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PRAMOTH.T
E 45/4 4th
cross,
Channa reddy layout, Email : pramothkrish@gmail.com
Roopena agrahara, BBMP, Mob No: 91-9738440822
Bangalore
Pin-560068
________________________________________________________________________
Objective:
Looking forward to work in an organization that offers challenging opportunities and which provides innovative work,
growth and wide exposure to the latest technologies. A career, which demands the best of my professional abilities,
technical and analytical skills for ensuring a good career.
Professional Experience:
1. Past Company : Multi Tech Systems, Bangalore
Designation : PCB Design Engineer.
Period : 2 Years (From June-2013 to May-2015)
2. Present Company : Ambujex Technologies PVT ltd., Bangalore
Designation : PCB Design Engineer.
Period : (From June-2015 to till date).
Profile at a Glance:
 A self-motivated IT Professional with a career spanning above 3.5years experience with a client site
experience in BOARD design.
 I have skills on Schematic design and Board level Testing and Debugging, Analog and Mixed
signal layout Design, Board Bring up, Design Verification, Engineering Documentation,
Preparation of Test Plan and resource Management to meet the target.
 Excellent knowledge in standards like, IPC-2221A, IPC-2222A, and IPC-7351.
 I had worked and interacted with different type of companies both private and government of organizations,
like Telecommunication, Instrumentation, Space application, Defense, Aerospace, etc.
Roles & Responsibilities:
 Circuit analysis and verification.
 Schematic Creation, footprint and parts library Creation & Verification.
 Preparing BOM & Net list creation.
 Creating & verifying the Gerber & Plot files.
 Taken care thermal problem.
 Board design and testing & debugging.
 Coordinating with mechanical engineer for system design.
 Designing PCB’s to meet with DFT, DFA & DFM requirements.
Technical Experience in Board:
 Designed online & ground cards and Flight cards for Different space and defense application (ISRO, BEL,
Mahindra Tech, L&T, Cypress, TEJAS networks).
 Involved in Multi-layer board design (Up to 14 Layers) in high speed design.
 Worked with almost all types of packages like SMD, ASIC, FPGA, BGA based designs
 Experienced in designing High speed peripheral interfaces like PCIe, USB3.0, USB2.0, and other inter IC
communication interfaces I2C, SPI, UART.
 Good knowledge on Power plane designs, Split Power plane designs, Analog & Mixed signal designs, RF
Transmitter and Receiver design, High speed designs, Impedance controlled designs.
 Good knowledge in Signal Integrity guidelines on PCB design(reflection noise, crosstalk, ground bounce)
 Designing PCBs to take care SI & EMI/EMC Issues in designs.
 Design verification with all design constraints.
Soft ware’s known for (CAD):
 Orcad Schematic Capture 16.6
 Cadence Allegro 16.6 and 16.3,
 Altium 14
 CADSTAR
 CAM.350
Education Qualification:
 Graduate in Electrical & Electronics Engineering. (2009-13) from Nandha College of Technology,
Erode affiliated to Anna University
 HSC (XII) from ERK Higher Secondary School, Harur, State board in 2009
 SSLC (X) from Govt Boys Higher Secondary School, Uthangarai, State board in 2007.
Experience Project Details:
Project 1:
Project Title : CLOUD CAN
Customer : Consumer Based Product.
Application : Internet of things (IOT) gateway
Device used : ALL WINNER and MEDIATEK, PMIC IC, 3G Module, DDR3, SDRAM, HDMI, USB3.0,
RJ45, WIFI BLUETOOTH MODULE, SD CARD, SIM CARD, AUDIO AMP, WIFI MODULE,
FCI CONNECTOR, SATA BRIDGE, PCIe EXPRESS.
Description : Cloud based product, intended to be used as an IOT gateway, moreover,
It’s a cloud data transmission gateway. The product facilitated the transmission and
Storage of huge amount of data. The product has ‘N’ number of applications and is
Capable of facilitating any kind of IOT based home appliances, making sure all the
Appliances are connected to a common node (i.e. the Cloud Can).
Project 2:
Project Title : GATEWAY DONGLE VAR 2.0
Customer : Tech Mahindra
Application : Communication
Device used : BGA (0.65mm), DDR3, WIFI, RF MODULE, USB, HDMI, PMIC,
Skill set : This card includes, DDR3, ASIC (4) PCIE, Ethernet, Flash memory, VI interface. The
Placement was very challenging due to space constraints. The layout was designed using a
board size of 100mm X 45mm" with 1.6 mm as board thickness. Total number of layer is 10.
No of components involved are 900 with 2500 connections.
Description : This card is a piece of hardware that attaches to computer, TV, or other electronic device, and
that, when attached, enables additional functions such as copy protection, audio, video,
games, data, or other services.
Project 3:
Project Title : CONTROL CARD.
Customer : BEL.
Application : Security system
Device used : Altera BGA, PMIC, QFN, ETHERNET, USB 2.0, RJ45 CONNECTOR, etc.
Skills set : SDRAM, mixed digital & analog board. Its 10 layer card with the size of 308 mm X 131 mm.
This card is used for defense purpose. It also mixes signal board with audio out and this
Board is used in security control application .This board operating with 1Gbps speed.
The Controlled impedance signals with 50 ohms for single ended and 100 for differential signals.
Placement and length matching was challenging due to space constraints.
3W rule was followed for routing DDR data signals, they were routed lane wise and
Fan-out length was fixed and they were length matched.
Project 4:
Project Title : RR BOARD
Customer : L&T
Application : Aero space
Device used : BGA, QFN, PMIC, USB 3.0, HDMI, FFC Connector, LQFP, etc.
Skill set : Its 14 layer card with the size of 150 mm X 144 mm .This board used in aerospace sectors.
The main function of the board is used in video communication purpose. The data lines from
ADC are length matched and buffer to FPGA traces are length are length matched. All digital
traces are 50ohm impedance matched. No of components involved are 887 with
3557connections,2 BGA’s were used and had a controlled impedance of 50 and 100 ohms for
singe ended and 100 ohm for differential Signals.
Personal Details:
 Father’s Name : N.Thamotharan
 Nationality : Indian
 Marital Status : Single
 Date of Birth : 06-05-1992
 Languages known : Tamil, English, Kannada
Declaration:
I hereby declare that all the information furnished above is true to the best of my knowledge.
Date: Yours faithfully,
Place: (PRAMOTH.T)

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T.Pramoth_PCB Designeer_3.5yr. Experience.docx

  • 1. PRAMOTH.T E 45/4 4th cross, Channa reddy layout, Email : pramothkrish@gmail.com Roopena agrahara, BBMP, Mob No: 91-9738440822 Bangalore Pin-560068 ________________________________________________________________________ Objective: Looking forward to work in an organization that offers challenging opportunities and which provides innovative work, growth and wide exposure to the latest technologies. A career, which demands the best of my professional abilities, technical and analytical skills for ensuring a good career. Professional Experience: 1. Past Company : Multi Tech Systems, Bangalore Designation : PCB Design Engineer. Period : 2 Years (From June-2013 to May-2015) 2. Present Company : Ambujex Technologies PVT ltd., Bangalore Designation : PCB Design Engineer. Period : (From June-2015 to till date). Profile at a Glance:  A self-motivated IT Professional with a career spanning above 3.5years experience with a client site experience in BOARD design.  I have skills on Schematic design and Board level Testing and Debugging, Analog and Mixed signal layout Design, Board Bring up, Design Verification, Engineering Documentation, Preparation of Test Plan and resource Management to meet the target.  Excellent knowledge in standards like, IPC-2221A, IPC-2222A, and IPC-7351.  I had worked and interacted with different type of companies both private and government of organizations, like Telecommunication, Instrumentation, Space application, Defense, Aerospace, etc. Roles & Responsibilities:  Circuit analysis and verification.  Schematic Creation, footprint and parts library Creation & Verification.  Preparing BOM & Net list creation.  Creating & verifying the Gerber & Plot files.  Taken care thermal problem.  Board design and testing & debugging.  Coordinating with mechanical engineer for system design.  Designing PCB’s to meet with DFT, DFA & DFM requirements.
  • 2. Technical Experience in Board:  Designed online & ground cards and Flight cards for Different space and defense application (ISRO, BEL, Mahindra Tech, L&T, Cypress, TEJAS networks).  Involved in Multi-layer board design (Up to 14 Layers) in high speed design.  Worked with almost all types of packages like SMD, ASIC, FPGA, BGA based designs  Experienced in designing High speed peripheral interfaces like PCIe, USB3.0, USB2.0, and other inter IC communication interfaces I2C, SPI, UART.  Good knowledge on Power plane designs, Split Power plane designs, Analog & Mixed signal designs, RF Transmitter and Receiver design, High speed designs, Impedance controlled designs.  Good knowledge in Signal Integrity guidelines on PCB design(reflection noise, crosstalk, ground bounce)  Designing PCBs to take care SI & EMI/EMC Issues in designs.  Design verification with all design constraints. Soft ware’s known for (CAD):  Orcad Schematic Capture 16.6  Cadence Allegro 16.6 and 16.3,  Altium 14  CADSTAR  CAM.350 Education Qualification:  Graduate in Electrical & Electronics Engineering. (2009-13) from Nandha College of Technology, Erode affiliated to Anna University  HSC (XII) from ERK Higher Secondary School, Harur, State board in 2009  SSLC (X) from Govt Boys Higher Secondary School, Uthangarai, State board in 2007. Experience Project Details: Project 1: Project Title : CLOUD CAN Customer : Consumer Based Product. Application : Internet of things (IOT) gateway Device used : ALL WINNER and MEDIATEK, PMIC IC, 3G Module, DDR3, SDRAM, HDMI, USB3.0, RJ45, WIFI BLUETOOTH MODULE, SD CARD, SIM CARD, AUDIO AMP, WIFI MODULE, FCI CONNECTOR, SATA BRIDGE, PCIe EXPRESS. Description : Cloud based product, intended to be used as an IOT gateway, moreover, It’s a cloud data transmission gateway. The product facilitated the transmission and Storage of huge amount of data. The product has ‘N’ number of applications and is
  • 3. Capable of facilitating any kind of IOT based home appliances, making sure all the Appliances are connected to a common node (i.e. the Cloud Can). Project 2: Project Title : GATEWAY DONGLE VAR 2.0 Customer : Tech Mahindra Application : Communication Device used : BGA (0.65mm), DDR3, WIFI, RF MODULE, USB, HDMI, PMIC, Skill set : This card includes, DDR3, ASIC (4) PCIE, Ethernet, Flash memory, VI interface. The Placement was very challenging due to space constraints. The layout was designed using a board size of 100mm X 45mm" with 1.6 mm as board thickness. Total number of layer is 10. No of components involved are 900 with 2500 connections. Description : This card is a piece of hardware that attaches to computer, TV, or other electronic device, and that, when attached, enables additional functions such as copy protection, audio, video, games, data, or other services. Project 3: Project Title : CONTROL CARD. Customer : BEL. Application : Security system Device used : Altera BGA, PMIC, QFN, ETHERNET, USB 2.0, RJ45 CONNECTOR, etc. Skills set : SDRAM, mixed digital & analog board. Its 10 layer card with the size of 308 mm X 131 mm. This card is used for defense purpose. It also mixes signal board with audio out and this Board is used in security control application .This board operating with 1Gbps speed. The Controlled impedance signals with 50 ohms for single ended and 100 for differential signals. Placement and length matching was challenging due to space constraints. 3W rule was followed for routing DDR data signals, they were routed lane wise and Fan-out length was fixed and they were length matched. Project 4: Project Title : RR BOARD Customer : L&T Application : Aero space Device used : BGA, QFN, PMIC, USB 3.0, HDMI, FFC Connector, LQFP, etc. Skill set : Its 14 layer card with the size of 150 mm X 144 mm .This board used in aerospace sectors. The main function of the board is used in video communication purpose. The data lines from ADC are length matched and buffer to FPGA traces are length are length matched. All digital traces are 50ohm impedance matched. No of components involved are 887 with
  • 4. 3557connections,2 BGA’s were used and had a controlled impedance of 50 and 100 ohms for singe ended and 100 ohm for differential Signals. Personal Details:  Father’s Name : N.Thamotharan  Nationality : Indian  Marital Status : Single  Date of Birth : 06-05-1992  Languages known : Tamil, English, Kannada Declaration: I hereby declare that all the information furnished above is true to the best of my knowledge. Date: Yours faithfully, Place: (PRAMOTH.T)