This document provides an overview of Boson Techno Systems Pvt. Ltd., an Indian company that distributes semiconductor and electronics manufacturing equipment. It discusses the company's presence in India, major customers, and business divisions. The company aims to leverage the growing Indian semiconductor market by partnering with equipment manufacturers and targeting universities and research centers. It proposes a collaboration to penetrate the market using Boson's sales team and strategic focus on the Indian government's initiatives in the semiconductor sector.
The worldwide semiconductor industry: Trends and opportunities 2016 The Broker Forum
The worldwide semiconductor industry: Trends and opportunities 2016
Today, the rapid pace of innovation and ever-expending use of technologically advanced devices including smartphones, tablets, flat-screen monitors, smart connected cars and medical devices is multiplying the number of semiconductor components being used around us every day. Digitization, connectivity and the internet of things (IOT) now promise solid growth for the global semiconductor market.
Discover how you can develop your business by looking at this market infographic from The Broker Forum.
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Silicon Photonics 2018 - Report by Yole Developpement Yole Developpement
Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China.
More information on that report at http://www.i-micronews.com/reports.html
The worldwide semiconductor industry: Trends and opportunities 2016 The Broker Forum
The worldwide semiconductor industry: Trends and opportunities 2016
Today, the rapid pace of innovation and ever-expending use of technologically advanced devices including smartphones, tablets, flat-screen monitors, smart connected cars and medical devices is multiplying the number of semiconductor components being used around us every day. Digitization, connectivity and the internet of things (IOT) now promise solid growth for the global semiconductor market.
Discover how you can develop your business by looking at this market infographic from The Broker Forum.
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Silicon Photonics 2018 - Report by Yole Developpement Yole Developpement
Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China.
More information on that report at http://www.i-micronews.com/reports.html
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/embedded-vision-alliance/embedded-vision-training/videos/pages/may-2019-embedded-vision-summit-tschudi
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Yohann Tschudi, Technology and Market Analyst at Yole Développement, presents the "AI Is Moving to the Edge—What’s the Impact on the Semiconductor Industry?" tutorial at the May 2019 Embedded Vision Summit.
Artificial intelligence is proliferating into numerous edge applications and disrupting numerous industries. Clearly this represents a huge opportunity for technology suppliers. But it can be difficult to discern exactly what form this opportunity will take. For example, will edge devices perform AI computation locally, or in the cloud? Will edge devices use separate chips for AI, or will AI processing engines be incorporated into the main processor SoCs already used in these devices?
In this talk, Tschudi answers these questions by presenting and explaining his firm's market data and forecasts for AI processors in mobile phones, drones, smart home devices and personal robots. He explains why there is a strong trend towards executing AI computation at the edge, and quantifies the opportunity for separate processor chips and on-chip accelerators that address visual and audio AI tasks.
ELECTRONICS INDUSTRY STUDY REPORT - Semiconductors and Defense ElectronicsSVCAVET
WHERE Globalization started:
National Defense University, The Industrial College of the Armed Forces, Washington, DC, 20319
ABSTRACT: The commercial semiconductor industry is characterized by fierce competition, large fluctuations in demand, increasing performance, and falling prices. Defense electronics has become a miniscule part of the semiconductor industry (less than 1%), but is essential to national security. However, U.S. commercial and defense semiconductor production is losing ground. The industry faces a number of challenges, including: rising capital costs, rapidly evolving technology, future workforce shortages, increasing offshore design and production, infringement of intellectual property rights, and ineffective export controls that hinder U.S. global competitiveness.
++ Globalization and the rise of the Asia-Pacific region
CONCLUSIONS:
The semiconductor industry and the defense electronics industry are inextricably linked. Every new weapons system in production will rely on semiconductors as its core component. A healthy, robust, and leading edge semiconductor industry is essential for defense needs and indeed for all elements of national security. Several broad conclusions can be drawn from our study.
• There is growing concern regarding the offshore flight of intellectual capital and semiconductor production facilities. Some argue that the ability of the U.S. to maintain access to cutting-edge technology will be adversely affected. The decline of technical talent among U.S. students contributes to these concerns.
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Silicon photonics is an evolving technology in which data is transferred among computer chips by optical rays. Optical rays can carry far more data in less time than electrical conductors.
This presentation gives emphasis on the basics of silicon photonics
I am not putting any restrictions on this PPT. But, it will be very great, if you acknowledge my work. It will cost nothing. And, of course you can appreciate my work :) .Surprisingly, it also costs NOTHING. Happy to help you :)
I tried to acknowledge everything ,(not usually cut,copy and paste and then forgetting..) that helped me to make this ppt. May be why I ended up with a job in a research co. because of this.
Are you looking to buy Si Wafer? We are a leading supplier of Silicon wafers across six continents in over 45 countries. Call (561) 842-4441 or Shop at our website.
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
The Global Semiconductor Industry
(Computer Chips)
::TABLE OF CONTENTS::
Overview & Background
Global Shifts & Patterns of Consumption
Production Costs & Technology Development
The Role of the State
Corporate Strategies
Case of East Asia
Discussion
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
Automotive market growth is reshaping the SiC market’s dynamics and ecosystem.
More information on: https://www.i-micronews.com/products/power-sic-2019-materials-devices-and-applications/
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/embedded-vision-alliance/embedded-vision-training/videos/pages/may-2019-embedded-vision-summit-tschudi
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Yohann Tschudi, Technology and Market Analyst at Yole Développement, presents the "AI Is Moving to the Edge—What’s the Impact on the Semiconductor Industry?" tutorial at the May 2019 Embedded Vision Summit.
Artificial intelligence is proliferating into numerous edge applications and disrupting numerous industries. Clearly this represents a huge opportunity for technology suppliers. But it can be difficult to discern exactly what form this opportunity will take. For example, will edge devices perform AI computation locally, or in the cloud? Will edge devices use separate chips for AI, or will AI processing engines be incorporated into the main processor SoCs already used in these devices?
In this talk, Tschudi answers these questions by presenting and explaining his firm's market data and forecasts for AI processors in mobile phones, drones, smart home devices and personal robots. He explains why there is a strong trend towards executing AI computation at the edge, and quantifies the opportunity for separate processor chips and on-chip accelerators that address visual and audio AI tasks.
ELECTRONICS INDUSTRY STUDY REPORT - Semiconductors and Defense ElectronicsSVCAVET
WHERE Globalization started:
National Defense University, The Industrial College of the Armed Forces, Washington, DC, 20319
ABSTRACT: The commercial semiconductor industry is characterized by fierce competition, large fluctuations in demand, increasing performance, and falling prices. Defense electronics has become a miniscule part of the semiconductor industry (less than 1%), but is essential to national security. However, U.S. commercial and defense semiconductor production is losing ground. The industry faces a number of challenges, including: rising capital costs, rapidly evolving technology, future workforce shortages, increasing offshore design and production, infringement of intellectual property rights, and ineffective export controls that hinder U.S. global competitiveness.
++ Globalization and the rise of the Asia-Pacific region
CONCLUSIONS:
The semiconductor industry and the defense electronics industry are inextricably linked. Every new weapons system in production will rely on semiconductors as its core component. A healthy, robust, and leading edge semiconductor industry is essential for defense needs and indeed for all elements of national security. Several broad conclusions can be drawn from our study.
• There is growing concern regarding the offshore flight of intellectual capital and semiconductor production facilities. Some argue that the ability of the U.S. to maintain access to cutting-edge technology will be adversely affected. The decline of technical talent among U.S. students contributes to these concerns.
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Silicon photonics is an evolving technology in which data is transferred among computer chips by optical rays. Optical rays can carry far more data in less time than electrical conductors.
This presentation gives emphasis on the basics of silicon photonics
I am not putting any restrictions on this PPT. But, it will be very great, if you acknowledge my work. It will cost nothing. And, of course you can appreciate my work :) .Surprisingly, it also costs NOTHING. Happy to help you :)
I tried to acknowledge everything ,(not usually cut,copy and paste and then forgetting..) that helped me to make this ppt. May be why I ended up with a job in a research co. because of this.
Are you looking to buy Si Wafer? We are a leading supplier of Silicon wafers across six continents in over 45 countries. Call (561) 842-4441 or Shop at our website.
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
The Global Semiconductor Industry
(Computer Chips)
::TABLE OF CONTENTS::
Overview & Background
Global Shifts & Patterns of Consumption
Production Costs & Technology Development
The Role of the State
Corporate Strategies
Case of East Asia
Discussion
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
Electronic Sytem Sesign and Manufacturing SectorVibrant Gujarat
This presentation profiles the Electronic System Design and Manufacturing (ESDM) sector presenting the key facts & figures, policy interventions, electronics policy of Gujarat state and current business and growth opportunities.
Top 5 Best Semiconductor Stocks in India.pdfkundkundtc
Technology is achieving exponential growth in recent times a small chip can run a laptop, refrigerator and almost every electronic device. That chip is known as a semiconductor. Even the EVs are running through the semiconductors. Due to the global pandemic, wars & other imbalances, there has been a shortage of semiconductors for the past two years and the industry faced a revenue loss of around $500 billion. In this blog, we’ll discuss the best semiconductor stocks in India 2022.
Electronics is the fastest growing manufacturing sector in the world and is primarily driven by the demand for new age consumer electronics. . In India, Karnataka ranks amongst the largest contributors to Electronic Industrial Output and recorded a growth rate of 18% CAGR.
Production Linked Incentive Scheme by Government of IndiaVIKAS CHAUHAN
The Central Government has unveiled a
PRODUCTION LINKED INCENTIVE SCHEME
to encourage domestic manufacturing
investments in 10 More Sectors with an
estimated outlay of about Rs1.46 Lakh Crore
over the next Five Years.
These Sectors have been identified on the basis
of their potential to create employment and
make India Self-Relian
An attempt to answer the following pertinent question:
Will India realize its semiconductor dreams without first creating local products and domestic brands.?
Yes or No.?
Future of semiconductor fabrication (fab) industries in india opportunities ...eSAT Journals
Abstract The peak demand of electronics products in India will reach several billions in forthcoming years. It has been always a dream of Electronics engineers in India to have a well structured manufacturing sector. At present a good number of companies are working in design but they don’t have their own fabrication facility here. The design projects which they are handling have larger dependency on foreign FABs. The country is a leading exporter of information technology service, including knowledge-intensive chip design under the EDA environment. India’s strength in chip design doesn’t help at all as we are lacking in wafer fabrication. Local electronics manufacturing remains disconnected from India’s chip design capabilities, research and development area. This has also affect the employment of electronics engineer as we have lacking in electronics manufacturing. India’s increasing domestic demand of electronics products results in rise in imports of final products and high dependency on key components/ICs. The manufacturing of semiconductor in India will only boost up with effective and growth oriented semiconductor policy and with a well maintained eco-system set up by the central government so that international player may attract to set up the wafer fabrication and R&D units in India. Keywords: FAB, ESDM, NPE, EDA, Wafer.
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Generating a custom Ruby SDK for your web service or Rails API using Smithyg2nightmarescribd
Have you ever wanted a Ruby client API to communicate with your web service? Smithy is a protocol-agnostic language for defining services and SDKs. Smithy Ruby is an implementation of Smithy that generates a Ruby SDK using a Smithy model. In this talk, we will explore Smithy and Smithy Ruby to learn how to generate custom feature-rich SDKs that can communicate with any web service, such as a Rails JSON API.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Future & growth of semiconductor industry In india
1. By – Rajendra Kumar Singh
Sales & Marketing Executive
Boson Techno Systems Pvt. Ltd .
2. Introduction of Company
Presence and Team
Branch and Division
Semiconductor Sector Overview
Semiconductor - An Upcoming Sector
Regulatory Frame work in Semiconductor Sector
List of Universities involved in Nano technology R & D
Nano Technology R & D Centre
Our Installation List
Major Customer List
Our Business Plan
3. Headquarter
Nature of business
Human resource
Focus
Products
Boson Techno Systems Pvt. Ltd.
C-2694 Sushant Lok-1 Gurgaon.
Distribution of “State of the art” technology
products & Service support .
Technically skilled and experience Sales &
Technical staff.
Defense , Aerospace, DRDO units
Automotive Semiconductor Industry.
Semiconductor, Electronics manufacturing,
Precision Industry, Various Chambers &
Shakers.
4. Group of Techno Crates with 14 year of
experience in the same field
Year of establishment :- -2010
Five offices in North, West & South India
like Gurgoan , Pune , Ahemdabad ,
Banglore and Chandigarh .
Last year turn over was USD 3 million
This year target is USD 4 million
Highly experienced, skilled and most
important focused sales & service team.
Singapore office to be opened by May
2014
5. Boson Techno Systems Pvt. Ltd.
Bare PCB & PCBA
Division
Mr. Nabeel Khan in
North & West India
Sales Service
Environmental Testing
equipment Division
Mr. Vijay Sharma In
North & South India
Sales Service
Semiconductor & Process
Equipment Division
Mr. Rajendra Singh In
North & West India
Sales Service
Mr. Vibhu Swaroop Saxena ,
DGM
6. The semiconductor sector involves pre-fabrication, fabrication (fab) and post-
fabrication verticals. In the last four years, the Indian semiconductor market has
grown from approximately USD 6.5 billion (2011) to approximately USD 9.7 billion
(2013).
The demand for semiconductor solutions, the heart of the electronic systems, is also
expected to get a fillip as the consumption of electronic equipment in India will grow
at a CAGR of 29.8 percent from USD 28.3 billion in 2005 to reach USD 363 billion
by 2015.
Both the electronics and the semiconductor sectors are mutually beneficial for each
other and the growth in one sector leads to growth in the other.
The major semiconductor end-user segments have been communications, IT and
consumer electronics.
Semiconductors are poised to impact human life far more as they open up new
possibilities in nano-sciences, biotechnology, medical sciences, electro-mechanical
devices, photonics, remote sensing and so on. India has a great potential to become a
global hub.
7.
8. The semiconductor design requirements of such verticals provide an opportunity to
multinational companies to come to India and tap the potential.
Reasons for
Growth in
Semiconductor
Industry
Growth in the Chip
Design industry
Unprecedented growth
in domestic
consumption of
electronic goods
Significant export
potential for this industry
Increased
semiconductor content
in the electronic
industry
9. 9
29.0
35.4
43.1
23.7
14.4
2.4
18.5
11.2
8.6
6.6
4.6
3.3
0
5
10
15
20
25
30
35
40
45
50
2004 2005 2006E 2007E 2008E 2009E 2010E 2011E 2012E 2013E 2014E 2015E
USDBillion
0.10
0.23
0.29
0.36
0.45
0.55
0.65
0.78
0.18
0.10
0.07
0.00
0.15
0.30
0.45
0.60
0.75
0.90
2005 2006E 2007E 2008E 2009E 2010E 2011E 2012E 2013E 2014E 2015E
NumberinMillion
Semiconductor design revenues to witness CAGR
of 29.5 percent
India is on the world map in chip designing; the growing production and consumption of electronics across
various sectors is further driving growth of semiconductor designing in the country.
The semiconductor designing segment
generated revenues worth USD 3.25 billion
in 2005 and is expected to reach
approximately USD 14.4 billion and USD
43.1 billion by 2010 and 2015, respectively.
During 2005–2015, it is expected to
register growth at a CAGR of
approximately 29.5 percent.
The growth in the Indian semiconductor design
market will lead to the growth in the
engineering workforce employed by this
segment. It employed 0.07 million engineers in
2005 and the employment figure is likely to
grow to 0.78 million by 2015 at a CAGR of
approximately 27 percent during 2005–2015.
Total Semiconductor Designing Market in India
(in USD billion)
Engineering Workforce Employed by Indian
Semiconductor Design Market
10. 10
Semiconductor Manufacturing in India
The increasing spending on electronics products offers a large opportunity to global semiconductor
companies to set up their manufacturing plants in the country.
It is estimated that approximately seven to eight
Solar Photovoltaic (SPV) units will be set up in
India, with an investment of USD 5–6 billion.
The number of solar chip fab units in India is
expected to surpass the number of semiconductor
chip fab units in the country in the next few years.
Currently, there are no operational wafer
fabs in the country and the semiconductor
manufacturing is limited to only three
government companies (Bharat
Electronics Limited, Society for Integrated
Circuit Technology and Applied Research,
and Semi-Conductor Laboratory).
Semiconductor Manufacturing in India
11. India with the govt. support for setting up the lab firming up at about 40 percent of
the total cost , officials going ahead with the two big company – IBM and ST
Microelectronics . Typically , setting up a chip foundry cost around 4- 5 billion
USD .
India is trying to create an electronics manufacturing ecosystem to prevent the loss of
billions of dollars of foreign exchange in such imports every year . This bill, expected to
reach $SS billion (about Rs 3.4 lakh crore ) by 2020 from about $7 billion (Rs 43,600 crore ).
The centre has approved the setting up of two semiconductor wafer fabrication (FAB)
facilities in the country, involving total investment of Rs 63,410 crore.
These FAB units are to be set up by two consortia , one led by Jai Prakash Associate and other
led by HSMC Technologies India Pvt. Ltd. .
Jai Prakash Associates limited will partner IBM and Tower Jazz of Israel to invest.Rs34,399
crore . In a project to manufacture 90/65/45/28 nm chips, with an overall capacity of
40,000 WSPM. The project will be located along the Yamuna Expressway in Uttar Pradesh.
The project, to be located in Prantij, Gujarat, will have a capacity to manufacture 40,000
WSPM of 90/65/45/28/22 nm size.
12. 12
Incentives under
National
Semiconductor
Policy
Assuming a 1:1 debt to equity
ratio for the project,
government restricts its
participation to 26 percent of
the equity capital.
There is also an option that
state governments can
provide additional incentives
to semiconductor companies.
In case of units located
outside the SEZ, the
Countervailing Duties
(CVD) on capital goods will
be exempted.
20 percent of the capital
expenditure of a
semiconductor manufacturing
unit located inside of Special
Economic Zone (SEZ) will be
carried by the government for
the first 10 years.
In case of units located
outside SEZ, government
will carry 25 percent of the
capital expenditure for the
stated time duration.
The policy covers LCDs,
storage devices, plasmas,
photo-voltaics, solar cells
and nanotechnology
products, and also includes
assembly and testing of
these products.
The threshold
investment for a
semiconductor
manufacturing (wafer
fabs) plant would be
approximately USD 575
million and for other
ancillary units (storage
devices, organic LED,
micro or nano-
technology products)
approximately USD 220
million.
These incentives are not extended
to older plants having second-
hand equipment.
Regulation of NSP
Incentives offered by the Government to the Companies
Regulatory Policy and Incentives Offered in
Semiconductor Sector
13. Sr. No Nano Technology Research Centre Place/Year of
Establishment
1 Bhabha Atomic Research Centre Mumbai ( 1954)
2 Center of Materials for Electronics
Technology
Pune ( 1990)
3 Central Electronics Research Institute Rajasthan (1953)
4. SSPL New Delhi (1962)
5 Saha Institute of Nuclear Physics Kolkata ( 1949)
6. S. N. Bose National Center for Basic
Sciences (DST)
Kolkata (1986)
7 National Physics Laboratories New Delhi
8 Defence Research and Development
Establishment (DRDE)
Gwalior (1973)
9 Regional Research Laboratories Trivandrum
14. 10. Indian Association for the Cultivation of
Sciences (IACS)
Kolkata
11. Institute of Fundamental Research Mumbai
12. Central Scientific Instruments Organization Chandigarh
13 National Centre for Biological Sciences Karnataka
14 National Metallurgical Laboratory Jamshedpur
15 Raman Research Institute Bangalore
16 National Chemical Laboratories Pune
17 Central Glass and Ceramic Research Institute Kolkata
15.
16. We are offering a business proposal to you in which we both can penetrate
Indian Semiconductor Market , which is full of lots of opportunities .
As I discussed Government of India promoting Investors to make their
products in India according to Make IN India scheme .
As we know your company has a brand name in manufacturing of Vacuum
coating equipments and process equipment like Sputtering , PECVD , CVD
etc.
We will make a marketing strategy for expansion of business and implement
those strategies with the help our skilled team in all over India .
Our team will bring enquiries by finding potential customer in all over india.
I believe , we both can create a land mark in semiconductor industry and this
will create history .
17. I would like to share that in India there are more than 500 educational
institutes & universities , R&D center , Defense Institutes , which can
be the target and new potential customers for the manual and small
wire bonder equipments
Indian Government is injecting more money to modernize all above
institutes , specially their NANOTECHNOLOGY and SEMICON
departments therefore, we have been finding lots and lots of query from
our these customers to enquire about manual and semi Automatic wire
bonding equipments
As these are our existing customers for other range of products like
plasma coating , PECVD and sputtering systems. Few customers are
like
DMSRDE-Kanpur, Jamia Humdard University, Gurukul Kangri –
Haridwar, IIT Ropar, S.N.Bose National Centre for Basic Sciences-
Kolkata, JNCASR-Banglore and other DRDO and ISRO Labs.
18. We, Boson techno Systems, have our offices in 5 places across Indian and
enjoy the demographical advantage.
Right now we have 5 sales person and one service guy dedicated for the
wire bonder products, However as demand increases , we have willingness
and resources to add more head counts to cater to market and customers.
We normally share the manpower of our other division to tap the
semiconductor market, whenever the other division guy visit to any
customer, they share the complete product profile and share the lead with
SEMICON guys in case customer share interest for that.
Semiconductor manufacturing In India: Recently, setting up of some new fabs has been proposed and the already approved fab units are expected to be operational by 2014 to 2020. The Indian government has also proposed to develop a ‘Fab City’ in Hyderabad , Madhya Pradesh and Greater Noida , which is expected to house 10 manufacturing plants.
Regulator Policy and Incentives offered in India : To be self-reliant in chip manufacturing and attract semiconductor companies to set up their manufacturing plants in the country, the Indian government announced ‘National Semiconductor Policy’ (NSP) or ‘Fab Policy’ in 2007. Under this policy, the government has proposed special incentive plan to encourage companies to come to India for semiconductor and related ancillary manufacturing