11. ConfidentialPage 11
HA‐x00 & HA‐x300
Wafer per Cassette 25 or 50
Maximum Payload 4.5kg
Vacuum performance
Base operating pressure <5.00x10‐7 Torr
Leak rate 5.00x10‐9 scc He/sec
Input Power 208 VAC 20A 1Ø
Electrical Integration Yes
Maximum Temperature 100⁰C
MCBF >1x106
MTTR <2 hours**
Materials exposed
6061‐T6 Aluminum, Stainless Steel 300
and 400 Series, Viton, Borosilicate Glass
Control Interface RS‐232 / Ethernet
Vacuum Transport Systems
Specifications
12. Confidential
HA‐800, HA‐600 & HA‐500
Two Cassette Load Port
HA-x00
Transport Module (TM)
Hine Vacuum Robot
Compatible with opaque and
transparent substrates
Two Cassette Load Ports (CLP)
Hine Vacuum Elevator
Sophisticated automation
features: wafer mapping, wafer
cross‐slot detection, and safety
interlocks
VAT valve (SMC available upon
request)
HA-5.0 Vacuum Robotic Arm
HA-50V Vacuum Elevator
CONSTELLATION SYSTEMS HA‐500 HA‐600 HA‐800
Max. Cassette Load Ports 2 2 2
Max Process Modules 3 4 6
Page 12
Page 12
13. Confidential
HA‐400
One Cassette Load Port
HA-400
Transport Module (TM)
Hine Vacuum Robot
Compatible with opaque and
transparent substrates
Cassette Load Port (CLP)
Hine Vacuum Elevator
Sophisticated automation
features: wafer mapping, wafer
cross‐slot detection, and safety
interlocks
VAT valve (SMC available upon
request)
HA-5.0 Vacuum Robotic Arm
HA-50V Vacuum Elevator
CONSTELLATION SYSTEMS HA‐400
Max. Cassette Load Ports 1
Max Process Modules 3
Page 13
14. Confidential
HA‐200
Entry level System
HA-200
CONSTELLATION SYSTEMS HA‐200
Max. Cassette Load Ports 1 (2)
Max Process Modules 2 (3)
Transport Module (TM)
HA‐3.2 Vacuum Robot
Compatible with opaque and
transparent substrates
Removable Lid
Optional Mechanical Aligner
Cassette Load Port (CLP)
Vacuum & Atmosphere Options
Hine Vacuum or Atmospheric
Elevator Options
Sophisticated automation
features: wafer mapping, wafer
cross‐slot detection, and safety
interlocks
Optional slit valve for independent
plumbing between TM and CLP
HA-3.2 Vacuum Robotic Arm
HA-50V Vacuum Elevator
Page 14
Page 14
15. Confidential
HA‐4300 & HA‐6300 with EFEM
Two Cassette Shuttle up to 300mm
HA-4300
Transport Module (TM)
Hine Vacuum Robot
Compatible with opaque and
transparent substrates
Two Cassette Shuttle EFEM
Hine Atmospheric Elevator
Sophisticated automation features:
wafer mapping, wafer cross‐slot
detection, and safety interlocks
Two (2) position linear slide
allowing cassette exchange during
operation
Fan Filter Unit for Mini
Environment with integrated
ionization & dual LED "Lumifilter"
with light bars
VAT Door
HA-5.0 Vacuum Robotic Arm
HAtm-50 Atmospheric Elevator
CONSTELLATION SYSTEMS HA‐4300
Max. Cassette Load Stations 2
Max Process Modules 3
Page 15
Page 15
16. Confidential
Vacuum Transport Systems
Control Box and Communication Hub
Safety Interlock
Circuit Breakers
System Controller
Power Supply
Standard Features
Communication Hub
Ethernet Port
for OEM
Controller
Ethernet Port
for Robotic
Components
Well packaged electrical and communication interfaces make the
Constellation HA-x00 easy to integrate with any OEM system.
Single communication interface between the OEM system and the
Constellation units.
Page 16
Page 16
17. Confidential
Wafer Change Kit
Standard Options
Standard Wafer Change Kits for SEMI‐standard wafers 75mm‐300mm
Cassette cradle and Head plate assembly
Head plate: Typical SEMI H‐bar design
Tilt‐out cassette cradle: Typical SEMI cassette design
Cassette cradle payload: 6 lbs. (typical)
End‐effector
Material: 17‐4 stainless steel; #3 brushed finish
Payload: 5 lbs. (typical)
Standard contact points: PERLAST Series G75H (or equivalent)
High temperature contact points: 316L stainless steel pads
Electrostatic discharge contact points: PERLAST Series G75H (or equivalent) Gold‐
Palladium sputter coated
Optical Aligner (Optional)
Contact points (std., HT, ESD): PERLAST Series G75H (or equivalent)
Pedestal: Sized for SEMI‐standard wafers
Custom WCK available upon request Page 17
Page 17
24. Confidential
The Hine Automation HA‐5.0 & HA‐3.2 wafer
transfer robots are designed for:
Production environments requiring minimum
vibration
Minimum particle contamination
High throughput with high reliability
performance
Ultra high vacuum environment.
Additionally the HA‐5.0 & HA‐3.2 Robot are:
Compact, cylindrical, ergonomically designed
robots
Utilizing a servo mounted drive assembly
ARM based processor control electronics
Designed for applications with multiple reach
requirements using standard and customer
specific arm lengths.
24
Vacuum Robotic Arms
Overview
28. Confidential
Vacuum and Atmospheric Elevator
Standard Features
Designed for wafer indexing 25 or 50 wafer cassettes
Stainless steel bellows assures compatibility with all vacuum environments
Brushless DC motor provides higher counter resolution and improved
repeatability
Integrated “fail safe” brake prevents movement when power is removed and
can be configured through the control interface.
Page 28
Page 28
HA 50V HA 51V HAtm 50 HAtm 51
Payload 34kg
Weight 18kg
Vacuum performance
Leak Rate 1.00E‐09 NA
Base operating pressure 5.00E‐09 NA
Input Power 24 VDC at 2.5 Amps
Maximum Temperature 100⁰C
Exposed Materials Stainless Steel 300 and 400 Series
Control Interface RS‐232 / Ethernet
MCBF >3.00E+06
CE yes
SEMI S2 Compliant
Repeatability
Z 0.05mm
Class 1 yes
Vertical Stroke 185mm 305mm 185mm 305mm
ELEVATOR
30. Confidential
Optical Aligner
Standard Feature
Optical Aligners Page 30
Features
Designed for ultra high vacuum environments due to
its magnetic liquid feed through seal
Unlimited rotational travel
Programmable notch & flat orientation
Ethernet or RS‐232 control interface
Multi‐wafer size configurability made through
adjustment of hardware and software settings.
Options
Wafer chucks available for all wafer sizes and most
end effector
Configurable for opaque or transparent materials
Integrated optical aligner available on the HA‐400
thru HA‐6300 platforms
Facet mounted optical aligner available for all
Constellation Systems
32. Confidential
Star Systems
Overview
Page 32
Automated Load Locks
200mm
Star SL‐200
Std. Z‐ lift
300mm
Star SL‐300
Std. Z‐ lift
450mm
Star SL‐450
Std. Z‐lift
STANDARD FEATURES
Base Chamber
Wafer & Transfer Chamber, Lid & Hinges,
View & Vacuum Ports
Safety Interlock & Wafer Sensor
Linear Motion Mechanism
Linear Track Assembly
Programmable Motor via RS‐232,
Ethernet or DeviceNet
OPTIONAL FEATURES
Vacuum Package – Level 2
Control Package – Level 3
Vertical Motion Mechanism – Z lift
SEMI Standard and Custom End Effectors
Heated Chamber & Wafer PreHeat
Star SL-200
33. Confidential
Star Systems
Standard Feature and Benefits
Page 33
Z LIFT
LEVEL 2 VACUUM & VENT
CONNECTIONS
Features Benefits
LEVEL 1:
Aluminum chambers and linear motion
mechanism powered by a programmable
stepper motor.
Vertical motion powered by a
programmable stepper motor.
Safety Switch & Wafer Present Sensor
LEVEL 1:
OEM Vacuum interface
design and inventory
management to reduce costs
OEM performs 100%
Software integration
LEVEL 2:
Vacuum plumbing, Vent/Purge system
and Pneumatic manifold are included
with the SL‐x00
LEVEL 2:
Minimizes components OEM
needs to supply
OEM performs 100%
Software integration
LEVEL 3:
Software includes high level commands:
Load/Unload, Evacuate/Vent
LEVEL 3:
• Minimal coordination
between OEM and Hine
Automation for software
integration
• Typically used with Level 2
Option but can be
configured to Customer
supplied Vacuum
components.
34. Confidential
Star Systems
Programmable Z‐lift Option
Page 34
Configurable option adds motor actuated Z‐lift
Multiple positions & sequences using
programmable stepper motor
Rubber dampers create a smooth deceleration
and keep lead screw from binding in the event
of an impact
Adjustable hard stops allow for greater
flexibility and ease of setup.
Belleville disc springs are used to preload the
linkage assembly, virtually eliminating side‐to‐
side play
Z LIFT
35. Confidential
Star Systems
Specifications
Page 35
Page 35
† SEMI Standard sizes. Custom end effectors available upon request.
‡ Measured as three standard deviation (3σ)
* Pay Load depends on End effector
** Max Reach measured from the edge of the slit valve
*** Vertical stroke is optional
Star SL‐200 Star SL‐300 Star SL‐450
Wafer Sizes ≤200mm† ≤300mm† ≤450mm†
Pay Load* 1.5kg 1.5kg 5.0kg
Mounting facet 200mm MESC 300mm MESC 450 MESC
Axes of Motion R, Z R, Z R, Z
Vacuum performance
Leak Rate 1x10‐9
scc He/sec 1x10‐9
scc He/sec 1x10‐9
scc He/sec
Base operating pressure <5x10‐7
Torr <5x10‐7
Torr <5x10‐7
Torr
Input Power 24 VDC 2.0 Amps 24 VDC 2.0 Amps 24 VDC 2.0 Amps
Maximum Temperature 100⁰C
Exposed Materials
6061‐T6 Aluminum, Stainless Steel 300 and 400 Series, Viton, Borosilicate Glass,
Crytox, Delrin, PEEK
Control Interface RS‐232 / Ethernet
MCBF >3x105
CE compliant
Repeatability‡
R 0.15mm
Z 0.10mm
Max. Reach** 305mm 355mm 635mm
Vertical Stroke*** 0.5° 0.5° 0.5°