High Temperature Ceramic Capacitors For Harsh Environments

1. High Temperature Ceramic Capacitors
for Harsh Environments
Reggie Phillips
Sr. Product Manager
5 February 2018

2. Agenda
➢Applications & Trends
➢Product Overview
➢Product Differentiators
➢Product Grades and Ratings
➢Featured New Products
➢Up Next

3. High Temperature Applications
DEEP WELL AVIONICS AUTOMOTIVE HEAVY INDUSTRIAL
PERFORATION GEOTHERMAL LIGHTING HIGH CURRENT & WBG

4. SMD (BME )
- 200ºC C0G
- Pulse Discharge
- Gold Terms
Axial (PME)
- C3 Technology
Radial (PME)
- C3 Technology
SMD (BME )
- X8R
- X8L
KPS (BME ) J-Lead
X8L
Radial (PME)
- C3 Technology
KPS MCC (BME )
- C0G
Radial (BME)
- Molded
High Temperature Products
Aximax
- X8R
- X8L
High Temp
SMD
MLCC
X7R
Under Development
NEW !
- -- 260°C SMD
-- Gold Term

5. Product Differentiators
✓Patented CaZO3 High-Temperature Dielectric
✓High Temperature-High Reliability Thin-Layer Technology
✓RoHS-Pb-Free Offering
✓Sn, Au, and Sn/Pb termination Options
✓SMD, Leaded, and Stacked Form Factors

6. Trend in BME MLCC Technology:
Dielectric Thickness and Layers Count Progression

7. Product Grades and Ratings
High Temperature Rated
• Design Control
• Change Control
• Process Change
Notification
• Automated Visual
Inspection
• EOL Lot Testing
• Robust Conservative Design
• Design Control
• Change Control
• Process Change Notification
• EOL Lot Testing
• 100% Voltage Conditioning & PDA
• 100% C-SAM
• 100% Visual Inspection per MIL-
STD-123
125°C or 150°C
125°C max
175°C or 200°C, 260°C

8. NEW PRODUCT
HIGHLIGHTS
AND
FEATURES

9. Reliable Performance up to 200ºC
Superior Performance over X7R Dielectric Technology
DC Voltage Ratings of 500 – 2,000V
EIA 0805 – 4540 Case Sizes
Patented C0G Dielectric Technology
Voltage and Temperature Stable
Capacitance up to 150nF
Large Case 2824 - 4540
High Voltage / High Temperature
200ºC HV C0G SMD MLCC

10. Voltage Breakdown Vs. Temperature
High-Temp
Reliability

11. +200°C operating temperature range
Flash, Thin & Thick Gold Options
Soldering, Epoxy & Wire Bonding Applications
Ordering Option E = Flash Gold / 1.97-11.8µin
Ordering Option F = Thin Gold / 30 - 50µin
Ordering Option G = Thick (Standard) Gold / 100µin min.
Eliminates Tin-Whisker Susceptibility
High Temperature Termination Finishes
200°C Capable / Gold (Au)
Gold Terms
3 Thicknesses
Available

12. COG Dielectric
-40°C to +200°C operating temperature range
Case Codes 3, 4 and 5
DC Rated Voltage 50 – 2000V
Capacitance offerings from 4.7 nF up to 2.0 uF
tolerances ±5%, ±10%
No piezoelectric noise
Extremely low ESR and ESL
High thermal stability & High ripple current capability
Non-polar device, 100% silver plated lead finish
Robust mechanical design
Vibration resistant
Patent pending lead frame technology
Excellent reliability for thermal cycling and thermal shock
KPS MCC 200ºC Stacked Solution
Newly Released!Patent Pending: US2015/0114697A1
Robust Against Temp Cycling

13. KPS MCC 200ºC Stacked Solution
Product Offering
CC5 / 2225 [in] CC4 / 3640 [in] CC3 / 4550 [in]
DC
Voltage
1 2 3 4 5 1 2 3 4 5 2 4 6 8 10
Chips per Stack Chips per Stack Chips per Stack
50 0.3µF 0.6µF 0.9µF 1.2µF 1.5µF - - - - - - - - - -
100 0.3µF 0.6µF 0.9µF 1.2µF 1.5µF 330nF 680nF 1.0µF 1.3µF 1.7µF - - - - -
200 110nF 220nF 330nF 440nF 550nF 330nF 680nF 1.0µF 1.3µF 1.7µF 400nF 0.8µF 1.2µF 1.6µF 2.0µF
500 47nF 92nF 150nF 190nF 250nF 120nF 240nF 360nF 470nF 600nF 400nF 0.8µF 1.2µF 1.6µF 2.0µF
630 28nF 56nF 84nF 110nF 150nF 82nF 170nF 250nF 330nF 420nF 250nF 500nF 750nF 1.0µF 1.2µF
1000 18nF 36nF 54nF 72nF 92nF 56nF 120nF 170nF 220nF 270nF 160nF 330nF 470nF 630nF 820nF
2000 4.7nF 9.2nF 14nF 19nF 25nF 15nF 29nF 42nF 56nF 72nF 40nF 80nF 120nF 160nF 200nF

14. Large Case Sizes (0402 – 1812)
-55°C to +260°C operating temperature
range
DC Voltage Ratings from 25- 100
Capacitance from 0.5pF – 15nF
No piezoelectric noise
Excellent AC performance
Extremely low ESR and ESL
Ultra High Temperature C0G SMD
260ºC Capable
Gold End
Metallization with
Thick Nickel for
Diffusion Mitigation Temp
Case
Size
(EIA)
Cap
DC
Voltages
C0G
SMD
260ºC
0402 0.5pF - 330pF 25
0603
0.5pF - 1.5nF 25
0.5pF - 390pF 50
0.5pF - 180pF 100
0805
0.5pF - 5.6nF 25
0.5pF - 2.0nF 50
0.5pF - 1.0nF 100
1206
1.0pF - 10nF 25
1.0pF - 5.6nF 50
1.0pF - 2.7nF 100
1210
1.0pF - 15nF 25
1.0pF - 10nF 50
1.0pF - 5.6nF 100

15. ✓ 150°C Rated, AEC-Q200 Certified
✓ Very high ripple current capability
✓ Extremely low ESR
✓ Extremely low ESL
✓ High frequency operation (>10 MHz)
✓ Ideal for:
 WBG Semi Circuits as DC-LINK
 Snubber Circuits
 Resonator Circuits

16. What’s Next?
KEMET
KONNECT
Technology
Termination
Circuit Board/ Package
Solder
Using
KONNECT
➢ HMP Solder Replacement
➢ No Lead Frame (reduced
CTE mismatch issues)
➢ Bulk Capacitance in same
footprint
US Patent 8,902,565B2

17. Join Us for:
International Conference on
High Temperature Electronics
(HiTEC 2018)
May 8-10, 2018
Albuquerque, New Mexico, USA

18. Thank You!
Thank you
Reggie Phillips
Senior Product Manager
Specialty Ceramics
2835 KEMET Way
Simpsonville, SC 29681
(864) 228-4052
reggiephillips@kemet.com
www.kemet.com/Hi-Temp