110922.Thin.Handling.Daetec.R2

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Thin Substrate Hanlding

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110922.Thin.Handling.Daetec.R2

  1. 1. Daetec  Experience  and  Success       Temporary  Adhesives  for     Thin  Substrate  Handling  &   Backside  Processing   Daetec,  LLC   2011  DAETEC Diversified  Applica@ons  Engineering  Technologies   1
  2. 2. Product Development Substrate HandlingFab Mftg DAETEC Support Analytical Testing Bridging Your Success Process Toll Development Intellectual Property Support DAETEC Diversified  Applica@ons  Engineering  Technologies   2
  3. 3. Daetec  Business  Model  •  What  We  Do:  Product  development  and   consul>ng  •  How  We  Do  it:  Formulate  commercially   available  ingredients  &  apply  to  a  process  •  Primary  Experience:  Coa>ngs  &  cleaning   products  •  Deliverables:  New  product  or  ancillary  •  Clients:  Materials  &  equipment  suppliers,  end-­‐ users  (manufacturing)  DAETEC Diversified  Applica@ons  Engineering  Technologies   3
  4. 4. Product  &  Process  Development   Resin Application via Spin Coater Thickness vs Spin Speed FTIR of DUV Resist on Silicon GATR Accessory 30.00 100.0 GenTak Adhesive 98.0 v = 3,600 25.00 Thickness  achieve  >25um   Static Dispense, 1min Spin 96.0 Hot Plate Cure 1min @100C Thickness (um) Transmittance (%) 94.0 1610 cm-1 20.00 92.0 v = 800 90.0 1510 cm-1 1450 cm-1 88.0 15.00 v = 300 86.0 Top: Resist Reference, 3um v = 160 84.0 10.00 Bottom (2): 1) Resist @ 16A, 2) Blank 1170 cm-1 82.0 v = viscosity 80.0 5.00 1700 1600 1500 1400 1300 1200 1100 0 1000 2000 3000 4000 5000 6000 Wavenumber (cm-1) Cure  Condi@ons  -­‐  Analy@cal   Spin Speed (rpm) Eng.  Curves,  Adhesion  Equipment  Applica@ons  &  Diagnos@cs   Cleans  &  Stability  Tests  DAETEC Diversified  Applica@ons  Engineering  Technologies   4
  5. 5. Concept  to  Commercializa>on   Daetec   Daetec   Daetec   Proof  of   Demo   Prototype   Concept   Client   Client   Daetec   Mass   Commercial   Technology   Produc@on   Scale-­‐Up   Transfer   Timing,  Demo  –  Tech  Transfer  ~6mos  DAETEC Diversified  Applica@ons  Engineering  Technologies   5
  6. 6. Daetec  Working  Rela>onship     Suppor2ng  Market  Leaders  •  The  staff  at  Daetec  have  developed  products,   patents,  wriUen  papers,  and  presented  work  with  a   wide  number  of  leaders  in  the  industry.    Our  work   spans  temporary  adhesives  used  in  3DIC  to  PR  and   residue  removal  processes.   DAETEC Diversified  Applica@ons  Engineering  Technologies   6
  7. 7. What  is  3DP?  •  3DP  –  3D  Packaging  (Chip  Stacking)  •  Process:  Thinning,  TSVs  for  connec>vity,  metal   for  heat  dissipa>on,  stacking  •  Similar  or  mul>ple  types  of  chips  DAETEC Diversified  Applica@ons  Engineering  Technologies   7
  8. 8. Thin  Wafer  support  Thin  Wafer   Thickness   Chem  &   Single   Backside   Handling   Min  (um)   Therm   Wafer  or   Processing   Resistant   Batch   Support  Tape   >50   No   Both   No  Vacuum   >50   No   Single   No  Chuck  Adhesive   <25   Yes   Both   Yes  Bonded  Carrier   Thinner  is   Must  be     Versa@lity   Must  do   BeXer   Resistant   Is  Best   Backside   Processing   DAETEC Diversified  Applica@ons  Engineering  Technologies   8
  9. 9. Temporary  Spin-­‐On  Adhesive   Coa@ng  and  Moun@ng  Model   Substrate  with     Coat  &  fix  on  substrate   So]/hard  bake   topography   Penetra@on  and  seng   Drive-­‐off  vola@les,  planarize   Bonding  to  carrier   Adhesion  on  cooling   Substrate  Thinning  Planarized  substrate  surface   Maintain  pressure   Grind,  polish,  stress  relief   Carrier  wafer  is  mounted  to  the  wafer  to  be  thinned  and  used   to  “handle”  or  “support”    the  thinned  wafer     through  all  the  steps  of  backside  processing   DAETEC Diversified  Applica@ons  Engineering  Technologies   9
  10. 10. Integra>ng  Thin  Wafers  &  Bumping   Through Hole Contact Bond Pad Device Build Completed  Wafer   Full size wafer Solder Bump Bumps  Complete  Thinned Wafer Carrier or no- Thinning  &  Back-­‐  carrier attached Vias and Side  Processing  Using     metallization Adhesive/Carrier   Flip-chip to solder bump on board lead mount with Flip-­‐chip  mounted   epoxy To  board   DAETEC Diversified  Applica@ons  Engineering  Technologies   10
  11. 11. Range of Coatings Available •  Solvent or water casting •  Thermoplastic or thermoset •  Evaporative (bake) or UV initiated cure •  Thermal resistance min. 200C; systems at >500C for extended time are possible •  Many are moisture and/or chemical resistant •  Transparency is possibleDAETEC Diversified  Applica@ons  Engineering  Technologies   11
  12. 12. Example Coating Systems Chemistry   Cure   Thickness    Thermal   Moisture   Method   Resistance   Resistance  Epoxy   UV   <20um   >275C   Yes  Rubber   Evap   <15um   >250C   Yes  Poly-­‐phenylene   Evap   <10um   >330C   Yes  Imidazole   Evap.   <5um   >450C   Yes  Biphenyl   Evap.   <10um   >300C   No  Sulfonate  +  Polyester  Acrylic   UV   <20um   <250C   Yes  Silicone   Cataly@c   <10um   >300C   Yes  PEI   Evap   <10um   >400C   Yes  Hybrid  system   Evap   >50um   >500C   Yes  DAETEC Diversified  Applica@ons  Engineering  Technologies   12
  13. 13. Tunable Properties•  Thickness – carrier solvent and solids•  Cure condition – material dependent•  Adhesion – neat, promoter, primer•  Outgas – process dependent (i.e. CVD)•  Hardness – crosslinking extent•  Scratch resistance – crosslink, additives•  Rework or cleans – inhibitor addition DAETEC Diversified  Applica@ons  Engineering  Technologies   13
  14. 14. Process  Development   Spin-­‐Coat   UV  Cure   Molding   Wafer  w/ devices   Spray   Heat  Cure   (Final)  DAETEC Diversified  Applica@ons  Engineering  Technologies   14
  15. 15. Coating Application Options Spin-Coating Spray-CoatingDAETEC Diversified  Applica@ons  Engineering  Technologies   15
  16. 16. Define UV Operating Window Resin Cutoff 405-415nm I-line G-line 365nm 436nmDAETEC Diversified  Applica@ons  Engineering  Technologies   16
  17. 17. DAROCUR 1173 % in Acetonitrile Wavelength (nm) IRGACURE 184 % in Acetonitrile Wavelength (nm) 3 3 2.5 2.5 Absorbance Absorbance 2 2 1.5 1.5 1 1 0.5 0.5 0 0 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 IRGACURE 754 % in Acetonitrile Wavelength (nm) IRGACURE 500 % in Acetonitrile Wavelength (nm)Free Rad 3 3 2.5 2.5 Absorbance Absorbance 2 2 1.5 1.5Initiators 1 1 0.5 0.5 0 0 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 IRGACURE 369 % in Acetonitrile Wavelength (nm) IRGACURE 907 % in Acetonitrile Wavelength (nm) 3 3 2.5 2.5Most are I-line Absorbance Absorbance 2 2 1.5 1.5 1 1 0.5 0.5 0 0 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500Few are G-line IRGACURE 1300 % in Acetonitrile Wavelength (nm) IRGACURE 819 % in Acetonitrile Wavelength (nm) 3 3 2.5 2.5 Absorbance Absorbance 2 2 1.5 1.5 1 1 0.5 0.5 0 0 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 IRGACURE 250 % in Acetonitrile Wavelength (nm) IRGACURE 784 % in 1-Methyl-2-pyrrolidone (NMP) Wavelength (nm) 1.0 3.5 3 0.8 2.5 Absorbance Absorbance 0.6 2 1.5 0.4 1 0.2 0.5 0.0 0 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 250 300 350 400 450 500 550 600 0.10 0.010 0.001DAETEC Diversified  Applica@ons  Engineering  Technologies   17
  18. 18. Simple and Rapid UV CuringLow emission source UV LED Lamp UV LED Designed SourceDAETEC Diversified  Applica@ons  Engineering  Technologies   18
  19. 19. LED vs. Hg-Arc LED Narrow EmissionDAETEC Diversified  Applica@ons  Engineering  Technologies   19
  20. 20. Low Outgas Product for CVDTargets for successful CVD processing: •  Low permeability coating •  High Tg •  If amorphous, high softening/melting point •  Softening/melt pt is > process temp •  Design cure program as > process temp DAETEC Diversified  Applica@ons  Engineering  Technologies   20
  21. 21. Barrier Usage for Reduced Outgas Gas Barrier Properties Assist with formulating low outgas coatingsDAETEC Diversified  Applica@ons  Engineering  Technologies   21
  22. 22. Process Overlay SP – softening point 50 100 CVD   150 200 250 Cure  Program   SP   De-­‐Bond   50 100 150 200 250 TemperatureDAETEC Diversified  Applica@ons  Engineering  Technologies   22
  23. 23. De-Bonding Rubber,  olefinic  &   high  MW   hydrocarbon   polymers,  blends   Acrylic,  styrenic,   and  blends   Polyimide  &   silicone   DAETEC Diversified  Applica@ons  Engineering  Technologies   23
  24. 24. Low COO Development for Solar•  Solar manufacturer of <10um thick substrates•  Suggest to eliminate spin-coating adhesive with a film lamination practice•  Use SEMI Std E35 for COO comparison of the technologies; use a ratio between COO2 (new) and COO1 (current)•  Assumptions: similar yield, internal costs, scrap, life, maintenance, etc.•  Tool costs, service, support, etc., identified as a factor of material costsDAETEC Diversified  Applica@ons  Engineering  Technologies   24
  25. 25. COO for Technology Comparison Adhesive Liquid Spin-Coat Process Adhesive Film lamination ProcessDAETEC Diversified  Applica@ons  Engineering  Technologies   25
  26. 26. COO Comparison of TechnologiesCOO    =          F$+R$+Y$                          Costs                                 =                                  L×T×Y×U                          Product           Item   Defini@on   F$   Fixed  Costs   COO2 Film Adhesive R$   Recurring  Costs   COO1 = Liquid Adhesive Y$   Yield  Cost  (scrap)   L   Equipment  Life   T   Throughput   Y   Composite  Yield   U   U@liza@on   DAETEC Diversified  Applica@ons  Engineering  Technologies   26
  27. 27. COO CalculationsCOO  2                  F$2+R$2+0                                L×T×Y×U                      COO  1                         =        L×33T2×Y×U          X        F$ +R$ +0                   1 1COO                              (0.38R$ +R$    )                            0                                                                                                2 = 2       2     =    .038R$2 = 0.0027  COO  1                    33(0.087R$ +R$    )                              R$                   1 1 1 The COO for integrating a film adhesive is 0.3% of the COO for a liquid adhesive. DAETEC Diversified  Applica@ons  Engineering  Technologies   27
  28. 28. Daetec’s  Experience   Temporary  Adhesive  Development   Date Description Customer Chemistry ProductPre-2000 Wafer dicing & Johansen Rosin/ AquaBond cleans Technology oligomer 55 & 852000 First spin-on GCC – Rosin/ GenTak 230 adhesive Motorola urethane2004 First spin-on high- GCC – Silicone GenTak 330 temp thermoset INTEL2005 First spin-on high BSI Rubber BSI HT1010 temp, acid resist2009 First spin & spray SUSS Acrylic SS1101 wafer molding composite2011 First wafer TCTI Urethane Adh-U lamination for solarDAETEC Diversified  Applica@ons  Engineering  Technologies   28
  29. 29. Daetec Issued Patents Temporary Adhesives for Thin Substrates•  US Patent #6,869,894: Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing•  US Patent #7,098,152: Adhesive support method for wafer coating, thinning, and backside processing•  US Patent #7,232,770: High temperature and chemical resistant process for wafer thinning and backside processing•  US Patent #7,678,861: Thermal and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive•  Two additional applications in 2009 (not-issued) DAETEC Diversified  Applica@ons  Engineering  Technologies   29
  30. 30. Daetec  for  Temporary  Adhesives  •  Include  an  expert  on  your  team  •  Low-­‐cost  adhesives  are  available    •  Increase  throughput  -­‐  migrate  from  single-­‐ wafer  to  batch  (from  6  wph  to  >100  wph)  •  Process  tuning  to  your  process  •  You  own  the  adhesive  and  process  •  Conven>onal  comparison,  COO  is  <50%  and   <10%  depending  upon  usage   DAETEC Diversified  Applica@ons  Engineering  Technologies   30
  31. 31. Contact for More Information•  DAETEC provides new product development, consulting, and technical support to solve manufacturing problems and introduce new options of doing business.•  Diversified Applications Engineering Technologies (DAETEC) Camarillo, CA (USA) (805) 484-5546 jmoore@daetec.com; www.DAETEC.comDAETEC Diversified  Applica@ons  Engineering  Technologies   31

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