This document summarizes Quest's capabilities for manufacturing printed circuit boards. It lists their commitment to 7 vertical markets and describes their global footprint across existing offices in Europe, Singapore, Sri Lanka, Middle East, India, and China. It also provides details on their product and service offerings including layer counts, board sizes, materials, design features, and production processes. Tables outline their process capabilities for layer registration, minimum line widths, hole sizes, surface finishes, electrical testing parameters and more.

1. Building a Mutually Rewarding
Partnership
Quest’s Commitment to Delivering
Unequaled Value to our Partners

2. Verticals
1. Medical
2. Avionics
3. Telecom , computing and
networking
4. Defense
5. Industrial 6.Automobile
7. Consumer
OEM’s
ODM’s
Design Houses
& Government
Establishment
CEM (EMS)
Our Market Segments

3. Europe
Singapore
SriLanka
Middle East
India
China
Existing office
Expansion plan
Global Foot Print

4. Prototypes

5. Product and Service Offering
Products
• Double Side Board
• 36 Layers 550mm*450mm for communication application
• 20 Layers with C.I. 2.4mm thickness
• 26 Layers with immersion gold and C.I.
• Upto 12 Layers flex rigid of any combinations (Maximum size 305mm x 455 mm)
• 26 Layers C.I. for communication application
• 18 Layers, HDI Laser drilling both sides
• 16 Layers, blind and buried vias
• 12 Layers, HDI 2 build up from each side for medical application
• Board with heat sink
Services
Fast Prototyping from 5 to 15 working days (Ex-works)
• Standard Delivery Time : 2 to 3 weeks
• Quick Delivery : 1 to 2 Weeks
• Volume Delivery: 3 to 4 weeks
Medium and high quantities

6. ROW MATERIAL
DRILLING
EXPOSING A.O.ICUTTING
PATTERN
PLATING
P.T.H
PRESSING
EXPOSING
 Lot No.
 Thickness
 Step Wedge
 No Deviation
Between Layers
 Open
 Short
 Line And
Space Width
 Lab. Inspection
 Over Plating
 Coating Thickness
In Holes
 Step Wedge
 Breakout
 Deviation
 Open
 Short
 Line Reduction
 Lab. Inspection
 Pressure
 Temperature
 Vacuum
 Thickness
 Resin Flow
 Delimitation
FILM
STRIPPER
ETCHING TIN STRIPPER SOLDER MASK
 Visual Inspection
 Visual Inspection
 Conductor width
 Open / Short
 No Copper
 Residues Of Film
 Visual Inspection  Visual Inspection
 No Deviation
 No S.M On Pads
And Inside Holes
SHIPMENT FINAL
INSPECTION
ELECTRICAL
TEST
ROUTING
PRINTINGH.A.L
 Inspection According To
Mechanical Drawing
 Visual
Inspection
 Clear Marking
 No Color
On Pads
 Visual Inspection
 Uniform Tin Lead
Coating
 No Exposed Pads
 Open Holes
 Short
 No Missing Holes
 No Extra Holes
 No Deviation
 X-Ray Inspection
 Visual Inspection
 Dimensional Inspection
 Incoming Inspection
OUTER LAYER
IN PROCESS QUALITY FLOW CHART
INNER LAYER

7. Production

8. Roadmap of Capacity
0
100000
200000
300000
400000
500000
600000
700000
800000
2000 2001 2002 2003 2004 2005 2006 2007

9. s/n Item Capability description
1 Layers count 1- 36 layers
2 Finished Board Thickness 16~134mil(0.4mm – 3.4mm)
3 Max. panel size 21.5” × 24.5” ( 622mm × 546mm )
4 Available Laminates Material
FR-4, CEM-1,CEM-3, Aluminum-based, High Frequency, High
Tg, High CTI,Teflon, Halogen Free. Lead free compatible
5 Finished board Thickness tolerance
≤1.0mm ±0.10mm (±4mil) 1.0~1.6mm ±0.15mm
（6mil）
6 Inner thin core Min. thickness 4mil (0.10mm)
7 Min. Inner Line Width/Spacing 3/3mil (0.075/0.075mm)
8 Min. outer Line width/spacing
3/3mil (0.075/0.075mm)[for gold plating PCB]; 4/4mil
(0.10/0.10mm)[for HASL PCB];
9 Layer-layer registration tolerance ± 2mil (± 0.05mm )
10 Copper foil thickness 12u,18u, 35u, 70 u, 105u, 140u, 175u, 210u (1/3oz-6oz)
11 Min. finished hole size 0.15mm (6mil)
Process Capability

10. s/n Item Capability description
12 Min. drilling bit size 0.20mm
13 Max. drilling bit size 6.30mm
14 Finished hole size tolerance (PTH) ± 0.08mm (±3mil)
15 Finished hole size tolerance (NPTH) ± 0.050mm (±2mil)
16
Drill hole true position tolerance
(Compared with CAD data)
± 0.08mm (±3mil)
17 PTH hole copper thickness >=25um (1.0mil)
18 Max. Aspect ratio 8:1
19 Impedance Control ±10%
20 Min SMT PAD Pitch & precision tolerance 0.4±0.1mm (16±4mil)
21 Min. solder mask opening 0.05mm (2mil)
22 Min. Solder mask coverage 0.05mm (2mil)
23 Min. solder dam 0.076mm (3mil)
Process Capability

11. s/n Item Capability description
24 Surface Finished
OSP, Gold plating, Gold finger, HASL, Peelable Solder Mask, carbon
ink, , ENIG, Immersion silver, Immersion Tin, HASL (lead free).
25 G/F Au thickness 0.76um max (30u“ max)
26 ENIG thickness Ni: 2.54-6um / Au: 0.05-0.15um (100~238U" / 2~6U")
27 Immersion silver 8-12U" (0.20um-0.30um)
28 Immersion Tin 0.8~1.2um (31.5~48U")
29 OSP ENTEK PLUS HT:0.3-0.5um ; F2:0.15-0.3um
30 V-Cut angle 30°、45°、60°
31 Min. V-cut board thickness 0.4mm
32 Gold finger Chamfer angle 20°、30°、45°
33 Profiling mode Routing & Punching
34 profiling tolerance ± 0.10mm (4mil)
35 E-Test voltage 250 ± 5V
36 Max. E/T Insulation resistance 100 MΩ
37 Min. E/T conductive resistance 10Ω
Process Capability

12. Thank You!
Contact : Rajesh
Mobile : 9008457144
Email: rbc@qspec.in