SlideShare a Scribd company logo
1 of 25
POINT-TO-
POINT
INTERCONNEC
T
PRESENTED BY: KINZA RAZZAQ
ROLL NO: BSIT-13-F72
P2P INTERCONNECT
•The point-to-point interconnect has lower
latency, higher data rate, and better scalability.
•An important and representative example of
the point-to-point interconnect approach is
Intel’s Quick Path Interconnect (QPI), which was
introduced in 2008.
DERIVATIVE OF P2P INTERCONNECT
• The shared bus architecture was the standard approach
to interconnection between the processor and other
components (memory, I/O, and so on) for decades.
• The principal reason driving the change from bus to
point-to-point interconnect was the electrical
constraints encountered with increasing the frequency
of wide synchronous buses.
• Further, with the advent of multicore chips, with
multiple processors and significant memory on a single
chip, it was found that the use of a conventional shared
bus on the same chip magnified the difficulties of
increasing bus data rate and reducing bus latency to
keep up with the processors.
CHARACTERISTICS OF QPI
1)Multiple direct connections
2)Layered protocol architecture
3)Packetized data transfer
MULTICORE
CONFIGURATION
USING QPI
QPI LAYERS
QPI PHYSICAL LAYER
• data lanes
• clock lane
• 32 GB/s
• four quadrants of 5
lanes
• binary value
• receiver senses the
polarity
• determine the logic
level
• Translation
between 80-bit
flits and 20-bit
phits
QPI LINK
LAYER
• flow control
• error control
• 72-bit message payload
• 8-bit error control code
• data flits transfer the actual bits of data
• Message flits are used for such functions as flow control, error
control, and cache coherence
• credit scheme
QPI ROUTING LAYER
•The Routing layer is used to determine the course
that a packet will traverse across the available
system interconnects.
•Routing tables are defined by firmware and describe
the possible paths that a packet can follow.
•In small configurations, such as a two-socket
platform, the routing options are limited and the
routing tables quite simple.
•For larger systems, the routing table options are
more complex, giving the flexibility of routing and
rerouting traffic depending on how (1) devices are
populated in the platform, (2) system resources are
QPI PROTOCOL LAYER
•In this layer, the packet is defined as the unit of
transfer.
•The packet contents definition is standardized with
some flexibility allowed to meet differing market
segment requirements.
•One key function performed at this level is a cache
coherency protocol, which deals with making sure
that main memory values held in multiple caches
are consistent.
•A typical data packet payload is a block of data
being sent to or from a cache.
PCI EXPRESS
BY HIRA SAEED
ROLL NO: BSIT-13-F71
PCI
• Peripheral component interconnect (PCI) is a popular high-bandwidth,
processor independent bus
• Delivers better system performance for high speed I/O subsystems
• new version, known as PCI Express (PCIe) has been developed
• key requirement for PCIe is high capacity to support the needs of
higher data rate I/O devices, such as Gigabit Ethernet
PCI PHYSICAL AND
LOGICAL ARCHITECTURE
• A root complex device, also referred to as a chipset
• connects the processor and memory subsystem to the PCI Express
• root complex acts as a buffering device
• The root complex also translates between PCIe transaction formats
and the processor and memory signal and control requirements
PCIE:
Following kinds of devices that implement PCIe:
• Switch: The switch manages multiple PCIe
streams
• PCIe endpoint: An I/O device or controller that
implements PCIe
• PCIe/PCI bridge: Allows older PCI devices to be
connected to PCIe-based systems.
LAYERS OF PCIE PROTOCOL
ARCHITECTURE
• Physical: Consists of the actual wires carrying the signals
• Data link: Is responsible for reliable transmission and flow
control. Data packets generated and consumed by the DLL are
called Data Link Layer Packets (DLLPs).
• Transaction: Generates and consumes data packets used to
implement load/ store data transfer mechanisms and also
manages the flow control of those packets between the two
components on a link. Data packets generated and consumed
by the TL are called Transaction Layer Packets (TLPs).
PCIE PHYSICAL LAYER
• PCIe is a point-to-point architecture
• Each PCIe port consists of a number of bidirectional lanes
• Transfer in each direction in a lane is by means of differential
signaling over a pair of wires
• PCI port can provide 1, 4, 6, 16, or 32 lanes
• Data are distributed to the four lanes 1 byte at a time
PCIE PHYSICAL LAYER
• At each physical lane, data are buffered and processed 16 bytes (128
bits) at a time
• Each block of 128 bits is encoded into a unique 130-bit codeword for
transmission
• Referred to as 128b/130b encoding
PCIE TRANSACTION LAYER
• Transaction layer (TL) receives read and write requests
• Creates request packets for transmission to a destination via the link
layer
• Most transactions use a split transaction techniqueA request packet is
sent out by a source PCIe device, which then waits for a response,
called a completion packet
• Each packet has a unique identifier
PCIE DATA LINK LAYER
• The purpose of the PCIe data link layer is to ensure reliable delivery of
packets across the PCIe link.
DATA LINK LAYER PACKETS
• Data link layer packets originate at the data link layer of a transmitting device
and terminate at the DLL of the device on the other end of the link
TRANSECTION LAYER PACKET
PROCESSING
• DLL adds two fields to the core of the TLP created by the TL
• 16-bit sequence number and a 32-bit link-layer CRC (LCRC)
• When a TLP arrives at a device, the DLL strips off the sequence
number and LCRC fields and checks the LCRC
Point to point interconnect

More Related Content

What's hot

Ram and-rom-chips
Ram and-rom-chipsRam and-rom-chips
Ram and-rom-chips
Anuj Modi
 
Microprocessor 80386
Microprocessor 80386Microprocessor 80386
Microprocessor 80386
yash sawarkar
 
Instruction pipelining
Instruction pipeliningInstruction pipelining
Instruction pipelining
Tech_MX
 

What's hot (20)

Ram and-rom-chips
Ram and-rom-chipsRam and-rom-chips
Ram and-rom-chips
 
Computer architecture input output organization
Computer architecture input output organizationComputer architecture input output organization
Computer architecture input output organization
 
Asynchronous data transfer
Asynchronous data transferAsynchronous data transfer
Asynchronous data transfer
 
Cache memory
Cache memoryCache memory
Cache memory
 
Modes of transfer
Modes of transferModes of transfer
Modes of transfer
 
Control Unit Design
Control Unit DesignControl Unit Design
Control Unit Design
 
Microprocessor 80386
Microprocessor 80386Microprocessor 80386
Microprocessor 80386
 
Instruction code
Instruction codeInstruction code
Instruction code
 
DMA operation
DMA operationDMA operation
DMA operation
 
Memory organization (Computer architecture)
Memory organization (Computer architecture)Memory organization (Computer architecture)
Memory organization (Computer architecture)
 
Instruction Execution Cycle
Instruction Execution CycleInstruction Execution Cycle
Instruction Execution Cycle
 
Addressing sequencing
Addressing sequencingAddressing sequencing
Addressing sequencing
 
Computer registers
Computer registersComputer registers
Computer registers
 
Modes of data transfer
Modes of data transferModes of data transfer
Modes of data transfer
 
Interfacing memory with 8086 microprocessor
Interfacing memory with 8086 microprocessorInterfacing memory with 8086 microprocessor
Interfacing memory with 8086 microprocessor
 
Instruction pipelining
Instruction pipeliningInstruction pipelining
Instruction pipelining
 
Computer organization
Computer organizationComputer organization
Computer organization
 
Datapath Design of Computer Architecture
Datapath Design of Computer ArchitectureDatapath Design of Computer Architecture
Datapath Design of Computer Architecture
 
Instruction pipeline: Computer Architecture
Instruction pipeline: Computer ArchitectureInstruction pipeline: Computer Architecture
Instruction pipeline: Computer Architecture
 
INTER PROCESS COMMUNICATION (IPC).pptx
INTER PROCESS COMMUNICATION (IPC).pptxINTER PROCESS COMMUNICATION (IPC).pptx
INTER PROCESS COMMUNICATION (IPC).pptx
 

Similar to Point to point interconnect

Web technologies: recap on TCP-IP
Web technologies: recap on TCP-IPWeb technologies: recap on TCP-IP
Web technologies: recap on TCP-IP
Piero Fraternali
 
Evaluating UCIe based multi-die SoC to meet timing and power
Evaluating UCIe based multi-die SoC to meet timing and power Evaluating UCIe based multi-die SoC to meet timing and power
Evaluating UCIe based multi-die SoC to meet timing and power
Deepak Shankar
 
Scalable multiprocessors
Scalable multiprocessorsScalable multiprocessors
Scalable multiprocessors
Komal Divate
 
Lecture 2 -_understanding_networks_2013
Lecture 2 -_understanding_networks_2013Lecture 2 -_understanding_networks_2013
Lecture 2 -_understanding_networks_2013
Travis Leong Ping
 

Similar to Point to point interconnect (20)

Hyper Transport Technology
Hyper Transport TechnologyHyper Transport Technology
Hyper Transport Technology
 
Web technologies: recap on TCP-IP
Web technologies: recap on TCP-IPWeb technologies: recap on TCP-IP
Web technologies: recap on TCP-IP
 
Hyper Transport Technology
Hyper Transport TechnologyHyper Transport Technology
Hyper Transport Technology
 
unit2-210710110327.pptx
unit2-210710110327.pptxunit2-210710110327.pptx
unit2-210710110327.pptx
 
Sargation university's open system interconnection
Sargation university's open system interconnectionSargation university's open system interconnection
Sargation university's open system interconnection
 
Storage networks
Storage networksStorage networks
Storage networks
 
Evaluating UCIe based multi-die SoC to meet timing and power
Evaluating UCIe based multi-die SoC to meet timing and power Evaluating UCIe based multi-die SoC to meet timing and power
Evaluating UCIe based multi-die SoC to meet timing and power
 
Unit 2 ppt-idc
Unit 2 ppt-idcUnit 2 ppt-idc
Unit 2 ppt-idc
 
Scalable multiprocessors
Scalable multiprocessorsScalable multiprocessors
Scalable multiprocessors
 
Lecture 2 -_understanding_networks_2013
Lecture 2 -_understanding_networks_2013Lecture 2 -_understanding_networks_2013
Lecture 2 -_understanding_networks_2013
 
TCP/IP Protocols
TCP/IP ProtocolsTCP/IP Protocols
TCP/IP Protocols
 
Osi
OsiOsi
Osi
 
Lecture 1 Network Reference Models Final.pptx
Lecture 1 Network Reference Models Final.pptxLecture 1 Network Reference Models Final.pptx
Lecture 1 Network Reference Models Final.pptx
 
lecture 4.pptx
lecture 4.pptxlecture 4.pptx
lecture 4.pptx
 
CISSP - Chapter 4 - Network Fundamental
CISSP - Chapter 4 - Network FundamentalCISSP - Chapter 4 - Network Fundamental
CISSP - Chapter 4 - Network Fundamental
 
06 - OSI Model.ppt
06 - OSI Model.ppt06 - OSI Model.ppt
06 - OSI Model.ppt
 
06 - OSI Model.ppt
06 - OSI Model.ppt06 - OSI Model.ppt
06 - OSI Model.ppt
 
Difference between PCI PCI-X PCIe
Difference between PCI PCI-X PCIeDifference between PCI PCI-X PCIe
Difference between PCI PCI-X PCIe
 
Pcie basic
Pcie basicPcie basic
Pcie basic
 
Unit 5 multi-board system
Unit 5 multi-board systemUnit 5 multi-board system
Unit 5 multi-board system
 

More from Kinza Razzaq (10)

Leadership in technology
Leadership in technologyLeadership in technology
Leadership in technology
 
Governance Analysis using enterprise architecture
Governance Analysis using enterprise architectureGovernance Analysis using enterprise architecture
Governance Analysis using enterprise architecture
 
Risk Management
Risk ManagementRisk Management
Risk Management
 
Ipv4 and Ipv6
Ipv4 and Ipv6Ipv4 and Ipv6
Ipv4 and Ipv6
 
Internet wan
Internet wanInternet wan
Internet wan
 
The internet protocols and OSI Model
The internet protocols and OSI ModelThe internet protocols and OSI Model
The internet protocols and OSI Model
 
HDLC and Point to point protocol
HDLC and Point to point protocolHDLC and Point to point protocol
HDLC and Point to point protocol
 
Operating system
Operating systemOperating system
Operating system
 
Data mining
Data miningData mining
Data mining
 
Recruitment and selection
Recruitment and selectionRecruitment and selection
Recruitment and selection
 

Recently uploaded

Integrated Test Rig For HTFE-25 - Neometrix
Integrated Test Rig For HTFE-25 - NeometrixIntegrated Test Rig For HTFE-25 - Neometrix
Integrated Test Rig For HTFE-25 - Neometrix
Neometrix_Engineering_Pvt_Ltd
 
Hospital management system project report.pdf
Hospital management system project report.pdfHospital management system project report.pdf
Hospital management system project report.pdf
Kamal Acharya
 
1_Introduction + EAM Vocabulary + how to navigate in EAM.pdf
1_Introduction + EAM Vocabulary + how to navigate in EAM.pdf1_Introduction + EAM Vocabulary + how to navigate in EAM.pdf
1_Introduction + EAM Vocabulary + how to navigate in EAM.pdf
AldoGarca30
 
DeepFakes presentation : brief idea of DeepFakes
DeepFakes presentation : brief idea of DeepFakesDeepFakes presentation : brief idea of DeepFakes
DeepFakes presentation : brief idea of DeepFakes
MayuraD1
 
XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
ssuser89054b
 

Recently uploaded (20)

COST-EFFETIVE and Energy Efficient BUILDINGS ptx
COST-EFFETIVE  and Energy Efficient BUILDINGS ptxCOST-EFFETIVE  and Energy Efficient BUILDINGS ptx
COST-EFFETIVE and Energy Efficient BUILDINGS ptx
 
Integrated Test Rig For HTFE-25 - Neometrix
Integrated Test Rig For HTFE-25 - NeometrixIntegrated Test Rig For HTFE-25 - Neometrix
Integrated Test Rig For HTFE-25 - Neometrix
 
Thermal Engineering -unit - III & IV.ppt
Thermal Engineering -unit - III & IV.pptThermal Engineering -unit - III & IV.ppt
Thermal Engineering -unit - III & IV.ppt
 
HOA1&2 - Module 3 - PREHISTORCI ARCHITECTURE OF KERALA.pptx
HOA1&2 - Module 3 - PREHISTORCI ARCHITECTURE OF KERALA.pptxHOA1&2 - Module 3 - PREHISTORCI ARCHITECTURE OF KERALA.pptx
HOA1&2 - Module 3 - PREHISTORCI ARCHITECTURE OF KERALA.pptx
 
UNIT 4 PTRP final Convergence in probability.pptx
UNIT 4 PTRP final Convergence in probability.pptxUNIT 4 PTRP final Convergence in probability.pptx
UNIT 4 PTRP final Convergence in probability.pptx
 
Thermal Engineering-R & A / C - unit - V
Thermal Engineering-R & A / C - unit - VThermal Engineering-R & A / C - unit - V
Thermal Engineering-R & A / C - unit - V
 
S1S2 B.Arch MGU - HOA1&2 Module 3 -Temple Architecture of Kerala.pptx
S1S2 B.Arch MGU - HOA1&2 Module 3 -Temple Architecture of Kerala.pptxS1S2 B.Arch MGU - HOA1&2 Module 3 -Temple Architecture of Kerala.pptx
S1S2 B.Arch MGU - HOA1&2 Module 3 -Temple Architecture of Kerala.pptx
 
Orlando’s Arnold Palmer Hospital Layout Strategy-1.pptx
Orlando’s Arnold Palmer Hospital Layout Strategy-1.pptxOrlando’s Arnold Palmer Hospital Layout Strategy-1.pptx
Orlando’s Arnold Palmer Hospital Layout Strategy-1.pptx
 
Linux Systems Programming: Inter Process Communication (IPC) using Pipes
Linux Systems Programming: Inter Process Communication (IPC) using PipesLinux Systems Programming: Inter Process Communication (IPC) using Pipes
Linux Systems Programming: Inter Process Communication (IPC) using Pipes
 
Hospital management system project report.pdf
Hospital management system project report.pdfHospital management system project report.pdf
Hospital management system project report.pdf
 
Jaipur ❤CALL GIRL 0000000000❤CALL GIRLS IN Jaipur ESCORT SERVICE❤CALL GIRL IN...
Jaipur ❤CALL GIRL 0000000000❤CALL GIRLS IN Jaipur ESCORT SERVICE❤CALL GIRL IN...Jaipur ❤CALL GIRL 0000000000❤CALL GIRLS IN Jaipur ESCORT SERVICE❤CALL GIRL IN...
Jaipur ❤CALL GIRL 0000000000❤CALL GIRLS IN Jaipur ESCORT SERVICE❤CALL GIRL IN...
 
Online food ordering system project report.pdf
Online food ordering system project report.pdfOnline food ordering system project report.pdf
Online food ordering system project report.pdf
 
FEA Based Level 3 Assessment of Deformed Tanks with Fluid Induced Loads
FEA Based Level 3 Assessment of Deformed Tanks with Fluid Induced LoadsFEA Based Level 3 Assessment of Deformed Tanks with Fluid Induced Loads
FEA Based Level 3 Assessment of Deformed Tanks with Fluid Induced Loads
 
1_Introduction + EAM Vocabulary + how to navigate in EAM.pdf
1_Introduction + EAM Vocabulary + how to navigate in EAM.pdf1_Introduction + EAM Vocabulary + how to navigate in EAM.pdf
1_Introduction + EAM Vocabulary + how to navigate in EAM.pdf
 
Theory of Time 2024 (Universal Theory for Everything)
Theory of Time 2024 (Universal Theory for Everything)Theory of Time 2024 (Universal Theory for Everything)
Theory of Time 2024 (Universal Theory for Everything)
 
A Study of Urban Area Plan for Pabna Municipality
A Study of Urban Area Plan for Pabna MunicipalityA Study of Urban Area Plan for Pabna Municipality
A Study of Urban Area Plan for Pabna Municipality
 
School management system project Report.pdf
School management system project Report.pdfSchool management system project Report.pdf
School management system project Report.pdf
 
Introduction to Data Visualization,Matplotlib.pdf
Introduction to Data Visualization,Matplotlib.pdfIntroduction to Data Visualization,Matplotlib.pdf
Introduction to Data Visualization,Matplotlib.pdf
 
DeepFakes presentation : brief idea of DeepFakes
DeepFakes presentation : brief idea of DeepFakesDeepFakes presentation : brief idea of DeepFakes
DeepFakes presentation : brief idea of DeepFakes
 
XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
 

Point to point interconnect

  • 2. P2P INTERCONNECT •The point-to-point interconnect has lower latency, higher data rate, and better scalability. •An important and representative example of the point-to-point interconnect approach is Intel’s Quick Path Interconnect (QPI), which was introduced in 2008.
  • 3. DERIVATIVE OF P2P INTERCONNECT • The shared bus architecture was the standard approach to interconnection between the processor and other components (memory, I/O, and so on) for decades. • The principal reason driving the change from bus to point-to-point interconnect was the electrical constraints encountered with increasing the frequency of wide synchronous buses. • Further, with the advent of multicore chips, with multiple processors and significant memory on a single chip, it was found that the use of a conventional shared bus on the same chip magnified the difficulties of increasing bus data rate and reducing bus latency to keep up with the processors.
  • 4. CHARACTERISTICS OF QPI 1)Multiple direct connections 2)Layered protocol architecture 3)Packetized data transfer
  • 7. QPI PHYSICAL LAYER • data lanes • clock lane • 32 GB/s • four quadrants of 5 lanes • binary value • receiver senses the polarity • determine the logic level • Translation between 80-bit flits and 20-bit phits
  • 8. QPI LINK LAYER • flow control • error control • 72-bit message payload • 8-bit error control code • data flits transfer the actual bits of data • Message flits are used for such functions as flow control, error control, and cache coherence • credit scheme
  • 9. QPI ROUTING LAYER •The Routing layer is used to determine the course that a packet will traverse across the available system interconnects. •Routing tables are defined by firmware and describe the possible paths that a packet can follow. •In small configurations, such as a two-socket platform, the routing options are limited and the routing tables quite simple. •For larger systems, the routing table options are more complex, giving the flexibility of routing and rerouting traffic depending on how (1) devices are populated in the platform, (2) system resources are
  • 10. QPI PROTOCOL LAYER •In this layer, the packet is defined as the unit of transfer. •The packet contents definition is standardized with some flexibility allowed to meet differing market segment requirements. •One key function performed at this level is a cache coherency protocol, which deals with making sure that main memory values held in multiple caches are consistent. •A typical data packet payload is a block of data being sent to or from a cache.
  • 11. PCI EXPRESS BY HIRA SAEED ROLL NO: BSIT-13-F71
  • 12. PCI • Peripheral component interconnect (PCI) is a popular high-bandwidth, processor independent bus • Delivers better system performance for high speed I/O subsystems • new version, known as PCI Express (PCIe) has been developed • key requirement for PCIe is high capacity to support the needs of higher data rate I/O devices, such as Gigabit Ethernet
  • 13. PCI PHYSICAL AND LOGICAL ARCHITECTURE • A root complex device, also referred to as a chipset • connects the processor and memory subsystem to the PCI Express • root complex acts as a buffering device • The root complex also translates between PCIe transaction formats and the processor and memory signal and control requirements
  • 14.
  • 15. PCIE: Following kinds of devices that implement PCIe: • Switch: The switch manages multiple PCIe streams • PCIe endpoint: An I/O device or controller that implements PCIe • PCIe/PCI bridge: Allows older PCI devices to be connected to PCIe-based systems.
  • 16. LAYERS OF PCIE PROTOCOL ARCHITECTURE • Physical: Consists of the actual wires carrying the signals • Data link: Is responsible for reliable transmission and flow control. Data packets generated and consumed by the DLL are called Data Link Layer Packets (DLLPs). • Transaction: Generates and consumes data packets used to implement load/ store data transfer mechanisms and also manages the flow control of those packets between the two components on a link. Data packets generated and consumed by the TL are called Transaction Layer Packets (TLPs).
  • 17.
  • 18. PCIE PHYSICAL LAYER • PCIe is a point-to-point architecture • Each PCIe port consists of a number of bidirectional lanes • Transfer in each direction in a lane is by means of differential signaling over a pair of wires • PCI port can provide 1, 4, 6, 16, or 32 lanes • Data are distributed to the four lanes 1 byte at a time
  • 19. PCIE PHYSICAL LAYER • At each physical lane, data are buffered and processed 16 bytes (128 bits) at a time • Each block of 128 bits is encoded into a unique 130-bit codeword for transmission • Referred to as 128b/130b encoding
  • 20.
  • 21. PCIE TRANSACTION LAYER • Transaction layer (TL) receives read and write requests • Creates request packets for transmission to a destination via the link layer • Most transactions use a split transaction techniqueA request packet is sent out by a source PCIe device, which then waits for a response, called a completion packet • Each packet has a unique identifier
  • 22. PCIE DATA LINK LAYER • The purpose of the PCIe data link layer is to ensure reliable delivery of packets across the PCIe link.
  • 23. DATA LINK LAYER PACKETS • Data link layer packets originate at the data link layer of a transmitting device and terminate at the DLL of the device on the other end of the link
  • 24. TRANSECTION LAYER PACKET PROCESSING • DLL adds two fields to the core of the TLP created by the TL • 16-bit sequence number and a 32-bit link-layer CRC (LCRC) • When a TLP arrives at a device, the DLL strips off the sequence number and LCRC fields and checks the LCRC