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Hilaire An
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2 
 
 
Hilaire Ananda Perera 
Long Term Quality Assurance 
http://www.linkedin.com/in/hilaireperera 
 
Virtual  qualification  facilitates  selection  of  cost‐effective  test  parameters  for  validating  reliability 
assessment and design and also aids in the selection of components by providing information on their 
impact on reliability. Because the virtual qualification process does not involve manufactured prototypes  
and  physical  testing,  it  is  a  much  more  economical  and time‐efficient process compared to a 
manufactured product qualification process [28].  
The flowchart of the virtual qualification process is shown in the  above Figure. The inputs consist of life‐
cycle  profile  and  product  characteristics.  The  life‐  cycle  profile  can  be  further  categorized  as 
environmental and operational stresses as shown. The inputs are fed into a PoF model and simulation  
software where stress analysis, reliability assessment, and stresses sensitivity analysis are performed. 
The outputs of virtual qualification are predicted TTF based on the most dominant failure mechanisms, 
stress margin conditions, and screening and accelerated testing conditions.  
In addition to TTF prediction and reliability assessment, virtual qualification combined with advanced 
optimization  techniques  can  be  used  to  optimize  the  design  criteria  including  cost,  electrical 
performance, thermal  management, physical attributes, and reliability. By examining  potential trade‐
offs between the aforementioned criteria, ideal values can be achieved for specific applications.  
In  the  virtual  qualification  process,  it  is  imperative  to  use  the  most accurate inputs including 
material properties, design configuration, dimensions,  and  operational  and  environmental  conditions.  
Furthermore,  the failure mechanism models used in TTF prediction and reliability assessment must be 
valid. If the data or models on which the virtual qualification is performed is inaccurate or unreliable, 
any qualification results based on the data or models are suspicious.  
 
25. Cunningham, J., Valentin, R., Hillman, C, Dasgupta, A., and Osterman, M., “A demonstration of 
virtual qualification for the design of electronic hardware,” Proceedings  of  the  Institute  of  
Environmental  Sciences  and  Technology Meeting, April 24, 2001.  
26. Hu, J., Barker, D., Dasgupta, A., and Arora, A., “The role of failure mechanism identification in 
accelerated testing,” Journal of the Institute of Environmental Sciences, vol. 36, no. 4, pp. 39–45, 
1993.  
27. Caruso, H. and Dasgupta, A., “A fundamental overview of analytical acceler‐ ated testing 
models,” Journal of the Institute of Environmental Sciences, vol. 41, no. 1, pp. 16–30, 1998.  
28. McCluskey, P., Pecht, M., and Azarm, S., “Reducing time‐to‐market using virtual qualification,” 
Proceedings of the Institute of Environmental Sciences Conference, pp. 148–152, 1997 
 

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Virtual Qualification

  • 1.     Hilaire An Long Term http://ww   Ref: CA Virtual qu of  Failure anticipate whether a materials, simulation desired lif Virtual qu process    qualificati This  meth compone failure usi reliability  cycle  pro mechanis reliability  nanda Perera  m Quality Ass ww.linkedin.c ALCE Webb ualification is  e  (PoF)  base ed life cycle. V a part or syst ,    geometry, n software to fe goals [25].  ualification ca to    be    mo ion at the ini hodology  tak nts and syste ing the critica assessment  file,  using  a  ms  that  cau by the TTF as urance  om/in/hilaire VIR book - Encap the first stag ed  reliability  Virtual qualifi em can meet ,    and    ope o model phys   an be applied  oved    into    t tial stages of kes  advantag ems to be  qu al failure mec tool assesse database  of se  failures  a s a function o Flowch eperera  RTUAL Q psulation Tec ge of the ove assessment  cation (also c t its reliability erating    char sical hardwar at the design the    design  f design, tech ge  of  advanc alified  based chanisms and s the designs f  validated  Po nd  evaluates of typical  man hart of Virtual  1  QUALIFI chnologies f rall qualificat to  determin called simulat y goals under racteristics.  T re to determi n stages and,  phase  [26,27 hnology and f es  in  compu d  on  analysis  the applicab s for reliabili oF  models.  I s  the  effects  nufacturing t Qualification ICATION for Electroni tion process.  ne  if  a  prop tion‐assisted   anticipated l The  techniqu ine the proba hence, it allo 7].  It  allows  functional def uter‐aided  en s  of  the  sus ble failure mo ty in the env t  calculates  of    differen olerances and N ic Applicatio It is the appl posed  produc reliability ass life‐cycle prof ue  involves  t ability of the ows  the  relia the  design  finition, and  ngineering  so sceptibility  of odels associat vironments p times‐to‐failu nt    manufact d defects  ons, Section lication of  Ph ct  can  surviv sessment) ass files  based  o the  applicatio  system’s me ability  assess team  to  con supplier sele oftware  perm f  their  desig ed with them present in the ure  (TTFs)  fo uring    proce 7.3 hysics  ve  its  sesses  on  its   on  of  eeting  sment   nsider  ction.  mitting  ns  to  m. The  e life‐ or  the  ss  on   
  • 2. 2      Hilaire Ananda Perera  Long Term Quality Assurance  http://www.linkedin.com/in/hilaireperera    Virtual  qualification  facilitates  selection  of  cost‐effective  test  parameters  for  validating  reliability  assessment and design and also aids in the selection of components by providing information on their  impact on reliability. Because the virtual qualification process does not involve manufactured prototypes   and  physical  testing,  it  is  a  much  more  economical  and time‐efficient process compared to a  manufactured product qualification process [28].   The flowchart of the virtual qualification process is shown in the  above Figure. The inputs consist of life‐ cycle  profile  and  product  characteristics.  The  life‐  cycle  profile  can  be  further  categorized  as  environmental and operational stresses as shown. The inputs are fed into a PoF model and simulation   software where stress analysis, reliability assessment, and stresses sensitivity analysis are performed.  The outputs of virtual qualification are predicted TTF based on the most dominant failure mechanisms,  stress margin conditions, and screening and accelerated testing conditions.   In addition to TTF prediction and reliability assessment, virtual qualification combined with advanced  optimization  techniques  can  be  used  to  optimize  the  design  criteria  including  cost,  electrical  performance, thermal  management, physical attributes, and reliability. By examining  potential trade‐ offs between the aforementioned criteria, ideal values can be achieved for specific applications.   In  the  virtual  qualification  process,  it  is  imperative  to  use  the  most accurate inputs including  material properties, design configuration, dimensions,  and  operational  and  environmental  conditions.   Furthermore,  the failure mechanism models used in TTF prediction and reliability assessment must be  valid. If the data or models on which the virtual qualification is performed is inaccurate or unreliable,  any qualification results based on the data or models are suspicious.     25. Cunningham, J., Valentin, R., Hillman, C, Dasgupta, A., and Osterman, M., “A demonstration of  virtual qualification for the design of electronic hardware,” Proceedings  of  the  Institute  of   Environmental  Sciences  and  Technology Meeting, April 24, 2001.   26. Hu, J., Barker, D., Dasgupta, A., and Arora, A., “The role of failure mechanism identification in  accelerated testing,” Journal of the Institute of Environmental Sciences, vol. 36, no. 4, pp. 39–45,  1993.   27. Caruso, H. and Dasgupta, A., “A fundamental overview of analytical acceler‐ ated testing  models,” Journal of the Institute of Environmental Sciences, vol. 41, no. 1, pp. 16–30, 1998.   28. McCluskey, P., Pecht, M., and Azarm, S., “Reducing time‐to‐market using virtual qualification,”  Proceedings of the Institute of Environmental Sciences Conference, pp. 148–152, 1997