Spin Coating is basically a procedure which is used to deposit uniform thin films to any flat surface of work piece. Usually a small amount of coating material is applied on the centre of the work piece’s surface when the disk is spinning at very low speed. Here in this process we are using the basic principle of centrifugal force. This is applied due to the spinning of Disk.

1. i | P a g e
SCHOOL OF MECHANICAL ENGINEERING
REPORT ON CAPSTON PROJECT
TITLE: DESIGN & FABRICATION OF A LOW COST SPIN COATER
Submitted to Lovely Professional University
In partial fulfillment of the requirement for the award of
“DEGREE OF BACHELOR OF TECHNOLOGY [MECHANICAL
ENGINEERING]”
Submitted By
Name Registration No.
 SAURABH PANDEY 11102793
 KAPIL RAGHUWANSHI 11105326
 SUDHIR YADAV 11108007
 PUNEET KUMAR 11111389
Research Supervisor
Mr. Sumit shoor
UID. 14602
Assistant Professor
School Of Mechanical Engineering

2. ii | P a g e
CERTIFICATE
This is certified that Saurabh Pandey, Kapil Raghuwanshi, Sudhir Yadav, Puneet Kumar have
complete this capstone project of – Design & Fabrication of Low Cost Spin Coater under my
guidance. During this project they have done most efforts to study and understand the subject in
detail. In addition to the books mentioned in the bibliography they have referred various study
material, magazine, websites, research papers and notes to complete this project. During this
project they have been very much curious and enthusiast to understand the spirit of the expert
documentation and procedures.
We wish them best of luck.
Research Supervisor
Mr. Sumit Shoor
14602
Asst. Professor
School Of Mechanical Engg. Signature of Supervisor

3. iii | P a g e
DECLARATION
This is to certify that we are the student of School Of Mechanical Engineering, pursuing
Bachelor of Technology(Mechanical Engineering) have completed capstone project on topic
“Design & Fabrication of Low Cost Spin Coater” for partial fulfillment of degree of Bachelor
of Technology to Lovely professional University, Phagwara (PUNJAB).We solemnly declare
that the work done by us is original and no copy of it has been submitted to Lovely Professional
University or any other university for award of any other degree/fellowship.
Name Registration Number Signature
 Saurabh Pandey 11102793
 Kapil Raghuwanshi 11105326
 Sudhir Yadav 11108007
 Puneet Kumar 11111389

4. iv | P a g e
Acknowledgement
Itakethis opportunitytopresent myvotes ofthanks toallthoseguidepost whoreallyactedas lightening pillars
to enlighten our way throughout this project that has led to successful and satisfactorycompletion of
this study. We are really grateful to our teacher for providing us with an opportunity to undertake
this project in this university and providing us with all the facilities. We are highly thankful to
Mr. Sumit Shoor(Asst. Professor) for his active support, valuable time and advice, whole-
hearted guidance, sincere cooperation and pains-taking involvement during the study
and in completing the assignment of preparing the said project within the time
stipulated.
Lastly, we are thankful to all those particularly the various friends who have been
instrumental in creating proper, healthy and conductive environment and including
new and fresh innovative ideas for us during the project, their help, it would have
been extremely difficult for us to prepare the project in a time bound framework.

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ABSTRACT
The goal of this capstone project was designing a low cost spin coater which works
economically.
With the help of this spin coater we can create a thin film on the flat surface of any work piece.
This process is basically follows the principle of Centrifugal Force which draws a rotating body
away from the centre of rotation.
The thickness of film depends on different factors which are as follows:
 Concentration of the Solution
 Rotational Speed
 Rotation Time
So these above are some factors which can affect the thickness of the film. By taking care of
these above said factors we can get the desired thickness of film of any substrate.
Spin Coating is a fast and easy method to generate thin and homogeneous films out of solutions.

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TABLE OF CONTENTS
Title Page
Cover Page i
Certificate ii
Declaration iii
Acknowledgement iv
Abstract v
Table of Contents vi – vii
List of figures viii
List of Graph ix
List of Tables x
CHAPTER 1 Introduction 1 - 4
1.1 Definition and brief history of Spin Coating 1
1.2 Physics of Spin Coating 2
1.3 Industrial uses of spin Coating technology 2
1.4 Common spin coating defects 2 -3
1.5 The Spinning Coating Process 4
1.6 Objective of Project 4
CHAPTER 2 Literature Review 5 - 8
2.1 Introduction 5
2.1.1 Spin Coater with a touch screen interface 5
2.1.2 Cost effective home-made Spin Coater 6 - 7
for depositing thin films
2.1.3 Design & Fabrication of a Low cost effective 7
Spin Coater for deposition of thin films
2.1.4 A comprehensive study of spin coating as a 8
thin film deposition technique and coating Equipment

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CHAPTER 3 Material and Modeling 9-16
3.1 Introduction 9
3.2 Materials/Parts used in the making of the project 9
3.3 Specification of Materials/Equipments 10-12
3.4 Modeling of spin coater 12-15
3.4.1 Key stages of spin coating 13-15
3.6 Cost Analysis 16
CHAPTER 4 Results & Discussion 17 - 20
4.1 Introduction 17
4.2 Result 17 - 19
4.2.1 Graph between film thickness Vs spin time 18
4.2.2 Graph between film thickness Vs spin speed 18- 19
4.3 Spin coating troubleshooting process 19- 20
CHAPTER 5 Conclusion & Future scope 20 - 21
5.1 Conclusion 21 - 22
5.1.1 Advantage 21
5.1.2 Disadvantage 21 - 22
5.2 Future scope 22
References 23- 24

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LIST OF FIGUERS
FIGURE 1.1 Spin Coating using Centrifugal force Page No. 1
FIGURE 1.2 Defects occurs from spin coating Page No. 3
FIGURE 1.3 Defects occurs from spin coating Page No. 3
FIGURE 1.4 Dispense of coating fluid at the centre Page No. 4
FIGURE 2.1 Touch screen interface
Page No. 5
FIGURE 2.2 Chuck with adjustable Clamps Page No. 6
FIGURE 3.1 Front View of outer cabinet Page No. 10
FIGURE 3.2 High speed sewing machine motor Page No. 11
FIGURE 3.3
Front & Rear view of the Disk with
Clamping arrangement Page No. 12
FIGURE 3.4 Final design of spin coater Page No. 13
FIGURE 3.5 Key stages of spin coating process Page No. 14
FIGURE 4.1 First experiment Page No. 17

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LIST OF GRAPHS
GRAPH 4.1 Relationship between film
thickness and spinning time
Page No. 18
GRAPH 4.2 Relationship between film
thickness and spinning time
Page No. 19

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LIST OF TABLE
TABLE 3.1 Cost analysis Page No. 16
TABLE 4.1 Troubleshooting Page No. 20
TABLE 4.2 Troubleshooting Page No. 20

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CHAPTER 01
INTRODUCTION
Spin Coating is basically a procedure which is used to deposit uniform thin films to any flat
surface of work piece. Usually a small amount of coating material is applied on the centre of the
work piece’s surface when the disk is spinning at very low speed. Here in this process we are
using the basic principle of centrifugal force. This is applied due to the spinning of Disk.
FIG. 1.1 Spin Coating using Centrifugal force [1]
1.1 Definition and brief history of Spin Coating
 A process in which solution is spread evenly over a surface using centripetal force when
the disk is rotating.
 Spin Coating will result in a relatively uniform thin film of a specific thickness.
 Spin Coating is an important way of creating thin films in the microelectronics industry
where we need thin films coating.
 Spin Coating was first used to apply coatings of paints and pitch around seventy years
ago.
 In 1958 Emsile et. Al. developed the first spin coating model.
 This model has been used as a basis for future more specific or complicated models.

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1.2 Physics of Spin Coating
Spin Coating process basically uses the principle of Centrifugal force. When the disk is rotating
in any direction, a centrifugal force generates which draws rotating body away from the centre of
rotation. We will further discuss about the centrifugal force here:
Centrifugal Force
Centrifugal force is the apparent force that draws a rotating body away from the centre of
rotation. It is caused by the inertia of the body.[2]
1.3 Industrial uses of Spin Coating technology
 Photo resists for patterning wafers in micro circuit production.
 Insulating layers for micro circuit fabrication such as polymers.
 Flat screen display coatings.
 Antireflection coatings and conductive oxides.
 DVD & CD ROM.
 Television tube antireflection coatings.
1.4 Common Spin Coating Defects
There occur lots of defects after completing the coating processes. Some of them are as follows:
 Bubbles on the surface of the Coated substrate.
 These bubbles occurs when fluid is deposited as the wafer is spinning, and may be
caused by a faulty dispense tip.
 A swirling pattern may be observed.

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FIG. 1.2 Defects occurs from spin coating[3]
 Causes :-
 Fluid deposited off centre.
 Acceleration too high.
 Spin time too short.
 Exhaust rate too high.
 A mark or circle in the centre of the wafer could indicate a chuck mark.
FIG. 1.3 Defects occurs from spin coating[3]
 If a Chuck mark occurs the type of chuck should be changed.
 Uncoated areas on substrate occur when to little fluid is deposited on the substrate.
 Pinhole defects can be caused by 1) Air Bubbles 2) particles in fluid/ Substrate
.

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1.5 Spin Coating process
A typical Spin Coating Process basically consist of four steps which consist of a Dispense step in
which the coating fluid material is deposited onto the surface of work piece, a high speed spin
step to thin the fluid, and a drying step eliminate excess coating fluid from the resulting film.
 Loading Of Substrate
FIG. 1.4 Dispense of coating fluid at the centre
 Dispense of Coating fluid on Substrate
 Film Casting And Drying
 Process Complete
This method was first described by Emslie et al. (1958) and Meyerhofer Et al. (1978) using
several simplifications.[4]
1.6 Objective of Project
The basic object of this project is to Design a low cost spin Coater which will effective as well as
economical. We tried here to Design a Spin Coater which is of low cost but fully functional.

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CHAPTER 2
LITRATURE REVIEW
2.1 Introduction
In very simple words spin coating is a method used to apply a layer of uniform thickness of thin
films to any work piece of flat surface. And the mechanism used for spin coating is known as
spin coater. So for getting some knowledge about above said project we need some basic
knowledge about the project which we got from some research papers, magazines, books etc. &
some of here as follows :
2.1.1 Spin Coater with a touch screen interface
Here according to Mr. Gurucharan V. Karnad(Dept. of Physics, Indian institute of science,
Bangalore), et. Al. Spin Coating is one of the coating technique used to apply thin uniform films
to flat surface of work piece. A spin coater is a machine used for spin coating , and is one of the
most ubiquitous instrument in any laboratory dealing with micro fluidic devices.
Run Time Setting Menu Display Screen RPM Setting
FIG. 2.1 [5]
They made a spin coater with a touch screen panel interface which cost about 350USD. The user
input is through the touch screen panel interface, where parameters like duration of spin and spin
speed can be entered. Real time speed is also displayed alongside.

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In these spin coater the substrate is mounted either using a double- side tape or a set of clamps.
Improvements with the help of vacuums chuck, computer interfacing etc. can be done as per
necessity.
FIG. 2.2 Chuck with adjustable Clamps
So here talking about our project we are using manual holding device over chuck for the
mounting of substrate. We studied in an article that there is a problem of entering fuid into the
vacuum pipe occurs when we are using vacuum chuck so we decide here not to use vacuum
chuck.[6]
2.1.2 Cost effective home-made Spin Coater for depositing thin
films
Writer : Mohua Fardousi et. Al.
A simple low cost spin coater design has been described in this paper. This low cost coating
system is used to deposit thin films. The system can be easily built with the basic knowledge of
machine and electronics.
According to them this project can be done using a DC motor and electronic circuit , Designed to
control the spinning speed. The spinning speed varies from 350- 3800 rpm.

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Talking about our project we used 230 volts regulator for controlling the speed of Motor. We
want to make a low cost project which are having very less complications so we did not used any
electronic circuit to avoid complications.[7]
2.1.3 Design & Fabrication of a Low cost effective Spin Coater for
deposition of thin films
Writer : Mohammad Meftahul Ferdaus et. Al.
According to authors this paper tells us about the design and fabrication of a low cost spin coater for
depositing thin films on any flat substrate. In simple words spin coater is a machine that can dispense a
liquid fluid onto a substrate equally.
Some unique desirable properties of Spin coating machine such as ability to make defect free and uniform
thickness of thin film, accuracy when talking about rotation control together with a closed optimized
process chamber etc. are maintained in this prototype spin coater.
The materials used for making thin film liquefied in a volatile solvent. Here the system is fabricated by
using a dc motor and simple electronics circuit, in which the spinning speed can be controlled very easily.
In this design the spinning speed is up to 3,000 rpm that can be controlled step by step manually.
Thin film deposition by this cost effective spin coater is a very simple technique and can be used widely
for preparing films of uniform thickness.[8]
So as we said above we were trying to reduce complication from the project so we used regulator
for controlling the speed of motor. We can regulate motor from 300 rpm to 9000 rpm.

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2.1.4 A comprehensive study of spin coating as a thin film
deposition technique and coating Equipment
Writer : M. D. Tyona, Advances in Material Research, Vol. 2, No. 4(2013) 181 – 193 et. Al.
According to the author spin coating machine designed and fabricated using affordable
components. The system was easily built with the knowledge of mechanics, fluid mechanics and
basics of electronics. This equipment employs majorly three basic components and two circuit
units in its operation.
These includes a high speed Dc motor, a proximity sensor mounted at a distance of about 15mm
from a reflective metal attached to the spindle of the motor to detect every passage of reflective
metal at its front and generate pulses.
Talking about our project we are neither using any kind of sensor here nor any electronic circuit
for reducing or controlling the speed of motor. In the process of making our project we are
focusing on making a low cost Spin Coater. That’s why here we used a 230 volt Regulator for
controlling the speed of motor.[9]

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CHAPTER 03
MATERIAL AND MODELING
3.1 Introduction
Material and Modeling is an important part of the project report. In which we will discuss here
about the materials, equipments etc. what we used during making of our project as well as the
modeling of spin coater and spin coating process. Here also we will discuss about the design of
the project as well as we will do cost analysis of the project.
3.2 Materials/Equipments used in the making of the project
Materials and equipments are the base for making of any project. Here in the making of our
project we used Tin for the outer covering inside which we will assemble all the other
equipments like motor, shafts, pulley, belt, other electronic parts etc.
We used here Pewter for making clamps because of its several properties like it is very less in
their weight comparing to other metals or any things.
We used here a plastic pot for the upper covering of Disk as it is very less in weight. As we were
trying to reduce the weight of our project. We also used a syringe for deposition of fluid exactly
at the centre in exact measurement.[10]
We used here hard board for making the disk because of its light weight. Another reason for
using of hard board’s disk is its ease of cleaning as after every deposition of fluid some fluid may
be shown there on the disk.

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3.3 Specification of Materials/Equipment
As we said that we used here Tin for making the outer covering of body. So the
specification/Size of the Tin part was as given below:
We used 2 Parts of Tin here both are of same size 23” * 9” & after that we gave them a design as
shown below here:
Below shown is the front view of the outer cabinet:
FIG 3.1 Front View of outer cabinet
Another important equipment used here is motor. Which plays a very important role is working
of project. Specification of motor is as given below:
Basically we need here a motor which is having very high speed as well as that speed can
controlled by any external means. So we used here High speed sewing machine motor here as it
has speed about 9000 revolution per minute. Which is comparatively very high than other spin
motors etc.[11]
Talking about our requirement we need a motor here which can work in between 300 to 6500
Rpm and that can be controlled by any external means like regulator etc.

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Specification of Motor:
AMPS 0.5
HORSE POWER 1/12
CYCLE 50. Hz
VOLTS 220/230 V
R.P.M. 9000
FIG. 3.2 High speed sewing machine motor
We also used here a syringe of 10ml for the depositing of coating fluid in exact volume at the
centre. We fitted the syringe at the centre of the top cover.
Talking about the disk we used hard board for making the disk because of its different properties
as we explained before in the report.
We also used here pewter for making of the holding arrangement and then we assemble those
pewter with the disk which is as shown below in the figure:

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FIG. 3.3 Front & Rear view of the Disk with Clamping arrangement
Then there are some other things which we use here in the making of our projects are as follows:
A shaft of Dia. 6 mm
2 nos. pulley of Internal Dia. 6mm
1 plastic pot with cover for top cover
Some screw bolts etc.
3.4 Modeling of spin coater
As already spin coating has been continuously used in the different industry long before, hardly
even a single theoretical study has been initiated. An exact theory of spin coating would allow
better understanding of design and control of the process in its various applications. Several
years of industrial production operations have shown that the depositions of thin films, which
constitute the main utilization of the spin coating process, are quasi perfectly controlled.
However, any progress in developing mathematical models should be probably more helpful in
the case of heat resistant dielectric insulating films (polyamides or other materials).[12]

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FIG. 3.4 Final design of spin coater
3.4.1 Key stages of spin coating
The operation of spin coating can be effectively modeled by dividing the whole process into four
stages sketched in Figure 10, which are deposition, spin-up (increase in rpm), spin-off (decrease
in rpm) and evaporation of solvents. The first three are commonly sequential, but spin-off and
evaporation usually overlap. Stage 3 and stage 4 are the two stages that have the most impact on
final coating thickness.
Deposition:
During the first stage, solution is provided to fall on rotating substrates from syringes and the
substrate is accelerated to the desired speed. Spreading of the solution takes place due to
centrifugal force and height is reduced to critical height. This is the stage of delivering an excess

24. 14 | P a g e
of the liquid to be coated to the surface of the substrate a portion of which’s immediately covered
or “wetted”.
FIG. 3.5 Key stages of spin coating process[13]
Spin-up:
The second stage is when the substrate is accelerated up to its final, desired, rotation speed. This
stage is usually characterized by aggressive fluid expulsion from the wafer surface by the
rotational motion. Because of the initial depth of fluid on the wafer surface, spiral vortices may
briefly be present during this stage; these would form as a result of the twisting motion caused by
the inertia that the top of the fluid layer exerts while the wafer below rotates faster and faster.
Eventually, the fluid is thin enough to be completely co-rotating with the wafer and any evidence
of fluid thickness differences is gone. Ultimately, the wafer reaches its desired speed and the
fluid is thin enough that the viscous shear drag exactly balances the rotational accelerations.[14]

25. 15 | P a g e
Stable fluid outflow:
This stage is also known as spin down process in which the speed of rotating of disk will get
decrease slowly. The third stage is when the substrate is spinning at a constant rate and fluid
viscous forces dominate fluid thinning behavior. This stage is characterized by gradual fluid
thinning.
Evaporation:
When spin-off stage ends the film drying stage begins. During this stage centrifugal out flow
stops and further shrinkage is due to solvent loss. This results in the formation of thin film on the
substrate. The fourth stage is when the substrate is spinning at a constant rate and solvent
evaporation dominates the coating thinning behavior. In this, the rate of evaporation depends on
two factors (a) the difference in partial pressure (actually chemical potential) of each solvent
species between the free surface of the liquid layer and the bulk of the gas flowing nearby.
During the evaporation stage the suspended or dissolved solids may grow so concentrated at the
liquid surface as to form a high viscosity, low diffusivity layer or solid skin.[15]

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3.5 Cost Analysis
Cost analysis is the portion where we will discuss about the cost of different used products,
materials as well as cost of the equipments etc.
The cost of every product/material/equipments is as shown below in the table:
TABLE:
Materials/Equipments
Names
Cost
Motor 1300
Tin for outer covering 700
Plastic pot 130
Syringe 10
Disk 200
Clamp 100
Shaft 50
Belt 10
Screw Bolts 50
Wires 20
Regulator 25
Plugs 25
Pulley 200
Welding Charges 200
TOTAL COST 3000
TABLE 3.1 Cost analysis

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CHAPTER 04
RESULT & DISCUSSION
4.1 Introduction
Here, we will discuss about different factors which affects coating as well as we will perform our
experiment and will put the result here. We will also discuss here the troubleshooting of spin
coating process.
4.2 Result
We perform on our project by taking a glass lid and the coating solution is the mixture of color
and water. Fill that solution in syringe and place the glass lid on disk and tighten by the clamps.
Place the top cover on its position.
After that start the machine and control the speed of motor with the help of the regulator. The
speed should be about 300 rpm at the time of starting the at the same speed press the syringe so
that deposition of the coating fluid can be occurs at the centre of glass lid.
Then slowly increase the speed of motor up to 6500 rpm. This is the second process of spin
coating leave as it is for 60 seconds and then slowly decreases the speed and bring it to around
1000 rpm so that evaporation can be occurs.
As we said before we perform a demonstration and what we got is as shown below:
FIG. 4.1 First experiment

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4.2.1 Graph between film thickness Vs spin time
There are several factors which affect the thickness of film. Basic Initial conditions that can be
recommended for a good film deposition are the following:

1) The spinning disk should be perfectly leveled horizontally.
2) The deposited solution should wet the substrate.
3) The substrate must be clean and free from any kind of dust particles.
4) The solution should be homogeneous and uniform.
The relationship of film thickness with spinning time is as shown in graph below:
GRAPH 4.1 Relationship between film thickness and spinning time
So here above is the graph showing the relationship between film thicknesses Vs. spinning time
As its shown here by increasing the spin time we can reduce the thickness of film.
4.2.2 Graph between film thickness Vs spin speed
Another factor which affects the film thickness is spin speed. So the relationship between film
thickness and spin speed is as shown in graph below:
We can get from the below graph that we can reduce the film thickness by increase in spin speed.

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GRAPH 4.2 Relationship Between film thickness and spin speed
There are several methods for the thin film deposition. Among all the advantages of spin-coating
methods are: available equipments, no time-consuming delays, fast operating and low cost. The
important factors are:
• Fluid viscosity.
• Solution concentration
• Angular speed.
• Spin Time.
• Evaporation rate of solvent.
Applications: In insulating layers for microcircuit fabrication (like: polymers, SOG), microcircuit
production, flat screen display coatings, antireflection coatings, in dielectric application and
microelectronic industries for the fabrication of integrated circuits.
4.3 Spin coating troubleshooting process
As already explained, there are number of major factors which affect the coating process. Some
of them are these as follows spin speed, acceleration, spin time and exhaust. Following is a list of
issues to consider for specific process problems.

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Film too thin
Reason Solution
Spin speed too high Select lower speed
Spin time too long Decrease time during high speed step
TABLE 4.1 Troubleshooting
Film too thick
Spin speed too low Select higher speed
Spin time too short Increase time during high speed step
TABLE 4.2 Troubleshooting
Air bubbles on wafer surface
1) Air bubbles in dispensed fluid (resin)
2) Dispense tip is cut unevenly or has burrs or defects
Comets, streaks, or flares
1) Fluid velocity (dispense rate) is too high
2) Spin bowl exhaust rate is too high
3) Resist sits on wafer too long prior to spin
4) Spin speed and acceleration setting is too high
5) Particles exist on substrate surface prior to dispense
6) Fluid is not being dispensed at the center of the substrate surface
Swirl pattern
1) Spin bowl exhaust rate is too high
2) Fluid is striking substrate surface off center
3) Spin speed and acceleration setting is too high
4) Spin time too short

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CHAPTER 05
Conclusion & Future scope
5.1 Conclusion
A cost effective spin-coater was successfully designed and fabricated. The total system is very
simple. Spin coaters are ideal tools for the preparation of thin films. In this work, thin films are
successfully prepared by spin-coating method. This spin coater can also be used for film
deposition of different types of precursor solution.
From this review we conclude that one can understand the basic physics behind the spin coating
process. And establish the relationship between film thickness Vs. time and speed.
.
5.1.1 Advantages
As evidenced by its maturity, spin coating has many advantages in coating operations with its
biggest advantage being the absence of coupled process variables. Film thickness is easily
changed by changing spin speed, or switching to a different viscosity photo resist. But among the
alternative coating techniques, many have multiple coupled parameters, making coating control
more complex. Another advantage of spin coating is the ability of the film to get progressively
more uniform as it thins, and if the film ever becomes completely uniform during the coating
process, it will remain so for the duration of the process. It is low cost and fast operating system.
The maturity of spin coating implies many of the issues involved in spin coating have been
studied and a lot of information exists on the subject.
5.1.2 Disadvantages
The disadvantages of spin coating are few, but they are becoming more important as substrate
size increases and photo resist costs rise. Large substrates cannot be spun at a sufficiently high
rate in order to allow the film to thin. The biggest disadvantage of spin coating is its lack of
material efficiency. Typical spin coating processes utilize only 2–5% of the material dispensed

32. 22 | P a g e
onto the substrate, while the remaining 95–98% is flung off in to the coating bowl and disposed.
Not only are the prices of the photo resist increasing substantially, but disposal costs increasing
as well. If economically feasible manufacturing costs are to be maintained, a method for
improving this material utilization is of primary importance, especially in the flat panel display
area.
5.2 Future scope
By including microprocessor in the main circuit we can include the auto on/off system. We also
can add a digital display to know the speed, time and other necessary readings.

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REFERENCE
[1] A G Emsile, F T Bonner and L G Peek J. Appl. Phys. 29 858 (1958)
[2] D Meyerhofer J. Appl. Phys. A9 3993 (1978)
[3] D E Bornside, C W Macosko et al, J. Imaging Tech. 13 122 (1987)
[4] R K Yonkoski and D S Soane J. Appl. Phys. 72 725 (1992)
[5] C J Lawrence and W Zhou Journal of Non-Newtonian Fluid Mechanics 39 137 (1991)
[6] S Middleman An Introduction to Fluid Dynamics (New York : John Wiley and Sons) (1998)
[7] O Omar, A K Ray, A K Hassan and F Davis Supramolecular Science 4 417 (1997)
[8] W W Flack, D S Soong, A T Bell and D W Hess J. Appl. Phys. 56 1199 (1983)
[9] http://www.cise.columbia.edu/clean/process/spintheory.pdf
[10] http://www.mse.arizona.edu/faculty/birnie/Coatings
[11] Ohring, M. (1992), ‘The Materials Science of Thin Films’, Academic Press limited, 24-28
Oval Road, London, NW1, 7DX, UK, pp. XIII. Moshfegh, A. Z. Känel, H.V., Kashyap, S.C.,
and Wuttig, M. (2003), ‘Proceedings of the International Workshop on Physics And Technology
Of Thin Films’, World Scientific Publishing Co. Pvt Ltd. 5 Toh Tuck Link, Singapore, 596224
Tehran, Iran, pp. IX.
[12] Seshan, K. (2002), ‘Handbook of thin-film Deposition processes and techniques: Principles,
Methods, Equipment and Applications’, 2nd ed, Norwich, New York, U.S.A.: Noyes
publications, William andrew publishing.

34. 24 | P a g e
[13] Aguilar, R.G., and López, J.O. (2011), ‘Low cost instrumentation for spin-coating
deposition of thin films in an undergraduate laboratory’, Latin American Journal of Physics
Education, 5 (2), 368-373.
[14] Smirnov, M.A., Rambu, P., Baban, C., and Rusu, G.I. (2010), ‘Electronic Transport
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