Simplified vs. Detailed

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Craig Hillman

© 2004 – 2010
Sherlock Automated Design
Analysis™

© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Model Simplifications for Rapid Assessment of
Interconnects
o Unique scaling challenge of modeling the
robustness of soldered interconnects of
electronics
o Large assembly with thousands of small solder joints
(sub mm)
o Sherlock uses simplified component structures that
approximate the mass and stiffness of the electronic
component without modeling the actual interconnects

© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Model Comparison
o Quarter symmetric model of BGA device under
board bending moment.
o Sherlock uses package dependent board level
strain fatigue models for vibration predictions

© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Models
o Board parameters are identical
o Detailed part includes individual solder joints, die,
substrate and lid
o Simplified part just includes substrate

© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o Identical bending moments applied to board
edges
Displacement Results
≈ 2% Difference
Detailed
0.2618 mm
Simplified
0.2672 mm

© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Principal Board Strains
Simplified
Detailed
Similar corner
PCB strains

© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Discussion
o Based on the board level deflections the
difference between the two models will not have
a significant impact on the dynamic response of
the circuit board.
o Both models generate similar PCB strains

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