1. John R. Dick
1304 E. Sawmill Rd., Quakertown, PA 18951
Phone: 980-253-8357
jrdick.scieng@gmail.com
Objective: Seeking a position allowing me to utilize the diverse skill set which I have developed to date
and to expand my capabilities in Program Management, Tool and Manufacturing Process Development
Experience Summary
• Having more than 25 years experience as a process development engineer for the manufacture of
integrated circuits, thermal-electric devices, solar cells, LEDs, and Lasers. I have had a broad range
of responsibilities and assignments including: process development; process and metrology
equipment specification and development; equipment selection, purchase, acceptance testing, and
repair; work-space design, and personnel and Project Management.
• Have documented processes (per ISO standards), selected and trained staff, created SPC metrics to
monitor quality, and fulfilled sustaining engineering and continuous improvement functions to
increase profitability.
• Have developed and implemented programs to assure compliance with EPA, and OSHA regulations,
and testing and quality protocols developed by International Standards Organizations.
• Having worked as a "Bench technician" repairing analog and digital circuits and subsequently as a
"Field Engineer" for sophisticated scientific equipment, I acquired a considerable level of skill
trouble-shooting equipment to the component level and modifying existing systems. As a result of
this experience I was generally considered to be the in-house "first-responder" for failures of most
of the manufacturing equipment on-site throughout my career.
Selected Accomplishments
• Saved $4-6M in capital equipment costs.
• Consistently released processes which routinely demonstrated greater than 95% yield
• Reduced down-time for manufacturing and metrology equipment to less than 5 % (including
planned maintenance).
• Wrote more than 100 work instructions
• Satisfied audit requirements for ISO9001 certification for several labs and manufacturing cells
Work History
Program/Project Management
OEM Group, Inc., Coopersburg, PA Applications Lab Manager 2/2014 to 12/2014
• Implemented standard procedures for equipment operation, laboratory procedures, and
correspondence with customers. I established chemical handling and chain of custody procedures
compliant with OSHA regulations, and with (local, state, and Federal) EPA regulations regarding the
handling, storage, and disposal of solvents, acids, and bases commonly used in the facility.
• Developed applications for wet-chemical etch, solvent cleaning, as well as SC1, SC2, and ozone
cleaning of device substrates.
• Developed processes to perform specific customer applications, identified resources necessary for
lab operations, visited customers to diagnose, and remedy long-standing equipment performance
issues.
2. Semprius, Inc., Durham, NC Senior Scientist 8/2008 to 9/2013
• Hired in 2008 to develop manufacturing processes, funding issues led to my assignment to identify
the equipment requirements for high-volume manufacturing factory and propose optional facility
layouts. Since manufacturing process development was "early stage" many tools needed were
specified so that they either included or were otherwise configured to permit expanding capability if
subsequently deemed necessary. Most equipment required was acquired from used equipment
dealers or custom equipment manufacturers. Due diligence included lengthy and numerous
exchanges with in-house staff; identifying, researching, and comparing prospective tools and
vendors; and assuring that after-sale support was specified and achievable in purchase agreements.
The equipment set was required to satisfy projected production volumes (through-put and capacity
rates) for each process. While $18M was budgeted for the equipment acquisition the final price-tag
was $(12-$14)M and the capability of the equipment set exceeded ultimate requirements. This
somewhat ambitious project was completed ahead of schedule, largely due to good communication,
planning, and execution.
Technology Transfer and Manufacturing Process Development Experience
Working with start-up companies to bring new technology to the market place I have worked with
several solid state materials and devices which are listed below according to company identity and dates
of the work. I worked with a diverse array of technologies and while many of these involved well
understood technologies associated with the application, in several cases material specific parameters
required substantial knowledge of the technologies and materials in order to adapt the process to the
application.
Manufacturing processes with which I have ample experience include Reactive Ion Etching (RIE), Physical
Vapor Deposition (PVD) including electron beam evaporation, thermal evaporation, and sputter
deposition, electro-plating of gold (using sulfate and cyanide based solutions), copper, tin, and nickel,
contact and proximity photolithography, Plasma Enhanced Chemical Vapor Deposition (PECVD), wet-
chemical etching and cleaning of semiconductor and device surfaces, substrate thinning using lapping
and polishing as well as back-grinding, dicing (using saw and excimer laser), reflow die-bonding, and so
on. In addition to developing processes I developed metrics to Statistical Process Control, inspection
regimens to qualify direct and indirect incoming consumable materials, visual inspection procedures for
outgoing devices, wrote work instructions per ISO 9001 requirements, supervised, and trained staff. I
was the technical lead for 3 manufacturing areas in a 24/7 operation with one employer.
I was generally the resident Scanning Electron Microscopist, and generally served as the first responder
for equipment failures for most companies listed. I have also both used and developed metrology
equipment for performing a wide array of electrical tests.
Semprius, LLC, Durham, NC Senior Scientist 8/2008 to 6/2013
Multi-junction GaAs/AlGaAs Concentrated Photovoltaic devices (solar cells)
Nextreme Thermal Solutions, LLC, Durham, NC Senior Process Engineer 4/2004 to 8/2008
Bismuth Telluride based thermal-electric devices
RF Micro Devices Inc., Greensboro, NC Senior Process Engineer 3/2002 to 4/2004
Galium Nitride integrated circuits and power devices
3. Uniroyal Opto-Electronics, Inc., Tampa, FL Senior Process Engineer 5/1999 to 4/2004
High Brightness Light Emitting Diodes (LEDs)
Private Consulting, Boulder CO 1/1991 to 4/1999
• I contracted with the companies listed below to manage and perform programs to develop and
demonstrate fabrication methods for specific solid state devices. (The arrangement permitted me
to perform parental duties for two young kids.) One project involved the duplication of equipment
already in use to manufacture an emulsion used for attaching electrodes to brain, (giving me insight
into medical industry requirements for chemical manufacture) expanding the production volumes.
These companies included (and not limited to) NIST (GaAs strip-line standards, Ball Aerospace (GaAs
integrated circuits), Vapor Technologies (solar thermal materials), Cielo Communications (vertical
cavity surface emitting lasers or VCSELs), and Analytical Spectral Devices (optical spectrometry).
Anadigics, Inc., Warren, NJ Process Engineer 8/1986 to 3/1989
GaAs integrated circuits.
Materials Characterization for R&D Projects
• Performed SIMS and SEM analyses, documented results and presented orally and in lab reports for
in-house and sub-contract research organizations.
• Both modified and created hardware and software to increase the capability of lab equipment sets.
AT&T Bell Labs, Murray Hill, NJ Member of the Technical Staff 1/1985 to 6/1986
NREL, Golden, CO Staff Scientist 3/1982 to 12/1984
Other Training, Certification, Experience
Laser Safety Officer, Implementation of 6 Sigma Lean Manufacturing, Total Quality Management, 5S,
Kaizen, Kanban, Other Quality programs, PMBoK, etc
Education:
• BS Electrical Engineering 1978 Union College (Schenectady, NY)
• Completed half the course required for MS Electrical Engineering (1987 - Rutgers University,
New Brunswick NJ) when family needs required relocation.
Bibliography and references available upon request.