This document outlines an automation test setup for wafer level testing of digital and analog devices. The setup includes a PC computer connected via GPIB to components like a switch matrix, signal sources, measurements devices, a probe station, and probe card. The PC controls the components to perform automated measurements on multiple wafers, dies, and devices for data collection and analysis. The overall setup is intended to be economical, reliable, fast and productive for testing engineers while requiring experienced engineers with software and GPIB technical skills.