 Founded 1987

 Former Battelle Institute Staff

 Printed Circuit Board Sourcing Worldwide

 Combining Off-Shore Price with Local

  Service
Robert Simon, CEO
Amy Holbrook, Operations Manager
                                                       Wendy Lang, Vice President




                                                                                    Allene Ehrhardt,
                                                                                    Systems Manager



                               Craig Schneider, IT
  Deb Aungst, Business Manager Manager                    Mike Clevenger, CPA
 Underwriters Labs

 ISO 9001:2008

 ISO 14001

 TS 16949

 QS9000

 ITAR
Instrumentation
Power
Lighting
Consumer
Medical/Comm
Other
US $k
$2,000.00

$1,500.00

$1,000.00

 $500.00

   $0.00
 Blind and buried vias

 Laser drilling

 Impedance control

 Heavy copper and gold

 Scoring/routing/punching

 FR4, Tg180, Hi-

  freq, Rogers, Aluminum

 RoHS HAL / ENIG / OSP / Carbon

  ink

 Peelable solder mask
1
2
4
6
8
Other
   Max Layers            6 (Flex)
                         10 (Rigid)
   Max Board Size        600mm x 600mm(24'' x 24'')
   Board Thickness       0.05~0.2mm (FPCB)
                         0.20~3.2mm (RPCB)
   Min Board Thick       4 layers: 0.38mm (15mils)
                         6 layers: 0.55mm (22mils)
                         8 layers: 0.80mm (32mils)
                         10 layers: 1.00mm (40mils)
   Max Copper Thickness                6 oz (External) / 3 oz (Inner)
   Min Line Width/Space0.10mm (4mils)
   Min Hole Diameter 0.15mm (6mils)
   Hole Position Deviation             ±0.075mm (3mils)
   PTH hole dia tolerance              ±0.05mm (2mils)
   NPTH hole dia tolerance ±0.03mm (1.5mils)
   Impedance Cntrl Tolerance ±8% (≤50Ω)
                               ±10% (>50Ω)
   Board Thickness Tolerance ±10% (>1.0mm)
                              ±8% (<1.0mm)
   Max Au ENIG            3u''
   Max Au Finger          50u''
   Min Bridge SM Width 5mils
   Bent and Twist         ≤0.75%
   Aspect Ratio           10:1
   Insulation Resistance >1000 billionΩ Normal
   Peel-off Strength      1.4N/mm
   Solder Mask Abrasion >6H
   Thermal Stress         255 ℃ 10 seconds
   E-Test Voltage         250V
   V-cut                 30°/45°
Engineering      →        Film Plots        →    Laminate Inspection


    Image Development   ←   Inner Layer Exposure   ←     Substrate Cutting      8
9       Oxidation       →     Inner Circuits AOI   →      Inner Layer Etch


        De-smear        ←         Hole Drill       ←         Lamination         8
9   Image Development   →   Outer Layer Exposure   →       Copper Plate


    Legend Silkscreen   ←       Solder Mask
                                                   ←      Inner Layer Etch
                                                                                8
9      100% E-test      →     Route and V-cut      →       HAL or ENIG


    Package and Ship    ←      Vacuum Pack         ←   100% Visual Inspection   8
 Facilities meet international standards
  for process water treatment.
 Gerber files


 Aperture list


 Board specification


 Panel specification


 Special requirements
 Part Number


 Revision number


 Readme file name


 Panel general guideline name


 Panel print name
 Material type, temp. rating  Copper finished each layer
 Thickness                   Copper in hole minimum
 RoHS required               Blind/Buried vias
 Finish type & thickness     Solder mask color and
 Individual board size        sides
 Layers and Stack-up         Legend color and sides
                              IPC class
 Date code on board (Y/N)


 Date code location spec'd (Y/N)


 UL logo/V0 required


 UL logo/V0 location spec'd (Y/N)
Panelized #-up
Panel size (exact/min./max.)
Panels: Score/Route/Either/Both
V-score web thickness remaining
Tooling holes and fiducials spec'd
X-outs allowed: # or %
Certificate of compliance
Full QC report
X-section details
E-test stamp on each panel
E-test stamp on each board
 Special packaging


 Chosen transportation


 Quantity and date schedule
 Quotations within 24 hrs
 Standard shipment 3 weeks
 Fast turn shipment 1 week (protos)
 Accelerated turns available
 WIP monitoring
 Expediting
 Order Tracking
 Inventory management
 Wide variety of product supplied
 Rapid response to quotes
 Extended availability
 Expediting at reduced cost
 Competitive pricing
 Flexible scheduling
 Deep-seated customer support
 USTEK expedites, schedules, and coordinates
  information transfer:
    OEM D CM D USTEK D Factory
 USTEK Top tier status gets the CM:
    Priority production scheduling
    Preferential pricing
    Designated factory q.c. team
    Favored shipping schedule
    Tailored packaging
 Dedication to customer satisfaction
 Technical training enhancement
 Commitment to zero defects
 Rapid response to inquiries
 Competitive prices
 On-time delivery
 Team effort
 Lifeline Pilots:
     USTEK donates pilot time and money for long distance transportation of critically ill
       patients and family members. Lifeline Pilots is a network of private and corporate
       pilots who at no charge cooperate to ferry patients across the country between their
       homes and treatment facilities.

 Team Greyhound Adoption:
     USTEK donates staff time and money to support and underwrite the cost of rescuing
       retired racing greyhounds, vetting them, fostering them, and placing them into
       permanent homes. Team Greyhound uses several prisons within the state of Ohio
       where the dogs undergo initial acclimation to a non-kennel life and learn basic
       commands, while at the same time providing the inmates with a valuable activity that
       engenders self worth and eases them back into society after their release.

 Environmental Awareness:
     USTEK partners only with environmentally sensitive companies and ensures that all
       comply with regional and international standards. USTEK practices
       conservation, reuse, and recycling of all manufacturing, packaging, and shipping
       materials.
 Phone us to discuss design options for enhancing your product
  performance and reducing total cost.

 Send us your specification and Gerbers and we will respond
  within 24 hours with a quote:
    E-mail:   Info @ ustek.com
    Phone:    614.538.8000
    Fax:      614.538.8002
    Mail:     4663 Executive Drive #3, Columbus, OH 43220

USTEK Pcb Presentation

  • 2.
     Founded 1987 Former Battelle Institute Staff  Printed Circuit Board Sourcing Worldwide  Combining Off-Shore Price with Local Service
  • 3.
    Robert Simon, CEO AmyHolbrook, Operations Manager Wendy Lang, Vice President Allene Ehrhardt, Systems Manager Craig Schneider, IT Deb Aungst, Business Manager Manager Mike Clevenger, CPA
  • 4.
     Underwriters Labs ISO 9001:2008  ISO 14001  TS 16949  QS9000  ITAR
  • 5.
  • 6.
  • 7.
     Blind andburied vias  Laser drilling  Impedance control  Heavy copper and gold  Scoring/routing/punching  FR4, Tg180, Hi- freq, Rogers, Aluminum  RoHS HAL / ENIG / OSP / Carbon ink  Peelable solder mask
  • 8.
  • 9.
    Max Layers 6 (Flex)  10 (Rigid)  Max Board Size 600mm x 600mm(24'' x 24'')  Board Thickness 0.05~0.2mm (FPCB)  0.20~3.2mm (RPCB)  Min Board Thick 4 layers: 0.38mm (15mils)  6 layers: 0.55mm (22mils)  8 layers: 0.80mm (32mils)  10 layers: 1.00mm (40mils)  Max Copper Thickness 6 oz (External) / 3 oz (Inner)  Min Line Width/Space0.10mm (4mils)  Min Hole Diameter 0.15mm (6mils)  Hole Position Deviation ±0.075mm (3mils)  PTH hole dia tolerance ±0.05mm (2mils)  NPTH hole dia tolerance ±0.03mm (1.5mils)  Impedance Cntrl Tolerance ±8% (≤50Ω)  ±10% (>50Ω)  Board Thickness Tolerance ±10% (>1.0mm)  ±8% (<1.0mm)  Max Au ENIG 3u''  Max Au Finger 50u''  Min Bridge SM Width 5mils  Bent and Twist ≤0.75%  Aspect Ratio 10:1  Insulation Resistance >1000 billionΩ Normal  Peel-off Strength 1.4N/mm  Solder Mask Abrasion >6H  Thermal Stress 255 ℃ 10 seconds  E-Test Voltage 250V  V-cut 30°/45°
  • 10.
    Engineering → Film Plots → Laminate Inspection Image Development ← Inner Layer Exposure ← Substrate Cutting 8 9 Oxidation → Inner Circuits AOI → Inner Layer Etch De-smear ← Hole Drill ← Lamination 8 9 Image Development → Outer Layer Exposure → Copper Plate Legend Silkscreen ← Solder Mask ← Inner Layer Etch 8 9 100% E-test → Route and V-cut → HAL or ENIG Package and Ship ← Vacuum Pack ← 100% Visual Inspection 8
  • 12.
     Facilities meetinternational standards for process water treatment.
  • 13.
     Gerber files Aperture list  Board specification  Panel specification  Special requirements
  • 14.
     Part Number Revision number  Readme file name  Panel general guideline name  Panel print name
  • 15.
     Material type,temp. rating  Copper finished each layer  Thickness  Copper in hole minimum  RoHS required  Blind/Buried vias  Finish type & thickness  Solder mask color and  Individual board size sides  Layers and Stack-up  Legend color and sides  IPC class
  • 16.
     Date codeon board (Y/N)  Date code location spec'd (Y/N)  UL logo/V0 required  UL logo/V0 location spec'd (Y/N)
  • 17.
    Panelized #-up Panel size(exact/min./max.) Panels: Score/Route/Either/Both V-score web thickness remaining Tooling holes and fiducials spec'd X-outs allowed: # or %
  • 18.
    Certificate of compliance FullQC report X-section details E-test stamp on each panel E-test stamp on each board
  • 19.
     Special packaging Chosen transportation  Quantity and date schedule
  • 20.
     Quotations within24 hrs  Standard shipment 3 weeks  Fast turn shipment 1 week (protos)  Accelerated turns available  WIP monitoring  Expediting  Order Tracking  Inventory management
  • 21.
     Wide varietyof product supplied  Rapid response to quotes  Extended availability  Expediting at reduced cost  Competitive pricing  Flexible scheduling  Deep-seated customer support
  • 22.
     USTEK expedites,schedules, and coordinates information transfer:  OEM D CM D USTEK D Factory  USTEK Top tier status gets the CM:  Priority production scheduling  Preferential pricing  Designated factory q.c. team  Favored shipping schedule  Tailored packaging
  • 23.
     Dedication tocustomer satisfaction  Technical training enhancement  Commitment to zero defects  Rapid response to inquiries  Competitive prices  On-time delivery  Team effort
  • 24.
     Lifeline Pilots:  USTEK donates pilot time and money for long distance transportation of critically ill patients and family members. Lifeline Pilots is a network of private and corporate pilots who at no charge cooperate to ferry patients across the country between their homes and treatment facilities.  Team Greyhound Adoption:  USTEK donates staff time and money to support and underwrite the cost of rescuing retired racing greyhounds, vetting them, fostering them, and placing them into permanent homes. Team Greyhound uses several prisons within the state of Ohio where the dogs undergo initial acclimation to a non-kennel life and learn basic commands, while at the same time providing the inmates with a valuable activity that engenders self worth and eases them back into society after their release.  Environmental Awareness:  USTEK partners only with environmentally sensitive companies and ensures that all comply with regional and international standards. USTEK practices conservation, reuse, and recycling of all manufacturing, packaging, and shipping materials.
  • 25.
     Phone usto discuss design options for enhancing your product performance and reducing total cost.  Send us your specification and Gerbers and we will respond within 24 hours with a quote:  E-mail: Info @ ustek.com  Phone: 614.538.8000  Fax: 614.538.8002  Mail: 4663 Executive Drive #3, Columbus, OH 43220