This document discusses different cooling techniques for electronic devices, including air cooling, liquid cooling, and their components. It provides details on heat sinks, thermal interface materials, fans, blowers, and their differences. Liquid cooling uses water to transmit heat more efficiently than air cooling due to water's higher heat capacity and conductivity. While more effective, liquid cooling systems are more expensive, larger, require technical skills, and carry safety risks if leaked.
For Most Data Centers, Liquid and Air Cooling Will Not be Mutually ExclusiveUpsite Technologies
A recent report from Technavio indicates that the adoption of liquid-based cooling is high, as it is considered more efficient than air-based cooling. Globally liquid-based cooling is expected to grow at a remarkable rate through 2020, posting a CAGR of almost 16% during the forecast period. So, why is this level of adoption happening? Increasing rack densities lead by high performance computing (HPC) and the quest to improve efficiency are driving an increase in liquid cooling design strategies and deployment. While still relatively sparse, liquid cooling will become more prevalent, but this does not mean the end of air cooling. In this session, we’ll discuss how to implement liquid cooling while maintaining appropriate air-cooling conditions and fully realize efficiency gains. Lastly, we’ll discuss how to get started and get ahead of the market when it comes to improving cooling efficiency.
Computer hardware is the collection of physical parts of a computer system
Computer hardware is what you can physically touch.
This includes the computer case, monitor, keyboard, and mouse. It also includes all the parts of the computer case, such as the hard disk drive, motherboard, video card, and many others
For Most Data Centers, Liquid and Air Cooling Will Not be Mutually ExclusiveUpsite Technologies
A recent report from Technavio indicates that the adoption of liquid-based cooling is high, as it is considered more efficient than air-based cooling. Globally liquid-based cooling is expected to grow at a remarkable rate through 2020, posting a CAGR of almost 16% during the forecast period. So, why is this level of adoption happening? Increasing rack densities lead by high performance computing (HPC) and the quest to improve efficiency are driving an increase in liquid cooling design strategies and deployment. While still relatively sparse, liquid cooling will become more prevalent, but this does not mean the end of air cooling. In this session, we’ll discuss how to implement liquid cooling while maintaining appropriate air-cooling conditions and fully realize efficiency gains. Lastly, we’ll discuss how to get started and get ahead of the market when it comes to improving cooling efficiency.
Computer hardware is the collection of physical parts of a computer system
Computer hardware is what you can physically touch.
This includes the computer case, monitor, keyboard, and mouse. It also includes all the parts of the computer case, such as the hard disk drive, motherboard, video card, and many others
GONKA, established as a limited company in 1986 in Ostim, Ankara, has become one of the leading firms in Heating - Cooling - Air Conditioning - Ventilating Installation, with the high performance and disciplined working mentality of Halil GONCU (Mechanical engineer, BS MS ITU, 1975) and Salih KADAYIFCIOGLU (Mechanical Engineer, BS GU, 1982) within more than 23 years for both manufacturing and contracting.
GONKA Company, has been continuing its activities, in its factory located in Sincan Organized Industrial Area, since 1996. GONKA manufactures its products related to Heating - Cooling - Air Conditioning - Ventilating Installation in its factory in an area of 10.000 m2 and equipped with the latest technology.
GONKA, which is continuing its activities through its technical and managerial staff in its modern Directorate General Building in Cetin Emec Boulevard, Ankara which it has moved in 2002, has been replaced "GONKA Air Conditioning Installation Construction and Trade Joint-Stock Company" by transforming into "joint-stock company" in 2003.
GONKA enforces its activity in Turkey By serving through its network consisted of Istanbul and Ankara Region Offices and maintenance-repair services firms. In regions other than these, GONKA offers contact and service through local offices and central maintenance-repair crews.
GONKA; has KnowHow, especially about the field of "Clean Room" technology, which requires sterility in operating theatres and air conditioning-ventilating systems of environments such as operas, theatres, auditorium buildings, television studios which require silence.
GONKA has created "model company" profile in air conditioning sector through both manufacturing or supply of devices and its disciplined approach in mechanical operations by succeeding a lot of projects within last 23 years. GONKA, which has focused on internto 32 countries and succeeded many projects in Middle-East, Asia and Africa countries by its powerful foreign trade departmentational projects in last 15 years, gave representations
GONKA, established as a limited company in 1986 in Ostim, Ankara, has become one of the leading firms in Heating - Cooling - Air Conditioning - Ventilating Installation, with the high performance and disciplined working mentality of Halil GONCU (Mechanical engineer, BS MS ITU, 1975) and Salih KADAYIFCIOGLU (Mechanical Engineer, BS GU, 1982) within more than 23 years for both manufacturing and contracting.
GONKA Company, has been continuing its activities, in its factory located in Sincan Organized Industrial Area, since 1996. GONKA manufactures its products related to Heating - Cooling - Air Conditioning - Ventilating Installation in its factory in an area of 10.000 m2 and equipped with the latest technology.
GONKA, which is continuing its activities through its technical and managerial staff in its modern Directorate General Building in Cetin Emec Boulevard, Ankara which it has moved in 2002, has been replaced "GONKA Air Conditioning Installation Construction and Trade Joint-Stock Company" by transforming into "joint-stock company" in 2003.
GONKA enforces its activity in Turkey By serving through its network consisted of Istanbul and Ankara Region Offices and maintenance-repair services firms. In regions other than these, GONKA offers contact and service through local offices and central maintenance-repair crews.
GONKA; has KnowHow, especially about the field of "Clean Room" technology, which requires sterility in operating theatres and air conditioning-ventilating systems of environments such as operas, theatres, auditorium buildings, television studios which require silence.
GONKA has created "model company" profile in air conditioning sector through both manufacturing or supply of devices and its disciplined approach in mechanical operations by succeeding a lot of projects within last 23 years. GONKA, which has focused on internto 32 countries and succeeded many projects in Middle-East, Asia and Africa countries by its powerful foreign trade departmentational projects in last 15 years, gave representations
www.gonka.com.tr
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Welcome to UiPath Test Automation using UiPath Test Suite series part 3. In this session, we will cover desktop automation along with UI automation.
Topics covered:
UI automation Introduction,
UI automation Sample
Desktop automation flow
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Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
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Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
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👨🏫 Andras Palfi, Senior Product Manager, UiPath
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All of this illustrated with link prediction over knowledge graphs, but the argument is general.
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1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
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The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
4. HEAT SINKS
* Heat sinks are needed when the heat transfer to the
ambient air directly from the top of the device is not sufficient
to keep the semiconductor device within the allowable
temperature range.
* heat sink was supplanted in
higher power applications .
* increasing the thermal conductance
of components and increasing
the fin area exposed to the airflow
is very important.
5. THERMAL INTERFACE MATERIALS
• TIM is essential when two or more solid surfaces are in
the heat path.
• The air gaps created by multiple voids of "contacting"
hard surfaces are simply too large a thermal barrier for
even modest power applications.
• The first tactic in overcoming this barrier is to fill the
voids and eliminate air by introducing a third material to
the heat path that is fluidic and wets the surfaces.
6. Cont.
• An important property of any TIM is its thermal
conductivity.
• grease and Elastomeric pads are used as TIM.
7. COOLING FANS AND BLOWERS
• Cooling fans and blowers are essential to systems
that produce a significant amount of heat like
computers and other electronic components.
• Different systems are
engineered to work with
specific types of fans.
• Cooling fans come in all
shapes and sizes.
as well as voltage,
airflow, and case size.
8. Difference Between Fans and Blowers
Axial fans:
• Create an air flow that is parallel to the axis of the
fan blade.
• designed to work with systems that have low back
air pressure and high rate air flow.
• less noise.
• Quite common and the most
economical cooling solution.
• they are normally used
in computers.
9. CONT.
Blowers :
• Send air on a perpendicular direction in relation
to its axis.
• Designed to work with systems that have high
impedance (i.e. high back pressure) and low rate air flow.
• It produce a more concentrated airflow
in a system, So they tend to generate
a significant amount of noise.
• they are used in Servers.
10. AC AND DC COOLING FANS
property DC FANs AC Fans
voltages 5V, 12V, or 24V 110v , 220v
frequency 0 50 Hz , 60 Hz
Air Flow speed Variable Constant
Power consuming Low ( 60 percent less) high
Electro Magnetic
and Lower level Higher level
Radio Frequency
Interference
Life longer shorter
11. CONT.
• The difference in the cost between AC fan and DC fan is
negligible.
• When choosing fan for your applications, it is important
to look at the cooling requirements of the system and
applications, the fan type, the air flow, and AC or DC
power operation.
• AC fans are used when DC voltage is not available.
• All types of computer equipment rely on DC cooling fans.
16. IBM BLADE CENTER H:
COOLING SUBSYSTEM
Hot-swap customer serviceable Hot-swap customer serviceable
fan packs AC blower units
BladeCenter H rear chassis
18. COOLING OF RACKS WITH CONDITIONED AIR
AIRFLOW
Front or
Footprint Inlet
Raised Floor Supply Air Raised Floor Supply Air
Front In – Rear Out Front In – Top Out
20. What is liquid cooling ?
• Liquid (Water)cooling is a method of heat removal
from electrical components . As opposed to air
cooling, water is used as the heat conductor.
21. History
• Cooling hot computer components with various
fluids has been in use since at least as far back as
the development of Cray-2 in 1982.
• Through the 1990s, water cooling for home PCs
slowly gained.
• it started to become noticeably more prevalent after
the introduction of AMD's hot-running Athlon
processor in mid 2000
22. Cont.
• As of 2011, there are several manufacturers of
water cooling components and kits, and some
custom computer retailers include various setups of
water cooling for their high performance systems.
• Apple's Power Mac G5 was the first mainstream
desktop computer to have water cooling as
standard.
• Dell followed suit by shipping their XPS computers
with liquid cooling.
27. cont.
Radiators have different FPI (fins per inch) and therefor optimized for different type
of fans, the ones with high FPI are optimal with powerful fans where ones with low
FPI are better for lower RPM fans.
32. Advantages
of liquid cooling over air cooling
• water's higher specific heat capacity, density, and
thermal conductivity. This allows water to transmit
heat over greater distances with much less
volumetric flow and reduced temperature difference.
• Drawing heat away from the processor and outside
of the system. This allows for higher clock speeds in
the processor as the ambient temperatures of the
CPU core are still within the manufacturer's
specifications.
33. Advantages
cont.
• The water jacket around an engine is also very
effective at deadening mechanical noises, which
makes the engine quieter, Many high performance
CPUs require fan speeds in excess of 7000 rpm that
generate noise of 60+ decibels of noise.
• No DUST and no need to open computer to clean it.
34. Disadvantages.
• Costs significantly more than an air-cooled engine
system, approx. 600$.
• Size and weight ,need large area inside and out
side the computer require larger desktop system
cases to fit all of these parts within the computer
case itself ,approx.6.5Kg.
• and technical skills required to install a kit , suitable
tubes length , leaks could cause severe damage to
the components inside of the system.
35. cont.
• Leaking .
• Condensation, due to the ambient air right around
the pelt being cold.
• Water freezes at 0℃.
36. Usage
• Water cooling can be used to cool many computer
components.
• especially the CPU.
• GPU.
• Northbridge's.
• Southbridge's.
• Hard disk drives.
• Memory.
• Voltage regulator modules (VRMs).
• Power supplies can be water-cooled.
37. Coolant.
• This coolant contains a high quality anti-corrosion agent
for various materials including copper, aluminum, and
plastic, that prevents corrosion for long term operation.
• Material : Propylene Glycol & Anti-Corrosion Agent.
• Freezing Point : -9℃.
• Exchange Cycle : 1 year.
38. Liquid vs. Air cooling
Liquid Air
Cost high low
size big small
compatibility Specific CPU All CPU
safety less more
Skill required yes no
efficiency high moderate
spread low high