Unit1_Lecture1_Basic Planar Processes.ppt

1. Overview of Silicon Semiconductor
Technology
Module 1 – CMOS Technology
Module 1 – CMOS Technology

2. Learning Outcome
Learning Outcome
 Students will be able to illustrate the processing steps
in silicon semiconductor technology
Lecture 1 - Overview of Silicon
Semiconductor Technology 2
Course Outcome (CO1)
 Students will be able to Familiarize the process involved in
fabrication of CMOS Technology

3. Basic Planar Processes
Basic Planar Processes

4. Processes used to fabricate IC
Processes used to fabricate IC
Silicon Wafer (Substrate) Preparation
Epitaxial Growth
Oxidation
Photolithography
Diffusion
Ion Implantation
Isolation Technique
Metallization
Assembly Processing and Packaging

5. Silicon Wafer Preparation
Silicon Wafer Preparation
Czochralski Crystal Growth
Czochralski Crystal Growth

6. Silicon Ingot & Ingot Slicing
Silicon Ingot & Ingot Slicing

7. Wafer Polishing and Etching
Wafer Polishing and Etching

9. Epitaxial Growth
Epitaxial Growth

10. Oxidation
Oxidation
Si + 2H2O SiO2 + 2H2

11. Photolithography
Photolithography

12. Diffusion
Diffusion

13. Ion Implantation
Ion Implantation

14. Isolation Techniques
Isolation Techniques
PN Junction Isolation
Dielectric Isolation

15. PN Junction Isolation
PN Junction Isolation

16. Dielectric Isolation
Dielectric Isolation

17. Metallization
Metallization
Aluminium is used in metallization due to
following reasons:
It is a good conductor.
Easy to deposit using aluminium films
using vacuum deposition
It makes good mechanical bonds with
silicon
It forms low resistance contact with p type
Si and heavily doped n-type Si.

18. Vacuum Evaporation
Vacuum Evaporation

19. Assembly Processing and Packaging
Assembly Processing and Packaging

20. Assembly Processing and Packaging
Assembly Processing and Packaging