iW-RainboW-G8M-Q7 (Q7 Compatible i.MX51 Module) is based on Freescale's i.MX51 multimedia application processor comply with Qseven? Rel.1.20. The processor features advanced and power-efficient implementation of the ARM Cortex A8 core, which operates at speeds of 800 MHz and higher. This module provides advanced peripheral integration, green energy efficient-power savings, reduced time to market and it can be used for any portable computing applications like Industrial Handheld, High-end PDAs, Advanced HMI, Secure Devices, Automotive Handhelds, Mobile Internet Devices, Wireless Medical Handheld devices, etc. This form factor allows space-saving hardware designs as well as quick and simple integration of the module into the target application

1. Q7 SOM
A Substitute to Custom Engineering
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2. Session Agenda
SOM Overview
Uniqueness of Q7 SOM
ARM growth towards Q7
Q7 SOM design challenges
iWave’s Q7 SOM roadmap
Case Studies
References
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3. SOM OVERVIEW
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4. SOM/COM Definition
Extension of SOC and serves the purpose of
flexible SBC
Best aspects of Off the shelf SBC and Custom
design solution
Suitable for low power embedded computing
Widely accepted different industry requirements
X-Board, ETX/XTX, COM Express, Q7 etc
In 2008 COM market size is US$ 515 million - VDC
market study
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5. SOM Advantages
Small size packed with great stuff
Ready to use Off the shelf availability
Quick time to market
Great cost saving
Scalable CPU choices
Reduces risk - No manufacturing overheads
Design Reuse
Control over form factors
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6. SOM/COM standards Evolution
Standard X-Board ETX XTX COM Express
110x155mm (Extended)
Form factor 68mmx49mm 95x114 mm 95x114 mm 95x125mm (Basic)
95x95mm (Compact)
Legacy Support Full Legacy Full Legacy Legacy except ISA Legacy except ISA
PCI Yes Yes Yes Yes
PCIe No No Yes Yes
Voltage 3.3V,3.3VSB 5V, 5VSB 5V, 5VSB 12V, 5VSB
Legacy Support
PowerPC/X86 based architecture
Power intensive
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7. UNIQUENESS OF Q7 SOM
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8. Q7 SOM Interfaces
Legacy free interfaces only
4x PCI Express lanes
2x SATA, 8x USB 2.0
2x Express Card
SDIO, I²C Bus
High Definition Audio/AC97
Gigabit Ethernet
Graphic Interfaces
LVDS 2x24 Bit
SDVO, Display Port and HDMI (shared)
Power
Single 5V power for low cost implementation
Battery Management
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9. Q7 Uniqueness
Q7 is the Only one SOM Standard available for ARM/RISC CPU
Small Form factor & easy integration
High performance fast serial interfaces
Scalability across various CPU choices
ARM, X86, PPC Architecture
400MHz to Dual Core 2GHz+
Freescale, TI, NVIDIA, Intel CPU’s
Availability across various vendors
Congtec, Seco, Portwell, iWave
IEI, MSC Vertriebs
Obsolescence replacement
Freely available Industry Standard
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10. Q7 Uniqueness
Broad Industry support
Industrial, Medical
Automotive IVI
SOM for deep embedded applications
Low power designs (12W or less)
No Fan is required
Low cost, rugged high speed MXM connector
No connectors required on module
Available in various heights 5.5mm, 7.8mm etc
Offered by Foxconn, Aces, Speedtech, Lotes etc
Low cost – less than 2USD/unit
Certified for rugged & high speed applications
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11. ARM GROWTH TOWARDS Q7
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12. ARM’s Growth
Latest Q7 R1.20 defines new ARM specification
ARM is Coping with high level IO requirement of Q7
PCIe, HDMI, SATA, LVDS, Giga Ethernet etc.
Scalability of CPU choices
400MHz to Dual Core 1.2GHz CPU Speed
Inbuilt Graphic Accelerators
2D/3D Graphics, OpenVG/OpenGL
1080p HD Decode/Encode
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13. i.Mx6x ARM’s Growth towards Q7
10/100/100 Dual CH SATA2.0 1080p Decode Built-in PCIe2.0
Ethernet LVDS 3Gbps 1080p Encode HDMI x1 lane
Freescale i.Mx Series
i.Mx53
10/100 Dual CH SATA1.0 1080p Decode RGB to
LVDS 1.5Gbps 720p Encode HDMI None
Ethernet
i.Mx51
10/100 RGB to PATA to 720p Decode RGB to
Ethernet LVDS SATA D1 Encode HDMI None
ETHERNET LVDS SATA Decode/Encode HDMI PCIe
Freescale Application Processor – Built in Features
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14. Q7 SOM DESIGN CHALLENGES
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15. Functional Design Challenges
Application processor doesn’t support all Q7 interfaces
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16. Functional Design Challenges
Onboard conversion devices are required
HDMI TMDS – RGB to HDMI Converter
Minimum 3 USB Host ports –USB HUB
Ethernet – Onboard Ethernet PHY
SATA – PATA to SATA
LVDS Display - LVDS Transmitter
CAN – Onboard CAN controllers
Voltage translation buffers
Onboard Flash & Micro SD memory support
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17. Functional Design Challenges
Onboard conversion devices – i.Mx51 Q7 module
PMIC SPI
PATA x 1
PATA to SATA*
SATA x 1
MC13892
USB Host1 USB 2.0 x4
USB Transceiver USB HUB
RGB (24 Bit) LVDS x1
LVDS Transmitter
DDR2 SPI x 1(2.75V) CAN x 1
DRAM
128MB CAN Controller*
FEC x 1 Ethernet x 1
Ethernet PHY
SD1/MMC- 4 bit x 1
NAND FLASH NAND i.MX51
Q7 Module
128MB Processor SPI x 1
Edge Connector
AC’97 x 1(2.75) AC’97 x 1(3.3V CMOS)
I2C x 1(1.8V) Buffer/Voltage I2C x 1(3.3V CMOS)
WDT x 1(2.75V) Level WDT x 1
SD2 4bit Translator
Micro SD WDGOUT x 1 (2.75V) WDGOUT x 1
Reset Button x 1(1.8V) Reset Button x 1
Power Good x 10
Power Button x 1
JTAG
5V Input
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18. Real Estate Challenges
Real Estate
Available space
70mm*59.4mm
Component height
restrictions
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19. Real Estate Challenges
Heavy Component Density – Tough placement
Onboard convertor devices
Minimum 4 or 8 DDR devices
CPU supports 1GB or 2GB DDR2 controller
For 1GB support, 8x1Gb or 4x2Gb devices needed
Onboard multiple power regulator circuit
CPU & IO devices require multiple power rails
Core supply, DDR supply, 2.5V and 3.3V IO requirements
Switching regulators and associated bulk inductors
Too many Discrete Components
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20. Real Estate Challenges
4 DDR2 Devices Q7 Module Heavy Component Density – Tough placement
8 DDR2 Devices Q7 Module
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21. Layout Design Challenges
High Speed Layout Design
Accommodating all the components – Placement
Multiple signal/power planes requirements
DDR, PCIe, USB, LVDS… differential signals
Reference plane for all signal layers
Multiple voltage rails & avoiding split plane
Impedance control Board
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22. Layout Design Challenges
Strict 1.2mm board thickness requirement
Issue in achieving Impedance Control
No. of layers Vs. PCB thickness
Power & High speed section isolation
HDI Vs. Regular Layout Design
HDI- Can stuff more components
HDI - Expensive layout design & per unit price
Board warping due to imbalance placement
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23. Layout Design Challenges
Typical Layout Stack-up
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24. Thermal Design Challenges
Top edge defined for heat transfer
Heat transfer from CPU and DRAM via copper layers
Heat spreader defined for high power versions (12W max)
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25. IWAVE’s Q7 ROADMAP
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26. i.Mx Based Q7 Roadmap
Freescale i.Mx6x Q7
1.2GHz Dual Core
Freescale i.Mx53 Q7 1080p Decode 1080p Encode
800MHz/1GHz
1080p Decode 720p Encode WEC7, Android3.0, Linux
Multimedia Performance
Industrial/Automotive
WEC7, Android2.3, Linux,
QNX6.5
Freescale i.Mx51 Q7 Automotive/Industrial
800MHz
720p Decode D1 Encode
Freescale i.Mx50 Q7
WinCE6.0, Android2.3, Linux, 800MHz
QNX6.5
2D Graphics
Industrial/Medical
WEC7, Android2.3, Linux
Industrial/Medical – Low cost
Q3-2011 Q4-2011 Q1-2012 Q2- 2012
iWave i.Mx Q7 SOM Availability
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27. iWave i.Mx Series Q7 Features
Q7 Features i.Mx51 Q7 i.Mx53 Q7 i.Mx50 Q7 i.Mx6x Q7* ARM Q7 Min Q7 Max
Processor i.Mx51 800MHz i.Mx53 0.8/1GHz i.Mx50 800MHz i.Mx6x 1.2GHz
DDR2 RAM 128-512MB 512MB-1GB 256-512MB 512MB-1GB
NAND/eMMC Flash 128MB-2GB 2-8GB eMMC 2-8GB eMMC 2-8GB eMMC
On-board Micro SD Yes Yes Yes Yes
On-board JTAG Yes Yes Yes Yes
PCI Express Lane No No No PCIex1 Lane 0 4
SATA Channels SATA 1 Port SATA 1 Port No SATA 1 Port 0 2
USB 2.0 Ports 4 Host/1Device 4 Host/1Device 4 Host/1Device 4 Host/1 Device 3 8
LVDS Channels Single Channel Dual Channel Single Channel Dual Channel 0 Dual CH
Display
TMDS HDMI TMDS HDMI TMDS HDMI TMDS HDMI 0 1
SDVO/TMDS
HD Audio / AC'97 AC97 AC97 AC97 AC97 0 1
Ethernet 10/100 Ethernet 10/100 Ethernet 10/100 Ethernet 10/100/1000 Ethernet 0 10/100/1000
SD/MMC 8-bit SD/MMC 8-bit SD/MMC 8-bit SD/MMC 8-bit SD/MMC 8-bit 0 1
I2C Bus Yes Yes Yes Yes 1 1
SPI Bus Yes Yes Yes Yes 0 1
CAN Bus* Yes Yes Yes Yes 0 1
Watchdog Yes Yes Yes Yes 1 1
Express Card No No No No 0 2
LPC Bus No No No No 0 1
SMBus No No No No 0 1
Power Consumption 2.5W Typ 3W Typ 2.5W Typ 6W Typ 12W
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28. iWave i.Mx SOM OS Roadmap
OS Support i.Mx27 SOM i.Mx51 Q7 i.Mx53 Q7 i.Mx50 Q7 i.Mx6x Q7*
WinCE WinCE6.0 WinCE6.0 WEC7 WEC7 WEC7
Linux Linux2.6.19 Linux 2.6.35 Linux 2.6.35 Linux 2.6.35 Linux 2.6.35
Android Android1.6 Android 2.2 Android 2.3 Android 2.3 Android 3.0*
QNX QNX Neutrino 6.5 QNX Neutrino 6.5
VxWorks VxWorks6.6
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29. Q7 SOM – Target Applications
Industrial Automation & Control
Industrial/Medical HMI
Healthcare equipment's
Imaging system
Industrial Handhelds
Panel PC
Vehicle Infotainment
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30. Q7 Generic Carrier Board
Q7 ARM Development platform
Generic to all Q7 SOM modules
Samples Available now
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31. Design Services around SOM
Custom Carrier board development
Custom SOM development
Custom software driver development
OS Porting and Migration
BOM Optimization & Obsolescence replacement
Design review & Support
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32. CASE STUDIES
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33. Industrial HMI
Industrial HMI for Web enabled remote
monitoring
i.Mx51 based Q7 module
Custom Q7 carrier Board
USB2.0 Host/Device
3.5” TFT LCD
GSM/GPRS Module
Ethernet
RS485/RS232
OS: WinCE6.0 R2
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34. Medical HMI
Medical HMI for Keratometer
i.Mx51 based Q7 module
Custom Q7 carrier Board
USB2.0 Host/Device
7” TFT LCD
Dual Camera
SPI Printer Interface
OS: Linux 2.6.35
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35. REFERENCES
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36. References
http://www.qseven-standard.org/
http://www.xtx-standard.org/about.html
http://www.etx-ig.de/specs/specs.php
http://www.com-express-source.com
www.tri-m.com/products/kontron/files/manual/xboardgp8_man.pdf
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37. THANK YOU
Further Information mktg@iwavesystems.com
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