (by using of external controller and supply) Layout drawing ATR-3003L
  7. 7. VDesign OEM SystemsDual arm wafer transfer robot ADTR-300 SeriesDesign elementsBased on detailed analysis of latest developments insemiconductor automation and robotics, the design ofatmospheric wafer handling robot ADTR-300 combinessimplicity and components with proven reliability andperformance with completely new modular concept to create anadvanced modular robot design that outperforms competition inthroughput, reliability, repeatability and cleanliness. Thisinnovative handling solution is designed to handle wafers andmasks and feature extremely high precision and combinesreliability and performance.The ADTR-300 robot design meets or even exceedsexpectations for wafer handling throughput and reliability. Themodular design concept guarantees a maximum flexibility andcapability. Robot base is designed with fewer parts to improvereliability. The backbone frame design provides increasedstiffness and flexible top or bottom mounting. Brushless motorseliminate brush wear and assure higher MTBF. Direct-coupledarm drive system provides better repeatability. Advanced armdesign provides superior planarity and flexibility using flipmodules, integrated laser wafer mapping. The innovative robotdesign is ISO cleanroom class 3 compatible. It can be easilyattached to track system in top-mounted or bottom mountedconfiguration.Robot ADTR-300 is designed with standard arms 200-200 mm,making total available reach equal to 600 mm with end-effectorlength. Z-axis vertical travel standard is 340 mm. It can beextended to 440 mm.Features• Clean room compatible design• Increased reliability, repeatability and enhanced kinematicparameters (speed, accelerations etc.)• High MTBF and low MTTR• Extended motion ranges in comparison with other competitiverobots• Modular construction for ease of maintenance• Top or bottom mounted• Better performance and dynamic behavior• Full independence of axes control• Fast wafer swap• Possibility for attachment of flip modules on both of arms• Robot layout dimensions allowing possibility for “drop-in”replacement of competitive products• Absolute or incremental encoders• Integrated motion controller, servo-amplifier and power supplywithin the robot body• Optionally external controller and interconnecting cabling
  8. 8. Applications • Wafer handling systems such as EFEM’s, high throughput wafer sorters, wafer packers etc. • Reticle (photomask) handling systems. SpecificationsCleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E)Payload Max. 2.5 kg *Motion range Z axis Standard 340 mm (extended 440 mm)Motion range T axis 380° (no dead zone) **Motion range R1 axis ± 400 mmMotion range R2 axis ± 400 mmRepeatability Z axis ± 0.05 mmRepeatability T axis ± 0.1°Repeatability R axes ± 0.05 mmSpeed Z axis 400 mm/secSpeed T axis 360° /secSpeed R axes 1600 mm/secThroughput 4 sec/waferMTBF More than 40,000 hoursMTTR < 2hWeight 36.5 kgWafer presence sensing By vacuum sensorWafer mapping sensor Optionally on lower armPower supply AC 110/230 V 50/60 Hz ***Vacuum Requirement 0.9 bar 2 l/minNote : * by reduced speed and acceleration ** expandable to 600° continuous rotation *** optionally 48 VDC (by using of external controller and supply) Layout drawing
  9. 9. VDesign OEM Systems End-effector exchangerEnd-effector exchanger for wafer transfer robotsDesignFor realization of different process or control operations insemiconductor manufacturing sometimes is necessarywafer handling robot to be equipped with more than oneend-effector. Typical applications are using the samerobot for 200 mm and 300 mm wafer handling (by bridgetools) or handling of cold and hot wafers with the samerobot, carrying of different sizes of masks and maskadapters etc. One of possible solutions is usage of end-effector exchanger. End-effector exchanger givespossibility for changing of peripherals at the same robotinterface. Such of device assures enhancement of therobot flexibility and significantly increases robotmanipulating possibilities.The end-effector exchanger has unique cleanroomcompatible design. It assures high reliability and safetydue to unique fail-safe-locking mechanism. Specialkinematic coupling gives high positional repeatability ofexchanged end-effectors or other attached peripherals.Features• ISO class 3 cleanroom compatible design• High reliability• High safety due to fail-safe locking mechanism• High positional repeatability (±0.025 mm)• Actuated with vacuum only (no supply sourceenvironment contamination)• Allows transmission of several different power media toend-effector at the same time (air pressure, vacuum,electrical signals)• Low exchanger height and small footprint.• Simple design, all moving parts are closed (no airbornecontamination)• Allows at the same time attachment of different types ofend-effectors (vacuum holding end-effector and edgegripping end-effector, pneumatically or electrically driven)• Allows manipulation of different wafer dimensions withthe same robot• Fast lock/unlock operation and reliable end-effectorholding• Ease for control and operation.• Reliable sensing of holding status by means ofproximity sensor• High MTBF and low MTTR• Assures end-effector exhaust line when needed
  10. 10. Standard interface (power sources) transmitted viaexchanger• Pressure ………………………………… up to 3.2 bar• Vacuum ……………………..………….. up to 2.4 l/min• Electrical signals ……………………….. up to 12 linesSpecifications Cleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E) Lock/Unlock Time 0.5 seconds Vacuum 0.8 bar (exchanger actuation) Power 24V DC ±5% (proximity sensor) Power transmitted 24V DC 3A max. Vacuum transmitted 2.0 l/min (end-effector exhaust line) Air pressure transmitted (up to 3.0 bar) MTBF 100,000 cycles MTTR < 1h Weight 0.52 kg Power supply 24 V DC (Presence sensor) Vacuum exhaust line 2 l/min at 0.9 bar Overall dimensions
  11. 11. VDesign OEM SystemsHigh vacuum compatible wafer transfer robot VTR-300 Vacuum Robot VTR-300Design elementsNewly developed vacuum robot design VTR-300 is a significantadvancement in vacuum compatible R-Theta-Z robot designand architecture.The robot should offers superior reliability and precision. The -6innovative design is UHV compatible to 10 Torr. By choosingcomponents with proven performance, and combined them witha completely new driving concept to create a vacuum robotdesign that outperforms others in reproducibility, reliability,stiffness, and throughput.Benefiting from the technological advances of todayscomponents, the VTR-300 robot utilize fast, quick responsezero-backlash DC Harmonic Drive® actuators enabled withincremental or absolute encoders. The controller assuresaccurate fast and smooth motion.VTR-300 robot is designed with standard two-link arm 200-200mm, making total available reach equal to 650 mm (plus end-effector length). Vertical travel is 25 mm. Additional optionsinclude extended vertical travel (up to 50 mm) and advancedvacuum compatible edge grip end-effector.Features• UHV compatible robot design• High reliability and repeatability, performance and dynamicbehavior.• Modular construction for ease of maintenance• Full independence of axes control• High MTBF and low MTTR• Coaxial ferrofluidic seal and metal bellow• Possibility for attachment of normal or heavy duty robot arm(for different payload applications)• Absolute or incremental encoders• External controller and interconnecting cabling
  12. 12. Applications• Mid-size vacuum chambers• High speed wafer transferOptions• Absolute encoders• Advanced design of edge grip end-effector enable to work inhigh vacuum environmentTechnical Specifications -8UHV compatibility Up to 10 TorrPayload 2.5 kg (heavy duty arm 5.0 kg )Motion range Z axis 25 mm (50 mm)Motion range T axis 380° *Motion range R axis ±400 mm (±500 mm)Repeatability Z axis ±0.020 mmRepeatability T axis ±0.01°Repeatability R axis ±0.025 mmSpeed Z axis 250 mm/secSpeed T axis 360° /secSpeed R axis 1200 mm/secThroughput 4 sec/waferMTBF 25,000 hoursMTTR < 2hWeight 24.5 kgPower supply AC 110/230 V **Note : * expandable to 900° continuous rotation ** optionally 24 V DC (by using of external supply) Layout drawing V-Design OEM Systems Tel. (+49) 6142 2200030 E-mail: v.design@mail.bg http://www.vdesign.bg Dipl. Eng. Vesselin Dantchev Cell. (+49) 162 8876400 vdantchev@mail.bg

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