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PCB Laminates 101

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Choosing the right PCB laminate is key to a quality product, You must consider application, assembly techniques, etc. But don't get caught by the "latest & greatest" fad. Make sensible decisions and save yourself money without compromising quality.

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PCB Laminates 101

  1. 1. PCB LaminatesWhat you need to know!
  2. 2. What Is It? Components •Core •Pre-Preg •Foil Vendor Datasheet • Thickness • Glass Weave
  3. 3. What Is It? • Fiberglass Reinforced Epoxy
  4. 4. High Speed vs. Glass Weave
  5. 5. The “Players” • USA • Asia
  6. 6. The “Choices” *Isola’s Product Ladder
  7. 7. The “Choices” • FR-4 - Flame Retardant Class 4 • DICY Epoxy • Modified DICY Epoxy • Fillers • Low Loss • Halogen-Free • Others • PTFE, LCP, Polyamide, CEM
  8. 8. Properties • Tg - Glass Transition Temperature • Td - Decomposition Temperature • CTE - Coefficient of Thermal Expansion • Dk - Dielectric Constant • Df - Dissipation Factor • Moisture Absorption • Flammability • Anti-CAF - Conductive Anodic Filament
  9. 9. Physical Properties • Glass Transition Temperature (Tg)
  10. 10. Physical Properties • Decomposition Temperature (Td)
  11. 11. Physical Properties • Effects of Multiple Lead-Free Cycles
  12. 12. Anti-CAF?
  13. 13. Lead-Free Failures
  14. 14. Electrical Properties • Dielectric Constant (Dk)
  15. 15. Electrical Properties • Dissipation Factor (Df)
  16. 16. Why Do We Care? • Lead-Free Assembly • Higher Layer Counts • Smaller Feature Sizes • Faster Edge Rates
  17. 17. How Do They Stack-Up?
  18. 18. PCB Categories • Lead Assembly • 2L Lead-Free Assembly • ≥4L Lead-Free Assembly • ≥4L Lead-Free Assembly (High Speed) • RF (>2GHz)
  19. 19. Lead Assembly • Traditional Epoxy System (/21) • I.e. Nan Ya NP-140 • I.e. TLM TLM-140 • Meets Customer Tg≥135˚C Requirement • Low Cost Materials (~0.8x) • Easy to Manufacture
  20. 20. 2L Lead-Free Assembly • Modified Epoxy System (/101 /121) • I.e. Nan Ya NP-140M - NOT NP-140! • I.e. TLM TLM-140(mt) • Pb-Free Compatible Materials • Low Risk for Z-Axis CTE Failures • Low-Medium Cost Materials (~0.9x) • Easy to Manufacture
  21. 21. ≥4L Lead-Free Assembly • Modified & Filled Epoxy System (/99 /126) • I.e. Nan Ya NP-175F - NOT NP-170! • I.e. TLM TLM-170(t) • Pb-Free Compatible Materials • Anti-CAF • Low CTE Z-Axis Expansion • Medium Cost Materials (~1.0x) • Difficult to Manufacture • Routed NOT Punched!
  22. 22. High Speed & RF • Modified & Filled Epoxy Systems (/29 /129) • I.e. Isola FR408HR • I.e. Nelco N4000-SI • I.e. Panasonic Megtron4 • Same as ≥4L Lead-Free Assembly, But Lower Dk/ Df c/o Specialty Fillers • Higher Cost Materials (~1.8x) • Difficult to Manufacture • Other Important Considerations
  23. 23. Discussion • HATS Testing • Define Qualified Materials in PCB Specification • Specify as IPC-4101 Slash Sheet • More Engineering Consideration • USA vs. Asia Materials • Vendor Portability • Customer Communication • Cost vs. Quality

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