This document discusses the challenges of high performance testing, including increasing reliability requirements, broader temperature ranges, higher currents, and parallel test formats. It introduces a test-in-tray format using a compliant thermal contact, high conductivity materials to transfer fluid, and uniform contact pressure to provide rapid thermal response and controlled environmental testing of semiconductor devices in parallel configurations. A mini-chamber seals each tray to form an isolated test environment while flexible frames allow independent thermal control at each device under test.

1. High Performance Testing in
Test-in-Tray Formats
Thomas Di Stefano
Centipede Systems
2012 BiTS Workshop
March 4 - 7, 2012

2. Challenges in High Performance Test
• Increasing Reliability
• Broader Temperature Ranges
• Higher Currents
• Parallel Test
• Bare Die Formats (WLP, KGD, TSV, …)
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3. Test Engineering is Stretched in all Directions
Test Complexity
Faster Indexing Thermal Management
Finer Pitch Higher Current
Higher Power Increasing
COST!!! Parallelism
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4. Soooo … What’s the Problem?
Get Power into and out of the Chip
• Hot Spots
• Extreme Test Temperatures
• Power Variations
• Test Time
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5. Biggest Challenge -> Thermal
Set Temperature Accurately Across Chip
• Mechanically Compliant Contact
• Low Thermal Resistance to Ambient
• Fast Response to Set and Maintain Temperature
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6. Penalty for Failure
Normal Scatter
Yield Loss Hot Spot Scatter
• 15⁰C Shifts Timing1 by 15% Yield Loss
Test Escapes
• Field Failures P(f)

Low ATE Utilization
• Major Component of Test Cost fC f
1. Andrew Yang, TSMC EDN Sept /2005
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7. Objectives
 Compliant Thermal Contact
 High Conductivity to Transfer Fluid
 Uniform Contact Pressure
 Rapid Thermal Response
 Controlled Environment
 Parallel Test Configurations
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8. Compliant Thermal Contact
50
W/ ⁰C-cm2 40
30
0.05 ⁰C -cm2/W
20
Thermode 10
Chip 0
Gap 0 0.5 1
(µm) Gap (µm)
Mechanical Compliance Minimizes Gap
• Chip Warp
• Particles or Contamination
• Surface Irregularities
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9. Compliant Thermal Contact
Compliant Membrane
Thermode Module*
• Thin Metal Membrane
• Dry Contact Surface
• No Residue
• Compliant to ±50 µm
* Patents Issued and Pending
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10. High Conductivity to Transfer Fluid
Thermal Resistance 0.05 ⁰C–cm2 / Watt*
• Minimum Path to Transfer Fluid
• Power to 200 Watts / cm2
* In He Ambient
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11. High Conductivity to Transfer Fluid
Fluid Compatibility
• All Metal Construction
• Fluorocarbon Seals
• Fluid Pressure to 150 psig
• Temperature Range -65⁰C to +160⁰C
• Liquid or Gas Transfer Fluid
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12. Uniform Pressure
Manifold
Thermode
Pneumatically Actuated Thermode
• Clamping Action over a 0.5mm Range
• Gimbal Action of Active Thermode Element
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13. Uniform Pressure
80
DUT in Clamp 60
DUT (psi)
40
• Uniform Pressure
20
• Computer Controlled (with regulator) 0
0 20 40 60 80
CDA (psi)
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14. Rapid Thermal Response
Response Time
• Rapidly Switched Fluid Flow
• Total Heat Capacity < 0.45 J / ⁰C
• Short Thermal Path
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15. Rapid Thermal Response
100
Start Down
80
Temp 80 ± 1.0⁰C
60
(⁰C)
40
20
0
1.0 2.0 3.0 4.0
-20 Time (sec)
-20 ± 1.0⁰C
-40
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16. Controlled Environment
Pneumatic Actuator
Mini-Chamber
Tray
FlexFrame Carrier Contactor
Actuator moves Mini-Chamber
into Contact with the Tray
16

17. Controlled Environment
Sealed Mini-Chamber
Mini-Chamber Seals Tray to Contactor
Forming an Environmental Chamber
17

18. Controlled Environment
Environmental Gas (He, N2, …) Introduced into Chamber
Thermode Clamped to DUTs with Controlled Pressure
18

19. Controlled Environment
Electrical Test of DUTs
19

20. Controlled Environment
Vent Chamber and Release Thermode
20

21. Controlled Environment
Open Chamber
21

22. Controlled Environment
Disengage and Remove Tray
22

23. Controlled Ambient: Test-in-Tray
Mini-Chamber
Thermode
Seals to
Tray
FlexFrame Carrier
Mini-Chamber forms Sealed Environment around Tray
• Eliminates Condensation
• Allows Transfer Gas (He, …)
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24. Parallel Test: Test-in-Tray Format
Seal Band
FlexFrame Carrier
ESD Plastic Tray
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25. Conclusion
Test-in-Tray Facilitates High Performance Test
• Highly Parallel Test
• Controlled Ambient
• High Performance Thermodes
• Independent Thermal Control at Each DUT
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