©2018 Creative Electron, Inc.
The X-Factor - How X-ray Technology is
Improving the Electronics Assembly Industry
Griffin Lemaster
Creative Electron, Inc.
+1 760.752.1192
glemaster@creativeelectron.com
Summary for today
1. Electronic component inspection.
2. Real-time defect verification.
3. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC).
4. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D
x-ray inspection.
5. Design for manufacturing (DFM) and design for x-ray inspection (DFXI).
6. Reverse engineering.
7. Counterfeit detection.
8. Component counting and material management.
9. Artificial Intelligence and x-ray inspection
©2018 Creative Electron, Inc.
Where Are Defects Introduced?
Counterfeit
Components
Defects associated with paste application
Excess solder
Solder bridges
Insufficient solder
Solder Paste Application Defects
Component Placement Defects
Defects associated with component placement
Misalignment
Polarity
Missing component
Reflow Oven Defects
Defects associated with the reflow profile
Voiding
Bridging
Solder balls
Excess solder
Insufficient solder
Statistical Process Control
Manufacturing process quality assurance.
Solder joint measurement data, collected during x-ray test, can be
statistically analyzed to identify manufacturing drifts, trends and other
relevant process quality issues.
Principles of x-ray inspection
8
X-ray imaging 101: the bottom terminated
component, side view
BTC
PCB
Solder Balls Side View
PCB
X-ray imaging 101: the BGA, top view
Solder Balls
BGA
X-ray image of BGA
QFN assembly with excess voiding
Detail of open pin in QFN package
Void Measurement
Solder voids in LED assembly
BGA Inspector
Dual Energy
High Energy Image Low Energy Image
Dual Energy Image
PATENT PENDING
The best – and worse – BGA assembly
1. COPLANARITY
2. SHORT
3. HEAD IN PILLOW
4. OPEN
9. MISSING
8. SHAPE
7.VOIDS
6. SOLDER MASK 5. SPLATTER
Design For Inspection: Think 3D!
n Components on both sides of board align in such a way it’s
difficult to assess defects
¨ Overlapping BTC
¨ Caps under QFN and BGA
¨ Heat sinks
n How to avoid it
¨ ($) Design for Inspection
¨ ($$) 2.5 or ($$$$) 3D x-ray inspection
BGA 2D x-ray
BGA 2.5D x-ray
So what’s 3D X-Ray Inspection (Computed Tomography)?
Principle of Planar CT: 3D x-ray
Large Area
Detector
Steer-able
X-Ray Source
Inspection
Plane
Multiple Transmission Images
Principle of Planar CT
Use multiple off-axis x-ray
images to separate top/bottom
overlapping or obscured solder
connections
QFP
ResistorPCB
Top Side
Bottom Side
Cross Section x-ray provides the capability to
generate un-obscured views of top and
bottom side components
2D
2.5D
3D
Design for Inspection
n Think carefully about component placement when designing
PCB
n Place parts so 2.5 and 3D x-ray are not needed.
n Goal is to have the whole board inspected with 2D x-ray
¨ Faster
¨ Better quality
¨ Cheaper
Power components under BGA
Caps under BGA
Caps under QFN leads
Caps under BGA balls
Sample
Voiding
Complex construction
Caps and QFN
QFN overlap
Heat sink
Heat sink: x-ray
Heat sink removed: x-ray
Think 3D!
n X-rays are a requirement when inspecting BTC
n DFM + DFI: Easier to design for inspection
n Some applications require 2.5D & 3D x-ray
n Miniaturization major driver for high resolution, high
magnification, x-ray inspection
Design for Inspection – DFI
n The right time to think about x-ray inspection is during PCB
layout
n After board is assembled is too late to improve x-ray inspection
ability
Reverse Engineering
Reasons for Reverse Engineering
n Limited R&D budget
n Part obsolescence
n Poor or no documentation
n Same product or concept must be recreated cheaper and/or
better
Black Box Case Study
Government product platform extended 10 years past original
expectation and manufacturer of black box now out of business.
Poor documentation leaves project in distress. Performing an x-
ray CT on the device will show the full details of the product,
including individual layers of the PCB.
Black Box Case Study
2D X-ray Scan CT X-ray Slice
Counterfeit Electronics
Surplus stock of electronic components dumped into the market
further establishing the broker and grey markets
Huge amounts of scrap electronics
Components made obsolete
Need for short delivery time
Massive cost reduction pressures on OEM buyers for double digit
price reductions
Buying and selling via the internet became common practice
The counterfeit electronics problem
48
Surplus stock of electronic components dumped into the market
further establishing the broker and grey markets
Huge amounts of scrap electronics
Components made obsolete
Need for short delivery time
Massive cost reduction pressures on OEM buyers for double digit
price reductions
Buying and selling via the internet became common practice
The counterfeit electronics problem
49
Component Harvesting
50
Only expensive parts are counterfeited…
Anything wrong with these caps?
What happens when you got the wrong cap?
Component Counting and Material
Management
Material Management 101
n What does a factory do?
¨ Moving, Storing, Transforming
n What materials need to be purchased?
n Who will supply these materials?
n When do these materials need to be purchased?
n How much of these materials need to be purchased?
Just-In-Time Inventory vs. Reality
n Too little inventory
¨ Results in costly production line stoppages
n Too much inventory
¨ Wasted cash sitting on the shelves
n To achieve best balance, real time data counts must be accurate
Inventory Accuracy
Major reason for SMT line stoppage
is that information in MRP does not
match reality
Part Counting
X-ray image taken of entire reel of
components. Image is analyzed and
component type, quantity, and
defects can be reported back to
operator.
X-ray Part Counting Benefits
n Fast (15-30seconds per reel)
n Accurate Countbacks (99%+)
n Component Type Identification
n Counterfeit Detection
n Integration with MRP System
Artificial Intelligence
30-second intro to artificial intelligence (AI)
X ? Y
X Y
2 4
0 0
3 6
-5 -10
10 20
x2
©2018 Creative Electron, Inc.
www.creativeelectron.com
Automatic Phone Inspection
MADE IN USA
12Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
©2018 Creative Electron, Inc.
www.creativeelectron.com
Automatic Phone Inspection
MADE IN USA
13Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
©2018 Creative Electron, Inc.
www.creativeelectron.com
Automatic Phone Inspection
MADE IN USA
10Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
©2018 Creative Electron, Inc.
www.creativeelectron.com
Automatic Phone Inspection
MADE IN USA
11Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
©2018 Creative Electron, Inc.
www.creativeelectron.com
Automatic Phone Inspection
MADE IN USA
14Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
©2018 Creative Electron, Inc.
www.creativeelectron.com
Automatic Phone Inspection
MADE IN USA
15Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
www.creativeelectron.com
Medical Devices
MADE IN USA
19Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
©2018 Creative Electron, Inc.
©2018 Creative Electron, Inc.
www.creativeelectron.com
Medical Devices
MADE IN USA
20Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
Thanks for your time!
+1 760.752.1192
info@creativeelectron.com
www.creativeelectron.com

How X-ray Technology is Improving the Electronics Assembly Process

  • 1.
    ©2018 Creative Electron,Inc. The X-Factor - How X-ray Technology is Improving the Electronics Assembly Industry Griffin Lemaster Creative Electron, Inc. +1 760.752.1192 glemaster@creativeelectron.com
  • 2.
    Summary for today 1.Electronic component inspection. 2. Real-time defect verification. 3. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 4. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection. 5. Design for manufacturing (DFM) and design for x-ray inspection (DFXI). 6. Reverse engineering. 7. Counterfeit detection. 8. Component counting and material management. 9. Artificial Intelligence and x-ray inspection ©2018 Creative Electron, Inc.
  • 3.
    Where Are DefectsIntroduced? Counterfeit Components
  • 4.
    Defects associated withpaste application Excess solder Solder bridges Insufficient solder Solder Paste Application Defects
  • 5.
    Component Placement Defects Defectsassociated with component placement Misalignment Polarity Missing component
  • 6.
    Reflow Oven Defects Defectsassociated with the reflow profile Voiding Bridging Solder balls Excess solder Insufficient solder
  • 7.
    Statistical Process Control Manufacturingprocess quality assurance. Solder joint measurement data, collected during x-ray test, can be statistically analyzed to identify manufacturing drifts, trends and other relevant process quality issues.
  • 8.
    Principles of x-rayinspection 8
  • 9.
    X-ray imaging 101:the bottom terminated component, side view BTC PCB Solder Balls Side View
  • 10.
    PCB X-ray imaging 101:the BGA, top view Solder Balls BGA X-ray image of BGA
  • 11.
    QFN assembly withexcess voiding
  • 12.
    Detail of openpin in QFN package
  • 13.
  • 14.
    Solder voids inLED assembly
  • 19.
  • 20.
    Dual Energy High EnergyImage Low Energy Image Dual Energy Image PATENT PENDING
  • 21.
    The best –and worse – BGA assembly 1. COPLANARITY 2. SHORT 3. HEAD IN PILLOW 4. OPEN 9. MISSING 8. SHAPE 7.VOIDS 6. SOLDER MASK 5. SPLATTER
  • 22.
    Design For Inspection:Think 3D! n Components on both sides of board align in such a way it’s difficult to assess defects ¨ Overlapping BTC ¨ Caps under QFN and BGA ¨ Heat sinks n How to avoid it ¨ ($) Design for Inspection ¨ ($$) 2.5 or ($$$$) 3D x-ray inspection
  • 23.
  • 24.
  • 25.
    So what’s 3DX-Ray Inspection (Computed Tomography)?
  • 26.
    Principle of PlanarCT: 3D x-ray Large Area Detector Steer-able X-Ray Source Inspection Plane Multiple Transmission Images
  • 27.
    Principle of PlanarCT Use multiple off-axis x-ray images to separate top/bottom overlapping or obscured solder connections QFP ResistorPCB Top Side Bottom Side Cross Section x-ray provides the capability to generate un-obscured views of top and bottom side components
  • 28.
  • 29.
    Design for Inspection nThink carefully about component placement when designing PCB n Place parts so 2.5 and 3D x-ray are not needed. n Goal is to have the whole board inspected with 2D x-ray ¨ Faster ¨ Better quality ¨ Cheaper
  • 30.
  • 31.
  • 32.
  • 33.
  • 34.
  • 35.
  • 36.
  • 37.
  • 38.
  • 39.
  • 40.
  • 41.
    Think 3D! n X-raysare a requirement when inspecting BTC n DFM + DFI: Easier to design for inspection n Some applications require 2.5D & 3D x-ray n Miniaturization major driver for high resolution, high magnification, x-ray inspection
  • 42.
    Design for Inspection– DFI n The right time to think about x-ray inspection is during PCB layout n After board is assembled is too late to improve x-ray inspection ability
  • 43.
  • 44.
    Reasons for ReverseEngineering n Limited R&D budget n Part obsolescence n Poor or no documentation n Same product or concept must be recreated cheaper and/or better
  • 45.
    Black Box CaseStudy Government product platform extended 10 years past original expectation and manufacturer of black box now out of business. Poor documentation leaves project in distress. Performing an x- ray CT on the device will show the full details of the product, including individual layers of the PCB.
  • 46.
    Black Box CaseStudy 2D X-ray Scan CT X-ray Slice
  • 47.
  • 48.
    Surplus stock ofelectronic components dumped into the market further establishing the broker and grey markets Huge amounts of scrap electronics Components made obsolete Need for short delivery time Massive cost reduction pressures on OEM buyers for double digit price reductions Buying and selling via the internet became common practice The counterfeit electronics problem 48
  • 49.
    Surplus stock ofelectronic components dumped into the market further establishing the broker and grey markets Huge amounts of scrap electronics Components made obsolete Need for short delivery time Massive cost reduction pressures on OEM buyers for double digit price reductions Buying and selling via the internet became common practice The counterfeit electronics problem 49
  • 50.
  • 51.
    Only expensive partsare counterfeited…
  • 52.
  • 53.
    What happens whenyou got the wrong cap?
  • 56.
    Component Counting andMaterial Management
  • 57.
    Material Management 101 nWhat does a factory do? ¨ Moving, Storing, Transforming n What materials need to be purchased? n Who will supply these materials? n When do these materials need to be purchased? n How much of these materials need to be purchased?
  • 58.
    Just-In-Time Inventory vs.Reality n Too little inventory ¨ Results in costly production line stoppages n Too much inventory ¨ Wasted cash sitting on the shelves n To achieve best balance, real time data counts must be accurate
  • 59.
    Inventory Accuracy Major reasonfor SMT line stoppage is that information in MRP does not match reality
  • 60.
    Part Counting X-ray imagetaken of entire reel of components. Image is analyzed and component type, quantity, and defects can be reported back to operator.
  • 61.
    X-ray Part CountingBenefits n Fast (15-30seconds per reel) n Accurate Countbacks (99%+) n Component Type Identification n Counterfeit Detection n Integration with MRP System
  • 62.
  • 63.
    30-second intro toartificial intelligence (AI) X ? Y X Y 2 4 0 0 3 6 -5 -10 10 20 x2
  • 64.
    ©2018 Creative Electron,Inc. www.creativeelectron.com Automatic Phone Inspection MADE IN USA 12Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
  • 65.
    ©2018 Creative Electron,Inc. www.creativeelectron.com Automatic Phone Inspection MADE IN USA 13Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
  • 66.
    ©2018 Creative Electron,Inc. www.creativeelectron.com Automatic Phone Inspection MADE IN USA 10Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
  • 67.
    ©2018 Creative Electron,Inc. www.creativeelectron.com Automatic Phone Inspection MADE IN USA 11Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
  • 68.
    ©2018 Creative Electron,Inc. www.creativeelectron.com Automatic Phone Inspection MADE IN USA 14Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
  • 69.
    ©2018 Creative Electron,Inc. www.creativeelectron.com Automatic Phone Inspection MADE IN USA 15Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
  • 70.
    www.creativeelectron.com Medical Devices MADE INUSA 19Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc ©2018 Creative Electron, Inc.
  • 71.
    ©2018 Creative Electron,Inc. www.creativeelectron.com Medical Devices MADE IN USA 20Confidential - Do not duplicate or distribute without written permission from Creative Electron Inc
  • 72.
    Thanks for yourtime! +1 760.752.1192 info@creativeelectron.com www.creativeelectron.com