This document summarizes the results of device modeling simulations for an Insulated Gate Bipolar Transistor (IGBT) chip. It describes the IGBT part number and manufacturer, lists the model parameters, and shows the circuit designs and results of simulations evaluating the transfer characteristics, fall time, gate charge, and saturation characteristics of the device. Comparisons are made between the simulation results and experimental measurements.
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Device Modeling Report for Insulated Gate Bipolar Transistor
1. Device Modeling Report
COMPONENTS: Insulated Gate Bipolar Transistor (IGBT)
PART NUMBER: IRG4PF50W
MANUFACTURER: International Rectifier
Bee Technologies Inc.
All Rights Reserved Copyright (C) Bee Technologies Inc. 2004
2. Pspice model
Model description
parameter
TAU Ambipolar Recombination Lifetime
KP MOS Transconductance
AREA Area of the Device
AGD Gate-Drain Overlap Area
WB Metallurgical Base Width
VT Threshold Voltage
KF Triode Region Factor
CGS Gate-Source Capacitance per Unit Area
COXD Gate-Drain Oxide Capacitance per Unit Area
VTD Gate-Drain Overlap Depletion Threshold
All Rights Reserved Copyright (C) Bee Technologies Inc. 2004