This document contains definitions for 277 common computer and technology related acronyms and abbreviations, including ALU, ACPI, AC, AM, AMD, AMI, ANSI, API, APIC and others related to hardware components, software, networking and other areas of computing.
Craneboard, from Mistral, is a hardware development platform that enables customers to develop general purpose computing and other applications based on the Sitara AM3517 ARM Cortex - A8 microprocessor device. Craneboard is a low cost, open source reference platform to help the developer community leverage the benefits of the AM3517 processor while leveraging a host of exciting peripherals.
Raspberry pi glossary of terms dictionary extendedWiseNaeem
The Extended Version of glossary of Necessary Terms that are used to discover Raspberry pi or Arduino Projects and their Related Content and terms, Which one would have know About the Projects
Craneboard, from Mistral, is a hardware development platform that enables customers to develop general purpose computing and other applications based on the Sitara AM3517 ARM Cortex - A8 microprocessor device. Craneboard is a low cost, open source reference platform to help the developer community leverage the benefits of the AM3517 processor while leveraging a host of exciting peripherals.
Raspberry pi glossary of terms dictionary extendedWiseNaeem
The Extended Version of glossary of Necessary Terms that are used to discover Raspberry pi or Arduino Projects and their Related Content and terms, Which one would have know About the Projects
PCIe Gen 3.0 Presentation @ 4th FPGA CampFPGA Central
PCIe Gen3 presentation by PLDA at 4th FPGA Camp in Santa Clara, CA. For more details visit http://www.fpgacentral.com/fpgacamp or http://www.fpgacentral.com
iW-RainboW-G8M-Q7 (Q7 Compatible i.MX51 Module) is based on Freescale's i.MX51 multimedia application processor comply with Qseven? Rel.1.20. The processor features advanced and power-efficient implementation of the ARM Cortex A8 core, which operates at speeds of 800 MHz and higher. This module provides advanced peripheral integration, green energy efficient-power savings, reduced time to market and it can be used for any portable computing applications like Industrial Handheld, High-end PDAs, Advanced HMI, Secure Devices, Automotive Handhelds, Mobile Internet Devices, Wireless Medical Handheld devices, etc.
This form factor allows space-saving hardware designs as well as quick and simple integration of the module into the target application
The AM37x EVM and/or DM37x EVM from Mistral is a highly integrated and easy-to-use development platform based on TI's AM/DM37x Sitara Microprocessor. Designed with a modular and extendable architecture, the EVM helps developers leverage the benefits of the powerful AM/DM37x processor comprising of the advanced Superscalar ARM® Cortex™-A8 RISC core with NEON co-processing.
To view this webcast on-demand, visit http://ecast.opensystemsmedia.com/337
How to Minimize Cost and Risk for Developing Safety-Certifiable Systems
Designing modern avionics systems, for manned as well as unmanned aircraft, requires a challenging and unique integration of safety-critical components, including processors, operating systems, communication media and application software. The requirement to meet RTCA DO-178 Level A or other safety certification criteria makes designs for these systems even more demanding.
In this webinar, learn how the use of one common integration platform in your designs lowers development and certification costs and reduces overall project risk. We will discuss testability of distributed systems, how to avoid sources of non-determinism, design alternatives to reliable communication and more.
As an innovator of safety-certifiable communications software based on the world's leading implementation of the OMG Data Distribution Service (DDS), we are working with dozens of teams developing safety-critical distributed systems. Our position renders a unique perspective spanning very different designs that we will share with you during the webinar. The intended audience includes architects and chief engineers for safety-critical systems.
Spansion Traveo MCUs for Automotive Dashboards with HMI and Embedded 3D Graph...Spansion
Spansion® Traveo™ microcontroller family is aimed at rich human machine interface (HMI) in automotive dashboards. For the first time, Spansion is integrating its breakthrough HyperBus™ interface with its ARM® Cortex®-R5-based embedded Traveo MCU, enabling seamless connections with HyperBus memories, including Spansion HyperFlash™ memory, to provide customers design simplification and faster performance in automotive systems.
PCIe Gen 3.0 Presentation @ 4th FPGA CampFPGA Central
PCIe Gen3 presentation by PLDA at 4th FPGA Camp in Santa Clara, CA. For more details visit http://www.fpgacentral.com/fpgacamp or http://www.fpgacentral.com
iW-RainboW-G8M-Q7 (Q7 Compatible i.MX51 Module) is based on Freescale's i.MX51 multimedia application processor comply with Qseven? Rel.1.20. The processor features advanced and power-efficient implementation of the ARM Cortex A8 core, which operates at speeds of 800 MHz and higher. This module provides advanced peripheral integration, green energy efficient-power savings, reduced time to market and it can be used for any portable computing applications like Industrial Handheld, High-end PDAs, Advanced HMI, Secure Devices, Automotive Handhelds, Mobile Internet Devices, Wireless Medical Handheld devices, etc.
This form factor allows space-saving hardware designs as well as quick and simple integration of the module into the target application
The AM37x EVM and/or DM37x EVM from Mistral is a highly integrated and easy-to-use development platform based on TI's AM/DM37x Sitara Microprocessor. Designed with a modular and extendable architecture, the EVM helps developers leverage the benefits of the powerful AM/DM37x processor comprising of the advanced Superscalar ARM® Cortex™-A8 RISC core with NEON co-processing.
To view this webcast on-demand, visit http://ecast.opensystemsmedia.com/337
How to Minimize Cost and Risk for Developing Safety-Certifiable Systems
Designing modern avionics systems, for manned as well as unmanned aircraft, requires a challenging and unique integration of safety-critical components, including processors, operating systems, communication media and application software. The requirement to meet RTCA DO-178 Level A or other safety certification criteria makes designs for these systems even more demanding.
In this webinar, learn how the use of one common integration platform in your designs lowers development and certification costs and reduces overall project risk. We will discuss testability of distributed systems, how to avoid sources of non-determinism, design alternatives to reliable communication and more.
As an innovator of safety-certifiable communications software based on the world's leading implementation of the OMG Data Distribution Service (DDS), we are working with dozens of teams developing safety-critical distributed systems. Our position renders a unique perspective spanning very different designs that we will share with you during the webinar. The intended audience includes architects and chief engineers for safety-critical systems.
Spansion Traveo MCUs for Automotive Dashboards with HMI and Embedded 3D Graph...Spansion
Spansion® Traveo™ microcontroller family is aimed at rich human machine interface (HMI) in automotive dashboards. For the first time, Spansion is integrating its breakthrough HyperBus™ interface with its ARM® Cortex®-R5-based embedded Traveo MCU, enabling seamless connections with HyperBus memories, including Spansion HyperFlash™ memory, to provide customers design simplification and faster performance in automotive systems.
What are the top 100 PHP Interview Questions and Answers in 2014? Based on the most popular PHP questions asked in interview, we've compiled a list of the 100 most popular PHP interview questions in 2014.
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uCluster (micro-Cluster) is a toy computer cluster composed of 3 Raspberry Pi boards, 2 NVIDIA Jetson Nano boards and 1 NVIDIA Jetson TX2 board.
The presentation shows how to build the uCluster and focuses on few interesting technologies for further consideration when building a cluster at any scale.
The project is for educational purposes and tinkering with various technologies.
Embedded Event 2012 - ARM Based Solution Presentation with Multi Cores , CortexRx Platforms and more .
NXP LPC43xx Multi Core MCU
TI's Multi Core DSP and Cortex
TI's Hercules CortexR4
A Strategic Approach: GenAI in EducationPeter Windle
Artificial Intelligence (AI) technologies such as Generative AI, Image Generators and Large Language Models have had a dramatic impact on teaching, learning and assessment over the past 18 months. The most immediate threat AI posed was to Academic Integrity with Higher Education Institutes (HEIs) focusing their efforts on combating the use of GenAI in assessment. Guidelines were developed for staff and students, policies put in place too. Innovative educators have forged paths in the use of Generative AI for teaching, learning and assessments leading to pockets of transformation springing up across HEIs, often with little or no top-down guidance, support or direction.
This Gasta posits a strategic approach to integrating AI into HEIs to prepare staff, students and the curriculum for an evolving world and workplace. We will highlight the advantages of working with these technologies beyond the realm of teaching, learning and assessment by considering prompt engineering skills, industry impact, curriculum changes, and the need for staff upskilling. In contrast, not engaging strategically with Generative AI poses risks, including falling behind peers, missed opportunities and failing to ensure our graduates remain employable. The rapid evolution of AI technologies necessitates a proactive and strategic approach if we are to remain relevant.
Francesca Gottschalk - How can education support child empowerment.pptxEduSkills OECD
Francesca Gottschalk from the OECD’s Centre for Educational Research and Innovation presents at the Ask an Expert Webinar: How can education support child empowerment?
Normal Labour/ Stages of Labour/ Mechanism of LabourWasim Ak
Normal labor is also termed spontaneous labor, defined as the natural physiological process through which the fetus, placenta, and membranes are expelled from the uterus through the birth canal at term (37 to 42 weeks
Acetabularia Information For Class 9 .docxvaibhavrinwa19
Acetabularia acetabulum is a single-celled green alga that in its vegetative state is morphologically differentiated into a basal rhizoid and an axially elongated stalk, which bears whorls of branching hairs. The single diploid nucleus resides in the rhizoid.
Unit 8 - Information and Communication Technology (Paper I).pdfThiyagu K
This slides describes the basic concepts of ICT, basics of Email, Emerging Technology and Digital Initiatives in Education. This presentations aligns with the UGC Paper I syllabus.
Synthetic Fiber Construction in lab .pptxPavel ( NSTU)
Synthetic fiber production is a fascinating and complex field that blends chemistry, engineering, and environmental science. By understanding these aspects, students can gain a comprehensive view of synthetic fiber production, its impact on society and the environment, and the potential for future innovations. Synthetic fibers play a crucial role in modern society, impacting various aspects of daily life, industry, and the environment. ynthetic fibers are integral to modern life, offering a range of benefits from cost-effectiveness and versatility to innovative applications and performance characteristics. While they pose environmental challenges, ongoing research and development aim to create more sustainable and eco-friendly alternatives. Understanding the importance of synthetic fibers helps in appreciating their role in the economy, industry, and daily life, while also emphasizing the need for sustainable practices and innovation.
Read| The latest issue of The Challenger is here! We are thrilled to announce that our school paper has qualified for the NATIONAL SCHOOLS PRESS CONFERENCE (NSPC) 2024. Thank you for your unwavering support and trust. Dive into the stories that made us stand out!
June 3, 2024 Anti-Semitism Letter Sent to MIT President Kornbluth and MIT Cor...Levi Shapiro
Letter from the Congress of the United States regarding Anti-Semitism sent June 3rd to MIT President Sally Kornbluth, MIT Corp Chair, Mark Gorenberg
Dear Dr. Kornbluth and Mr. Gorenberg,
The US House of Representatives is deeply concerned by ongoing and pervasive acts of antisemitic
harassment and intimidation at the Massachusetts Institute of Technology (MIT). Failing to act decisively to ensure a safe learning environment for all students would be a grave dereliction of your responsibilities as President of MIT and Chair of the MIT Corporation.
This Congress will not stand idly by and allow an environment hostile to Jewish students to persist. The House believes that your institution is in violation of Title VI of the Civil Rights Act, and the inability or
unwillingness to rectify this violation through action requires accountability.
Postsecondary education is a unique opportunity for students to learn and have their ideas and beliefs challenged. However, universities receiving hundreds of millions of federal funds annually have denied
students that opportunity and have been hijacked to become venues for the promotion of terrorism, antisemitic harassment and intimidation, unlawful encampments, and in some cases, assaults and riots.
The House of Representatives will not countenance the use of federal funds to indoctrinate students into hateful, antisemitic, anti-American supporters of terrorism. Investigations into campus antisemitism by the Committee on Education and the Workforce and the Committee on Ways and Means have been expanded into a Congress-wide probe across all relevant jurisdictions to address this national crisis. The undersigned Committees will conduct oversight into the use of federal funds at MIT and its learning environment under authorities granted to each Committee.
• The Committee on Education and the Workforce has been investigating your institution since December 7, 2023. The Committee has broad jurisdiction over postsecondary education, including its compliance with Title VI of the Civil Rights Act, campus safety concerns over disruptions to the learning environment, and the awarding of federal student aid under the Higher Education Act.
• The Committee on Oversight and Accountability is investigating the sources of funding and other support flowing to groups espousing pro-Hamas propaganda and engaged in antisemitic harassment and intimidation of students. The Committee on Oversight and Accountability is the principal oversight committee of the US House of Representatives and has broad authority to investigate “any matter” at “any time” under House Rule X.
• The Committee on Ways and Means has been investigating several universities since November 15, 2023, when the Committee held a hearing entitled From Ivory Towers to Dark Corners: Investigating the Nexus Between Antisemitism, Tax-Exempt Universities, and Terror Financing. The Committee followed the hearing with letters to those institutions on January 10, 202
Embracing GenAI - A Strategic ImperativePeter Windle
Artificial Intelligence (AI) technologies such as Generative AI, Image Generators and Large Language Models have had a dramatic impact on teaching, learning and assessment over the past 18 months. The most immediate threat AI posed was to Academic Integrity with Higher Education Institutes (HEIs) focusing their efforts on combating the use of GenAI in assessment. Guidelines were developed for staff and students, policies put in place too. Innovative educators have forged paths in the use of Generative AI for teaching, learning and assessments leading to pockets of transformation springing up across HEIs, often with little or no top-down guidance, support or direction.
This Gasta posits a strategic approach to integrating AI into HEIs to prepare staff, students and the curriculum for an evolving world and workplace. We will highlight the advantages of working with these technologies beyond the realm of teaching, learning and assessment by considering prompt engineering skills, industry impact, curriculum changes, and the need for staff upskilling. In contrast, not engaging strategically with Generative AI poses risks, including falling behind peers, missed opportunities and failing to ensure our graduates remain employable. The rapid evolution of AI technologies necessitates a proactive and strategic approach if we are to remain relevant.
Introduction to AI for Nonprofits with Tapp NetworkTechSoup
Dive into the world of AI! Experts Jon Hill and Tareq Monaur will guide you through AI's role in enhancing nonprofit websites and basic marketing strategies, making it easy to understand and apply.
Introduction to AI for Nonprofits with Tapp Network
Computer relative short from....
1. 1. ALU: Arithmetic logic unit
2. ACPI: Advanced Configuration and Power Interface
3. AC: Alternating Current
4. AM: Amplitude Modulated
5. AMD: Advanced Micro Devices, Inc.
6. AMD: Advanced Micro Devices, Inc.
7. AMI: American Megatrends Inc.
8. ANSI: American National Standards Institute
9. API: Application Program Interface
10. APIC: Advanced Programmable Interrupt Controller
11. APM: Advanced Power Management
12. ASCII: American Standard Code for Information
Interchange
13. ASIC: Application Specific Integrated Circuit
14. ASPI: Advanced SCSI Programming Interface
15. AT: Advanced Technology
16. ATA: AT Bus Attachment
17. ATAPI: ATA Packet Interface
18. ATM: Asynchronous Transfer Mode
19. BBS: Bulletin Board System
20. BCC: Block Check Character
21. BSC: Binary Synchronous Communications
22. BSD: Berkeley Standard Distribution
23. BTU: British Thermal Units
24. BCD: Binary Coded Decimal
25. BIOS: Basic Input / Output System
26. BNC: Bayonet Nut Connector
27. BPS: Bytes Per Second
28. bps: bits Per Second
29. CAM: Computer Aided Manufacturing
30. CAD: Computer Aided Design
2. 31. CAS: Column Address Strobe
32. CPU : Central Processing Unit
33. CPI: Clocks Per Instruction
34. CR: Carriage Return
35. CUI : Composite User Interface
36. CRT : Cathode Ray Tube
37. CRC: Cyclical Redundancy Check
38. CD: Carrier Detect & Compact Disc
39. CD-R : Compact Disc-Recordable
40. CD-RW : Compact Disc-ReWritable
41. CD-ROM : Compact disc read-only memory
42. CGA: Color Graphics Adapter
43. CHS: Cylinder Head Sector
44. COMPUTER: Common Oriented Machine Particularly
Used for Trade Education and Research
45. CMOS: Complementary Metal-Oxide Semiconductor
46. CPLD: Complex Programmable Logic Device
47. CSR: Command Status Register
48. CRC: Cyclic Redundancy Check
49. CTS: Clear To Send
50. DVI : Digital Visual Interface
51. DVD : Digital Video Disc or Digital Versatile Disc
52. DAT: Digital Audio Tape
53. DC: Direct Current
54. DCD: Data Carrier Detect
55. DCE: Data Circuit-terminating Equipment
56. DD: Double Density
57. DEC: Digital Equipment Corporation
58. DIMM: Dual Inline Memory Module
59. DIP: Dual-In-line Package
60. DMA: Direct Memory Access
3. 61. DMI: Desktop Management Interface
62. DOS: Disk Operating System
63. DPE: Data Parity Error
64. DRAM: Dynamic Random Access Memory
65. DS: Double Sided
66. DSP: Digital Signal Processor
67. DSR: Data Set Ready
68. DTA: Disk Transfer Area
69. DTC: Data Terminal Controller
70. DTE: Data Terminating Equipment
71. DTR: Data Terminal Ready
72. EBCDIC: Extended Binary Coded Decimal Interchange
Code
73. EC: Error Check
74. ECC: Error Check and Correction
75. ECP: Enhanced Communication Port
76. ECU: EISA Configuration Utility
77. EDO: Extended Data Out RAM
78. EEPROM: Electrically Erasable Programmable Read Only
Memory
79. EGA: Enhanced Graphics Adapter
80. EIA: Electronic Industries Association
81. EIDE: Enhanced Integrated Device Electronics
82. EISA: Enhanced Industry Standard Architecture
83. EMI: Electro-Magnetic Interference
84. EMF: Electro-Magnetic Force
85. EMM: Expanded Memory Manager
86. EMS: Expanded Memory Specification
87. EOF: End Of File
88. EOL: End Of Line
89. EPP: Enhanced Parallel Port
4. 90. EPROM: Erasable Programmable Read Only Memory
91. ESCD: Extended System Configuration Data
92. ESD: Electro-Static Discharge
93. ESDI: Enhanced Small Devices Interface
94. FTP - File Transfer Protocol
95. FAT: File Allocation Table
96. FCC: Federal Communications Commission
97. FDD: Fixed/Floppy Disk Drive
98. FDDI: Fiber Distributed Data Interface
99. FDM: Frequency Division Multiplexing
100. FDX: Full-Duplex Transmission
101. FE: Front End
102. FEP: Front End Processor
103. FF: Form Feed
104. FIFO: First-In First-Out
105. FILO: First-In Last-Out
106. FM: Frequency Modulation
107. FPGA: Field Programmable Gate Array
108. FPM: Fast Page Mode RAM
109. FPU: Floating Point Unit
110. FRC: Functional Redundancy Checking
111. FRU: Field-Replaceable Unit
112. FSF: Free Software Foundation
113. FSK: Frequency Shifty Keying
114. GUI : Graphical user interface
115. GAS: Gallium Arsenide
116. GFLOPS: Billions of Floating Point Operations Per
Second
117. HTML : Hyper Text Markup Language
118. HD: High Density
119. HDD: Hard Disk Drive
5. 120. HDX: Half-Duplex Transmission
121. HFS: Hierarchical File System
122. HPFS: High Performance File System
123. IBM : International Business Machines
124. I/O: Input/Output
125. IC: Integrated Circuit
126. IDE: Integrated Device Electronics
127. IEEE: Institute of Electrical and Electronic Engineers
128. IMP: Interface Message Processor
129. IP: Internet Protocol
130. IPC: Inter Process Communication
131. IPX: Inter network Packet eXchange
132. IRQ: Interrupt ReQuest
133. ISA: Industry Standard Architecture
134. ISDN: Integrated Services Digital Network
135. ISO: International Standards Organization
136. ISR: Interrupt Service Routine
137. IVT: Interrupt Vector Table
138. JFS: Journalized File System
139. KNI: Katmai New Instructions
140. KVA: KiloVolt-Amps
141. LBA: Linear Block Array / Addressing
142. LCD : Liquid crystal display
143. LAN : Local area network
144. LOGO : Language of Graphic-Oriented
145. LED: Light Emitting Diode
146. LF: Line Feed
147. LIF : Low Insertion Force
148. LIM: Lotus/Intel/Microsoft’s Expanded Memory
Manager
149. LRU: Least-Recently Used
6. 150. LSB: Least Significant Byte/bit
151. LSI: Large Scale Integration
152. LUN: Logical Unit Number
153. LASER : Light Amplification by Stimulated
Emission of Radiation
154. MAN : Metropolitan area network
155. MESI: Modified/Exclusive/Shared/Invalid
156. MIPS : Microprocessor without Interlocked Pipeline
Stages
157. MSo : Micro Soft Office, Multi system operator
158. MB/Mb: Mega Bytes/bits
159. MBR: Master Boot Record
160. MCA: Micro Channel Architecture
161. MCGA: Multi-Color Graphics Array
162. MCM: Multi-Chip Module
163. MDRAM: Multi-bank RAM
164. MFLOPS: Millions of FLOating Point Operations per
Second
165. MFM: Modified Frequency Modulated
166. MHz: MegaHertz
167. MICR: Magnetic Ink Character Recognition
168. MIDI: Musical Instrument Data Interface
169. MIMD: Multiple-Instruction Multiple-Data
170. MISD: Multiple-Instruction Single Data
171. MMX: Multi-Media Extensions
172. MNP: Microcom Network Protocol
173. MODEM: MOdulator / DEModulator
174. MOPS: Millions of Operations Per Second
175. MOS: Metal-Oxide Semiconductor
176. MP: Multi-Processor
177. MPP: Massively Parallel Processor
7. 178. MPS: Multi-Processor System
179. MSB: Most Significant Byte/bit
180. MSDOS: Microsoft’s Disk Operating System
181. SI: Medium Scale Integration
182. MTBF: Mean Time Between Failure
183. N/C: No-Connect
184. NBS: National Bureau of Standards
185. NEMA: National Electrical Manufacturers
Association
186. NFS: Network File System
187. NFU: Not-Frequently Used
188. NIC: Network Interface Card
189. NMI: Non-Maskable Interrupt
190. NMOS: Negatively doped Metal-Oxide
Semiconductor
191. NOP: No OPeration NRU Not-Recently Used
192. NOS: Network Operating System
193. NSF: National Science Foundation
194. NTFS: New Technology File System
195. NVRAM: NonVolatile Random Access Memory
196. OCR: Optical Character Recognition
197. ODI: Open Data link Interface
198. OEM: Original Equipment Manufacturer
199. OS: Operating System
200. OSF: Open Software Foundation
201. OSI: Open Systems Interconnect
202. PAL: Programmable Array Logic
203. PB: Push Button
204. PBX: Private Branch eXtender
205. PC: Personal Computer, Program Counter
206. PCB: Printed Circuit Board
8. 207. PCI: Peripheral Component Interconnect
208. PCM: Pulse Code Modulation
209. PCMCIA: Personal Computer Memory Card
International Association
210. PE: Processor Element
211. PFF: Page Fault Frequency
212. PGA: Professional Graphics Array
213. PGA: Pin Grid Array
214. PIC: Programmable Interrupt Controller
215. PIO: Programmed Input / Output
216. PIROM: Processor Information ROM
217. PLA: Programmable Logic Array
218. PLCC: Plastic Leaded Chip Carrier
219. PLD: Programmable Logic Devices
220. PLL: Phase Locked Loop
221. PM: Preventive Maintenance
222. PMOS: Positively doped Metal-Oxide Semiconductor
223. PnP: Plug-and-Play
224. POST: Power On Self Test
225. PPP: Point-to-Point Protocol
226. PQFP: Plastic Quad Flat Pack
227. PROM: Programmable Read Only Memory
228. PSTN: Public Switched Telephone Network
229. PSP: Program Segment Prefix
230. PTE: Page Table Entry
231. QAM: Quadrature Amplitude Modulation
232. QFP: Quad Flat Pack
233. QIC: Quarter Inch Cartridge
234. RAM - Random-access memory
235. RAID: Redundant Arrays of Inexpensive Disks
9. 236. RAMDAC: Random Access Memory Digital to
Analogue Converter
237. RAS: Row Address Strobe
238. RCA: Radio Corporation of America
239. RCC: Routing Control Center
240. RDRAM: Rambus DRAM
241. RFC: Request For Comments
242. RFI: Radio Frequency Interference
243. RI: Ring Indicator
244. RISC: Reduced Instruction-Set Computer
245. RLL: Run Length Limited
246. RMS: Root Mean Squared
247. RMW: Read Modify Write
248. ROM: Read Only Memory
249. RPC: Remote Procedure Call
250. RPM: Rotations Per Minute
251. RTC: Real Time Clock
252. RTS: Request To Send
253. SAM: Sequential Access Memory
254. SASI: Shugart Associates Standard Interface
255. SCSI: Small Computer Systems Interface
256. SD: Single Density
257. SDLC: Synchronous Data Link Control
258. SDRAM: Synchronous Dynamic RAM
259. SDRAM DDR: Double Data Rate SDRAM
260. SDRAM BDDR: Bi-Directional Strobed DDR
SDRAM
261. SE: Systems Engineer
262. SEC: Single Edge Contact
263. SFF: Small Form Factor
264. SGRAM: Synchronous Graphics RAM
10. 265. SMS : Short Message Service
266. SIMD: Single-Instruction Multiple-Data
267. SIMM: Single Inline Memory Module
268. SIPP: Single Inline Pinned Package
269. SISD: Single-Instruction Single-Data
270. SLIP: Serial Line Internet Protocol
271. SMD: Surface Mount Device
272. SMT: Surface Mount Technology
273. SNA: System Network Architecture
274. SNR: Signal to Noise Ratio
275. SOL: Small Out Line
276. SOIC: Small Outline Integrated Circuit
277. SPOOL: Simultaneous Peripheral Operation On Line
278. SPT: Sectors Per Track
279. SPU: Single Processor Unit
280. SRAM: Static Random Access Memory
281. SS: Single Sided
282. STDM: Synchronous Time Division Multiplexing
283. STN: Super Twisted Nematic
284. STU: Streaming Tape Unit
285. SVGA: Super Video Graphics Array
286. TCM: Trellis Code Modulation
287. TCP : Transmission Control Protocol
288. TCP/IP: Transmission Control Protocol / Internet
Protocol
289. TDM: Time Division Multiplexing
290. TI: Texas Instruments
291. TIA: Telecomm Industry Association
292. TLB: Translation-Look aside Buffer
293. TPI: Tracks Per Inch
294. TRANSISTOR: TRANSformer resISTOR
11. 295. TSR: Terminate and Stay Resident
296. TTL: Transistor-Transistor Logic
297. UAE: Unrecoverable Application Error
298. UART: Universal Asynchronous
Receiver/Transmitter
299. USART: Universal Synchronous/Asynchronous
Receiver/Transmitter
300. UDP: User Datagram Protocol
301. UMB: Upper Memory Block
302. USB: Universal Serial Bus
303. UNIX: A trademark used for a computer disk
operating system
304. UPS - Uninterruptible power supply
305. USL: UNIX System Labs
306. UUCP: UNIX to UNIX Copy Program
307. VIRUS : Vital Information Resources Under Seize
308. VDU : Visual Display Unit
309. VBE: Video BIOS Extensions
310. VCR: Video Cassette RecorderVESA: Video
Enhanced Standards Association
311. VGA: Video Graphics Array
312. VLB: VESA Local Bus
313. VLIW: Very Long Instruction Word
314. VLSI: Very Large Scale Integration
315. VM: Virtual Memory
316. VME: Versa Module Euro-card
317. VRAM: Video Random Access Memory
318. VRT: Voltage Reduction Technology
319. VTR: Video Tape Recorder
320. WAN : Wide area network
321. WATS: Wide Area Telephone Service
12. 322. WD: Western Digital
323. WORM: Write Once - Read-Many
324. WRAM: Window Random Access Memory
325. WS: Wait State
326. WWW : World Wide Web
327. XGA: eXtended Graphics Array
328. XMS: Extended Memory Specification
329. XOR: Exclusive-OR
330. XNOR: Exclusive-NOR
331. XT: eXtended Technology
332. ZIF: Zero Insertion Force