The document discusses system-in-package (SiP) technology. It defines SiP as integrating multiple integrated circuits and passive components onto a single substrate to create a modular component. The document compares SiP to other packaging technologies and discusses the opportunities and challenges of SiP. It outlines various SiP solutions from Amkor Technology and describes applications of SiP in markets like wireless devices, solid-state drives, automotive, and the Internet of Things.