DAETEC provides product development, material modification, process design, and other engineering services to help clients enter new markets. It has facilities for research and development as well as access to manufacturing partners. DAETEC's services include developing new coatings, cleaning formulations, and other chemistries for applications in microelectronics, aerospace, industrial, and other sectors. It aims to help clients commercialize new technologies and processes in a cost-effective manner.
Experience:
• Experience in Product Design & Development, Analysis and Documentation Technology.
SUMMARY OF EXPERIENCE:
• 4+ years of Experience in New Product Design & Development, Analysis & Documentation.
• Experience in Design, Development and Modification of Plastics, Castings, Machined, Sheet metal (parts & Assemblies).
• Matching and Problem solving skills during manufacturing activities.
• Mechanical Engineering functions and Numerical Calculations.
• Knowledge of various ESS, ET & Q.A tests (Shock & Vibration, Acceleration Test Rain-Shower, EMI & EMC, Salt & Corrosion Tests, according to JSS-55555 standards).
• UNIGRAPHICS (NX) : Part Modelling (castings), Sheet metal, Plastic Design, Assembly,
Detailing & Drafting & Rendering.
• SOLIDWORKS: Part modelling (castings), Sheet metal, Plastic Design, Assembly, Detailing & Drafting & Rendering.
• SIMULATION: Static Analysis by using Simulation Premium.
• GD & T: Knowledge of GD&T using (ASME Standards Y14.5).
• AUTO CAD: 2D Drafting, Detailing & Dimensioning as per GD&T using (ASME Standards Y14.5).
• DFRM: Knowledge of Design for Reliability & Maintainability.
• DFA, DFM & DFMEA: Knowledge of Design for Assembly, Design for Manufacturability & Design for failure mode and effective analysis.
• STEALTH DESIGN: Good Knowledge of stealth Design Concepts.
• SAP (PLM): Creating Material Master, Creating & Uploading of Drawing, Creating BOM, Releasing Engineering Drawings, Creating ECR etc.
• SIX SIGMA: Basic Knowledge of Six sigma principles.
• ROHS: Restriction of Hazardous Substances Compliance.
• RENDERING & ANIMATION: Rendering of Products by using Photo view360 & Key shot tools.
• Reverse engineering.
• Tolerance stack up analysis.
• Frequent interaction with clients & vendors.
• Product Data Management Activities
• Customer Interaction.
• Estimation, Planning Documents, Deliveries.
Experience:
• Experience in Product Design & Development, Analysis and Documentation Technology.
SUMMARY OF EXPERIENCE:
• 4+ years of Experience in New Product Design & Development, Analysis & Documentation.
• Experience in Design, Development and Modification of Plastics, Castings, Machined, Sheet metal (parts & Assemblies).
• Matching and Problem solving skills during manufacturing activities.
• Mechanical Engineering functions and Numerical Calculations.
• Knowledge of various ESS, ET & Q.A tests (Shock & Vibration, Acceleration Test Rain-Shower, EMI & EMC, Salt & Corrosion Tests, according to JSS-55555 standards).
• UNIGRAPHICS (NX) : Part Modelling (castings), Sheet metal, Plastic Design, Assembly,
Detailing & Drafting & Rendering.
• SOLIDWORKS: Part modelling (castings), Sheet metal, Plastic Design, Assembly, Detailing & Drafting & Rendering.
• SIMULATION: Static Analysis by using Simulation Premium.
• GD & T: Knowledge of GD&T using (ASME Standards Y14.5).
• AUTO CAD: 2D Drafting, Detailing & Dimensioning as per GD&T using (ASME Standards Y14.5).
• DFRM: Knowledge of Design for Reliability & Maintainability.
• DFA, DFM & DFMEA: Knowledge of Design for Assembly, Design for Manufacturability & Design for failure mode and effective analysis.
• STEALTH DESIGN: Good Knowledge of stealth Design Concepts.
• SAP (PLM): Creating Material Master, Creating & Uploading of Drawing, Creating BOM, Releasing Engineering Drawings, Creating ECR etc.
• SIX SIGMA: Basic Knowledge of Six sigma principles.
• ROHS: Restriction of Hazardous Substances Compliance.
• RENDERING & ANIMATION: Rendering of Products by using Photo view360 & Key shot tools.
• Reverse engineering.
• Tolerance stack up analysis.
• Frequent interaction with clients & vendors.
• Product Data Management Activities
• Customer Interaction.
• Estimation, Planning Documents, Deliveries.
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2. Technology has many barriers
Most are Internal
• Ability to change
with the markets
• Ability to react
• Ability to find
answers
• Ability to assemble
resources
• All at low cost
Company Profile – www.daetec.com 2
3. How Does One Cross to a
New Market, Reach a New
Customer, or Find Answers?
Will it be one or more of these?
•Increase investment –
testing & applications
•New product
development
•New tool design
•New process design
•Modification or ancillary
•Bundling
Company Profile – www.daetec.com 3
4. What’s the right
level of
resources?
What is needed to…
•Stay on schedule
•Overcome challenges
•Acquire IP
•Ready for scale-up
•Train staff
•Respond to customers
•Support the Market
Company Profile – www.daetec.com 4
5. What’s the
shortest path to
achieve your
objective?
How do you…
•Stay on-track
•Maintain revenue from
core business
•Avoid hitting road-blocks
•Keep on schedule
•Who will drive this effort?
Company Profile – www.daetec.com 5
6. DAETEC
We can be your bridge
into new markets
Company Profile – www.daetec.com 6
7. DAETEC is a Bridge
Between One Source to Another
•Suppliers •End-Users
•Wafer Fabs •Assemblers
•Manufacturers •Consumers
•New Products
•Solutions
•New Markets
•Ancillaries
•New Processes
Company Profile – www.daetec.com 7
8. Partner Facilities to Scale-Up
• R&D in Camarillo, CA
• Partner Fab in Santa Barbara, CA (30,000 sf)
• Access to Toll Mftg at six (6) locations in USA
Company Profile – www.daetec.com 8
9. History
Daetec lab designed and
‘95 John Moore founds ‘05 Moore founds Daetec, built, equipment
Moore Enviro-Chemical, Inc. resigns from GCC. capitalized.
(MEC)
’95-’00 Moore develops PR ‘00-’05 Moore starts
strippers, cleaners, specialty products division at
polymers for GCC and designs
semiconductors, GenSolveTM, GenTakTM,
aerospace, and GenCleanTM for top-tier
automotive. semiconductor firms.
‘99 Moore develops aqueous
‘00 General Chemical Corp
soluble polymers and
(GCC) purchases MEC,
cleaners at MEC for
Moore becomes Product
slicing/dicing – used to found
Development Director of
Aquabond technologies, ‘02
Electronic Chem Division.
sale to private investors.
Company Profile – www.daetec.com 9
10. Successful Commercialization
Product Application Industry
Spin-On Polymer High Temperature Wafer Bonding Semiconductor
Metal Safe PR Stripper Negative Tone and Acrylic Stripper Semiconductor
Dissolving Gel Cured Polysulfide Resin Stripper Aviation
EHS Safe Stripper Negative Tone Isoprene & Semiconductor
Bisbenzocyclobutene
Spin-On Thermoplastic Med Temperature Wafer Bonding Compound Semiconductor
Aqueous Etch Residue Cleaner Copper/Low k residue remover Semiconductor
Aqueous Based Spin-On Polymer Polishing, Slicing, Dicing Electronics/Semiconductor
Aqueous Based Polymer Remover Remover of Aqueous Based Polymer Electronics/Semiconductor
Spray Coat Polymer Wafer Protection/bonding Compound Semiconductor
Spin-On Protection Coating Acid Etch Protection Layer MEMS
Please contact us to see any pertinent publications and patents.
Company Profile – www.daetec.com 10
11. Markets Served
Microelectronics
•Silicon, GaAs & other compound semi,
FPD, data storage, MEMS
•Cleans - PR stripper & rinsing
•Coatings – cured polymers, adhesives
•Rinses – surface active agents, non-foam
•Inhibitors – substrate & metal protection
Company Profile – www.daetec.com 11
12. Markets Served
Aerospace/Aviation
•Polymer sealants & coatings – high temp,
low CTE, special engineering apps.
•Cleaners – dissolve & remove oils,
silicones, polysulfides, epoxies, others.
Company Profile – www.daetec.com 12
14. Just a few of our past partners…
Company Profile – www.daetec.com 14
15. What We Do…
• Product Development
• Material Modification
• New Application
Development
• Process Design
• Tool Design Demo
• Ancillaries
• Yield Enhancement
• EHS Compliance Review
Company Profile – www.daetec.com 15
16. Technical Capabilities
Properties—physical and chemical Process modeling—screening testing
Cleaning and residue characterization New process demonstration
Coating applications and processing Etch rates
Polymer compounding— Electrical properties for I-V curves
SEM & CD analysis
thermoplastics
Curing—thermal & radiation ESCA/XPS
Properties—mechanical and adhesion FIB
Corrosion potential & evaluation SIMS
Thin film analysis & electrical
characterization
These and other tests allows us to immediately focus on those areas with the most
potential to improve the customers processes and applications.
Company Profile – www.daetec.com 16
17. Program Planning with Market Targets
Successful commercialization depends upon market experience
installed into your development schedule
Flat Panel Mftg
Company Profile – www.daetec.com
18. Intellectual Property
•IP Assigned to
Customer
•Greater Value to
Investment
•Greater Flexibility
on Business Model
Company Profile – www.daetec.com 18
19. Creativity to New Heights!
• Creative ideas are the core of our
business and we continually push
those limits to new levels;
• Your objective represents an
important part of our growth. This
interdependency fuels our program;
• Creating new answers often
provides new business options,
leading to greater market capture.
Company Profile – www.daetec.com 19
20. Results in Record Time
Compatibility Applications
DAETEC prefers screening tests over large DOEs.
Screening tests = many options + statistics
Options = less challenges + faster results
Fast results = less cost
Company Profile – www.daetec.com 20
21. Cost Effective
We Stretch Our Resources to Reduce Costs
• Screening tests are
inherently less costly
• Require a creative
approach
• Multi-tasked
experiments using
abbreviated number
of specimens
Company Profile – www.daetec.com 21
22. Applications
Coatings Technologies
Coating Optimization
Understanding PR Polymers
Coatings Electrical Testing
Substrate Thinning
Inhibitors for Corrosion Control
CLEANING
Materials and Processing
Wafer Bumping
Panels (Solar/FPD)
PLATING
Electrolytic/less
Etchants and Surface Finishing
Process Optimization
Company Profile – www.daetec.com 22
23. Coatings Technologies
• Spin-Coating
• Spray Coating
• Slit/Brush/Roll
Cured Water
Cleans (2 steps)
• Films Coating Rinse
1 X Puddle + 1 X Spin
• Molding
• Photo initiated
• Thermal/Electrical
Conductive
• Temporary/Permanent
Company Profile – www.daetec.com 23
26. Coatings Electrical Testing
•Hg Probe – Sensitive for Thin Films
•Rapid Measurement
•IV curves, Dielectric Const., Loss
Tangent
Hg-Probe I-V Plots of Triazoles on Cu
60.0
Triazoles, 0.5% Aqueous Solns
RT 30sec Exposure
50.0
TTA
Current (uAmps)
40.0
•Hg dot contact is non-destructive
30.0
BTA
Triazole
•Used for Epi-layers and films
20.0
Mix
<50Angstroms
10.0
•Ideal for Oxide Layers, Inhibitors,
0.0
0 0.1 0.2 0.3 0.4 0.5 0.6
and Used for Residue Detection
Voltage (volts)
Company Profile – www.daetec.com
27. Substrate Thinning
•Substrates to <20um
•Protection for Backside Processing
•Simple Application & Removal
•Permanent Systems
•High Temps >400C & Low CTE
•Wide Range of Process Options
•Coating Over Bumps
•Applicable to MEMS
•Aqueous Cleans Available
•Cleans for Single Wafer & Batch
Many Polymer Options
Company Profile – www.daetec.com
28. Inhibitors for Corrosion Control
Pourbaix Diagrams & Tafel Plots to Correct Corrosion
Feature Inhibitor
Corrosion Added
Company Profile – www.daetec.com 28
38. EHS Compliant Development
• Solvent Replacement • Eliminate Toxic or
Regulated Items
with Aqueous Agents
• Eliminate Haz Waste
• Green Coatings
• Green Cost Reduction
• Green Cleaners
• Reduced Energy Use
Company Profile – www.daetec.com 38
39. Draft Plan to Contract
2-Objective
3-Plan
1-Contact * Solution Need
* New Product
* Deliverables
Daetec * Complementary
* Timing
& Product
* IP
Customer * Bundle Option
* Costs
* New Technology
Adjust
5-Action
4-Contract
6-Completion * Progress Reports
* Written
* Deliverables
* Customer Meets
Document
* Payment for
Objective
* Work Plan –
Services
* Customer has IP
* Completion – Same as (3)
most in 6mos
Company Profile – www.daetec.com 39
40. To implement a new and innovative
plan, contact us!
John Moore Technical Director
jmoore@daetec.com
Daetec, LLC
Diversified Applications Engineering Technologies
www.daetec.com
1227 Flynn Rd., Unit 310 Camarillo, CA 93012-8551
Phone: 805-484-5546 Fax: 805-484-5556
Company Profile – www.daetec.com 40