Manufacturing That Eliminates Risk & Improves Reliability
Low Layer Count PCBs
Why They Are Not All Created Equal
02.15.2024
Manufacturing That Eliminates Risk & Improves Reliability
2
Why Talk About Low Layer Count Circuit Boards?
“…..anecdotal evidence tells us that most of the PCBs used
are double sided (two layer) and four layer in everyday
production….”
- Supporting American Printed Circuit Boards Act of 2022: An Appraisal
Manufacturing That Eliminates Risk & Improves Reliability
3
Agenda
 The basics of 2- and 4-layer PCBs – what you had to look for …
 Technology changes that have made 2- and 4-layer PCBs more attractive –
then vs. now.
 What design considerations change the game in terms of cost and reliability –
you will be surprised.
 Material selection – what is the impact on performance?
 Everyone can make these, so everyone’s quality is the same – right?
 Cost vs. functionality – why 2- and 4-layer boards work for many applications.
Manufacturing That Eliminates Risk & Improves Reliability
4
2/4 Layer PCB Basics
 Multilayer plated through-hole PCBs
invented in the 1960s.
 Double-sided plated through-hole PCBs
invented in the early 1940s.
Manufacturing That Eliminates Risk & Improves Reliability
5
Old School DS & 4-Layer
 Look at how little copper is left
Manufacturing That Eliminates Risk & Improves Reliability
6
Old School DS PCBs
 Big though holes and wide traces
Manufacturing That Eliminates Risk & Improves Reliability
7
Old School – 2-Layer & 4-Layer Through Hole
 Quality of Plated Through Hole
– Very simple as the holes were large
– Plating a through hole is all about
getting fluid through the drilled hole
 Quality of the Etched Circuit
– Didn’t need to be very defined
– Plenty of space to meet IPC spec
– Impedance wasn’t a big issue
– Shorts and opens
Manufacturing That Eliminates Risk & Improves Reliability
8
Old School 2- & 4-Layer PCBs
 Driven by cost or functionality
Manufacturing That Eliminates Risk & Improves Reliability
9
What Changed?
 Component Sizes – 01005 Passives
Manufacturing That Eliminates Risk & Improves Reliability
10
What Changed? Part Two
 BGAs and through holes with no components (VIAs)
Manufacturing That Eliminates Risk & Improves Reliability
11
So Now …
 The rules change
Manufacturing That Eliminates Risk & Improves Reliability
12
What Are The New Design Considerations?
 Fine lines and spaces -
0.004” and lower
 Very small holes – less than
10 mils
 Solder mask dams as small
as 4 or 5 mils
Manufacturing That Eliminates Risk & Improves Reliability
13
How Do All Of These Design Considerations Affect Cost?
 They all:
– Require specialized equipment
• To be done right
– Have a high effect on yield
– Add time to process
 Why?
– Less room for error
– 0.004” trace - +/-0.0004
– 0.015” trace - +/-0.0015
Over-etched PCB
Manufacturing That Eliminates Risk & Improves Reliability
14
Some ways to help …
 Different ways to treat vias
 Always use the largest features
possible – holes, traces and spaces
 Make sure you DFM your BGA
designs
Manufacturing That Eliminates Risk & Improves Reliability
15
Material Selection on 2- and 4-Layer PCBs
 Old School Thinking:
– Use high Tg material on all
through hole PCBs
 Today:
– Unless you plan on doing
extensive re-work to the
PCB, do you really need it?
NOTE: Tg or Glass transition temperature, is the base material
parameter for the temperature (°C). It defines at what temperature the
base material becomes mechanically unstable. It is not the PCB
maximum operating temperature, but rather that which the PCBA can
endure for a short time before it deteriorates.
Manufacturing That Eliminates Risk & Improves Reliability
16
Can You Really Re-Work These PCBs?
 Sure – SMD don’t require as much heat
Manufacturing That Eliminates Risk & Improves Reliability
17
Here Is Where It Matters …
 It will take a ton of heat to get
the large through hole
components out.
 If you have a large PCB where
you will want to regularly replace
a component.
 Tg 130 vs Tg 180.
Manufacturing That Eliminates Risk & Improves Reliability
18
Impedance Control and RF Circuits on 2/4 Layer
 Can it be done?
– Sure can
 Biggest challenges:
– Impedance features vs.
soldered features
– Important to keep the
soldered features the same
size and away from ground
planes
 Using trace design to create
the desired impedance
This rule aims to solve a manufacturing problem known as tombstone.
During reflow, a too large connection to an SMD pad acts like a heatsink,
creating a situation where one side of the component has a slightly lower
temperature. Because of this, one side of the component can lift up from
the PCB. This is especially true for small (0402 and smaller) components.
Manufacturing That Eliminates Risk & Improves Reliability
19
Everyone Can Make 2- & 4-Layers, Right?
 Yes and no
 Through hole – YES
 Tight spaced, less than 10 mil
via and 5 mil dams – NO
 Equipment matters
 Registration and trace quality
 Solder mask dam quality
Manufacturing That Eliminates Risk & Improves Reliability
20
Solder Mask Dam Challenges
Manufacturing That Eliminates Risk & Improves Reliability
21
Everyone Can Make 2- & 4-Layers, Right?
 Quality Registration
 Old Way
– Panel tooling holes
 New Way
– Registration to features
on each panel or PCB to
improve quality and yield
Manufacturing That Eliminates Risk & Improves Reliability
22
Even The Small Things Matter – Inkjet Printing
 Much faster and consistent process
 More functionality
Manufacturing That Eliminates Risk & Improves Reliability
23
Cost vs. Functionality
 #1 rule of thumb – Always make it as big as you can.
– Improves long-term reliability
– Reduces cost
– More room for error – pure math
 If it needs small features and tight tolerances – make sure that your
fabricator has made the necessary investment to be successful.
Manufacturing That Eliminates Risk & Improves Reliability
24
What’s Next For 2- & 4-Layer PCBs?
 Features will be getting smaller
 Semiconductors will be getting
more functionality
– Making 2/4 layers cost-effective
 Additional technology will be
developed and required
 Fabricators will need to invest to
be successful
Manufacturing That Eliminates Risk & Improves Reliability
25
Summary
 Not all PCBs are created equal.
 Feature size is more important than layer
count.
 Not all fabricators have made the
investment in equipment needed to keep up
with the smallest features and tight
tolerances.
 Use fabricators’ DFM services to check your
work while in development.
Manufacturing That Eliminates Risk & Improves Reliability
26
Our Products
Battery Packs Flex & Rigid-Flex PCBs Cable Assemblies Printed Circuit Boards
CNC Machining User Interfaces Flexible Heaters EC Fans & Motors
Manufacturing That Eliminates Risk & Improves Reliability
27
 You can quote and order circuit boards up to 16-layers online with
InstantPCBQuote™.
– Standard and Expedited Lead Times
– Various Material and Surface Finish Options
– Controlled Impedance, Controlled Dielectric, Via in Pad
 Go to www.epectec.com/instantpcbquote/ to get started.
Did You Know?
Manufacturing That Eliminates Risk & Improves Reliability
28
Q&A
 Questions?
– Enter any questions you may have
in the control panel
– If we don’t have time to get to it, we
will reply via email
Manufacturing That Eliminates Risk & Improves Reliability
29
Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
Stay Connected with Epec Engineered Technologies
Follow us on our social media sites for continuous technical updates and information:

Low Layer Count PCBs – Why They Are Not All Created Equal

  • 1.
    Manufacturing That EliminatesRisk & Improves Reliability Low Layer Count PCBs Why They Are Not All Created Equal 02.15.2024
  • 2.
    Manufacturing That EliminatesRisk & Improves Reliability 2 Why Talk About Low Layer Count Circuit Boards? “…..anecdotal evidence tells us that most of the PCBs used are double sided (two layer) and four layer in everyday production….” - Supporting American Printed Circuit Boards Act of 2022: An Appraisal
  • 3.
    Manufacturing That EliminatesRisk & Improves Reliability 3 Agenda  The basics of 2- and 4-layer PCBs – what you had to look for …  Technology changes that have made 2- and 4-layer PCBs more attractive – then vs. now.  What design considerations change the game in terms of cost and reliability – you will be surprised.  Material selection – what is the impact on performance?  Everyone can make these, so everyone’s quality is the same – right?  Cost vs. functionality – why 2- and 4-layer boards work for many applications.
  • 4.
    Manufacturing That EliminatesRisk & Improves Reliability 4 2/4 Layer PCB Basics  Multilayer plated through-hole PCBs invented in the 1960s.  Double-sided plated through-hole PCBs invented in the early 1940s.
  • 5.
    Manufacturing That EliminatesRisk & Improves Reliability 5 Old School DS & 4-Layer  Look at how little copper is left
  • 6.
    Manufacturing That EliminatesRisk & Improves Reliability 6 Old School DS PCBs  Big though holes and wide traces
  • 7.
    Manufacturing That EliminatesRisk & Improves Reliability 7 Old School – 2-Layer & 4-Layer Through Hole  Quality of Plated Through Hole – Very simple as the holes were large – Plating a through hole is all about getting fluid through the drilled hole  Quality of the Etched Circuit – Didn’t need to be very defined – Plenty of space to meet IPC spec – Impedance wasn’t a big issue – Shorts and opens
  • 8.
    Manufacturing That EliminatesRisk & Improves Reliability 8 Old School 2- & 4-Layer PCBs  Driven by cost or functionality
  • 9.
    Manufacturing That EliminatesRisk & Improves Reliability 9 What Changed?  Component Sizes – 01005 Passives
  • 10.
    Manufacturing That EliminatesRisk & Improves Reliability 10 What Changed? Part Two  BGAs and through holes with no components (VIAs)
  • 11.
    Manufacturing That EliminatesRisk & Improves Reliability 11 So Now …  The rules change
  • 12.
    Manufacturing That EliminatesRisk & Improves Reliability 12 What Are The New Design Considerations?  Fine lines and spaces - 0.004” and lower  Very small holes – less than 10 mils  Solder mask dams as small as 4 or 5 mils
  • 13.
    Manufacturing That EliminatesRisk & Improves Reliability 13 How Do All Of These Design Considerations Affect Cost?  They all: – Require specialized equipment • To be done right – Have a high effect on yield – Add time to process  Why? – Less room for error – 0.004” trace - +/-0.0004 – 0.015” trace - +/-0.0015 Over-etched PCB
  • 14.
    Manufacturing That EliminatesRisk & Improves Reliability 14 Some ways to help …  Different ways to treat vias  Always use the largest features possible – holes, traces and spaces  Make sure you DFM your BGA designs
  • 15.
    Manufacturing That EliminatesRisk & Improves Reliability 15 Material Selection on 2- and 4-Layer PCBs  Old School Thinking: – Use high Tg material on all through hole PCBs  Today: – Unless you plan on doing extensive re-work to the PCB, do you really need it? NOTE: Tg or Glass transition temperature, is the base material parameter for the temperature (°C). It defines at what temperature the base material becomes mechanically unstable. It is not the PCB maximum operating temperature, but rather that which the PCBA can endure for a short time before it deteriorates.
  • 16.
    Manufacturing That EliminatesRisk & Improves Reliability 16 Can You Really Re-Work These PCBs?  Sure – SMD don’t require as much heat
  • 17.
    Manufacturing That EliminatesRisk & Improves Reliability 17 Here Is Where It Matters …  It will take a ton of heat to get the large through hole components out.  If you have a large PCB where you will want to regularly replace a component.  Tg 130 vs Tg 180.
  • 18.
    Manufacturing That EliminatesRisk & Improves Reliability 18 Impedance Control and RF Circuits on 2/4 Layer  Can it be done? – Sure can  Biggest challenges: – Impedance features vs. soldered features – Important to keep the soldered features the same size and away from ground planes  Using trace design to create the desired impedance This rule aims to solve a manufacturing problem known as tombstone. During reflow, a too large connection to an SMD pad acts like a heatsink, creating a situation where one side of the component has a slightly lower temperature. Because of this, one side of the component can lift up from the PCB. This is especially true for small (0402 and smaller) components.
  • 19.
    Manufacturing That EliminatesRisk & Improves Reliability 19 Everyone Can Make 2- & 4-Layers, Right?  Yes and no  Through hole – YES  Tight spaced, less than 10 mil via and 5 mil dams – NO  Equipment matters  Registration and trace quality  Solder mask dam quality
  • 20.
    Manufacturing That EliminatesRisk & Improves Reliability 20 Solder Mask Dam Challenges
  • 21.
    Manufacturing That EliminatesRisk & Improves Reliability 21 Everyone Can Make 2- & 4-Layers, Right?  Quality Registration  Old Way – Panel tooling holes  New Way – Registration to features on each panel or PCB to improve quality and yield
  • 22.
    Manufacturing That EliminatesRisk & Improves Reliability 22 Even The Small Things Matter – Inkjet Printing  Much faster and consistent process  More functionality
  • 23.
    Manufacturing That EliminatesRisk & Improves Reliability 23 Cost vs. Functionality  #1 rule of thumb – Always make it as big as you can. – Improves long-term reliability – Reduces cost – More room for error – pure math  If it needs small features and tight tolerances – make sure that your fabricator has made the necessary investment to be successful.
  • 24.
    Manufacturing That EliminatesRisk & Improves Reliability 24 What’s Next For 2- & 4-Layer PCBs?  Features will be getting smaller  Semiconductors will be getting more functionality – Making 2/4 layers cost-effective  Additional technology will be developed and required  Fabricators will need to invest to be successful
  • 25.
    Manufacturing That EliminatesRisk & Improves Reliability 25 Summary  Not all PCBs are created equal.  Feature size is more important than layer count.  Not all fabricators have made the investment in equipment needed to keep up with the smallest features and tight tolerances.  Use fabricators’ DFM services to check your work while in development.
  • 26.
    Manufacturing That EliminatesRisk & Improves Reliability 26 Our Products Battery Packs Flex & Rigid-Flex PCBs Cable Assemblies Printed Circuit Boards CNC Machining User Interfaces Flexible Heaters EC Fans & Motors
  • 27.
    Manufacturing That EliminatesRisk & Improves Reliability 27  You can quote and order circuit boards up to 16-layers online with InstantPCBQuote™. – Standard and Expedited Lead Times – Various Material and Surface Finish Options – Controlled Impedance, Controlled Dielectric, Via in Pad  Go to www.epectec.com/instantpcbquote/ to get started. Did You Know?
  • 28.
    Manufacturing That EliminatesRisk & Improves Reliability 28 Q&A  Questions? – Enter any questions you may have in the control panel – If we don’t have time to get to it, we will reply via email
  • 29.
    Manufacturing That EliminatesRisk & Improves Reliability 29 Thank You Check out our website at www.epectec.com. For more information email sales@epectec.com. Stay Connected with Epec Engineered Technologies Follow us on our social media sites for continuous technical updates and information: