Solving Heat Management Issues with Thermally Conductive Plastics

SOLVING HEAT MANAGEMENT ISSUES
IN ELECTRONICS APPLICATIONS
USING THERMALLY CONDUCTIVE PLASTICS
06.17.2015Copyright © 2015 Momentive Performance Materials Inc. All rights reserved.
Webinar

PRESENTED BY:
ALLISON HOWARD YESKE DR. CHANDRA RAMAN
GLOBAL MARKETING MANAGER GLOBAL TECHNOLOGY LEADER
Copyright © 2015 Momentive Performance Materials Inc. All rights reserved.

• Review the basics of heat transfer
• Share simplified models of heat dissipation from chips in three electronic
devices
• Show how thermally conductive plastics can be used to create more
favorable operating conditions
• Present specific benefits of BN-based thermally conductive plastics in
electronics applications
AGENDA
3 Copyright © 2015 Momentive Performance Materials Inc. All rights reserved.

Mega-Trends
• Increasing miniaturization with more functionality
• Reducing weight
• Introducing more complex designs with easier assembly
4
Thermally conductive plastics (TCP)
containing boron nitride (BN) can
help solve today’s challenges

devices
AGENDA

Basics of Heat Transfer
Three Modes of Heat Transfer
6
TH
TC
𝑄 = 𝑘𝐴
(𝑇 𝐻 − 𝑇𝑐)
𝑙
Conduction
𝑄 = 𝑕𝐴(𝑇 𝐻 − 𝑇𝑐)Convection
TH
TC
𝑄 = 𝜖𝜍𝐴(𝑇 𝐻
4
− 𝑇𝐶
4
)Radiation
TH
TC

7
Theoretical Solution of Heat Transfer
Heat transfer equation
Bottom view
Top view
Element Model Inputs
Heat Source 2.4 W
Heat transfer
coefficient (h)
4.7 W/m2K
Emissivity e = 1
Plastic plate with heater
Top and bottom surfaces dissipate heat
by convection and radiation
𝜌𝐶 𝑝
𝜕𝑇
𝜕𝑡
= 𝛻 ∙ 𝑘𝑖 𝛻𝑇
Boundary conditions
−𝑘𝑖
𝜕𝑇
𝜕𝑥𝑖
= 𝑕 𝑇 − 𝑇∞ + 𝜍𝜖 𝑇4
− 𝑇∞
4

8
Temp
(oC)
Predicted Actual
Heater 125 124
Top
surface
119 110
Neat resin – 0.35 W/mK
Plastic Plate Case
Heat transfer calculations closely reflect reality

9
Temp
(oC)
Predicted Actual
Heater 93 96
Top
surface
83 80
Plastic Plate Case
TCP housing: 2 W/mK (X-Z); 0.6 W/mK (Y)
Heat transfer calculations closely reflect reality

devices
AGENDA

Set top box
Three application case studies
Mobile phone Wireless router

MOBILE PHONE CASE STUDY
Chip 1
Chip 2
Chip 3
Battery
Boundary conditions
Battery 0.1 W
Chip 1 0.5 W
Chip 2 0.2 W
Chip 3 0.2 W
Bottom face
(image above)
3.8 W/m2K, e = 1.0

Max Temp (oC) Predicted
Chip 1 67
Chip 2 72
Chip 3 72
Baseline case: unfilled plastic housing (0.2 W/mK)

SET TOP BOX CASE STUDY
Boundary conditions
Heat Source 3 W
Wall thickness 2 mm
Heat transfer
coefficient
5 W/m2K
Emissivity e = 0.9
Box dimensions 50 mm x 50 mm x 100 mm
Heat
source
Steel heat
spreader
Plastic
housing

Chip 94
Bottom surface 82
Baseline case: unfilled plastic housing (0.2 W/mK)

WIRELESS ROUTER CASE STUDY
Element Heat input
Chip 1 8 W
Chip 2 3 W
Chip 3 3 W
RAM 1 2 W
RAM 2 2 W
Total 18 W
Chip 3
Chip 2
Chip 1
RAM 1
RAM 2
Chips could be mounted on either
• Steel heat spreader (TC = 60 W/mK)
• Aluminum heat spreader (TC = 100 W/mK)
Heat transfer
coefficient
5 W/m2K
Emissivity e = 0.9
Box
dimensions
230 mm x 150 mm x 35 mm

Chip 3
Chip 2
Chip 1
RAM 1
RAM 2
Steel heat spreader (TC = 60 W/mK) with
unfilled plastic housing (TC = 0.2 W/mK)
Aluminum heat spreader (TC = 100 W/mK)
with unfilled plastic housing (TC = 0.2 W/mK)
Element Temperature (oC)
Chip 1 89
Chip 2 82
Chip 3 82
RAM 1 80
RAM 2 80
Bottom face 80
Chip 1 99
Chip 2 86
Chip 3 86
RAM 1 84
RAM 2 84
Bottom face 88

DO YOU CONSIDER THE DEVICE
HOUSING TO BE PART OF THE
OVERALL THERMAL MANAGEMENT
SOLUTION?
Tell Us What You Think!
OPTIONS – Pick One
• Yes
• No
• Sometimes
Share your
input now!
Do you and your
peers have the
same opinion?

devices
AGENDA

TCP housing: 3 W/mK (X-Z) ; 0.9 W/mK (Y)
Wide range of TCP
formulations possible

HOW MUCH OF A TEMPERATURE
CHANGE DO YOU EXPECT TO SEE
MOVING TO A THERMALLY
CONDUCTIVE PLASTIC SOLUTION?
• < 10 oC
• 10 - 20 oC
• > 20 oC
Share your
input now!
Do you and your
peers have the
same opinion?

Max Temp
(oC)
Baseline
Neat Plastic
0.2 W/mK
TCP
2 W/mK
TCP
3 W/mK
TCP
5 W/mK
Chip 1 67 49 46 43
Chip 2 72 46 43 40
Chip 3 72 43 37 40
-18o
-26o
-29o
-21o
-29o
-35o
-32o
-32o
-24o
Thermally conductive plastics can effectively lower operating
temperatures and potentially reduce failure rates
Note: Test data. Actual results may vary

Chip 1 42
Chip 2 42
Chip 3 40
Aluminum housing (TC = 100 W/mK)
Disadvantages of Al:
• Weight
• Painting required
• Interference with
wireless signals
Very similar to 5 W/mK TCP

Chip 72
Bottom surface 67
-12o
-15o
Thermally conductive plastics can effectively lower operating
temperatures and potentially reduce failure rates

Chip 3
Chip 2
Chip 1
RAM 1
RAM 2
Steel heat spreader (TC = 60 W/mK) with
TCP housing 2 W/mK (X-Z), 0.6 W/mK (Y)
Aluminum heat spreader (TC = 100 W/mK)
with TCP housing 2 W/mK (X-Z), 0.6 W/mK (Y)
Chip 1 77
Chip 2 70
Chip 3 70
RAM 1 68
RAM 2 68
Bottom face 73
Chip 1 87
Chip 2 75
Chip 3 74
RAM 1 72
RAM 2 71
Bottom face 82
-12o
-11o
-12o
-12o
-13o
-6o
-12o
-12o
-12o
-12o
-13o
-7o
Lower
operating
temperatures
with TCP

devices
AGENDA

Various Material Solutions for Thermal Management
Die-Cast
Aluminum
Graphite-loaded
Plastic
BN- / CoolFX*
hybrid filler-
loaded Plastic
Heat Transfer OS OK OK
Electrical Insulation X X EX
Electro-magnetic Interference X X EX
Design Freedom / Parts Integration X OK EX
Light Weight OK EX EX
Mechanical Properties EX OK OK
Color/Aesthetics X X EX
Mass Production Capability X EX EX
Process ability (low abrasion, wear, ease) X** OK OK
Price OK EX OK
** If high volume (100k shots = lifetime of tool)
EX = excellent OK = sufficient X = not sufficient OS = overshot
BN-based plastics offer unique benefits
in thermal management applications
*CoolFX is a trademark of Momentive Performance Materials Inc.

IS ELECTRICAL INSULATION
IMPORTANT FOR THE DEVICE
HOUSING?
• Yes
• No
• Sometimes
Share your
input now!
Do you and your
peers have the
same requirements?

With the proliferation of wireless connectivity, more devices are
transmitting and receiving wireless signals (= electromagnetic waves)
Electrically conductive materials interfere with electromagnetic waves
PRIMER ON EMI & SHIELDING
𝑆 = 20 𝑙𝑜𝑔10
𝐸𝑖𝑛𝑐
𝐸𝑡𝑟𝑎𝑛𝑠
Incident
Field (Einc)
Absorbed
(A)
Reflected (R)
Transmitted
Field (Etrans)
(MR)
Where:
• EMI = electromagnetic interference
• MR = multiple reflections
• S = shielding (in decibels)

𝑆 = 20 𝑙𝑜𝑔
𝜂0 + 𝜂 2
4𝜂0 𝜂
+ 20 𝑙𝑜𝑔 1 −
𝜂0 − 𝜂
𝜂0 + 𝜂
2
𝑒
−2𝑡
𝛿 𝑒−𝑗𝛽𝑡
+ 20𝑙𝑜𝑔 𝑒
𝑡
𝛿
𝑆 = 𝑅 + 𝑀𝑅 + 𝐴
𝑅 𝑀𝑅 𝐴
𝜂 =
𝑗𝜔𝜇
𝜎+𝑗𝜔𝜖
𝛿 =
1
𝜋𝑓𝜇𝜍
Where:
• 0 is the impedance of free space (~377 )
•  is the complex impedance of the medium
• d is the skin depth
• b is the phase constant of the shield material
• S is shielding (in decibels)
CALCULATING SHIELDING

Electrical (volume) resistivity
EMI IMPACT ON SIGNAL STRENGTH
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
1.0E+05
1.0E-07 1.0E-05 1.0E-03 1.0E-01 1.0E+01 1.0E+03 1.0E+05
TotalShielding(dB)
r (-cm)
8.3 dB
30 dB
Housing
thickness
2 mm
Frequency 1 GHz
@ 20 dB: signal power reduced
by a factor of 100
 Final signal is 1% of
original
@ 10 dB: signal power reduced
by a factor of 10
 Final signal is 10% of
original
Thermally conductive and electrically insulating plastics
offer unique benefits in thermal management applications
Typical TCP formulations containing
graphite/carbon fiber (30-50 wt%)

WOULD YOU CONSIDER THE
DEVICE HOUSING TO BE PART OF
THE OVERALL THERMAL
MANAGEMENT SOLUTION?
• Yes
• No
• Sometimes
Share your
input now!
Do you and your
peers have the
same opinion?

SUMMARY
• Demands for performance and functionality keep increasing in electronic
devices
• Thermally conductive plastics can effectively lower operating temperatures
and potentially reduce failure rates
• As number of wireless communication devices grows, potential for signal
interference is increasing
• BN-based thermally conductive and electrically insulating plastics offer unique
benefits, including strong signal transmission
• BN-based plastics are also lightweight and enable color and design freedom
• Momentive can help solve your thermal management issues and
accelerate new developments

34
Coatings
Follow Momentive on SpecialChem for the latest news about BN-
based thermally conductive plastics and TCP applications
http://polymer-additives.specialchem.com/centers/thermally-conductive-plastics--tcp--containing-boron-nitride

DISCLAIMER:
THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC. AND ITS SUBSIDIARIES AND AFFILIATES
(COLLECTIVELY “SUPPLIER”), ARE SOLD SUBJECT TO SUPPLIER’S STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE
DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON
REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIER MAKES NO
WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii)
AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING ITS PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE.
EXCEPT AS PROVIDED IN SUPPLIER’S STANDARD CONDITIONS OF SALE, SUPPLIER AND ITS REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR
ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making
its own determination as to the suitability of Supplier’s materials, services, recommendations, or advice for its own particular use. Each user must
identify and perform all tests and analyses necessary to assure that its finished parts incorporating Supplier’s products, materials, or services will
be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be
deemed to alter, vary, supersede, or waive any provision of Supplier’s standard Conditions of Sale or this Disclaimer, unless any such
modification is specifically agreed to in a writing signed by Supplier. No statement contained herein concerning a possible or suggested use of
any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property
right of Supplier covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement
of any patent or other intellectual property right.
*CoolFX is a trademark of Momentive Performance Materials Inc.
Momentive and the Momentive logo are trademarks of Momentive Performance Materials Inc.
THANK YOU FOR YOUR ATTENTION

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