This document describes a new palladium-free surface activation process for nickel electroless plating on ABS plastic. The process involves immobilizing nickel nanoparticles on the ABS surface as catalyst sites. The ABS surface is first etched to introduce hydrophilic functional groups like sulfonic acid. It is then treated with chitosan which reacts with these groups. Soaking the surface in a nickel sulfate solution deposits nickel nanoparticles which are reduced to elemental nickel. This nickel-activated surface allows for uniform electroless deposition of a smooth, amorphous nickel-phosphorus layer without using expensive palladium. XPS, SEM and XRD characterization show the introduction of functional groups, uniform deposition of nickel nanoparticles, and amorphous nature of the
2. X. Tang et al. / Materials Letters 63 (2009) 840–842 841
at 60 °C for 15 min. Afterward, the foils (ABS–CTS for short) were
immersed in a nickel sulfate solution (NiSO4∙6H2O: 2.0 g/L) at 40 °C for
10 min, rinsed and then reduced in a solution of KBH4 (3.0 g/L) at 40 °C
for 5 min. ABS–CTS–Ni was obtained.
The electroless nickel deposition was catalytically achieved by
dipping the pre-nucleated substrates (ABS–CTS–Ni) into a solution
containing sodium citrate as complexing agent and sodium hypopho-sphite
as reducing agent at 40 °C for 20 min.
2.2.2. Surface characterization
The chemical compositions and reactions on the substrate surface
after each treatment step were characterized by XPS. XPS spectra were
recorded using a Kratos Axis Ultra DLD spectrometer (UK) and em-ploying
a monochromated Al-Ka X-ray source (hv=1486.6 eV), hybrid
(magnetic/electrostatic) optics, and amulti-channel plate and delay line
detector.
The appearanceswere characterized by SEM. Electron micrographs
were taken by a SHIMADZU SS-550 scanning electron microscope (JP).
The XRD measurement of the deposited Ni–P layer was made with
Rigaku D/max-2500 powder diffractometer using CuKα radiation.
3. Results and discussion
The XPS investigations of ABS and ABS–CTS–Ni were undertaken. The XPS data are
listed in Table 1.
Our previous research has reported [4] that new hydrophilic functional groups
(–OH and/or –COOH) are formed on the ABS substrate surface after etching, and that
newchemically-stable functional groups –C(O)–NH–, –C(O)–O– and –C–O–C– formed
through the reaction of –OH and –NH3 of the CTS filmwith the hydrophilic functional
groups –OH and/or –COOH on the surface of ABS after the CTS filmwas dried at 60 °C.
This greatly enhanced the adhesive strength of the CTS film and ABS substrate surface.
Furthermore, ongoing research found that another important hydrophilic func-tional
group (H–O–S (O2)–C6H4)– was formed after etching. As shown in Table 1, the
S2p3/2 photoelectron spectrum peak appears at a binding energy of 168.7 eV for ABS,
which corresponded to the peak position of H–O–S (O2)–C6H4–, different from those of
NiSO4 and H2SO4. The sulfonic acid group was introduced by an electrophilic aromatic
substitution reaction of the benzene ring of the ABS during the etching with sulfuric
acid solution. Drying the CTS film on the surface of ABS at 60 °C causes the reaction of
the sulfonic acid group with the CTS amino groups (–NH3) forming new chemically-stable
–NH–S (O2)–C6H4– (the S2p3/2 absorption peak appears at a binding energy of
167.6 eV for ABS–CTS–Ni, in Table 1) functional groups. It illuminates that the etching
process can modify the surface to be hydrophilic, as well as enhance the adhesive
strength of CTS film and ABS substrate by reaction of functional groups.
The N1s spectrum absorption peak of ABS–CTS–Ni (407.5 eV) shifted 8.3 eV higher
compared to that of –NH3 in CTS (399.2 eV). This result indicates that nickel had chelated
with the nitrogen atom's isolated electrons, causing the thickness of the electron clouds
around nitrogen atoms to decrease and consequently shift the binding energy higher
[4,18]. Thus, Ni is immobilized on CTS film with higher adhesive strength by chemical
adsorption.
In Table 1, two Ni species peaks of Ni2p3/2 appears in XPS data for ABS–CTS–Ni. The
right peak (at binding energy of 852.8 eV) corresponds to Ni2p3/2 peak of Ni, and the left
peak (at binding energy of 857.8 eV) corresponds to Ni2p3/2 peak of NiSO4. The results
indicate that Ni(0) had successfully formed on ABS–CTS–Ni after being reduced by KBH4
solution.
The SEM photograph of ABS–CTS–Ni was showed in Fig. 1. The Ni nanoparticle
(diameterb50 nm) was uniformly formed on the substrate. It was firmly verified that
the formed Ni nanoparticle could be sufficient to start the nickel electroless plating.
Nickel deposition was achieved by dipping ABS–CTS–Ni into the electroless solution.
The plating player appeared glossy and smooth as showed in Fig. 2. The thickness of the
Ni–P layer is 7.2 μm on average determined by weight method. Fig. 3 shows the XRD
pattern of Ni–P plating layer produced with the described pretreatment method. A
broad diffraction peak in Fig. 3 is observed at around 45°, which originates from the
electrolessly deposited Ni–P layers. The results of XRD analyses clearly revealed that the
deposited Ni–P layer is an amorphous state. The amorphous state of the Ni–P layers is
largely attributed to the distortion of crystalline lattice of Ni caused by P atoms [19,20].
4. Summary
A novel palladium-free surface activation process for Ni electroless
plating on ABS had been achieved. This activation process was carried
out by immobilizing Ni nanoparticles as catalyst on ABS substrate. It
was found that an extra and important hydrophilic functional group
(H–O–S (O2)–C6H4)– was introduced during the etching process by
comparison with our previous work. It was confirmed that the formed
Table 1
XPS data for Ni, NiSO4, H2SO4, CTS, ABS and ABS-CTS-Ni (eV)
Samples N1s S2p3/2 Ni2p3/2
Ni – – 852.8 [14]
NiSO4 – 169.2 [15] 857.3 [16]
H2SO4 – 169.6 [17] –
CTS [13] 399.2 – –
ABS 399.3 168.7 –
ABS–CTS–Ni 399.1 407.5 167.6 852.8 857.8
Fig. 1. SEM photograph of ABS–CTS–Ni.
Fig. 2. SEM photograph of Ni–P layer.
Fig. 3. XRD pattern of electroless deposition Ni–P layer.
3. 842 X. Tang et al. / Materials Letters 63 (2009) 840–842
Ni nanoparticles was sufficient as catalyst for nickel electroless
plating. A glossy and smooth Ni–P plating layer was obtained from
an electroless nickel plating bath using this activation method. This
environmentally friendly activation process holds promise to reduce
both capital and operational costs in large scale manufacturing.
Acknowledgement
The authors gratefully acknowledge financial support by the program
(05YFSYSF030) from the Tianjin municipal science and technology
committee.
References
[1] Chen YD, Reisman A, Turlik I, Temple D. J Electrochem Soc 1995;142:3911–3.
[2] Toth Z, Szörenyi T, Toth AL. Appl Surf Sci 1993;69:317–20.
[3] Seeböck R, Esrom H, Charbonnier M, Romand M, Kogelschatz U. Surf Coat Technol
2001;142:455–9.
[4] Tang XJ, Cao M, Bi CL, Yan LJ, Zhang BG. Mater Lett 2008;62:1089–91.
[5] Shipley MG, Sherborn. US Patent 3,874,882.1995.
[6] Shipley MG, William A, Conan J. US Patent 3,904,792.1975.
[7] Zhang JY, Esrom H, Boyd IW. Appl Surf Sci 1996;96:399–404.
[8] Omura Y, Renbutsu E, Morimoto M, Saimoto H, Shigemasa Y. Polym Adv Technol
2003;14:35–9.
[9] Kordás K, Békési J, Vajtai R, Nánai L, Leppävuori S, Uusimäki A, et al. Appl Surf Sci
2001;172:178–89.
[10] Wang XC, Zheng HY, Lim GC. Appl Surf Sci 2002;200:165–71.
[11] Seita M, Kusaka M, Nawafune H, Mizumoto S. Plating Surf Finish 1996;83:57–9.
[12] Brocherieux A, Dessaux O, Goudmand P, Gengembre L, Grimblot J, Brunel M, et al.
Appl Surf Sci 1995;90:47–58.
[13] Charbonnier M, Romand M, Goepfert Y. Surf Coat Technol 2006;200:5028–36.
[14] Kishi K, Fujita T. Surf Sci 1990;227:107–13.
[15] Shalvoy RB, Reucroft PJ. J Vac Sci Technol 1979;16:567–9.
[16] Matienzo LJ, Yin LI, Grim SO, Swartz WE. Inorg Chem 1973;12:2762–9.
[17] Wren AG, Phillips RW, Tolentino CU. J Colloid Interface Sci 1979;70:544–57.
[18] Cheng CX. Surf Phys Chem 1995:676.
[19] Wang F, Arai S, Endo M. Carbon 2005;43:1716–21.
[20] Revesz A, Lendvai J, Loranth J, Padar J, Bakonyi I. J ElectrochemSoc 2001;148:C715–720.