reliability xbox red rings of death flip chip solder fatigue underfill solder bump glass transition tg radiation nasa qualification eee parts small missions cubesat space ffop rate of occurrence of failure mean cumulative function maintenance free operating period failure free operation period b10 mfop mcf rocof prediction maintenance avionics safety failure rate repair mtbf dfr solutions electronic packaging hermetic mil-std-750 hermeticity mil-std-883 mems mil-std-202 wearables design iot wearable electronics dfr
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