 SANJAY . D .
DHNDARE
29/09/15 1ME(E&TC engg.),DYPSOE,Lohegaon,Pune
CONTENT :
 Introduction
 Brief history
 Need
 Boundary Scan Test
 Terminology used
 Working
 What is four wire test ?
29/09/15 2ME(E&TC engg.),DYPSOE,Lohegaon,Pune
Cont....
 BST cell and its VHDL code
 BST register
 TAP controller
 Signal specification
 Timing diagram
 Conclusion
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 3
INTRODUCTION
 What is scan test ?
 The method in which testing of boards , separate
components and ASIC is carried out in a efficient
way is called as scan test.
 It is also known as Boundary Scan Test (BST).
29/09/15 4ME(E&TC engg.),DYPSOE,Lohegaon,Pune
BRIEF HISTORY
 1985 : JETAG studied a board testing
 1986 : JETAG became JTEG
 1990 : ANSI provide 2.0 standard
 1994 : JTAG formed 2.0 standard with
1149.1 IEEE standard
 1994 : New standard for test port and BST
i.e.1149.1b
 From 1994 IEEE standard still referred as a
JTAG standard
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 5
NEED
 Existing technology i.e. Bed-of-nail had limited
specification .
 Difficult to test the IC with closer pin spacing.
 Testing speed is generally low .
 Only one component testing is carried out at
one time .
 Separation below 0.1mm or 100 mm with 200
or more pins is not possible in bed-of-nail
testing .
 Need standard System Test Port and Bus.
29/09/15 6ME(E&TC engg.),DYPSOE,Lohegaon,Pune
BOUNDARY SCAN TEST
29/09/15 7ME(E&TC engg.),DYPSOE,Lohegaon,Pune
WHAT IS FOUR WIRE TEST ?
 The method include four basic signal to test
the device.
 TDI : Test Data Input
 TDO :Test Data Output
 TCK :Test Clock
 TMS :Test Mode Select
 RST (OPTIONAL) : Reset signal
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 8
TERMINOLOGY USED
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 9
BST CELL AND ITS VHDL CODE
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 10
BST REGISTER
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 11
TAP CONTROLLER STATE DIAGRAM
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 12
TIMING DIAGRAM
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 13
POWER ON RESET FOR TAP
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 14
BST INSTRUCTION
 SAMPLE /PRELOAD : To get snapshot of
chip output signal i.e. put data on a chip to
be test .
 EXTEST : To test off-chip circuits
 INTEST : To test on-chip circuits
 CLAMP : Forces component output to be
driven by BSR
 INCODE :To get the ID of device to be
check
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 15
Cont...
 USER CODE :To get the ID of user
programmable device under test
 HIGH Z: To bring the output all components
at high impedance state
 It will avoid damage of components
 Need to reset the controller or board when
goes into high impedance state
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 16
CONCLUSION
 From a given discussion we can conclude that it
is not possible to test printed circuit boards with
bed-of-nails tester to test multi-chip modules at all
without BST hence it is an important tool to test the
circuitry .
29/09/15 17ME(E&TC engg.),DYPSOE,Lohegaon,Pune
REFERENCES
 Digital system testing and testable design by
M.Abramovici .
 Agrawal.V. K. Multiple fault testing of large circuits
IEEE trans.vol c-30,no.11 pp 855 865.
 Introduction to testing and BIST by Breuer .M .A. And
A. D. Friedman.
29/09/15 18ME(E&TC engg.),DYPSOE,Lohegaon,Pune
.
Thank you ...
29/09/15 19ME(E&TC engg.),DYPSOE,Lohegaon,Pune

scan test by sanjay d dhandare

  • 1.
     SANJAY .D . DHNDARE 29/09/15 1ME(E&TC engg.),DYPSOE,Lohegaon,Pune
  • 2.
    CONTENT :  Introduction Brief history  Need  Boundary Scan Test  Terminology used  Working  What is four wire test ? 29/09/15 2ME(E&TC engg.),DYPSOE,Lohegaon,Pune
  • 3.
    Cont....  BST celland its VHDL code  BST register  TAP controller  Signal specification  Timing diagram  Conclusion 29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 3
  • 4.
    INTRODUCTION  What isscan test ?  The method in which testing of boards , separate components and ASIC is carried out in a efficient way is called as scan test.  It is also known as Boundary Scan Test (BST). 29/09/15 4ME(E&TC engg.),DYPSOE,Lohegaon,Pune
  • 5.
    BRIEF HISTORY  1985: JETAG studied a board testing  1986 : JETAG became JTEG  1990 : ANSI provide 2.0 standard  1994 : JTAG formed 2.0 standard with 1149.1 IEEE standard  1994 : New standard for test port and BST i.e.1149.1b  From 1994 IEEE standard still referred as a JTAG standard 29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 5
  • 6.
    NEED  Existing technologyi.e. Bed-of-nail had limited specification .  Difficult to test the IC with closer pin spacing.  Testing speed is generally low .  Only one component testing is carried out at one time .  Separation below 0.1mm or 100 mm with 200 or more pins is not possible in bed-of-nail testing .  Need standard System Test Port and Bus. 29/09/15 6ME(E&TC engg.),DYPSOE,Lohegaon,Pune
  • 7.
    BOUNDARY SCAN TEST 29/09/157ME(E&TC engg.),DYPSOE,Lohegaon,Pune
  • 8.
    WHAT IS FOURWIRE TEST ?  The method include four basic signal to test the device.  TDI : Test Data Input  TDO :Test Data Output  TCK :Test Clock  TMS :Test Mode Select  RST (OPTIONAL) : Reset signal 29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 8
  • 9.
    TERMINOLOGY USED 29/09/15 ME(E&TCengg.),DYPSOE,Lohegaon,Pune 9
  • 10.
    BST CELL ANDITS VHDL CODE 29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 10
  • 11.
    BST REGISTER 29/09/15 ME(E&TCengg.),DYPSOE,Lohegaon,Pune 11
  • 12.
    TAP CONTROLLER STATEDIAGRAM 29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 12
  • 13.
    TIMING DIAGRAM 29/09/15 ME(E&TCengg.),DYPSOE,Lohegaon,Pune 13
  • 14.
    POWER ON RESETFOR TAP 29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 14
  • 15.
    BST INSTRUCTION  SAMPLE/PRELOAD : To get snapshot of chip output signal i.e. put data on a chip to be test .  EXTEST : To test off-chip circuits  INTEST : To test on-chip circuits  CLAMP : Forces component output to be driven by BSR  INCODE :To get the ID of device to be check 29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 15
  • 16.
    Cont...  USER CODE:To get the ID of user programmable device under test  HIGH Z: To bring the output all components at high impedance state  It will avoid damage of components  Need to reset the controller or board when goes into high impedance state 29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 16
  • 17.
    CONCLUSION  From agiven discussion we can conclude that it is not possible to test printed circuit boards with bed-of-nails tester to test multi-chip modules at all without BST hence it is an important tool to test the circuitry . 29/09/15 17ME(E&TC engg.),DYPSOE,Lohegaon,Pune
  • 18.
    REFERENCES  Digital systemtesting and testable design by M.Abramovici .  Agrawal.V. K. Multiple fault testing of large circuits IEEE trans.vol c-30,no.11 pp 855 865.  Introduction to testing and BIST by Breuer .M .A. And A. D. Friedman. 29/09/15 18ME(E&TC engg.),DYPSOE,Lohegaon,Pune
  • 19.
    . Thank you ... 29/09/1519ME(E&TC engg.),DYPSOE,Lohegaon,Pune