The document discusses the economics and challenges of scaling in VLSI chip design. It describes how Moore's Law has led to an exponential increase in the number of transistors that can fit on a chip over time. However, continued scaling is facing challenges related to power consumption, leakage currents, and interconnect delays as features sizes shrink further. Design costs are also rising as more engineers and advanced tools are needed to design increasingly large and complex chips.
"Inspirerend, creatief en een tikkeltje pittig". Zo omschrijven klanten de dienstverlening van SY-NERGY.
Wij verrassen onze klanten graag met duurzame gebouwoplossingen, optimaal werkende installaties of een goed advies.
This document provides a curriculum vitae for Moses AK Kamarau, outlining his professional experience and qualifications as a Well Work Supervisor. It details his employment history working as a Well Work Supervisor for various oil and gas companies since 2007. It also lists his educational background and over 70 safety and technical training courses completed throughout his career related to well operations, including wireline, slickline, and supervision.
Tal is seeking a CFO position and has extensive experience as a CFO, including currently serving as CFO for a company that owns 11 movie theaters. He has over 10 years of experience managing finances for retail, manufacturing, and import/export companies. Tal is responsible, dedicated, and has strong leadership and communication skills.
Newton county parks & recreation upcoming eventsDLHill0508
The Newton County Parks & Recreation department has announced their upcoming events for the spring season. A 5k fun run will be held on April 15th at 8am in Central Park to raise funds for new playground equipment. An outdoor movie night will take place on May 1st at dusk in Town Square Park, featuring a screening of The Lion King. Additionally, registration is now open for youth baseball, softball, and soccer leagues for children ages 5 to 12 years old.
This short document promotes creating presentations using Haiku Deck on SlideShare. It encourages the reader to get started making their own Haiku Deck presentation by providing a button to do so. In a single sentence, it pitches presentation creation using Haiku Deck on SlideShare.
El documento describe las diferentes playas del norte de Perú, incluyendo Playa Huanchaco en Trujillo, Puerto Pacasmayo, Playa Pimentel en Chiclayo, Playa Tortuga en Chimbote y Playa Máncora en Piura. Estas playas se caracterizan por tener arena blanca y aguas tibias, en contraste con las playas grises y frías del sur de Perú.
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive function. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms for those who already suffer from conditions like anxiety and depression.
"Inspirerend, creatief en een tikkeltje pittig". Zo omschrijven klanten de dienstverlening van SY-NERGY.
Wij verrassen onze klanten graag met duurzame gebouwoplossingen, optimaal werkende installaties of een goed advies.
This document provides a curriculum vitae for Moses AK Kamarau, outlining his professional experience and qualifications as a Well Work Supervisor. It details his employment history working as a Well Work Supervisor for various oil and gas companies since 2007. It also lists his educational background and over 70 safety and technical training courses completed throughout his career related to well operations, including wireline, slickline, and supervision.
Tal is seeking a CFO position and has extensive experience as a CFO, including currently serving as CFO for a company that owns 11 movie theaters. He has over 10 years of experience managing finances for retail, manufacturing, and import/export companies. Tal is responsible, dedicated, and has strong leadership and communication skills.
Newton county parks & recreation upcoming eventsDLHill0508
The Newton County Parks & Recreation department has announced their upcoming events for the spring season. A 5k fun run will be held on April 15th at 8am in Central Park to raise funds for new playground equipment. An outdoor movie night will take place on May 1st at dusk in Town Square Park, featuring a screening of The Lion King. Additionally, registration is now open for youth baseball, softball, and soccer leagues for children ages 5 to 12 years old.
This short document promotes creating presentations using Haiku Deck on SlideShare. It encourages the reader to get started making their own Haiku Deck presentation by providing a button to do so. In a single sentence, it pitches presentation creation using Haiku Deck on SlideShare.
El documento describe las diferentes playas del norte de Perú, incluyendo Playa Huanchaco en Trujillo, Puerto Pacasmayo, Playa Pimentel en Chiclayo, Playa Tortuga en Chimbote y Playa Máncora en Piura. Estas playas se caracterizan por tener arena blanca y aguas tibias, en contraste con las playas grises y frías del sur de Perú.
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive function. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms for those who already suffer from conditions like anxiety and depression.
Laporan resmi praktikum elektronika p3 tentang mikrokontroler yang membahas sistem input/output, konverter analog-digital, dan interupsi eksternal yang disusun oleh Laurien Merinda untuk memenuhi tugas akhir praktikum di Institut Teknologi Sepuluh Nopember.
This document describes a software for determining decision-maker preferences in multi-criteria decision problems. The software uses numerical filters, including a pessimistic filter and arithmetic mean filter, to limit the solution space. It iteratively narrows the criteria ranges through shifting "cutting plains" until optimal solutions are identified that maximize some criteria while minimizing others. The stages of reaching solutions to four-criteria problems are presented through examples.
Martin Hawkins has over 12 years of experience in sales, customer service, and management. He has a proven track record of exceeding targets and received extensive training. His most recent role was as a Business Development Executive where he provided qualified leads and appointments to field sales professionals. He is seeking a new opportunity that utilizes his strong customer service, sales, and interpersonal skills.
- Ahmad Mostafa is a senior sales manager with over 21 years of experience in sales, marketing, and business development.
- He has a proven track record of developing sales strategies, managing distribution networks, and leading teams to achieve organizational goals.
- His areas of expertise include strategic planning, business development, channel management, and category management.
This document summarizes 3D printing techniques such as selective laser sintering (SLS), stereolithography (SL), and fused deposition modeling (FDM). It discusses how 3D printers work by adding materials layer by layer to create complex designs from CAD files. The document also outlines potential applications of 3D printing in industries like medical, food preparation, fashion, defense, entertainment, and architecture.
The project planning report outlines the steps to develop a new company website. Step 1 identifies that a website will boost sales and recognition by providing product information, availability, and payment options online. Step 2 defines the project scope as providing online transactions and ensuring security before launching by May 8, 2015. Step 3 involves fact-finding through surveys and user testing to understand customer wants. Step 4 analyzes costs, benefits, and technical requirements. Step 5 evaluates the feasibility from operational, technical, economic, and scheduling perspectives. Step 6 recommends moving forward with hiring a web vendor to develop the site within budget and timeline.
This document discusses several previous investigations that analyzed various manufacturing processes using MADML software. The investigations examined multi-parameter models related to electrolyte coating processes, thermal treatment of aluminum alloys, plasma coating deposition, and ion nitriding treatments. Experimental data and quality parameters from each process were analyzed to determine optimal process control parameters and trade-off solutions.
This design report outlines plans to launch an ecommerce website for Sauce Haus Co. to increase online sales of unique sauces. A beta version of the site is currently live at saucehaus.weebly.com. Feedback is being collected on the design, usefulness, and efficiency of the site. The report describes the site's interface, input/output design, and security measures. It is recommended to upgrade to Weebly's business plan to unlock more features and eliminate transaction fees. The IT department expects to complete the project within a week and maintain the site going forward.
- Ahmad Mostafa is a senior sales manager with over 21 years of experience in sales, marketing, and business development.
- He has a proven track record of developing sales strategies, managing distribution networks, and leading teams to achieve organizational goals.
- His areas of expertise include strategic planning, business development, channel management, and category management.
This is a very short document consisting of a single letter - "Aa". It does not contain much substantive information that can be summarized in 3 sentences or less. The document appears to be only the letter "Aa" without any other context provided.
The document discusses the tallest buildings in Ohio, with the Key Tower in Cleveland being the tallest. The next three tallest buildings are also located in Cleveland. The fourth tallest building is the Rhodes State Office Tower in Columbus. Tall buildings are typically constructed of steel, glass, and concrete and are characterized by their height exceeding surrounding structures, often being found in city centers.
Design and test challenges in Nano-scale analog and mixed CMOS technology VLSICS Design
The continuous increase of integration densities in Complementary Metal–Oxide–Semiconductor (CMOS) technology has driven the rapid growth of very large scale integrated (VLSI) circuit for today's high-tech electronics industries from consumer products to telecommunications and computers. As CMOS technologies are scaled down into the nanometer range, analog and mixed integrated circuit (IC) design and testing have become a real challenge to ensure the functionality and quality of the product. The first part of the paper presents the CMOS technology scaling impact on design and reliability for consumer and critical applications. We then propose a discussion on the role and challenges of testing analog and mixed devices in the nano-scale era. Finally we present the IDDQ testing technique used to detect the most likely defects of bridging type occurring in analog CMOS circuits during the manufacturing process and creating a resistive path between VDD supply and the ground. To prove the efficiency of the proposed technique we design a CMOS 90nm operational amplifier (Opamp) and a Built in Current Sensor (BICS) to validate the technique and correlate it with post layout simulation results.
This document outlines the course contents for a VLSI Design course. The course covers six units: (1) an introduction to VLSI design including Moore's Law and design challenges, (2) VLSI circuit design processes and technologies, (3) analysis of CMOS logic circuits, (4) advanced CMOS logic circuit techniques, (5) memories, and (6) testing and testability. The goal of the course is to provide students with knowledge of very large scale integration circuits, which are essential components in modern electronic devices.
This document discusses integrated circuit technology. It begins with an overview of the IC market breakdown by sector. It then discusses advantages of ICs such as smaller size, higher speed, lower power consumption compared to discrete components. The document provides a history of important IC inventions from 1904 to the present. It also discusses transistor scaling that has allowed achieving more complex ICs through reduced dimensions over time. Finally, it covers different IC design styles such as full custom, standard cell, gate array, and FPGA and their tradeoffs in terms of performance, cost, area, and time-to-market.
This document provides information about integrated circuit (IC) technology. It discusses the advantages of ICs over discrete components such as smaller size, higher speed, and lower power consumption. It outlines the early developments in IC technology from 1949 onwards. The document also discusses transistor scaling and how Moore's Law has allowed the semiconductor industry to achieve more complex ICs. Different IC circuit technologies such as BJT, CMOS, BiCMOS, SOI, and GaAs are briefly described. The scaling challenges at smaller technology nodes such as increased variability and static power are also mentioned.
This document provides an overview of VLSI (Very Large Scale Integration) and its applications. It discusses the history of integrated circuits from their inception in the late 1940s to today's advanced nanoscale technologies. Key topics covered include Moore's law of transistor scaling, digital circuit design challenges, CMOS fabrication processes, and examples of how VLSI is used in various electronic systems and devices.
This document provides an overview of Module 1 of the ECIE 4343 Very Large Scale Integrated Circuits (VLSI) Design course. The module introduces course logistics, content, and design implementation options. It outlines topics that will be covered including VLSI economy, MOSFET characteristics, circuit layout, fabrication, and CAD tools. A course schedule is provided listing weekly topics and assignments. Assessment breakdown consists of a final exam, project, midterm, and assignments/quizzes. Historical trends in transistor size reduction and integrated circuit scaling are reviewed.
A Low Power Solution to Clock Domain Crossingijtsrd
This paper presents a dual flip flop synchronizer circuit to address clock domain crossing issues. The synchronizer is designed using True Single Phase Clock (TSPC) logic and implemented using Silicon On Insulator (SOI) technology. Simulation results show the TSPC synchronizer on SOI improves rise time by 46.15%, fall time by 28.57%, reduces power dissipation by 24.23%, and reduces power delay product by 59.20% compared to an equivalent bulk CMOS design. The TSPC synchronizer on SOI also occupies less chip area than alternative synchronizer designs.
Analog and digital circuit design in 65 nm CMOS end of the road.docxZHKhan15
This document summarizes challenges in analog and digital circuit design for 65nm CMOS technology. It discusses how leakage currents, process variability, and interconnect delays increase as technologies scale down, posing new problems. A panel of experts will discuss whether 65nm marks the "end of the road" for continued design benefits from technology scaling or if issues can be addressed.
This document discusses the evolution of microelectronics from 1947 to present day. Some key points include:
- The first transistor was demonstrated in 1947 at Bell Labs. Fairchild developed the first planar process and monolithic IC in the late 1950s.
- Moore's Law, introduced in 1965, predicted the exponential increase in transistor density over time which has guided technological progress.
- Advances like MOSFET structures, lithography, and new materials have enabled continued miniaturization and increased integration levels from SSI to VLSI.
- Challenges now involve sustaining Moore's Law as physical limits are approached, with new approaches like quantum computing on the horizon.
Laporan resmi praktikum elektronika p3 tentang mikrokontroler yang membahas sistem input/output, konverter analog-digital, dan interupsi eksternal yang disusun oleh Laurien Merinda untuk memenuhi tugas akhir praktikum di Institut Teknologi Sepuluh Nopember.
This document describes a software for determining decision-maker preferences in multi-criteria decision problems. The software uses numerical filters, including a pessimistic filter and arithmetic mean filter, to limit the solution space. It iteratively narrows the criteria ranges through shifting "cutting plains" until optimal solutions are identified that maximize some criteria while minimizing others. The stages of reaching solutions to four-criteria problems are presented through examples.
Martin Hawkins has over 12 years of experience in sales, customer service, and management. He has a proven track record of exceeding targets and received extensive training. His most recent role was as a Business Development Executive where he provided qualified leads and appointments to field sales professionals. He is seeking a new opportunity that utilizes his strong customer service, sales, and interpersonal skills.
- Ahmad Mostafa is a senior sales manager with over 21 years of experience in sales, marketing, and business development.
- He has a proven track record of developing sales strategies, managing distribution networks, and leading teams to achieve organizational goals.
- His areas of expertise include strategic planning, business development, channel management, and category management.
This document summarizes 3D printing techniques such as selective laser sintering (SLS), stereolithography (SL), and fused deposition modeling (FDM). It discusses how 3D printers work by adding materials layer by layer to create complex designs from CAD files. The document also outlines potential applications of 3D printing in industries like medical, food preparation, fashion, defense, entertainment, and architecture.
The project planning report outlines the steps to develop a new company website. Step 1 identifies that a website will boost sales and recognition by providing product information, availability, and payment options online. Step 2 defines the project scope as providing online transactions and ensuring security before launching by May 8, 2015. Step 3 involves fact-finding through surveys and user testing to understand customer wants. Step 4 analyzes costs, benefits, and technical requirements. Step 5 evaluates the feasibility from operational, technical, economic, and scheduling perspectives. Step 6 recommends moving forward with hiring a web vendor to develop the site within budget and timeline.
This document discusses several previous investigations that analyzed various manufacturing processes using MADML software. The investigations examined multi-parameter models related to electrolyte coating processes, thermal treatment of aluminum alloys, plasma coating deposition, and ion nitriding treatments. Experimental data and quality parameters from each process were analyzed to determine optimal process control parameters and trade-off solutions.
This design report outlines plans to launch an ecommerce website for Sauce Haus Co. to increase online sales of unique sauces. A beta version of the site is currently live at saucehaus.weebly.com. Feedback is being collected on the design, usefulness, and efficiency of the site. The report describes the site's interface, input/output design, and security measures. It is recommended to upgrade to Weebly's business plan to unlock more features and eliminate transaction fees. The IT department expects to complete the project within a week and maintain the site going forward.
- Ahmad Mostafa is a senior sales manager with over 21 years of experience in sales, marketing, and business development.
- He has a proven track record of developing sales strategies, managing distribution networks, and leading teams to achieve organizational goals.
- His areas of expertise include strategic planning, business development, channel management, and category management.
This is a very short document consisting of a single letter - "Aa". It does not contain much substantive information that can be summarized in 3 sentences or less. The document appears to be only the letter "Aa" without any other context provided.
The document discusses the tallest buildings in Ohio, with the Key Tower in Cleveland being the tallest. The next three tallest buildings are also located in Cleveland. The fourth tallest building is the Rhodes State Office Tower in Columbus. Tall buildings are typically constructed of steel, glass, and concrete and are characterized by their height exceeding surrounding structures, often being found in city centers.
Design and test challenges in Nano-scale analog and mixed CMOS technology VLSICS Design
The continuous increase of integration densities in Complementary Metal–Oxide–Semiconductor (CMOS) technology has driven the rapid growth of very large scale integrated (VLSI) circuit for today's high-tech electronics industries from consumer products to telecommunications and computers. As CMOS technologies are scaled down into the nanometer range, analog and mixed integrated circuit (IC) design and testing have become a real challenge to ensure the functionality and quality of the product. The first part of the paper presents the CMOS technology scaling impact on design and reliability for consumer and critical applications. We then propose a discussion on the role and challenges of testing analog and mixed devices in the nano-scale era. Finally we present the IDDQ testing technique used to detect the most likely defects of bridging type occurring in analog CMOS circuits during the manufacturing process and creating a resistive path between VDD supply and the ground. To prove the efficiency of the proposed technique we design a CMOS 90nm operational amplifier (Opamp) and a Built in Current Sensor (BICS) to validate the technique and correlate it with post layout simulation results.
This document outlines the course contents for a VLSI Design course. The course covers six units: (1) an introduction to VLSI design including Moore's Law and design challenges, (2) VLSI circuit design processes and technologies, (3) analysis of CMOS logic circuits, (4) advanced CMOS logic circuit techniques, (5) memories, and (6) testing and testability. The goal of the course is to provide students with knowledge of very large scale integration circuits, which are essential components in modern electronic devices.
This document discusses integrated circuit technology. It begins with an overview of the IC market breakdown by sector. It then discusses advantages of ICs such as smaller size, higher speed, lower power consumption compared to discrete components. The document provides a history of important IC inventions from 1904 to the present. It also discusses transistor scaling that has allowed achieving more complex ICs through reduced dimensions over time. Finally, it covers different IC design styles such as full custom, standard cell, gate array, and FPGA and their tradeoffs in terms of performance, cost, area, and time-to-market.
This document provides information about integrated circuit (IC) technology. It discusses the advantages of ICs over discrete components such as smaller size, higher speed, and lower power consumption. It outlines the early developments in IC technology from 1949 onwards. The document also discusses transistor scaling and how Moore's Law has allowed the semiconductor industry to achieve more complex ICs. Different IC circuit technologies such as BJT, CMOS, BiCMOS, SOI, and GaAs are briefly described. The scaling challenges at smaller technology nodes such as increased variability and static power are also mentioned.
This document provides an overview of VLSI (Very Large Scale Integration) and its applications. It discusses the history of integrated circuits from their inception in the late 1940s to today's advanced nanoscale technologies. Key topics covered include Moore's law of transistor scaling, digital circuit design challenges, CMOS fabrication processes, and examples of how VLSI is used in various electronic systems and devices.
This document provides an overview of Module 1 of the ECIE 4343 Very Large Scale Integrated Circuits (VLSI) Design course. The module introduces course logistics, content, and design implementation options. It outlines topics that will be covered including VLSI economy, MOSFET characteristics, circuit layout, fabrication, and CAD tools. A course schedule is provided listing weekly topics and assignments. Assessment breakdown consists of a final exam, project, midterm, and assignments/quizzes. Historical trends in transistor size reduction and integrated circuit scaling are reviewed.
A Low Power Solution to Clock Domain Crossingijtsrd
This paper presents a dual flip flop synchronizer circuit to address clock domain crossing issues. The synchronizer is designed using True Single Phase Clock (TSPC) logic and implemented using Silicon On Insulator (SOI) technology. Simulation results show the TSPC synchronizer on SOI improves rise time by 46.15%, fall time by 28.57%, reduces power dissipation by 24.23%, and reduces power delay product by 59.20% compared to an equivalent bulk CMOS design. The TSPC synchronizer on SOI also occupies less chip area than alternative synchronizer designs.
Analog and digital circuit design in 65 nm CMOS end of the road.docxZHKhan15
This document summarizes challenges in analog and digital circuit design for 65nm CMOS technology. It discusses how leakage currents, process variability, and interconnect delays increase as technologies scale down, posing new problems. A panel of experts will discuss whether 65nm marks the "end of the road" for continued design benefits from technology scaling or if issues can be addressed.
This document discusses the evolution of microelectronics from 1947 to present day. Some key points include:
- The first transistor was demonstrated in 1947 at Bell Labs. Fairchild developed the first planar process and monolithic IC in the late 1950s.
- Moore's Law, introduced in 1965, predicted the exponential increase in transistor density over time which has guided technological progress.
- Advances like MOSFET structures, lithography, and new materials have enabled continued miniaturization and increased integration levels from SSI to VLSI.
- Challenges now involve sustaining Moore's Law as physical limits are approached, with new approaches like quantum computing on the horizon.
This document provides an outline and overview of key topics in computer architecture. It discusses three main classes of computers - desktops, servers, and embedded systems. It also defines important concepts like instruction set architecture, organization, hardware, and architecture. Several trends are covered, including improvements in integrated circuit technology, memory technology, network technology, and scaling of transistor performance over time. Power consumption in integrated circuits is also addressed. The document discusses cost trends in semiconductor manufacturing and metrics for measuring computer performance like response time and throughput.
This document outlines the key steps in VLSI design techniques, including system specification, functional design, logic design, circuit design, physical design, fabrication, and packaging. It discusses the history of integrated circuits and Moore's Law. The physical design cycle is described in more detail, including circuit partitioning, floorplanning, placement, routing, compaction, and verification. Finally, different design styles like full custom, standard cell, and gate array are compared.
This document introduces VLSI physical design. It discusses how the number of transistors on chips has rapidly increased over time, from 100,000 to over 3 million. Complex chip design is now only possible using computer-aided design tools. The document outlines the different levels of abstraction in chip design from behavioral modeling down to the cell/mask level. It provides examples of logical and architectural design, and discusses the different layout styles including full-custom, gate-array, and standard-cell approaches.
This document provides an overview of VLSI technology and VLSI design methodologies. It discusses the following key points:
1. VLSI design methodology involves multiple stages from system specification and architecture design to fabrication and packaging.
2. Top-down design methodologies involve describing the system at different levels of abstraction from system level to transistor level.
3. CMOS fabrication is described which involves various processes like oxidation, diffusion, deposition, etching to manufacture chips.
4. Challenges in VLSI technology include shrinking geometries, lower power voltages and higher frequencies which impact reliability. Understanding technology trends is important for efficient chip design.
IRJET - Low Power Design for Fast Full AdderIRJET Journal
This document describes the design of a low power, high speed full adder circuit using 45nm CMOS technology. It discusses how reducing the size of transistors from 65nm to 45nm allows for lower power consumption and higher processing speeds. A new hybrid full adder circuit is proposed that uses simultaneous XOR/XNOR gates and transmission gates to minimize delay and reduce dynamic and static power dissipation. Simulation results show the proposed 20T, 17T, 26T and 22T full adder circuits have higher speeds and lower power consumption than previous designs.
This document provides an overview of the history and fundamentals of VLSI technology and fabrication. It discusses the transition from vacuum tubes to transistors, the development of integrated circuits, and Moore's Law of transistor scaling. The key steps in VLSI chip fabrication are described, including wafer manufacturing, deposition, patterning, etching, and metallization. CMOS technology is highlighted as enabling large-scale integration due to its low power dissipation. The syllabus outlines topics like crystal growth, photolithography, oxidation, and testing/packaging.
This document provides an introduction to VLSI physical design automation. It discusses how physical design converts a circuit description into a geometric layout and involves steps like partitioning, floorplanning, placement, and routing. The document notes that physical design has become a dominant force in the design cycle due to deep submicron scaling. It also discusses ongoing challenges in physical design like the need for more optimal placement algorithms and the importance of considering manufacturability effects.
VLSI stands for Very Large Scale Integrated Circuits.
SSI – Small Scale Integration (50s and 60s)
1 – 10 transistors
Simple logic gates
MSI – Medium Scale Integration(70s)
10-100 transistors
logic functions, counters, etc
LSI – Large Scale Integration(80s)
100-10,000 transistors
First microprocessors on the chip
VLSI technology development nowadays is mostly focused on the downsizing of semiconductor devices, which is significantly reliant on advancements in complementary metal-oxide-semiconductor technology. Due to capacitance, shorter channel length, body biassing, faster-switching transistor, limited variability, and faster running transistor, Silicon-on-Insulator technology has seen a lot of changes. In comparison to traditional bulk technology, Silicon on Insulator offers intriguing new possibilities. The recent stalling of advancement in CMOS technology has been noticed. A fully depleted silicon on the insulator provides additional performance. Power usage and communication speed are two areas where performance can be improved. Silicon on insulator technology has the potential to reduce power consumption by nearly half while increasing speed by about 40%. Using the Atlas module of the SILVACO software, the research presents a comprehensive analysis of silicon on insulator-based nano metal oxide semiconductor field-effect transistors. Atlas is used to virtually construct a 20 nm silicon on insulator MOSFET. The gate metals employed are Aluminum, N. poly, W (Tungsten), and WSi2 (Tungsten Silicide), and their respective characteristics are obtained and compared. Finally, WSi2 was chosen as the final gate metal because it has the desired band offset, resulting in a positive threshold voltage without the need for any further implants in the channel region. Other metrics are collected, such as the variation of ID vs. VGS features at various values. There is also a fluctuation in drain current as a function of drain to source voltage.
This document provides an overview of a lecture on introduction to VLSI design. It discusses the course objectives which include understanding transistor operation, static and dynamic CMOS logic, power estimation, and designing digital circuits using HDLs. It outlines the major topics to be covered such as CMOS processing, components, design rules, combinational and sequential circuit design. It also discusses different design styles like full custom, ASICs, programmable logic and system on chip. Finally, it covers trends like Moore's law and historical transistor density growth in microprocessors.
This document discusses the basics of Very Large Scale Integration (VLSI) design. It begins with a brief history of transistors and integrated circuits. It then covers Moore's Law and the evolution of logic complexity in integrated circuits from single transistors to today's ultra-large scale integration. The rest of the document discusses VLSI design methodologies, including the design flow from behavioral to layout representations using a Y-chart. It emphasizes concepts like regularity, modularity, and locality to manage complexity in VLSI designs.
Literature Review Basics and Understanding Reference Management.pptxDr Ramhari Poudyal
Three-day training on academic research focuses on analytical tools at United Technical College, supported by the University Grant Commission, Nepal. 24-26 May 2024
KuberTENes Birthday Bash Guadalajara - K8sGPT first impressionsVictor Morales
K8sGPT is a tool that analyzes and diagnoses Kubernetes clusters. This presentation was used to share the requirements and dependencies to deploy K8sGPT in a local environment.
Using recycled concrete aggregates (RCA) for pavements is crucial to achieving sustainability. Implementing RCA for new pavement can minimize carbon footprint, conserve natural resources, reduce harmful emissions, and lower life cycle costs. Compared to natural aggregate (NA), RCA pavement has fewer comprehensive studies and sustainability assessments.
Using recycled concrete aggregates (RCA) for pavements is crucial to achieving sustainability. Implementing RCA for new pavement can minimize carbon footprint, conserve natural resources, reduce harmful emissions, and lower life cycle costs. Compared to natural aggregate (NA), RCA pavement has fewer comprehensive studies and sustainability assessments.
Optimizing Gradle Builds - Gradle DPE Tour Berlin 2024Sinan KOZAK
Sinan from the Delivery Hero mobile infrastructure engineering team shares a deep dive into performance acceleration with Gradle build cache optimizations. Sinan shares their journey into solving complex build-cache problems that affect Gradle builds. By understanding the challenges and solutions found in our journey, we aim to demonstrate the possibilities for faster builds. The case study reveals how overlapping outputs and cache misconfigurations led to significant increases in build times, especially as the project scaled up with numerous modules using Paparazzi tests. The journey from diagnosing to defeating cache issues offers invaluable lessons on maintaining cache integrity without sacrificing functionality.
TIME DIVISION MULTIPLEXING TECHNIQUE FOR COMMUNICATION SYSTEMHODECEDSIET
Time Division Multiplexing (TDM) is a method of transmitting multiple signals over a single communication channel by dividing the signal into many segments, each having a very short duration of time. These time slots are then allocated to different data streams, allowing multiple signals to share the same transmission medium efficiently. TDM is widely used in telecommunications and data communication systems.
### How TDM Works
1. **Time Slots Allocation**: The core principle of TDM is to assign distinct time slots to each signal. During each time slot, the respective signal is transmitted, and then the process repeats cyclically. For example, if there are four signals to be transmitted, the TDM cycle will divide time into four slots, each assigned to one signal.
2. **Synchronization**: Synchronization is crucial in TDM systems to ensure that the signals are correctly aligned with their respective time slots. Both the transmitter and receiver must be synchronized to avoid any overlap or loss of data. This synchronization is typically maintained by a clock signal that ensures time slots are accurately aligned.
3. **Frame Structure**: TDM data is organized into frames, where each frame consists of a set of time slots. Each frame is repeated at regular intervals, ensuring continuous transmission of data streams. The frame structure helps in managing the data streams and maintaining the synchronization between the transmitter and receiver.
4. **Multiplexer and Demultiplexer**: At the transmitting end, a multiplexer combines multiple input signals into a single composite signal by assigning each signal to a specific time slot. At the receiving end, a demultiplexer separates the composite signal back into individual signals based on their respective time slots.
### Types of TDM
1. **Synchronous TDM**: In synchronous TDM, time slots are pre-assigned to each signal, regardless of whether the signal has data to transmit or not. This can lead to inefficiencies if some time slots remain empty due to the absence of data.
2. **Asynchronous TDM (or Statistical TDM)**: Asynchronous TDM addresses the inefficiencies of synchronous TDM by allocating time slots dynamically based on the presence of data. Time slots are assigned only when there is data to transmit, which optimizes the use of the communication channel.
### Applications of TDM
- **Telecommunications**: TDM is extensively used in telecommunication systems, such as in T1 and E1 lines, where multiple telephone calls are transmitted over a single line by assigning each call to a specific time slot.
- **Digital Audio and Video Broadcasting**: TDM is used in broadcasting systems to transmit multiple audio or video streams over a single channel, ensuring efficient use of bandwidth.
- **Computer Networks**: TDM is used in network protocols and systems to manage the transmission of data from multiple sources over a single network medium.
### Advantages of TDM
- **Efficient Use of Bandwidth**: TDM all
A review on techniques and modelling methodologies used for checking electrom...nooriasukmaningtyas
The proper function of the integrated circuit (IC) in an inhibiting electromagnetic environment has always been a serious concern throughout the decades of revolution in the world of electronics, from disjunct devices to today’s integrated circuit technology, where billions of transistors are combined on a single chip. The automotive industry and smart vehicles in particular, are confronting design issues such as being prone to electromagnetic interference (EMI). Electronic control devices calculate incorrect outputs because of EMI and sensors give misleading values which can prove fatal in case of automotives. In this paper, the authors have non exhaustively tried to review research work concerned with the investigation of EMI in ICs and prediction of this EMI using various modelling methodologies and measurement setups.
ACEP Magazine edition 4th launched on 05.06.2024Rahul
This document provides information about the third edition of the magazine "Sthapatya" published by the Association of Civil Engineers (Practicing) Aurangabad. It includes messages from current and past presidents of ACEP, memories and photos from past ACEP events, information on life time achievement awards given by ACEP, and a technical article on concrete maintenance, repairs and strengthening. The document highlights activities of ACEP and provides a technical educational article for members.
DEEP LEARNING FOR SMART GRID INTRUSION DETECTION: A HYBRID CNN-LSTM-BASED MODELgerogepatton
As digital technology becomes more deeply embedded in power systems, protecting the communication
networks of Smart Grids (SG) has emerged as a critical concern. Distributed Network Protocol 3 (DNP3)
represents a multi-tiered application layer protocol extensively utilized in Supervisory Control and Data
Acquisition (SCADA)-based smart grids to facilitate real-time data gathering and control functionalities.
Robust Intrusion Detection Systems (IDS) are necessary for early threat detection and mitigation because
of the interconnection of these networks, which makes them vulnerable to a variety of cyberattacks. To
solve this issue, this paper develops a hybrid Deep Learning (DL) model specifically designed for intrusion
detection in smart grids. The proposed approach is a combination of the Convolutional Neural Network
(CNN) and the Long-Short-Term Memory algorithms (LSTM). We employed a recent intrusion detection
dataset (DNP3), which focuses on unauthorized commands and Denial of Service (DoS) cyberattacks, to
train and test our model. The results of our experiments show that our CNN-LSTM method is much better
at finding smart grid intrusions than other deep learning algorithms used for classification. In addition,
our proposed approach improves accuracy, precision, recall, and F1 score, achieving a high detection
accuracy rate of 99.50%.
Electric vehicle and photovoltaic advanced roles in enhancing the financial p...IJECEIAES
Climate change's impact on the planet forced the United Nations and governments to promote green energies and electric transportation. The deployments of photovoltaic (PV) and electric vehicle (EV) systems gained stronger momentum due to their numerous advantages over fossil fuel types. The advantages go beyond sustainability to reach financial support and stability. The work in this paper introduces the hybrid system between PV and EV to support industrial and commercial plants. This paper covers the theoretical framework of the proposed hybrid system including the required equation to complete the cost analysis when PV and EV are present. In addition, the proposed design diagram which sets the priorities and requirements of the system is presented. The proposed approach allows setup to advance their power stability, especially during power outages. The presented information supports researchers and plant owners to complete the necessary analysis while promoting the deployment of clean energy. The result of a case study that represents a dairy milk farmer supports the theoretical works and highlights its advanced benefits to existing plants. The short return on investment of the proposed approach supports the paper's novelty approach for the sustainable electrical system. In addition, the proposed system allows for an isolated power setup without the need for a transmission line which enhances the safety of the electrical network
Redefining brain tumor segmentation: a cutting-edge convolutional neural netw...IJECEIAES
Medical image analysis has witnessed significant advancements with deep learning techniques. In the domain of brain tumor segmentation, the ability to
precisely delineate tumor boundaries from magnetic resonance imaging (MRI)
scans holds profound implications for diagnosis. This study presents an ensemble convolutional neural network (CNN) with transfer learning, integrating
the state-of-the-art Deeplabv3+ architecture with the ResNet18 backbone. The
model is rigorously trained and evaluated, exhibiting remarkable performance
metrics, including an impressive global accuracy of 99.286%, a high-class accuracy of 82.191%, a mean intersection over union (IoU) of 79.900%, a weighted
IoU of 98.620%, and a Boundary F1 (BF) score of 83.303%. Notably, a detailed comparative analysis with existing methods showcases the superiority of
our proposed model. These findings underscore the model’s competence in precise brain tumor localization, underscoring its potential to revolutionize medical
image analysis and enhance healthcare outcomes. This research paves the way
for future exploration and optimization of advanced CNN models in medical
imaging, emphasizing addressing false positives and resource efficiency.
Introduction- e - waste – definition - sources of e-waste– hazardous substances in e-waste - effects of e-waste on environment and human health- need for e-waste management– e-waste handling rules - waste minimization techniques for managing e-waste – recycling of e-waste - disposal treatment methods of e- waste – mechanism of extraction of precious metal from leaching solution-global Scenario of E-waste – E-waste in India- case studies.
3. 21: Scaling and Economics Slide 3CMOS VLSI Design
Moore’s Law
In 1965, Gordon Moore predicted the exponential
growth of the number of transistors on an IC
Transistor count doubled
every year since invention
Predicted > 65,000
transistors by 1975!
Growth limited by power
[Moore65]
4. 21: Scaling and Economics Slide 4CMOS VLSI Design
More Moore
Transistor counts have doubled every 26 months for
the past three decades.
Year
Transistors
4004
8008
8080
8086
80286
Intel386
Intel486
Pentium
Pentium Pro
Pentium II
Pentium III
Pentium 4
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
1,000,000,000
1970 1975 1980 1985 1990 1995 2000
5. 21: Scaling and Economics Slide 5CMOS VLSI Design
Speed Improvement
Clock frequencies have also increased exponentially
– A corollary of Moore’s Law
Year
1
10
100
1,000
10,000
1970 1975 1980 1985 1990 1995 2000 2005
4004
8008
8080
8086
80286
Intel386
Intel486
Pentium
Pentium Pro/II/III
Pentium 4
ClockSpeed(MHz)
6. 21: Scaling and Economics Slide 6CMOS VLSI Design
Why?
Why more transistors per IC?
Why faster computers?
7. 21: Scaling and Economics Slide 7CMOS VLSI Design
Why?
Why more transistors per IC?
– Smaller transistors
– Larger dice
Why faster computers?
9. 21: Scaling and Economics Slide 9CMOS VLSI Design
Scaling
The only constant in VLSI is constant change
Feature size shrinks by 30% every 2-3 years
– Transistors become cheaper
– Transistors become faster
– Wires do not improve
(and may get worse)
Scale factor S
– Typically
– Technology nodes
Year
0.1
1
10
1965 1970 1975 1980 1985 1990 1995 2000 2005
FeatureSize(µm)
10
6
3
1.5
1
0.8
0.6
0.35
0.25
0.18
0.13
0.09
2S =
10. 21: Scaling and Economics Slide 10CMOS VLSI Design
Scaling Assumptions
What changes between technology nodes?
Constant Field Scaling
– All dimensions (x, y, z => W, L, tox)
– Voltage (VDD)
– Doping levels
Lateral Scaling
– Only gate length L
– Often done as a quick gate shrink (S = 1.05)
23. 21: Scaling and Economics Slide 23CMOS VLSI Design
Observations
Gate capacitance per micron is nearly independent
of process
But ON resistance * micron improves with process
Gates get faster with scaling (good)
Dynamic power goes down with scaling (good)
Current density goes up with scaling (bad)
Velocity saturation makes lateral scaling
unsustainable
24. 21: Scaling and Economics Slide 24CMOS VLSI Design
Example
Gate capacitance is typically about 2 fF/µm
The FO4 inverter delay in the TT corner for a
process of feature size f (in nm) is about 0.5f ps
Estimate the ON resistance of a unit (4/2 λ)
transistor.
25. 21: Scaling and Economics Slide 25CMOS VLSI Design
Solution
Gate capacitance is typically about 2 fF/µm
The FO4 inverter delay in the TT corner for a
process of feature size f (in nm) is about 0.5f ps
Estimate the ON resistance of a unit (4/2 λ)
transistor.
FO4 = 5 τ = 15 RC
RC = (0.5f) / 15 = (f/30) ps/nm
If W = 2f, R = 8.33 kΩ
– Unit resistance is roughly independent of f
26. 21: Scaling and Economics Slide 26CMOS VLSI Design
Scaling Assumptions
Wire thickness
– Hold constant vs. reduce in thickness
Wire length
– Local / scaled interconnect
– Global interconnect
• Die size scaled by Dc ≈ 1.1
43. 21: Scaling and Economics Slide 43CMOS VLSI Design
Observations
Capacitance per micron is remaining constant
– About 0.2 fF/µm
– Roughly 1/10 of gate capacitance
Local wires are getting faster
– Not quite tracking transistor improvement
– But not a major problem
Global wires are getting slower
– No longer possible to cross chip in one cycle
44. 21: Scaling and Economics Slide 44CMOS VLSI Design
ITRS
Semiconductor Industry Association forecast
– Intl. Technology Roadmap for Semiconductors
46. 21: Scaling and Economics Slide 46CMOS VLSI Design
Cost Improvement
In 2003, $0.01 bought you 100,000 transistors
– Moore’s Law is still going strong
[Moore03]
47. 21: Scaling and Economics Slide 47CMOS VLSI Design
Interconnect Woes
SIA made a gloomy forecast in 1997
– Delay would reach minimum at 250 – 180 nm,
then get worse because of wires
But…
[SIA97]
48. 21: Scaling and Economics Slide 48CMOS VLSI Design
Interconnect Woes
SIA made a gloomy forecast in 1997
– Delay would reach minimum at 250 – 180 nm,
then get worse because of wires
But…
– Misleading scale
– Global wires
100 kgate blocks ok
49. 21: Scaling and Economics Slide 49CMOS VLSI Design
Reachable Radius
We can’t send a signal across a large fast chip in
one cycle anymore
But the microarchitect can plan around this
– Just as off-chip memory latencies were tolerated
Chip size
Scaling of
reachable radius
50. 21: Scaling and Economics Slide 50CMOS VLSI Design
Dynamic Power
Intel VP Patrick Gelsinger (ISSCC 2001)
– If scaling continues at present pace, by 2005,
high speed processors would have power density
of nuclear reactor, by 2010, a rocket nozzle, and
by 2015, surface of sun.
– “Business as usual will not work in the future.”
Intel stock dropped 8%
on the next day
But attention to power is
increasing
[Moore03]
51. 21: Scaling and Economics Slide 51CMOS VLSI Design
Static Power
VDD decreases
– Save dynamic power
– Protect thin gate oxides and short channels
– No point in high value because of velocity sat.
Vt must decrease to
maintain device performance
But this causes exponential
increase in OFF leakage
Major future challenge
Static
Dynamic
[Moore03]
52. 21: Scaling and Economics Slide 52CMOS VLSI Design
Productivity
Transistor count is increasing faster than designer
productivity (gates / week)
– Bigger design teams
• Up to 500 for a high-end microprocessor
– More expensive design cost
– Pressure to raise productivity
• Rely on synthesis, IP blocks
– Need for good engineering managers
53. 21: Scaling and Economics Slide 53CMOS VLSI Design
Physical Limits
Will Moore’s Law run out of steam?
– Can’t build transistors smaller than an atom…
Many reasons have been predicted for end of scaling
– Dynamic power
– Subthreshold leakage, tunneling
– Short channel effects
– Fabrication costs
– Electromigration
– Interconnect delay
Rumors of demise have been exaggerated
55. 21: Scaling and Economics Slide 55CMOS VLSI Design
NRE
Engineering cost
– Depends on size of design team
– Include benefits, training, computers
– CAD tools:
• Digital front end: $10K
• Analog front end: $100K
• Digital back end: $1M
Prototype manufacturing
– Mask costs: $500k – 1M in 130 nm process
– Test fixture and package tooling
56. 21: Scaling and Economics Slide 56CMOS VLSI Design
Recurring Costs
Fabrication
– Wafer cost / (Dice per wafer * Yield)
– Wafer cost: $500 - $3000
– Dice per wafer:
– Yield: Y = e-AD
• For small A, Y ≈ 1, cost proportional to area
• For large A, Y → 0, cost increases exponentially
Packaging
Test
2
2
2
r r
N
A A
π
= −
57. 21: Scaling and Economics Slide 57CMOS VLSI Design
Fixed Costs
Data sheets and application notes
Marketing and advertising
Yield analysis
58. 21: Scaling and Economics Slide 58CMOS VLSI Design
Example
You want to start a company to build a wireless
communications chip. How much venture capital
must you raise?
Because you are smarter than everyone else, you
can get away with a small team in just two years:
– Seven digital designers
– Three analog designers
– Five support personnel
61. 21: Scaling and Economics Slide 61CMOS VLSI Design
Cost Breakdown
New chip design is fairly capital-intensive
Maybe you can do it for less?
salary
overhead
computer
entrytools
backendtools
fab
25%
25%
26%
9%
4%
11%