This document discusses a study on the manufacturability and reliability of printed circuit boards (PCBs) with multi-depth cavities. It examines solder paste printing, warpage, mechanical loading through drop tests, and thermal loading through temperature cycling tests. The goal is to identify any criteria of a solderable multi-depth cavity PCB that could impact manufacturability or reliability. Test vehicles were designed based on a JEDEC standard with varying cavity depths to evaluate factors like solder paste volume and component reliability. Preliminary results found no major deviations during the manufacturing process or differences in reliability between cavity and non-cavity areas.
1) The document describes trials to apply solder paste in PCB cavities using stencil printing. Two types of solder paste (Type 3 and 4) were tested in cavities of depths from 0 to 750um.
2) Testing found that Type 3 paste had lower paste volume transfer and surface coverage in cavities compared to Type 4 paste. Both pastes showed decreasing performance at greater cavity depths.
3) Additional trials used Type 4 paste with stencil cleaning between prints. Results showed comparable performance to Type 4 paste alone, with mean surface coverage over 95% across all footprints and cavity depths tested.
The objective of any rework process is to duplicate as closely as possible the original manufacturing
process while not disturbing neighboring components while still meeting the original specifications and
assembly criteria of the PCB .
This document discusses the challenges of transitioning to 0.3 mm pitch ball grid array (BGA) packages for surface mount technology (SMT) assembly as electronic devices continue to shrink in size. Through statistical analysis of equipment tolerances and preliminary experiments, the author finds that:
1) Current SMT printing and placement equipment is capable of meeting the alignment requirements for 0.3 mm pitch assembly within acceptable variability limits.
2) However, stencil flex and movement during printing contributes most to variability and may limit further pitch reductions.
3) Procedures will need to be revised from those used for larger 0.4 mm pitch and above to achieve reliable 0.3 mm pitch assembly at scale.
Analyzing the Effect of Different Process Parameters on Tool Wear, Chip Forma...IRJET Journal
The document analyzes the effect of different process parameters on tool wear, chip formation, and surface integrity during CNC milling of Hastelloy C-276. Experiments were conducted using PVD coated inserts under dry and wet conditions. The results showed that flank wear was the most common type of tool wear. Chipping, build-up edges, and microcracking occurred even at low cutting speeds due to high temperatures and pressures. Two types of chips formed: serrated chips at low speeds and fragment chips at higher speeds. Dry machining resulted in grooves and smears on the surface, while wet machining led to microchip re-deposition. Cutting speed, feed rate, and depth of cut were
Prediction of Draw Ratio in Deep Drawing through Software Simulationsirjes
Deep drawing process is one of the most commonly used Metal Forming Process within the
industrial field. Different analytical, numerical, empirical and experimental methods have been developed in
order to analyze it. In this paper deep drawing process with varying punch and die geometries are analysed. This
work reports on the stages of finite element analysis (FEA) and simulations of a Deep drawing process. The
obtained result allows to find optimum draw ratios in deep drawing.
Comparative study of printability analysis on pvc cast and pet g filmsIAEME Publication
This document summarizes a study that investigated the effect of gravure printing process parameters on dot skips (missing dots) when printing on PVC cast and PET-G shrink films. Experiments were conducted using a pilot scale gravure press with variations in line screen, viscosity, speed, and hardness. Analysis of variance (ANOVA) was used to analyze the design of experiments and identify the most influential factors in minimizing dot skips. The results showed that line screen ruling and hardness were the most important factors, and they were able to reduce dot skips by 79% and 87% for PVC and PET-G films respectively. Printability indicators like density, dot area, and tone curve were also evaluated and found to be similar between the
Study of roller burnishing process on aluminum work pieces using design of ex...IAEME Publication
This document discusses a study on the roller burnishing process for aluminum workpieces using design of experiments. Roller burnishing is a cold working process that improves the surface finish and hardness of a softer workpiece material through plastic deformation. The study aims to determine the optimum spindle speed, tool feed rate, and number of passes to minimize the surface roughness of aluminum workpieces. Design of experiments techniques are used to understand the individual and interactive effects of the process parameters on surface roughness. The results of this study can be applied to finish aluminum components for applications in various industries such as aerospace where low weight is important.
The document discusses various manufacturing processes including casting, molding, and powder metallurgy. It provides details on sand casting, shell mold casting, vacuum mold casting, and die casting. It also discusses machining, grinding, and other tertiary processes. Specific considerations for applying these processes are outlined such as part geometry limitations, tolerances achievable, surface finish, materials compatibility, and other factors.
1) The document describes trials to apply solder paste in PCB cavities using stencil printing. Two types of solder paste (Type 3 and 4) were tested in cavities of depths from 0 to 750um.
2) Testing found that Type 3 paste had lower paste volume transfer and surface coverage in cavities compared to Type 4 paste. Both pastes showed decreasing performance at greater cavity depths.
3) Additional trials used Type 4 paste with stencil cleaning between prints. Results showed comparable performance to Type 4 paste alone, with mean surface coverage over 95% across all footprints and cavity depths tested.
The objective of any rework process is to duplicate as closely as possible the original manufacturing
process while not disturbing neighboring components while still meeting the original specifications and
assembly criteria of the PCB .
This document discusses the challenges of transitioning to 0.3 mm pitch ball grid array (BGA) packages for surface mount technology (SMT) assembly as electronic devices continue to shrink in size. Through statistical analysis of equipment tolerances and preliminary experiments, the author finds that:
1) Current SMT printing and placement equipment is capable of meeting the alignment requirements for 0.3 mm pitch assembly within acceptable variability limits.
2) However, stencil flex and movement during printing contributes most to variability and may limit further pitch reductions.
3) Procedures will need to be revised from those used for larger 0.4 mm pitch and above to achieve reliable 0.3 mm pitch assembly at scale.
Analyzing the Effect of Different Process Parameters on Tool Wear, Chip Forma...IRJET Journal
The document analyzes the effect of different process parameters on tool wear, chip formation, and surface integrity during CNC milling of Hastelloy C-276. Experiments were conducted using PVD coated inserts under dry and wet conditions. The results showed that flank wear was the most common type of tool wear. Chipping, build-up edges, and microcracking occurred even at low cutting speeds due to high temperatures and pressures. Two types of chips formed: serrated chips at low speeds and fragment chips at higher speeds. Dry machining resulted in grooves and smears on the surface, while wet machining led to microchip re-deposition. Cutting speed, feed rate, and depth of cut were
Prediction of Draw Ratio in Deep Drawing through Software Simulationsirjes
Deep drawing process is one of the most commonly used Metal Forming Process within the
industrial field. Different analytical, numerical, empirical and experimental methods have been developed in
order to analyze it. In this paper deep drawing process with varying punch and die geometries are analysed. This
work reports on the stages of finite element analysis (FEA) and simulations of a Deep drawing process. The
obtained result allows to find optimum draw ratios in deep drawing.
Comparative study of printability analysis on pvc cast and pet g filmsIAEME Publication
This document summarizes a study that investigated the effect of gravure printing process parameters on dot skips (missing dots) when printing on PVC cast and PET-G shrink films. Experiments were conducted using a pilot scale gravure press with variations in line screen, viscosity, speed, and hardness. Analysis of variance (ANOVA) was used to analyze the design of experiments and identify the most influential factors in minimizing dot skips. The results showed that line screen ruling and hardness were the most important factors, and they were able to reduce dot skips by 79% and 87% for PVC and PET-G films respectively. Printability indicators like density, dot area, and tone curve were also evaluated and found to be similar between the
Study of roller burnishing process on aluminum work pieces using design of ex...IAEME Publication
This document discusses a study on the roller burnishing process for aluminum workpieces using design of experiments. Roller burnishing is a cold working process that improves the surface finish and hardness of a softer workpiece material through plastic deformation. The study aims to determine the optimum spindle speed, tool feed rate, and number of passes to minimize the surface roughness of aluminum workpieces. Design of experiments techniques are used to understand the individual and interactive effects of the process parameters on surface roughness. The results of this study can be applied to finish aluminum components for applications in various industries such as aerospace where low weight is important.
The document discusses various manufacturing processes including casting, molding, and powder metallurgy. It provides details on sand casting, shell mold casting, vacuum mold casting, and die casting. It also discusses machining, grinding, and other tertiary processes. Specific considerations for applying these processes are outlined such as part geometry limitations, tolerances achievable, surface finish, materials compatibility, and other factors.
Designing Optimized Selective Soldering Process for Thru-Hole Aerospace Conne...Shiju Jacob
This technical paper explains soldering process is optimized through selective soldering technology to avoid voids in thru-hole connectors and components. Chances of defects from PCB design and manufacturing, soldering consumables and machine parameters are analysed and corrected to resolve the void problem using system engineering approach. Test vehicle is assembled with optimized soldering parameters and tested in X-Ray machine. Test report shows that even with 2.4 mm PCB and thick pin components, void doesn’t occur in the PTH. Finally design for manufacturability (DFM) guideline is proposed for PCB design to eliminate the void issue caused by PCB design process. A test vehicle is assembled with optimized soldering parameters and tested in X-Ray machine. Test report shows that even with 2.4 mm PCB and thick pin components, void doesn’t occur in the PTH. Finally design for manufacturability (DFM) guideline is proposed for PCB design to eliminate the void issue caused by PCB design process.
This technical paper is published during the fulfillment of my post graduate degree in electronics System Design Engineering at Coventry University, in sept 2016.
Cutting parameter optimization for minimizing machining distortion of thinIAEME Publication
This document discusses an experimental study that uses Taguchi design of experiments to optimize machining parameters for minimizing distortion when machining thin-walled aluminum components. Specifically:
1) A series of machining experiments were conducted using an L16 orthogonal array to examine the effects of speed, feed, depth of cut, width of cut, and tool path on distortion.
2) Analysis of the signal-to-noise ratios and ANOVA revealed that depth of cut has the greatest influence on distortion (55.72%), followed by width of cut (25.31%). Feed has a negligible effect (2.49%).
3) Confirmation experiments using the optimized parameters of low feed, medium-high speed, low
This document summarizes deburring techniques for small intersecting holes. It discusses how hole size, tolerance, depth of intersection, and other factors impact the deburring process selection. Only 5 of the 37 major deburring processes are normally suitable for small holes. These include thermal energy method, abrasive jet, abrasive flow, electropolish, and manual methods. The document provides tables comparing deburring process capabilities based on hole size change, edge condition, and other criteria.
This document summarizes a study that used the Taguchi method to optimize drilling parameters for minimizing surface roughness when drilling mild steel. Experiments were conducted using an L27 orthogonal array to examine the effects of cutting speed, feed rate, and point angle on surface roughness. Analysis of the experimental results found that the lowest surface roughness was achieved with a low cutting speed, low feed rate, and medium point angle. Feed rate was found to be the most significant factor influencing surface roughness, followed by cutting speed. The optimal combination of drilling parameters to minimize surface roughness in mild steel is a cutting speed of 7 m/min, feed rate of 0.035 mm/rev, and point angle of 90 degrees.
1) Testing was conducted using a spiral mold to compare the flow and pressure characteristics of conventional injection molding versus Roctool technology.
2) With Roctool technology (180°C mold temperature), flow length was improved by up to 137% and injection pressure drop was reduced by up to 66% compared to conventional molding (80°C).
3) Pressure drop between sensors in the cavity was reduced by up to 48% when using Roctool technology with a 1.5mm thick spiral versus conventional molding.
Computer Aided Manufacturing Factors Affecting Reduction of Surface Roughness...IRJET Journal
This document summarizes an experimental investigation into factors that affect surface roughness and thickness reduction in the incremental sheet forming process. Key factors studied include tool diameter, sheet thickness, feed rate, speed, step size, lubrication, and tool path. Experiments were conducted using an aluminum alloy sheet formed on a CNC milling machine. Response variables of surface roughness and thickness reduction were measured for experiments conducted according to a Taguchi orthogonal array design of experiments. Results show that process parameters significantly influence the surface quality and thickness of parts formed using incremental sheet forming.
Simulation of Deep-Drawing Process of Large Panelstheijes
The article deals with the analysis of formability of deep-drawing DC06 steel sheets. The aim of the investigations is to verify possibilities of formability of sheet metal with thickness of 0.85 mm. The mechanical parameters of the sheets have been determined in uniaxial tensile and bulge tests. The numerical simulations using AUTOFORM has been carried out for two drawpiece models. Obtained results can be used during the simulation of real forming process.
This document summarizes research on minimizing form errors in additive manufacturing. It discusses how process parameters like slice thickness, orientation, and supports can impact form errors like staircase effect, cylindricity, and flatness. Adaptive slicing, optimized orientation, and contour shaping are presented as methods to reduce specific form errors. The effects of slice thickness and orientation on cylindricity error and build time are experimentally tested. Optimizing process parameters can improve geometric accuracy and surface finish of additively manufactured parts.
IRJET-Surface Roughness Modeling of Titanium Alloy GrindingIRJET Journal
This document presents a study on modeling surface roughness in the grinding of titanium alloy. It aims to develop a predictive surface roughness model that relates surface roughness values to process variables like speed and depth of cut. An analytical model is developed considering factors like elastic deflections, plowing effects, and thermal effects. MATLAB simulations are also used to model the grinding wheel profile and ground surface to directly predict surface roughness. Experimental grinding tests will be conducted to validate the results from the analytical model and simulations.
This document discusses methods for performing gauge repeatability and reproducibility (GR&R) tests on surface metrology equipment. It finds that GR&R values are often over 100% due to within-part variation rather than instrument error. Using a uniform sinusoidal specimen eliminates much of the within-part variation, resulting in more accurate GR&R values typically under 10%. The document also provides a method to determine the optimal number of measurements needed per part based on the surface variation and tolerance.
1) Roctool technology improves the surface quality of plastic parts by removing defects like weld lines and sink marks. It produces a smoother surface with up to 800% higher gloss.
2) Measurements show Roctool technology improves replication of textures on molds by up to 85% compared to conventional molding. Surface roughness is also reduced.
3) Tests found Roctool technology increases flow length in molds and reduces pressure drop during injection by up to 75% compared to conventional molding temperatures, especially at higher temperatures like 180C. This leads to better part quality.
The document discusses using image processing techniques to monitor the first mode of metal transfer during friction stir welding (FSW). Images of the weld zone under different conditions are captured and processed using MATLAB. Contour analysis, gray level variations, and histograms are used to analyze images from uniform welds, welds with tool pin failure, and welds with insufficient pin depth. Variations detected in these metrics indicate changes in the first mode of metal transfer and weld quality. An online monitoring system using these image analysis methods is proposed to automatically detect defects or parameter changes during FSW for process control and quality assurance.
International Journal of Engineering Research and DevelopmentIJERD Editor
The document discusses using the Taguchi method to analyze the effects of welding parameters on weld bead geometry. An experiment was conducted using MIG welding of mild steel plates with varying thickness, voltage, gas flow rate, and travel speed. Macrostructural tests were performed to measure the weld bead penetration, width, and reinforcement height. The results showed that penetration increased with higher speed and flow rate up to optimal values, while width and height increased with higher flow rate but decreased with higher speed. Therefore, the welding parameters significantly influence the weld bead geometry characteristics.
Big Bear specializes in thermoforming large and medium-sized plastic parts using single-sheet, twin-sheet, and pressure forming machines. They have experience forming a wide variety of plastic materials and can advise customers on material selection. Some advantages of thermoforming include low tooling costs, the ability to tailor tools for specific part volumes, and forming large parts difficult to make with other molding processes. However, thermoforming has higher per-part costs than injection molding due to sheet extrusion and trim waste.
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
Wally s3 e cold_rolling_mills_strip_processing_linesWally Heydendael
This document discusses recent technologies in cold rolling mills to improve product quality, as presented by SMS Demag AG. It describes Edge Drop Control systems that help achieve constant strip thickness across the width. It also details the T-roll® process technology package for simulating cold rolling processes. Furthermore, it presents a new lubrication and cleaning concept combining low-quantity lubrication with liquid nitrogen to improve strip surface quality. Online measuring systems are also discussed for documenting product quality parameters.
This document provides standards and guidelines for dimensional tolerances in die cast parts. It discusses the differences between standard and precision tolerances, with precision tolerances allowing for less variation from the design specifications. A variety of tolerance categories are covered, including linear dimensions, parting lines, draft angles, flatness, and cored holes. The document also discusses how to design parts to be efficiently produced through die casting rather than alternative processes like stamping, extrusion, machining, or casting. Overall it aims to help designers optimize part designs to meet functional requirements while minimizing costs through appropriate use of tolerances and die casting production methods.
EXPERIMENTAL ANALYSIS AND MODELLING OF GRINDING AISI D3 STEELijmech
Grinding of hardened steels for the realisation of better surface quality of the workpiece is an essentiality
of high productivity environments. The surface grinding of high carbon high chromium steels like AISI D3
with a production level grinding wheel used in the industry is the driver of the present research article. The
experimentation is done in dry as well as pool cooling conditions to ascertain the better of the two
conditions in providing a better set of cutting forces and surface finish. A mathematical model for
evaluating the forces generated during grinding is evolved and on comparison of the results obtained from
the model with the ones from experimentation is found to be correlating. The usage of production level
vitrified grinding wheel has shown good results in terms of lower forces generated and good surface finish
during surface grinding. The results are optimised and the set of inputs which yield good surface finish and
low forces are given. Dry grinding of AISI D13 yields good surface finish than wet grinding. Surface finish
of 0.14 microns is achievable using dry grinding.
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
1) A report summarizes test results for injection molding plastic samples using conventional and Roctool technologies.
2) Using Roctool technology improved gloss by up to 800% and removed defects from the surface. Texture replication was 85% compared to conventional.
3) Testing showed Roctool improved flow length by up to 75% and reduced pressure drop by up to 70% compared to conventional injection molding. The optimum mold temperature was 180°C.
The document discusses trials to address the challenge of applying solder paste into recessed cavities on printed circuit boards (PCBs) using stencil printing. Test vehicles were created with cavities of varying depths (0-750um) containing different component footprints. Two types of solder paste were printed into the cavities using a customized step stencil and squeegee. The solder paste application and coverage was analyzed using automated optical inspection. Type 4 solder paste showed better transfer efficiency and coverage than Type 3. Printing with periodic stencil cleaning produced more consistent results compared to no cleaning, though with slightly lower paste volumes. The trials helped clarify the challenges of solder paste application into cavities using stencil printing and
This document contains the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft as of March 31, 2016. It includes the consolidated statement of profit or loss, consolidated statement of comprehensive income, consolidated statement of financial position, consolidated statement of cash flows, and consolidated statement of changes in equity. The notes to the consolidated financial statements provide details on the company's accounting policies, consolidation principles, segments, and other financial details. The company manufactures printed circuit boards for industries such as mobile devices, automotive, industrial, medical and others.
Designing Optimized Selective Soldering Process for Thru-Hole Aerospace Conne...Shiju Jacob
This technical paper explains soldering process is optimized through selective soldering technology to avoid voids in thru-hole connectors and components. Chances of defects from PCB design and manufacturing, soldering consumables and machine parameters are analysed and corrected to resolve the void problem using system engineering approach. Test vehicle is assembled with optimized soldering parameters and tested in X-Ray machine. Test report shows that even with 2.4 mm PCB and thick pin components, void doesn’t occur in the PTH. Finally design for manufacturability (DFM) guideline is proposed for PCB design to eliminate the void issue caused by PCB design process. A test vehicle is assembled with optimized soldering parameters and tested in X-Ray machine. Test report shows that even with 2.4 mm PCB and thick pin components, void doesn’t occur in the PTH. Finally design for manufacturability (DFM) guideline is proposed for PCB design to eliminate the void issue caused by PCB design process.
This technical paper is published during the fulfillment of my post graduate degree in electronics System Design Engineering at Coventry University, in sept 2016.
Cutting parameter optimization for minimizing machining distortion of thinIAEME Publication
This document discusses an experimental study that uses Taguchi design of experiments to optimize machining parameters for minimizing distortion when machining thin-walled aluminum components. Specifically:
1) A series of machining experiments were conducted using an L16 orthogonal array to examine the effects of speed, feed, depth of cut, width of cut, and tool path on distortion.
2) Analysis of the signal-to-noise ratios and ANOVA revealed that depth of cut has the greatest influence on distortion (55.72%), followed by width of cut (25.31%). Feed has a negligible effect (2.49%).
3) Confirmation experiments using the optimized parameters of low feed, medium-high speed, low
This document summarizes deburring techniques for small intersecting holes. It discusses how hole size, tolerance, depth of intersection, and other factors impact the deburring process selection. Only 5 of the 37 major deburring processes are normally suitable for small holes. These include thermal energy method, abrasive jet, abrasive flow, electropolish, and manual methods. The document provides tables comparing deburring process capabilities based on hole size change, edge condition, and other criteria.
This document summarizes a study that used the Taguchi method to optimize drilling parameters for minimizing surface roughness when drilling mild steel. Experiments were conducted using an L27 orthogonal array to examine the effects of cutting speed, feed rate, and point angle on surface roughness. Analysis of the experimental results found that the lowest surface roughness was achieved with a low cutting speed, low feed rate, and medium point angle. Feed rate was found to be the most significant factor influencing surface roughness, followed by cutting speed. The optimal combination of drilling parameters to minimize surface roughness in mild steel is a cutting speed of 7 m/min, feed rate of 0.035 mm/rev, and point angle of 90 degrees.
1) Testing was conducted using a spiral mold to compare the flow and pressure characteristics of conventional injection molding versus Roctool technology.
2) With Roctool technology (180°C mold temperature), flow length was improved by up to 137% and injection pressure drop was reduced by up to 66% compared to conventional molding (80°C).
3) Pressure drop between sensors in the cavity was reduced by up to 48% when using Roctool technology with a 1.5mm thick spiral versus conventional molding.
Computer Aided Manufacturing Factors Affecting Reduction of Surface Roughness...IRJET Journal
This document summarizes an experimental investigation into factors that affect surface roughness and thickness reduction in the incremental sheet forming process. Key factors studied include tool diameter, sheet thickness, feed rate, speed, step size, lubrication, and tool path. Experiments were conducted using an aluminum alloy sheet formed on a CNC milling machine. Response variables of surface roughness and thickness reduction were measured for experiments conducted according to a Taguchi orthogonal array design of experiments. Results show that process parameters significantly influence the surface quality and thickness of parts formed using incremental sheet forming.
Simulation of Deep-Drawing Process of Large Panelstheijes
The article deals with the analysis of formability of deep-drawing DC06 steel sheets. The aim of the investigations is to verify possibilities of formability of sheet metal with thickness of 0.85 mm. The mechanical parameters of the sheets have been determined in uniaxial tensile and bulge tests. The numerical simulations using AUTOFORM has been carried out for two drawpiece models. Obtained results can be used during the simulation of real forming process.
This document summarizes research on minimizing form errors in additive manufacturing. It discusses how process parameters like slice thickness, orientation, and supports can impact form errors like staircase effect, cylindricity, and flatness. Adaptive slicing, optimized orientation, and contour shaping are presented as methods to reduce specific form errors. The effects of slice thickness and orientation on cylindricity error and build time are experimentally tested. Optimizing process parameters can improve geometric accuracy and surface finish of additively manufactured parts.
IRJET-Surface Roughness Modeling of Titanium Alloy GrindingIRJET Journal
This document presents a study on modeling surface roughness in the grinding of titanium alloy. It aims to develop a predictive surface roughness model that relates surface roughness values to process variables like speed and depth of cut. An analytical model is developed considering factors like elastic deflections, plowing effects, and thermal effects. MATLAB simulations are also used to model the grinding wheel profile and ground surface to directly predict surface roughness. Experimental grinding tests will be conducted to validate the results from the analytical model and simulations.
This document discusses methods for performing gauge repeatability and reproducibility (GR&R) tests on surface metrology equipment. It finds that GR&R values are often over 100% due to within-part variation rather than instrument error. Using a uniform sinusoidal specimen eliminates much of the within-part variation, resulting in more accurate GR&R values typically under 10%. The document also provides a method to determine the optimal number of measurements needed per part based on the surface variation and tolerance.
1) Roctool technology improves the surface quality of plastic parts by removing defects like weld lines and sink marks. It produces a smoother surface with up to 800% higher gloss.
2) Measurements show Roctool technology improves replication of textures on molds by up to 85% compared to conventional molding. Surface roughness is also reduced.
3) Tests found Roctool technology increases flow length in molds and reduces pressure drop during injection by up to 75% compared to conventional molding temperatures, especially at higher temperatures like 180C. This leads to better part quality.
The document discusses using image processing techniques to monitor the first mode of metal transfer during friction stir welding (FSW). Images of the weld zone under different conditions are captured and processed using MATLAB. Contour analysis, gray level variations, and histograms are used to analyze images from uniform welds, welds with tool pin failure, and welds with insufficient pin depth. Variations detected in these metrics indicate changes in the first mode of metal transfer and weld quality. An online monitoring system using these image analysis methods is proposed to automatically detect defects or parameter changes during FSW for process control and quality assurance.
International Journal of Engineering Research and DevelopmentIJERD Editor
The document discusses using the Taguchi method to analyze the effects of welding parameters on weld bead geometry. An experiment was conducted using MIG welding of mild steel plates with varying thickness, voltage, gas flow rate, and travel speed. Macrostructural tests were performed to measure the weld bead penetration, width, and reinforcement height. The results showed that penetration increased with higher speed and flow rate up to optimal values, while width and height increased with higher flow rate but decreased with higher speed. Therefore, the welding parameters significantly influence the weld bead geometry characteristics.
Big Bear specializes in thermoforming large and medium-sized plastic parts using single-sheet, twin-sheet, and pressure forming machines. They have experience forming a wide variety of plastic materials and can advise customers on material selection. Some advantages of thermoforming include low tooling costs, the ability to tailor tools for specific part volumes, and forming large parts difficult to make with other molding processes. However, thermoforming has higher per-part costs than injection molding due to sheet extrusion and trim waste.
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
Wally s3 e cold_rolling_mills_strip_processing_linesWally Heydendael
This document discusses recent technologies in cold rolling mills to improve product quality, as presented by SMS Demag AG. It describes Edge Drop Control systems that help achieve constant strip thickness across the width. It also details the T-roll® process technology package for simulating cold rolling processes. Furthermore, it presents a new lubrication and cleaning concept combining low-quantity lubrication with liquid nitrogen to improve strip surface quality. Online measuring systems are also discussed for documenting product quality parameters.
This document provides standards and guidelines for dimensional tolerances in die cast parts. It discusses the differences between standard and precision tolerances, with precision tolerances allowing for less variation from the design specifications. A variety of tolerance categories are covered, including linear dimensions, parting lines, draft angles, flatness, and cored holes. The document also discusses how to design parts to be efficiently produced through die casting rather than alternative processes like stamping, extrusion, machining, or casting. Overall it aims to help designers optimize part designs to meet functional requirements while minimizing costs through appropriate use of tolerances and die casting production methods.
EXPERIMENTAL ANALYSIS AND MODELLING OF GRINDING AISI D3 STEELijmech
Grinding of hardened steels for the realisation of better surface quality of the workpiece is an essentiality
of high productivity environments. The surface grinding of high carbon high chromium steels like AISI D3
with a production level grinding wheel used in the industry is the driver of the present research article. The
experimentation is done in dry as well as pool cooling conditions to ascertain the better of the two
conditions in providing a better set of cutting forces and surface finish. A mathematical model for
evaluating the forces generated during grinding is evolved and on comparison of the results obtained from
the model with the ones from experimentation is found to be correlating. The usage of production level
vitrified grinding wheel has shown good results in terms of lower forces generated and good surface finish
during surface grinding. The results are optimised and the set of inputs which yield good surface finish and
low forces are given. Dry grinding of AISI D13 yields good surface finish than wet grinding. Surface finish
of 0.14 microns is achievable using dry grinding.
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
1) A report summarizes test results for injection molding plastic samples using conventional and Roctool technologies.
2) Using Roctool technology improved gloss by up to 800% and removed defects from the surface. Texture replication was 85% compared to conventional.
3) Testing showed Roctool improved flow length by up to 75% and reduced pressure drop by up to 70% compared to conventional injection molding. The optimum mold temperature was 180°C.
The document discusses trials to address the challenge of applying solder paste into recessed cavities on printed circuit boards (PCBs) using stencil printing. Test vehicles were created with cavities of varying depths (0-750um) containing different component footprints. Two types of solder paste were printed into the cavities using a customized step stencil and squeegee. The solder paste application and coverage was analyzed using automated optical inspection. Type 4 solder paste showed better transfer efficiency and coverage than Type 3. Printing with periodic stencil cleaning produced more consistent results compared to no cleaning, though with slightly lower paste volumes. The trials helped clarify the challenges of solder paste application into cavities using stencil printing and
This document contains the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft as of March 31, 2016. It includes the consolidated statement of profit or loss, consolidated statement of comprehensive income, consolidated statement of financial position, consolidated statement of cash flows, and consolidated statement of changes in equity. The notes to the consolidated financial statements provide details on the company's accounting policies, consolidation principles, segments, and other financial details. The company manufactures printed circuit boards for industries such as mobile devices, automotive, industrial, medical and others.
- Revenue increased 5.3% to €615.1 million due to first revenues from new IC substrate and circuit board plants in China, though profitability declined.
- EBITDA fell 27.2% to €102.1 million due to €51.6 million in start-up costs for the new China plants, while adjusted EBITDA rose 8.5% as cost cuts offset price pressure.
- Net loss of €19.7 million compared to €60.2 million profit last year primarily from start-up effects and higher financing costs, though core business profitability improved.
This document provides key financial figures and performance highlights for AT&S, a leading manufacturer of printed circuit boards, for the years 2012/13 through 2015/16. Some key points:
- Revenue increased 14.4% in 2015/16 to €762.9 million, with growth primarily from the Mobile Devices & Substrates segment.
- EBITDA remained flat at €167.5 million while EBIT declined 14.6% due to higher depreciation from a new production line in China.
- ROCE declined from 12.0% to 8.2% due to investments in a new plant in Chongqing, China.
- Headcount increased 12.3% to 9
AT&S Investor and Analyst Presentation March 2017 AT&S_IR
AT&S presented an investor and analyst presentation covering the company's strategy and financials. The presentation included:
1) An overview of AT&S' position as a leading manufacturer of high-end printed circuit boards and IC substrates for applications in mobile devices, automotive, industrial, medical, and semiconductors.
2) Details on AT&S' strategic focus on high-end technologies and applications with above average growth potential and long-term profitability.
3) Financial highlights showing AT&S' track record of revenue growth and margins above industry levels, as well as investments in new production capacity, particularly in Chongqing, China.
In diesem Kurz-Workshop wird das Thema Markt und Wettbewerb beschrieben und die TeilnehmerInnen aufgefordert dazu einige Fragen, vorwiegend für sich selbst, zu beantworten.
El documento describe las diferentes etapas del proceso creativo según varios autores como Graham Wallas, Alex Osborn y James Webb Young. Luego detalla las fases del proceso creativo como la preparación, generación, incubación, iluminación, evaluación y elaboración. El proceso creativo no es lineal sino interactivo e involucra volver a las primeras etapas múltiples veces hasta alcanzar una conclusión valiosa.
El documento describe las características y etapas del proceso creativo. Explica que hay dos tipos de creatividad: la creatividad eureka, que produce ideas revolucionarias, y la creatividad secundaria, que mejora ideas existentes. Luego detalla las cuatro etapas del proceso creativo: la preparación, donde se identifica un problema e investiga; la incubación, un período de ansiedad donde las ideas se desarrollan inconscientemente; la iluminación, cuando surge una solución; y la verificación, donde se evalúa la soluc
El documento describe las 5 fases del proceso creativo: 1) Cognición o conocimiento, donde se identifica la necesidad de crear o solucionar un problema; 2) Concepción o inmersión, donde se investiga el problema recolectando información; 3) Combustión o inspiración, donde llega la solución; 4) Consumación o terminación, donde se materializa la creación; y 5) Comunicación o compartir, donde se da a conocer el producto. Todo el proceso requiere imaginación, conocimiento y una nueva organización de experiencias.
Este documento describe los cuatro componentes principales de la creatividad: fluidez, flexibilidad, originalidad y viabilidad. La fluidez se refiere a la cantidad de ideas que una persona puede generar sobre un tema. La flexibilidad es la variedad y heterogeneidad de las ideas. La originalidad es la rareza de las ideas. Y la viabilidad es la capacidad de generar ideas que sean prácticas y aplicables.
El documento describe el proceso creativo como un proceso no lineal e interactivo que involucra varias etapas como la preparación, incubación, iluminación y verificación. Explica las características de la creatividad como fluidez, flexibilidad, originalidad y elaboración. También detalla las etapas del proceso creativo, donde la preparación implica la percepción de un problema e investigación, la incubación es un período de espera inconsciente, la iluminación es cuando surge la solución, y la verificación es la evaluación de la soluc
El proceso creativo consta de cuatro etapas: investigación, análisis, iluminación y verificación. Involucra recopilar información, analizarla e incubar ideas antes de plasmar una solución creativa, la cual es luego evaluada. La creatividad surge mejor en estados de abstracción que cuando uno se enfoca directamente en el problema.
Este documento discute cinco factores que influyen en la creatividad: inteligencia, conocimiento, estilos de pensamiento, personalidad y motivación. La inteligencia juega tres papeles claves en la creatividad: producir ideas originales, evaluar ideas y promover ideas. El conocimiento no siempre conduce a mayor creatividad. Los estilos de pensamiento y la personalidad también afectan la creatividad de una persona. La motivación es importante, ya que la creatividad florece cuando a alguien le gusta la tarea. El contexto ambiental también puede fomentar o
This document discusses leaded surface mount technology (SMT). It describes three types of SMT boards: Type I uses components on one or both sides of the board; Type II uses a combination of through-hole and SMT components; Type III uses through-hole components on one side and SMT on the other. The document provides guidelines for SMT design including minimum spacing between components and land pattern design considerations for different component types.
(Company profile)ykt pcb manufacturer_in_korea_2019_1st_halfPark Jin Young
Now, the U.S. and China traded war is getting worse and worse.
It is time to re-consider your PCB supply chain in order to overcome the unforeseeable global trading circumstance.
If you are looking for a reliable PCB manufacturer in Korea, we guarantee that we can be your alternative option for your Business Continuity Management Plan.
If you are interested in purchasing PCB from Korea, please do't hesitate to contact me.
Casting Defect Identification and its Solution by Niyama SimulationIRJET Journal
This document discusses using simulation software to identify casting defects and solutions. It summarizes a study that:
1. Used ProCAST simulation software to simulate the filling and solidification processes of a casting and predict defects like porosity.
2. Compared the simulation results to actual casting results to validate the accuracy of the simulation in predicting defect locations.
3. Showed that simulations can help optimize design parameters like gating system design to reduce common defects like cold shots and porosity.
There is a strong interest in understanding the surface mount
assembly requirements of QFN (Quad Flat No-Lead) type
packages due to their rapid industry acceptance.
For more details visit us at Solder.net
This document provides guidelines for board level assembly and reliability considerations for QFN (Quad Flat No-Lead) packages. It discusses board design recommendations including pad pattern dimensions and tolerances. Surface mount process guidelines are also presented, such as stencil design recommendations to achieve proper solder paste coverage and standoff for perimeter pads and the large exposed thermal pad. Different via treatment options and their impact on solder voiding are described. Process parameters like reflow profile and temperature are discussed in relation to solder joint quality and reliability.
This paper provides guidelines in board design and surface mount of this package based on extensive surface mount experiments.
For more details at Solder.net
An experimental study on factors affecting Cold Extrusion of steelsIRJET Journal
This document summarizes an experimental study on factors affecting cold extrusion of steels. The study used Design of Experiments to test different combinations of punch diameter, punch depth, and material thickness. Experiments were conducted using 5T hand press, 40T mechanical press, and 30T hydraulic press. The results show that punch diameter has the greatest effect on pip height, followed by material thickness. Slower presses like hand and hydraulic presses allow better material flow, producing taller pips than faster mechanical presses. Overall, the study establishes relationships between process parameters and pip formation to provide guidance for optimizing the sheet metal extrusion process.
Optimization of Tool Path and Process Parameters in Slot Milling using Grey R...IRJET Journal
This document summarizes a research study that aimed to optimize the tool path and process parameters for slot milling of AISI D3 steel. The study investigated different tool paths (raster, trochoidal, hybrid) at various cutting speeds and feed rates using a Taguchi experimental design. Surface roughness and cutting forces were measured for each experimental run. Grey relational analysis was used to analyze the results and identify the optimal tool path and cutting conditions that minimized surface roughness and cutting forces. The results of the study will help manufacturers select machining parameters that improve part quality while reducing production costs.
This document provides an overview of standoff improvement for engineering in 2023. It discusses the current status of standoff part numbers and PCBs using standoffs. Various standoff soldering methods are analyzed, including their advantages and disadvantages. Formulas for calculating solder paste volume are detailed. Key metrics for stencil printing like area ratio and transfer efficiency are explained. Guidelines for stepping stencil design are provided. Finally, an example calculation of standoff soldering parameters is shown.
This study evaluated three step stencil technologies - chemically etched, laser welded, and micro-machined - to determine their effectiveness in applying different volumes of solder paste. Measurements found that etched steps were deeper than nominal values, while welded and machined steps were closer to targets. Across all technologies, solder paste volumes were higher closer to step edges (10-20 mils) than further away (30-50 mils), indicating squeegee difficulty. A fluoropolymer nano-coating slightly increased volumes. Overall, the technologies were viable for step stencils, but further investigation is needed to differentiate their performance.
Computer Aided Analysis and Design of Multi-Storeyed Building using Staad ProIRJET Journal
This document describes the analysis and design of a G+21 multi-storey reinforced concrete building using STAAD Pro software. The building dimensions, material properties, and loads are defined. STAAD Pro is used to generate the model, perform the analysis under various load combinations, and design the building elements. Sample results are presented for beams, columns, and other elements to demonstrate the modeling, analysis, design, and visualization capabilities of STAAD Pro in accordance with Indian codes and standards.
IRJET- Optimisation Technique for Design and Fabrication of ASTM Based Multit...IRJET Journal
This document describes the design and optimization of a die for manufacturing parts of varying thicknesses according to ASTM standards. Key points:
1) The multi-thickness die has three sections - a male part, holding plate, and female part. Variable thickness parts can be made by inserting shims of different thicknesses between the male and female parts.
2) The die design was optimized to reduce costs by machining cavities directly into the core plate, eliminating the need for a separate cavity plate.
3) Total manufacturing cost, material cost, tooling cost, and processing cost formulas were developed and optimized to reduce the cost per part. Process optimization focused on streamlining machining steps.
The document describes the manufacturing process for printed circuit boards. It involves several steps: 1) Pre-production engineering like file inspection and drill data generation. 2) CNC cutting and drilling of copper clad laminate. 3) Wet processing like direct plating system and electroplating to deposit copper. 4) Photo imaging and developing to transfer circuit images. 5) Etching and inspection to remove unwanted copper.
This document discusses Surface Mount Technology (SMT), which involves mounting electronic components directly onto the surface of printed circuit boards rather than inserting them into holes. It provides an overview of SMT, including its advantages over traditional through-hole mounting, different types of SMT, surface mount components, the SMT assembly process, and applications. Key advantages noted are higher density packaging, improved reliability, and easier automation of the manufacturing process.
This document discusses Surface Mount Technology (SMT), which involves mounting electronic components directly onto the surface of printed circuit boards rather than inserting them into holes. It provides an overview of SMT, including its advantages over traditional through-hole mounting, different types of SMT, surface mount components, the SMT assembly process, and applications. Key advantages noted are higher density packaging, improved reliability, and easier automation of the manufacturing process.
The document discusses Surface Mount Technology (SMT) used in electronic circuit board production. SMT involves mounting electronic components directly onto the surface of printed circuit boards rather than inserting them into holes. The key steps of SMT include receiving printed circuit boards, applying glue, placing chips and integrated circuits using specialized machines, curing the boards in a reflow oven, conducting visual and automated inspections, and any needed repairs. The document outlines the advantages of SMT, such as higher component density, improved mechanical and electrical performance, and faster automated assembly.
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
IRJET- Design and Development of Jig and Fixture for Tacho BracketIRJET Journal
This document describes the design and development of a new fixture for machining a Tacho Bracket component. The current process requires 5 setups on different machines, including VMC, RDM, and HMC machines. This leads to long cycle times and loading/unloading of the component between machines. The new fixture is designed to complete the required operations in 2 setups on HMC machines. It utilizes hydraulic clamping to reduce loading/unloading time. Analytical calculations and FE analysis show the new fixture design is capable of withstanding the cutting forces. The new process is expected to significantly reduce the cycle time for machining each component from 47 minutes to 34 minutes.
Assessment & Optimization of Influence of Some Process Parameters on Sheet Me...IRJET Journal
This document discusses optimization of sheet metal blanking process parameters through experimental studies and modeling. The study aims to assess how sheet thickness, clearance, wear radius, and shear angle influence burr height, accuracy, and circularity in blanking medium carbon steel. Experiments were conducted using an orthogonal array to evaluate these parameters. Response tables and graphs identified optimal levels for blanking. Taguchi's Grey Relational Analysis was found to be an effective technique for parameter optimization in blanking. The document provides background on blanking process mechanics and definitions various die and press components.
Generative AI Deep Dive: Advancing from Proof of Concept to ProductionAggregage
Join Maher Hanafi, VP of Engineering at Betterworks, in this new session where he'll share a practical framework to transform Gen AI prototypes into impactful products! He'll delve into the complexities of data collection and management, model selection and optimization, and ensuring security, scalability, and responsible use.
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Sudheer Mechineni, Head of Application Frameworks, Standard Chartered Bank
Discover how Standard Chartered Bank harnessed the power of Neo4j to transform complex data access challenges into a dynamic, scalable graph database solution. This keynote will cover their journey from initial adoption to deploying a fully automated, enterprise-grade causal cluster, highlighting key strategies for modelling organisational changes and ensuring robust disaster recovery. Learn how these innovations have not only enhanced Standard Chartered Bank’s data infrastructure but also positioned them as pioneers in the banking sector’s adoption of graph technology.
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Why You Should Replace Windows 11 with Nitrux Linux 3.5.0 for enhanced perfor...SOFTTECHHUB
The choice of an operating system plays a pivotal role in shaping our computing experience. For decades, Microsoft's Windows has dominated the market, offering a familiar and widely adopted platform for personal and professional use. However, as technological advancements continue to push the boundaries of innovation, alternative operating systems have emerged, challenging the status quo and offering users a fresh perspective on computing.
One such alternative that has garnered significant attention and acclaim is Nitrux Linux 3.5.0, a sleek, powerful, and user-friendly Linux distribution that promises to redefine the way we interact with our devices. With its focus on performance, security, and customization, Nitrux Linux presents a compelling case for those seeking to break free from the constraints of proprietary software and embrace the freedom and flexibility of open-source computing.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
Introducing Milvus Lite: Easy-to-Install, Easy-to-Use vector database for you...Zilliz
Join us to introduce Milvus Lite, a vector database that can run on notebooks and laptops, share the same API with Milvus, and integrate with every popular GenAI framework. This webinar is perfect for developers seeking easy-to-use, well-integrated vector databases for their GenAI apps.
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
1. SMT Manufacturability and reliability in PCB cavities*)
Markus Leitgeb, Christopher Michael Ryder
AT&S
Leoben, Austria
Abstract
Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various
subtopics have materialized regarding the processing and application of such features in device manufacturing.
In a previous paper1 the topic of solder paste printing on PCBs on standard SMT equipment and with multiple
cavity depths was investigated. The success of solder paste printing is a prerequisite for further assembly and
reliability of the entire electronic construct. In this paper we intend to examine the overall manufacturability and
subsequently analyze the reliability of multi-depth cavity PCBAs, presupposing the presence of solderable
features within these cavities.
The intended methods of evaluation for manufacturability will be the evaluation of solder paste volume (PV) and
warpage performance.
The intended methods of evaluation for reliability will be the evaluation of mechanical loading (drop test) and
thermal loading (TCT, reflow) on PCBA test vehicles.
The aim of these investigations is to identify any possible criteria of a solderable multi-depth cavity PCB, which
may affect manufacturability and/or reliability, and if so to which magnitude. Thus, we expect to locate general
and possibly specific advantages and/or limitations of such a product under a standard manufacturing
environment.
In an effort to achieve a broader understanding of the entire process and product scope, the participants in the
trial are an HDI PCB manufacturer, stencil manufacturer and a global EMS manufacturer.
Introduction
Two major drivers in the electronics industry are electrical and mechanical miniaturization. Whereas lines and
spaces have been getting smaller over the years, mechanical miniaturization has thus far been mostly limited to
decreasing layer-count and material thickness.
As PCB cavities increasingly become part of the solution required for component and product miniaturization,
efficiency, effectiveness and reliability of manufacturing with such cavities becomes more relevant. In a
previous paper from the same authors a methodology of printing solder paste in multi-depth cavity PCBs was
analyzed. The results clearly demonstrated that at least one proposed technical solution can prove effective in
terms of solder paste transfer efficiency and volume during a multi-depth single stencil print.
Above and beyond the ability to effectively bring solder paste into the PCB cavities, the manufacturability and
reliability aspects must also be examined in order to provide a better picture of how cavity PCBs and above all
PCBs with multi-depth cavities can be employed in standard SMT manufacturing. This is the target of this
paper.
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [1]
2. Employing similar means of solder paste printing, stencil manufacturing, PCB manufacturing and SMT
manufacturing as those described in the previous paper (means which will for the sake of completeness also be
described here) data has been gathered and tests performed which will demonstrate the variations currently
inherent to this manufacturing constellation.
The test methodology applied in this investigation employs commonly used reliability test specifications. The
target here is to supply comparable data where possible.
The results will conclude that no major deviations from cavity-relevant elements could be observed during
manufacturing. Furthermore, in terms of mechanical reliability comparable results for non-cavity plane and
cavity plane were recorded.
Test vehicle
The decision to use the JEDEC JESD 22-B111 test vehicle is based on the target of making these analyses as
comparable as possible to standard testing methods and materials. Some modifications have been made to the
overall JEDEC JESD 22-B111 test vehicle design to account for the local depth reduction (i.e. cavities), but the
general design, dimensions and structure remains the same.
Four versions of the test vehicle were manufactured to account for the following test factors:
• No cavity (POS 1)
• 1 layer removed (POS 2)
• 2 layers removed (POS 3)
• 3 layers removed (POS 4)
The boards have been populated as shown as in Table 1.
Table 1 – Number of needed cards and components for drop test (DT) and TCT
DT TCT
Cards Components Cards Components
POS 1 9 5 4 15
POS 2 9 5 4 15
POS 3 9 5 4 15
POS 4 9 5 4 15
Total 36 180 16 240
The created vehicle contained a footprint (see Figure 1) of a daisy chain level 2 components with following
specification:
• Package size 12x12x0,86mm
• 288 I/O
• Die size: 10x10mm
• 0,5mm pitch
• LF35 solder ball
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [2]
3. Figure 1 - Footprint of daisy chain component
This footprint was placed according the JEDEC JESD 22-B111 on all four versions. Minimum distance from the
test pattern to the cavity wall for the experiment was 2mm. Each component is connected to a PTH terminal on
the edge of the card through microvias throughout the inner layers (see Figure 2).
Figure 2 - JEDEC Standard no. 22-B111
The build for the 1,1mm thick PCB was a 10 layer multi-layer with Panasonic R1551W material (halogen-
reduced epoxy resin based prepreg) with exception to the outer layers, which contained Mitsui MRG300 RCC-
Foil (Resin Coated Copper-Foil. This stack up and production method based on patented technology2 enables
the removal of multiple layers at varying depths. The specific depth is achieved by the application of a paste on
the release layer with subsequent relamination of the entire board. A laser cutting process then trims and cuts at
the predetermined shape to separate the relaminated layers from the release layer. The final step is then “cap
removal” and paste stripping (see Figure 3). What remains is the solder footprint pattern. Diverse surface
finishes and also application of solder mask can be employed in the cavities. Entek HT (Organic surface
protection) was used as a surface finish for all solder able surfaces (see Figure 4).
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [3]
4. Figure 3 - Schematic process flow of cavity formation
Figure 4 - Test vehicle build-up with recessed areas (PCB and components are not to scale)
Test material, equipment and manufacturing equipment
The solder paste used for these trials is a commonly used SAC type 3 lead-free solder paste.
The solder paste printing system used in this trial is a two part system consisting of a step stencil (Christian
Koenen) and a customized squeegee. Four stencils were used in alignment with the four test vehicle variations,
all of which were laser cut and electro polished stainless steel stencils glued in polyester mesh and tensioned in
an aluminum frame. The outer dimensions of the stencils were (736 x 736 x 40 mm³). Stencil base thickness
was 0,1mm, 0,3mm and 0,4mm and 0,5mm corresponding the cavity depth. One stencil (0,1mm) was a standard
stencil (no accommodation for cavities). The three remaining stencils were provided with local depth reduction
in the respective print area (see Figure 5). Stencil thickness in the print area was 100µm for all stencils.
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [4]
5. Figure 5 - Overview Step Stencil on PCB (demonstration)
The customized steel squeegee is 196mm in length and is designed with movable sections to account for depth.
Therefore the multi-depth top side contour of the stencil is accounted for through the varying pressure of the
movable squeegee sections (Figure 6).
Figure 6 - Squeegee blade with moveable parts (demonstration)
The sloped edges of the step openings in the stencil ensure that excess paste is removed from the stencil during
printing (see Figure 7).
Figure 7 - Cross section of Step stencil with sloped edge (demonstration)
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [5]
6. The printer used was a DEK265. The parameters employed are shown in Table 2.
Table 2 - Printing parameters
Parameter Value Unit
Speed F/B 30/ 30 mm/s
Squeegee pressure F/B 35/ 35 N
Snap off speed 10,0 mm/s
Cleaning Each PCB -
The stencil and customized squeegee were subsequently installed and registered. The squeegee must be aligned
to the specific cavities for which the movable parts are designed. This was done manually using the alignment
of arrow markings on both stencil and squeegee (Figure 8).
Figure 8 - Alignment marking on Squeegee and stencil
The type 3 solder paste was mixed accordingly and applied to the step stencil surface. Using the print
parameters described above, several test prints were then carried out to verify effectiveness and accuracy.
For the purpose of this investigation one of the factors which shall determine manufacturability is solder paste
volume. As the solder paste was applied using the same general resources (stencil type, equipment, etc.) the
target was to observe variations, if any, in absolute volume when comparing the 0µm to cavity depths and
amongst the variable cavity depths themselves. Post printed test vehicles were analyzed inline for solder paste
volume employing a commonly used Koh-Young optical inspection device.
Table 3 - cpk values of paste volume for all test vehicles (POS 1, POS 2, POS 3 and POS 4)
POS cpk
1 3,53
2 2,27
3 1,95
4 1,37
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [6]
7. When comparing the cpk values (see Table 3), one finds a clear trend in process capability under these standard
conditions. While the test vehicle without cavity (0µm) displayed a comparatively high cpk (therefore
consistently sufficient volume), with each reduction in layer count we see sufficient but somewhat diminishing
process capability. No major deviations (voids, skips, etc.) were observed with any test vehicles during the one-
pass production trials (Figure 9).
POS 1: No layer removed POS 2: 1 layer removed
POS 3: 2 layers removed POS 4: 3 layers removed
Figure 9 – Process capability of paste volume for all test vehicles (POS 1, POS 2, POS 3 and POS 4)
The pick and place (PNP) programming for all versions of test vehicles remained the same due to the PNP
device Siplace D3 capability to determine final component placement depths by mechanical force gauging. No
deviations and/or performance variations were observed in pick and place regardless of test vehicle constellation.
We can therefore deem manufacturability as sufficient for this particular trial and equipment setup.
Reflow of the test vehicles was carried out successfully without any deviations observed. Furthermore all test
vehicles passed the IPC-650-TM, Method 2.4.22, test for warpage, therefore eliminating (under these conditions)
warpage as a hindrance to manufacturability. A standard JEDEC lead-free reflow profile was used for the trials
(see Figure 10).
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [7]
8. Figure 10 – JEDEC Lead-free Reflow profile
Test methods and results
Drop Test
The drop test specification was based on the JEDEC JESD22-B111 (see Table 4). The test vehicles were
soldered at the test terminal PTHs and test events were monitored online as opposed to post hoc testing and
verification.
Table 4 – Drop Test Specifications
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [8]
9. For these trials five center components were chosen to be assembled due to overall higher exposure to tension
during this type of drop test (see Figure 11). As Figure 12 illustrates, these particular areas of the test vehicle
deviate farthest from a neutral axis.
Figure 11 - Position of components for drop test
Figure 12 - Model of tension distribution at drop test
Drop test results
The 0µm test vehicle (no cavity) demonstrated the highest level of performance during drop test with an η of 527
(Figure 13). For each removed layer drop test performance was otherwise successively lower.
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [9]
10. Figure 13 - Weibull chart for all test vehicles (POS 1, POS 2, POS 3 and POS 4)
The earliest failure occurred with the test vehicle POS 3. Upon investigation of the earliest failures, cross
sections revealed cracks in solder near the component pad, i.e. no defects found at PCB solder joint (see Figure
14). Test vehicle POS 4 demonstrated, however, a somewhat inferior performance in general when compared
with the other test vehicles.
Figure 14 - Crack in solder near component pad
Test vehicles POS 2 and POS 3 displayed a similar performance in drop testing with exception of the first
failure. To sum up a steady reduction in η was observed with increasing cavity depth. The specific values and
the relationship to paste printing cpk will be evaluated further on in this text.
The contour plot Figure 15 clearly demonstrates a significant relationship between the cavity performances
versus the outer layer (0µm POS 1) performance. The contour plot graphically illustrates the η and β of the
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [10]
11. Weibull fit. The curve plots show that η and β will fall within the marked areas at the following drop at a
probability of 50%. If these plots do not converge, a statistically significant difference exists between the
respective population (POS 2, POS 3 and POS 4 versus POS 1).
Figure 15 - Contour plot for all components for all test vehicles (POS 1, POS 2, POS 3 and POS 4)
In general the observation was made that, concerning defect mode, no particular location was more prevalent
than any other. Furthermore, no particularly frequent defect mode was visible during investigation (i.e. cracks in
all locations throughout solder joints, bulk solder and PCB) (see Figure 16).
Crack in solder (239 drops, POS 1) Crack in solder (720 drops, POS 2)
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [11]
12. Crack in solder, pad/via deformation (555 drops, POS 3) Crack in solder, pad/via deformation (666 drops,
POS 4)
Figure 16 - Typical failure modes for drop test
TCT
The TCT specification was based on the JEDEC JESD22-A104C (see Table 5). The test vehicle based on
JEDEC JESD22 B111 was soldered at the test terminal PTHs.
Table 5 - TCT specification
Four test vehicles were tested, each with 15 SMD daisy chains. Test events were monitored online as opposed to
post hoc testing and verification (Figure 17, Figure 18).
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [12]
13. Figure 17 - Position of components for TCT
Figure 18 - Online test event registration
The boards were subjected to a constant change in temperature in the range of -40°C ↔ +125°C in a one
chamber test device. The amount of cycle deemed as target was 1000 cycles.
An event is registered as a failure after demonstrating a resistance change of >1000 Ohm.
In all cavity constellations the test vehicle passed 1000 cycles without failure. No further cross sections or
analyses were made due to the lack of any relevant failure. The only exception worth noting were a string of
failures in the POS 1 (no cavity) starting at 627 cycles (Figure 19).
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [13]
14. Figure 19 - Weibull for TCT of POS 1
Cross sections were made to investigate failure position and failure modes. Two failure modes were found; both
revealed cracks in the solder (one near component, one near PCB, see Figure 20).
Crack in solder near component Cracks in solder near PCB
Figure 20 - Failure modes for TCT
Conclusion/ Summary
It is worth noting in the conclusion of this analysis that the preparation, manufacturing and availability of
materials (i.e. stencil, squeegee, PCB, solder paste, etc.) posed no obstacle to the overall investigation. This fact
is important when highlighting our focus on the manufacturability when employing these elements.
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [14]
15. Therefore, we posit that in consideration of standard SMT parameters with standard SMT equipment
manufacturability is given, albeit with some additional considerations to be made. These considerations
generally refer to solder paste volume. We found a correlation between solder paste volume and cavity depths,
and a correlation of solder paste volume to drop test performance (see Figure 21). The reduction in solder paste
volume cpk is graphically congruent to the reduction in drop test η. Therefore, it is fair to say that while under
certain terms this system provides manufacturability, considerations could be made to find methods to increase
solder paste volume in deeper cavities and therefore positively affect reliability. Such considerations could be
the aim of future analyses on this subject.
Figure 21 – Chart of cpk and η
Regarding reliability some clear trends were visible, both within the grouping of cavity test vehicles and the test
vehicles as a whole. TCT performance for the components assembled in the cavities provided no indication of
variable performance to standard outer layer constructs. The POS 1 board clearly showed superior drop test
performance, whereas the cavity boards, while somewhat worse than POS 1, demonstrated similar behavior.
One possible explanation for this general demarcation would be choice of material throughout the test vehicle.
The inner layers made use of a 1080 prepreg whereas the outer layer contained and RCC-foil. There is good
reason to believe that the rigidity of a glass reinforced woven material (prepreg) could present inferior drop test
performance in general when compared to the elastic properties of an RCC-foil (see Figure 15). However,
further analysis in this regard would exceed the scope of this paper.
In light of the test vehicle construction and test results one could extrapolate further considerations to improve
reliability performance. Underfill applied to the components above and within the cavities, for example, could
be expected to exhibit a superior drop test performance.
Further scope of investigation on this topic may include involving further test variables and considerations of
specific technology design rules.
References
1
Application of solder paste in PCB cavities, Markus Leitgeb and Christopher Michael Ryder, Originally
distributed at the International Conference on Soldering and Reliability” , Toronto, Ontario, Canada; May 4-6,
2011
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [15]
16. 2
2.5D® Technology, ® Registered Trademark AT 257759 by AT&S
*) First presented at IPC APEX EXPO 2012, San Diego February 28 – March 1 [16]