EE driving the cost out of your design

DRIVING COST OUT OF YOUR DESIGNS
THROUGH YOUR PCB FABRICATOR’S EYES!
8/25/2015
Brett McCoyBrett McCoy
Presenter from Eagle Electronics, Inc.Presenter from Eagle Electronics, Inc.

DRIVING COST OUT OF YOUR DESIGN
THROUGH YOUR PCB FABRICATOR'S EYES!
Brett McCoy:Brett McCoy:
• Vice President / Director of Sales
1. Operations and company financial responsibility
2. Sales and marketing
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2. Sales and marketing
3. Oversight of quality and engineering departments
4. Key technical contact for all customer inquiries
5. Over 5 years experience in CAM engineering

HistoryHistory
1979 - Operations begin in Des Plaines, IL.
1980 - Medium to high volume rigid PCB fabricator.
1984 – Moved to current facility in Schaumburg, IL (50K SF)
1991 – Edge plating technology developed.
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1996 – ISO Certified.
2002 – Retooled as a quick turn to medium volume domestic fabricator.
2004 – Blind and buried via technology developed.
2005 – Grayhill places first order with Eagle (93AD5644-1 Rev F).

HistoryHistory
2006 – Rigid flex technology developed.
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2008 – ITAR Registered facility.
2009 – IMS technology developed.
2012 – Via in pad technology in-house.

HistoryHistory
2013 – Laser direct imaging capability.
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2014 – Micro via technology developed.

Future DevelopmentsFuture Developments -- 20152015
Q2 – Install new AOI machine
Q2 – Chemical lab renovation completed.
Q3 – Install new strip-etch-strip (SES) line.
Q3 – Install copper via fill bath (micro via cap plating).
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Q4 – Upgrade plating tank 2 with dual rectification.

We are your partner!We are your partner!
• We have to “be the customer”
The difference between a great product andThe difference between a great product and
a merely good product is that the greata merely good product is that the great
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a merely good product is that the greata merely good product is that the great
product embodies an idea people canproduct embodies an idea people can
understand and learn aboutunderstand and learn about ––an idea thatan idea that
grows in their minds, one they emotionallygrows in their minds, one they emotionally
engage withengage with
Creating the customer experienceCreating the customer experience

Partner with your suppliersPartner with your suppliers
• They are your resource
• They are their product experts
• They are there to help you succeed
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• They are there to help you succeed

Key TopicsKey Topics
• Material utilization and specification
• Surface finishes
• Understanding and specifying via protection
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• Understanding and specifying via protection
• Panelization
• What level of test do you need?
• What is tooling?
• Ensuring transferability
• Summary

Material utilization and specificationMaterial utilization and specification
• PCB basic building blocks?
1. Laminate
A. Most laminates are produced with dielectrics ranging from
0.002” to 0.200” thick. Copper thickness ranges from 1/4oz
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0.002” to 0.200” thick. Copper thickness ranges from 1/4oz
to 12oz, however the most readily used is 1/2oz, 1oz, and
2oz.
2. Pre-preg
A. Typical glass styles and their associated thickness (after press)
i. 106 = 0.0018” thick
ii. 1080 = 0.0025” thick
iii. 2113 = 0.0035” thick
iv. 2116 = 0.0045” thick
v. 7628 = 0.007” thick

• Why choose one laminate system over another?
1. Electrical performance
A. Dk – Dielectric Constant
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i. Ratio of capacitance of an electrically insulating material
B. Df – Dissipation Factor (loss tangent)
i. Ratio of the power loss of a dielectric material
2. Thermal performance
A. Td – Decomposition Temperature
i. Temperature at which the dielectric material will breakdown
B. Tg – Glass transition Temperature
i. Temperature at which the resin system will begin to flow
C. CTE – Thermal expansion (X-Y-Z)

• Why choose one laminate system over another?
1. Impedance or RF
A. Low loss material for high speed signals
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2. Leaded or Lead-Free Assembly
A. Lead Free assembly requires a Td of 340C or higher
B. Typical lead free material has a Tg value of 150C or above
3. Material Availability (When specifying a
manufacturer)
A. Always keep in mind to utilize STANDARD materials
readily available to your PCB fabricator.

• How to specify material?
1. IPC-4101
A. Slash sheet
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i. /126 = Most compliant for lead free FR-4 material
ii. /21 = standard FR-4 (non lead free compatible)
2. By Electrical/Thermal Performance
A. Dk/Df if impedance/rf is required
B. Tg/Td of material based on assembly and end application

• How to specify material?
1. IPC-4101 (example)
A. Laminate and pre-preg to be in accordance with IPC-
4101/126
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4101/126
2. By Electrical/Thermal Performance (example)
A. Laminate and pre-preg to have a minimum Td value of
340C
B. Controlled Impedance required with a Dk value of 3.8

• When to specify a specific laminate/pre-preg?
1. Impedance/RF Required
A. Tight Impedance (+/- 5% or below) and especially RF
designs can be very sensitive to changes in the laminate
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designs can be very sensitive to changes in the laminate
system. Even if the material change is an equivalent in
terms of electrical attributes small differences in fillers
used, resin content, and glass style will impact signal
output. Prototype and production parts of this nature
should specify the exact type (manufacturer) and grade of
the laminate/pre-preg as well as a specific layer stack-up
defined.

• Reduce Cost and Lead Time?
1. Allow the PCB manufacturer to choose the material
whenever possible. By specifying by IPC-4101 or
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the electrical/thermal requirements will allow the
fabricator to utilize their standard materials.
2. Each fabricator has their own preferred materials
based on region, price, support, and service. By
leveraging these stocked items you will be assured
of the lowest laminate cost, highest yield, and
virtually no delays in raw material procurement.

Surface FinishesSurface Finishes
• What surface finish to use and costs associated?
1. ENIG – Electroless Nickel Immersion Gold
A. IPC-6012 table 3-2 defines the nickel thickness to be 118u” (min).
Typical process range is 150 – 200 u”
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Typical process range is 150 – 200 u”
B. IPC-6012 table 3-2 defines the gold thickness to be 1.97u” (min).
Typical process range is 2-4 u”
C. Flat solderable surface ideal for SMT components especially tight
pitch devices such as BGA’s.
D. Easier to control plated hole diameters; good for press fit holes
E. Long shelf life (1 year or longer when properly stored)
F. Can survive multiple reflow cycles.
G. Expensive – Can be nearly 30% more than HASL

1. Immersion Silver
A. IPC-6012 table 3-2 defines the silver thickness to be
solderable. Typical process range is 8–16 u”.
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solderable. Typical process range is 8–16 u”.
B. Flat solderable surface ideal for SMT components
especially tight pitch devices such as BGA’s.
C. Easier to control plated hole diameters; good for press fit
holes
D. Special care must be taken in packaging and storage.
E. Short shelf life ranging from 2-6 months.
G. Less expensive than ENIG by as much as 20%.

1. Lead Free HASL
A. IPC-6012 table 3-2 defines the LFHASL thickness to be
coverage/solderable. Typical process range is 50–400 u”.
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B. Similar solderability as HASL
C. ROHS
D. Uneven surface finish not ideal for tight pitch devices.
G. Low Cost ROHS alternative (5% more than HASL)

1. HASL
A. IPC-6012 table 3-2 defines the HASL thickness to be
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B. Extremely good solderability.
C. Contains lead (non-ROHS)
D. Uneven surface finish not ideal for tight pitch devices.
G. Lowest cost surface finish

1. Specialty or Selective surface finishes
A. Hard gold fingers (bussed)
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i. Card edge connectors
B. Selective hard gold internal to the part
i. Typical use for keypads or switches
C. Selective soft gold
i. Gold wire bonding
D. ENEPIG – Electroless Nickel Electroless Palladium Immersion
Gold
i. Can be used for both SMT and gold wire bonding with one finish
E. OSP – Organic solder protection
F. Immersion Tin

Understanding and Specifying Via ProtectionUnderstanding and Specifying Via Protection
• What is via protection?
1. Simply put, it is a means to protect the via for
several reasons.
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A. To keep solder from flowing from one side to the other.
B. To keep chemistry from being trapped in the via.
C. For thermal heat transfer.
D. To allow for assembly directly over a hole (via-in-pad).
E. To improve surface planarity.
F. To provide a surface ideal for ICT testing (vacuum).
G. To provide additional reliability to a via.

• Types of via protection?
1. IPC-4761 identifies seven via protection types
A. Type I = Tented (dry film mask only)
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B. Type II = Tented and Covered (Type I with additional mask
material applied over the dry film)
C. Type III = Plugged (Partial fill in the barrel with mask material)
D. Type IV = Plugged and Covered ( Type III with additional mask
material applied over the plug)
E. Type V = Filled (100% fill of the via barrel)
F. Type VI = Filled and Covered (Type V with additional mask
material applied over the plug)
G. Type VII = Filled and Capped Plated (Type V with a metalization
formed over the top and bottom of the via)

1. Type I Tented
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Dry Film Mask

1. Type II Tented and Covered
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LPI Mask
Dry Film Mask

1. Type III Plugged
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LPI Mask

1. Type IV Plugged and Covered
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Secondary LPI Mask
LPI Mask

1. Type V Filled
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100% fill with non-conductive
or conductive ink

1. Type VI Filled and Covered
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100% fill with Non-conductive
or conductive ink
Secondary LPI Mask

1. Type VII Filled and Capped Plated
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100% fill with non-conductive
or conductive ink
Copper MetallizationVia-in-pad formation

1. Type VII Filled and Capped Plated
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• Tented?
1. The term tenting has been used with many different end
results.
A. Tenting = Vias are to be covered with LPI solder mask on both
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A. Tenting = Vias are to be covered with LPI solder mask on both
sides.
B. Tenting = Dry film mask covering vias.
C. Tenting = Vias are to be plugged and covered with LPI solder
mask.
2. A very dangerous and outdated term which is still used in many
specifications today.
3. Per IPC-4761 Type I dry film mask is a capability few board
fabricators posses today. Nearly 100% of all manufactures
utilize LPI solder mask.

• When to use a plugged or filled via?
1. A plugged via is typically used to prevent solder transfer from
one side of the hole to the other. It can also be used to
improve the vacuum effect during ICT testing.
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improve the vacuum effect during ICT testing.
A. Plugging is a partial penetration of the mask material into the
hole. There are different processes for performing this task.
Consult your board fabricator for which method is used.
i. Plug before final mask application, Plug performed after final finish is
applied.
2. A filled via is typically used for either thermal transfer (utilizing a
conductive ink) or a via-in-pad requirement. Other uses may
be for improved reliability of the hole as it is 100%
encapsulated.

• Specification and why it’s so important
1. The best way to specify via protection is to utilize the IPC-4761
specification.
2. Over half of all new prototype orders we take do not specify via
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2. Over half of all new prototype orders we take do not specify via
protection correctly.
3. This creates costly delays as well as the potential for the
finished PCB to be manufactured based on an incorrect
interpretation.
4. Potential for adding additional costs where they are not needed
or not providing the needed protection required by the design.

PanelizationPanelization: who decides and why does it: who decides and why does it
matter?matter?
1. Panelization is the process of taking a single-up
design and step and repeating that design.
A. Array – Step and repeated one-up design
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A. Array – Step and repeated one-up design
B. Panel – PCB fabricator takes the array and step and
repeats it into the manufacturing panel.
2. Consulting PCB house is critical to getting the most
cost effective usage of the manufacturing panel.
3. Poor panelization can often double the cost of a
PCB.

matter?matter?
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Single Up
Design
Step and Repeated
Design - Array
Step and Repeated
Array - Panel

matter?matter?
1. Utilizing software tools like Kwickfit (www.micromeg.com) array
and panel utilization can be easily developed before the
fabricator receives the design.
Understanding the assembly set-up, component placement,
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2. Understanding the assembly set-up, component placement,
and fabricator’s panel is critical to avoiding long delays at the
fabricators front end CAM department.
3. These delays increase labor content and extend lead times
sometimes significantly.
4. It is not uncommon to have to set-up an array 2 or more times
at the PCB fabricator due to the array not being defined during
the design cycle.

What level of test do you want and need?What level of test do you want and need?
1. 100% electrical test for opens and shorts should
always be done on any PCB.
2. AOI (automatic optical inspection) is typically
performed on all inner/outer layers and will identify
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performed on all inner/outer layers and will identify
open, shorts, nicks, neck downs, and other etching
and material defects. The earlier these defects can
be detected the quicker the board fabricator can
react especially in a quick turn order.
3. If impedance is part of your design then TDR testing
is a most.
4. Ionic contamination testing.
5. Cross sectioning to validate plated holes.

1. Electrical test of the final PCB
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1. AOI for inspection of inner and outer layers
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1. TDR Testing for impedance controlled designs.
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1. Ionic contamination testing.
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Cleanliness is defined by IPC-6012Cleanliness is defined by IPC-6012
As not exceeding 1.56ug/cm2 of sodium chloride

1. Cross sectional analysis.
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What is tooling?What is tooling?
1. Tooling is the artwork and associated programs
which must be generated to produce the PCB.
A. All Copper layers
B. All Solder mask layers
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All Solder mask layers
C. All legend layers
D. All drill data
E. All routing data
F. AOI data
G. Electrical test data
H. TDR test (if required)
I. Specialty data
i. Carbon pads
ii. Beveling
iii. Counter bore/sinks

Ensuring Transferability?Ensuring Transferability?
1. Engage with your board fabricator directly and early
in the design phase.
2. Specify so that any fabricator will understand your
requirements. Use IPC spec call outs whenever
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requirements. Use IPC spec call outs whenever
possible.
3. Get feedback from the prototype build.
A. Stack-up used (construction)
B. Material certs
C. Cross section results
D. Test data
4. Request working data from the prototype build for
the production house as a reference.

Simple ways to control your costs?Simple ways to control your costs?
• In Summary
1. Panelize your design into an economical array which works for
both the assembly and PCB fabricator. Consider this just as
important as the design itself.
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2. Specify material’s based on the IPC-4101 whenever possible.
3. Chose a final finish which meets the needs of your assembly
taking into account the lesson's learned today.
4. Specify via protection utilizing IPC-4761 whenever possible.
5. Validation of the product and its results are critical to future
success in production.
6. Understand tooling and how it may affect the product through
the prototype to production cycle.

The Eagle TeamThe Eagle Team
• Mike Kalaria
President and CEO
One of the original founders
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One of the original founders
Degreed mechanical engineer
Over 35 years in the industry

• Brett McCoy
Vice President / Director of Sales
8 Years with Eagle
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8 Years with Eagle
18 Years in the industry
Technical Degree from Purdue

• Charlie Savaliya
Quality Manager
4 Years with Eagle
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4 Years with Eagle
Six Sigma Black Belt
IPC A-600 Certified Trainer

• Nori Luciano
Operations Manager
8 Years with Eagle
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8 Years with Eagle
Degree in Business Management

• Dawn McConnell
Customer Service Manager
17 Years with Eagle
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17 Years with Eagle
Best Service in the Business!!

EE driving the cost out of your design

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