Nanofone2
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The document presents Nanofone Ltd's Mic-in-CMOS technology, which integrates a microphone sensor directly into a CMOS chip. This provides advantages over traditional MEMS microphones such as smaller size without needing additional packaging components like metal housings or wire bonding. The Mic-in-CMOS has improved signal-to-noise ratio by eliminating acoustic noise sources. It also has benefits for waterproofing, scalability, electromagnetic interference protection, lower production costs, and seeking corporate partners for further research and development.
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Nanofone2
- 1. presents industry’s first CMOS COMPATIBLE microphone August 2020
- 2. Small Size / Minimal Packaging 2 MEMS microphone 0.5mm Requires front and back chamber Metal housing required Wire bonding required No front or back chamber No need for metal housing No need for wire bonding Front Chamber Back Chamber 1mm Mic-in-CMOS Proprietary & confidential Copyright 2020 Nanofone Ltd
- 3. Improved SNR 3 Noise Sources: • Electronic Limited by Electronic noise which can be further improved Lower electronic noise → Higher SNR Noise Sources: • Acoustic (due to air friction through vent holes) • Electronic Limited by Acoustic noise! MEMS microphone Mic-in-CMOS Proprietary & confidential Copyright 2020 Nanofone Ltd 0.5mm
- 4. Watertight & Ingress-proof 4 MEMS microphone Vent holes Perforated membrane & backplate Prone to air friction noise Open to water and ingress contamination No vent hole or perforations No pressure compensation No air flow No acoustic noise Mic-in-CMOS Proprietary & confidential Copyright 2020 Nanofone Ltd
- 5. Monolithic Structure 5 Sensor and Electronics fabricated in CMOS foundry (Requires some additional post-processing) Sensor fabricated in MEMS foundry, electronics fabricated in CMOS foundry MEMS microphone XC06 Process Mic-in-CMOS Proprietary & confidential Copyright 2020 Nanofone Ltd
- 6. Mic-in-CMOS Post-Processing 6 FabricateStructurein CMOS ClearEtch Holes Etch Gap SealUnderVacuum Proprietary & confidential Copyright 2020 Nanofone Ltd
- 7. Scalable for optimum performance 7 Matrix structureFixed size for each model 5 x 5 7 x 7 11 x 11 MEMS microphone Larger area → More sensitivity Mic-in-CMOS Proprietary & confidential Copyright 2020 Nanofone Ltd
- 8. On-Die EMI / EMC 8 A built-in Faraday cage using CMOS metal layers Metal cap required for EMI/EMC protection MEMS microphone Mic-in-CMOS Proprietary & confidential Copyright 2020 Nanofone Ltd
- 9. Production Cost Comparison 9 ASIC Die Cost MEMS Die Cost Wirebonding Packaging Cost Test & Calibration Cost Yield Losses Cost Monolithic Sensor & Electronics No Wirebonding Low Packaging Cost Low Test & Calibration Cost High Yield due to Simple Design COSTS MEMS microphone Mic-in-CMOS Proprietary & confidential Copyright 2020 Nanofone Ltd
- 10. 10 Small Size Watertight & Ingressproof SNR (Electronic Limited) CMOS compatible (Monolithic) Device ready in several post-processing steps Scalable On-Die EMI / EMC Minimal Packaging Reduced Fabrication Cost Analytically Proven Optimum Solution Low Power Consumption via Electret-mic-in-CMOS Proprietary & confidential Copyright 2020 Nanofone Ltd Microphone-in-CMOS
- 11. IPR Protection Proprietary & confidential Copyright 2020 Nanofone Ltd
- 12. is actively seeking corporate research partners to further develop its Mic-in-CMOS Contact: Yavuz Ahıska yahiska@nanofone.co.uk