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A method to increase FOV in an e-beam
microcolumn

Om Krishna Suwal, Ph.D.
Department of Physics and Nanoscience
Sun Moon University

1

SUNMOON UNIVERSITY
Outline
 Objective:



To analyze the influence of Einzel lens structure on FOV

Outline of presentation:


Microcolumn – introduction



MEMS fabrication technique of lens



Assembly of microcolumn with various gap between electrodes



Analysis of FOV for narrow and wide gap of electrodes and
microcolumn operation mode at various tip voltages and working

distances


E-beam trajectory, electric field analysis following computer
simulation
2

SUNMOON UNIVERSITY
Microcolumn
Source size, do

Cathode
Source lens
2o

Deflector
~ 3-10 mm
Optical axis
for e-beam

Einzel lens
Probe size, d1

21
Sample

2
Resolution 𝑑1 =

𝑀𝑑0

2

+ 𝑑2 + 𝑑2 𝑠 + 𝑑2 𝑐
𝐶
𝐶
𝑑

d1 = Probe size
M = Column magnification
d0 = virtual source size
dd= 1.5/1V
V = Beam energy
3
𝑑 𝐶 𝑠 = 0.25 Cs 1
𝑑 𝐶 𝑐 = Cc 1 V/V
Cs = Spherical aberration coefficient
Cc = Chromatic aberration
coefficient
T.H.P. Chang et al. (1989)
3

SUNMOON UNIVERSITY
Microcolumn Features and Benefits
Miniaturized Electron Optical system
 Portable electron source
 Mini-SEM (Desktop SEM)

Low energy e-beam
Electron energy 100 eV – 2 keV
Less sample damages due to e-beam
Microfabricated Columns
MEMS technology applicable
Low cost and High yield
Arrayed Beam Operation
Parallel beam operation
High throughput with low beam voltage
Short stage traveling
SUNMOON UNIVERSITY

4
Microcolumn Assembly
Emitter
Source Lens

Deflectors

Einzel lens

Schematic

Shield microcolumn

H.S. Kim et al. / Microelectronic Engineering 83 (2006) 962–967
5

SUNMOON UNIVERSITY
Einzel Lens Assembly
 = 200 m / 100 m

~0.5 mm /
1.5 mm

E1

Pyrex 150 m
/ 500 m

E2
E3

Emitter

3 mm
8 mm
Si

Source Lens

Pyrex

Source or Einzel lens
structural cross section

3 - 10
mm

Deflector
Einzel Lens

Microcolumn cross section
SUNMOON UNIVERSITY

Grid
(sample)
6
Fabrication Process
a. Boron doping and oxidation
Si wafer
b. Front side lithography

c. DRIE Si trenches

d. SiO2 deposition

Si

Boron doped Si

PR

SiO2
7

SUNMOON UNIVERSITY
Fabrication Process cont…
e. Back side patterning

f. Back side Si etching
v
i
e
w

g. SiO2 strip off and doping
10 mm
v
i
e
w

Si

Boron doped Si

PR

SiO2
8

SUNMOON UNIVERSITY
Si Membrane-Pyrex Bonding
A
Pyrex
Si
Hot plate

A Pyrex bonded
membrane
Pyrex

HT

Membrane detachment

Si membrane

Si
Pyrex

Si
Pyrex

10 ㎛

Interface of bonded Si-Pyrex

9

SUNMOON UNIVERSITY
Multiple Lens Alignments

Pyrex
Si

L1

L2

Laser

Laser

Laser

22.5o 45o

L3

Top view of the
assembled lens

10

SUNMOON UNIVERSITY
Modes of Operation
Source lens
focusing
VS1
VS2

S1
S2
S3

Source + Einzel
lens focusing

Einzel lens
focusing
VS1

S1
S2
S3

VS1
VS2

S1
S2
S3

D1

D1

D1

E1
E2
E3

E1
E2
E3

E1
E2
E3

D2

D2

Sample

VE2

VE2

D2

Sample

Sample
11

SUNMOON UNIVERSITY
Simulation of e-beam trajectory and electric potential
along optical axis
Module

-300V S2

S1

S3

100

D1

20
50

D2

 = 500 m

Electric Potential distribution at Einzel lens system
E2
E1 E3

Gap =

150 m

Gap =

500 m

 = 200 m

Gap = 150 m, S2 = -240 V, E2 = 500 V
WD

Gap = 250 m, S2 = -240 V, E2 = 500 V
WD

Gap =500 m, S2 = -240 V, E2 = 500 V
WD
Working Distance (m)

1600

SUNMOON UNIVERSITY

1500

S2 & E2 focusing

1400
1300
1200
1100
100

12
200

300

400

500

Gap between electrodes (m)
Scan Range Dependency on WD and Gap
(Source Lens Focusing )
Narrow gap

Wide gap

800

200 m

S2 : -269 V, 20 nA
Deflector 100 V,
E1 : 0.02 nA, E2 : 0 V

Scan length (m)

700

500 m

S2 : -252 V, 20 nA
Deflector 100V,
E1 : 0.02 nA, E2 : 0 V

600

Tip voltage
S2 focusing mode
-200 V
-300 V Narrow gap
-400 V
Wide gap



500
400
300
200

2

4

6

8

WD (mm)
350

S2 focusing mode

Gap = 250 m, S2 = -245 V, D =  35 V, E2 = 0 V

Gap = 500 m, S2 = -245 V, D =  30 V, E2 = 0 V

Scan Range (um)

Gap = 150 m, S2 = -245 V, D =  40 V, E2 = 0 V

300

250
100

SUNMOON UNIVERSITY

Source lens
Einzel lens

200

300

400

500

Gap between electrodes (um)

13
Image Quality Dependency on Gap and
Scan Range with Tip Voltage (Einzel Lens Focusing )
-200V

Wide gap

-250V

-300V

Narrow gap

-350V

100 m

200 m
Tip Voltage=-300V; S1 Current=0.5uA
S1 Voltage=-89V; E2 Voltage=357V

-400V

-450V

-500V

450

E1 positions

Wide gap Einzel lens
E2 focusing mode

Wide

400

Scan Range (m)

Tip Voltage = -300V; S1 Current = 10 nA
S1 Voltage = -79V; E2 Voltage = 411 V

Narrow

350
300
Experiment
Linear fitting

250
-400

SUNMOON UNIVERSITY

Vtip (V)

-200

14
Combined Source and Einzel Lens Focusing
SEM Images from narrow gap lens system
A

B

Simulation of E-beam trajectory for
combined S2 and E2 focusing mode

C

Gap = 150 m, S2 = -240 V, D =  55 V, E2 = 500 V

D

E

Gap = 250 m, S2 = -240 V, D =  50 V, E2 = 480 V

F

Gap = 500 m, S2 = -240 V, D =  40 V, E2 = 570 V
Combined S2 and E2 focusing mode

Operation parameters
SEM
Image

Tip
nA

V

A

-140

B

S2

Mag

nA

V

nA

V

-270

-267

25

50

10

10

-141

-214

-267.1

24

150

4.5

-140

-220

-265

17

200

4.5

-143

-222

-264

27

250

E

-145

-232

-265

28

270

2

F

-147

-231

-265

29

289.8

1

D

-300

nA

E2

V

C

V

S1

100

SUNMOON UNIVERSITY

5

4.5

Scan Range (um)

150

100

50
100

200

300

400

500

Gap between elctrodes (um)

15
Summary
 Fabrication of thin Si membrane lens ->
gap can be easily adjusted by selecting the proper Pyrex thickness.
 MEMS process such as Deposition, DRIE, Etching, bonding etc.
 Investigated the performance of a microcolumn
depending on gap between lenses and operation mode

 Source Lens Focusing mode : Larger scan range for narrow gap
 Einzel Lens Focusing mode : Lower image quality with narrow gap
due to the interference of electric field with deflector

 Two Lens Focusing mode (use source and Einzel lens simultaneously) :
Scan range of narrow gap lens is smaller than that of wide gap lens
 For the optimized scan range and good image quality,
adjustment of lens gap is required, tentatively 250 or 300 m.
16

SUNMOON UNIVERSITY
THANK YOU

17

SUNMOON UNIVERSITY

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A method to increase fov in e beam microcolumn

  • 1. A method to increase FOV in an e-beam microcolumn Om Krishna Suwal, Ph.D. Department of Physics and Nanoscience Sun Moon University 1 SUNMOON UNIVERSITY
  • 2. Outline  Objective:   To analyze the influence of Einzel lens structure on FOV Outline of presentation:  Microcolumn – introduction  MEMS fabrication technique of lens  Assembly of microcolumn with various gap between electrodes  Analysis of FOV for narrow and wide gap of electrodes and microcolumn operation mode at various tip voltages and working distances  E-beam trajectory, electric field analysis following computer simulation 2 SUNMOON UNIVERSITY
  • 3. Microcolumn Source size, do Cathode Source lens 2o Deflector ~ 3-10 mm Optical axis for e-beam Einzel lens Probe size, d1 21 Sample 2 Resolution 𝑑1 = 𝑀𝑑0 2 + 𝑑2 + 𝑑2 𝑠 + 𝑑2 𝑐 𝐶 𝐶 𝑑 d1 = Probe size M = Column magnification d0 = virtual source size dd= 1.5/1V V = Beam energy 3 𝑑 𝐶 𝑠 = 0.25 Cs 1 𝑑 𝐶 𝑐 = Cc 1 V/V Cs = Spherical aberration coefficient Cc = Chromatic aberration coefficient T.H.P. Chang et al. (1989) 3 SUNMOON UNIVERSITY
  • 4. Microcolumn Features and Benefits Miniaturized Electron Optical system  Portable electron source  Mini-SEM (Desktop SEM) Low energy e-beam Electron energy 100 eV – 2 keV Less sample damages due to e-beam Microfabricated Columns MEMS technology applicable Low cost and High yield Arrayed Beam Operation Parallel beam operation High throughput with low beam voltage Short stage traveling SUNMOON UNIVERSITY 4
  • 5. Microcolumn Assembly Emitter Source Lens Deflectors Einzel lens Schematic Shield microcolumn H.S. Kim et al. / Microelectronic Engineering 83 (2006) 962–967 5 SUNMOON UNIVERSITY
  • 6. Einzel Lens Assembly  = 200 m / 100 m ~0.5 mm / 1.5 mm E1 Pyrex 150 m / 500 m E2 E3 Emitter 3 mm 8 mm Si Source Lens Pyrex Source or Einzel lens structural cross section 3 - 10 mm Deflector Einzel Lens Microcolumn cross section SUNMOON UNIVERSITY Grid (sample) 6
  • 7. Fabrication Process a. Boron doping and oxidation Si wafer b. Front side lithography c. DRIE Si trenches d. SiO2 deposition Si Boron doped Si PR SiO2 7 SUNMOON UNIVERSITY
  • 8. Fabrication Process cont… e. Back side patterning f. Back side Si etching v i e w g. SiO2 strip off and doping 10 mm v i e w Si Boron doped Si PR SiO2 8 SUNMOON UNIVERSITY
  • 9. Si Membrane-Pyrex Bonding A Pyrex Si Hot plate A Pyrex bonded membrane Pyrex HT Membrane detachment Si membrane Si Pyrex Si Pyrex 10 ㎛ Interface of bonded Si-Pyrex 9 SUNMOON UNIVERSITY
  • 10. Multiple Lens Alignments Pyrex Si L1 L2 Laser Laser Laser 22.5o 45o L3 Top view of the assembled lens 10 SUNMOON UNIVERSITY
  • 11. Modes of Operation Source lens focusing VS1 VS2 S1 S2 S3 Source + Einzel lens focusing Einzel lens focusing VS1 S1 S2 S3 VS1 VS2 S1 S2 S3 D1 D1 D1 E1 E2 E3 E1 E2 E3 E1 E2 E3 D2 D2 Sample VE2 VE2 D2 Sample Sample 11 SUNMOON UNIVERSITY
  • 12. Simulation of e-beam trajectory and electric potential along optical axis Module -300V S2 S1 S3 100 D1 20 50 D2  = 500 m Electric Potential distribution at Einzel lens system E2 E1 E3 Gap = 150 m Gap = 500 m  = 200 m Gap = 150 m, S2 = -240 V, E2 = 500 V WD Gap = 250 m, S2 = -240 V, E2 = 500 V WD Gap =500 m, S2 = -240 V, E2 = 500 V WD Working Distance (m) 1600 SUNMOON UNIVERSITY 1500 S2 & E2 focusing 1400 1300 1200 1100 100 12 200 300 400 500 Gap between electrodes (m)
  • 13. Scan Range Dependency on WD and Gap (Source Lens Focusing ) Narrow gap Wide gap 800 200 m S2 : -269 V, 20 nA Deflector 100 V, E1 : 0.02 nA, E2 : 0 V Scan length (m) 700 500 m S2 : -252 V, 20 nA Deflector 100V, E1 : 0.02 nA, E2 : 0 V 600 Tip voltage S2 focusing mode -200 V -300 V Narrow gap -400 V Wide gap  500 400 300 200 2 4 6 8 WD (mm) 350 S2 focusing mode Gap = 250 m, S2 = -245 V, D =  35 V, E2 = 0 V Gap = 500 m, S2 = -245 V, D =  30 V, E2 = 0 V Scan Range (um) Gap = 150 m, S2 = -245 V, D =  40 V, E2 = 0 V 300 250 100 SUNMOON UNIVERSITY Source lens Einzel lens 200 300 400 500 Gap between electrodes (um) 13
  • 14. Image Quality Dependency on Gap and Scan Range with Tip Voltage (Einzel Lens Focusing ) -200V Wide gap -250V -300V Narrow gap -350V 100 m 200 m Tip Voltage=-300V; S1 Current=0.5uA S1 Voltage=-89V; E2 Voltage=357V -400V -450V -500V 450 E1 positions Wide gap Einzel lens E2 focusing mode Wide 400 Scan Range (m) Tip Voltage = -300V; S1 Current = 10 nA S1 Voltage = -79V; E2 Voltage = 411 V Narrow 350 300 Experiment Linear fitting 250 -400 SUNMOON UNIVERSITY Vtip (V) -200 14
  • 15. Combined Source and Einzel Lens Focusing SEM Images from narrow gap lens system A B Simulation of E-beam trajectory for combined S2 and E2 focusing mode C Gap = 150 m, S2 = -240 V, D =  55 V, E2 = 500 V D E Gap = 250 m, S2 = -240 V, D =  50 V, E2 = 480 V F Gap = 500 m, S2 = -240 V, D =  40 V, E2 = 570 V Combined S2 and E2 focusing mode Operation parameters SEM Image Tip nA V A -140 B S2 Mag nA V nA V -270 -267 25 50 10 10 -141 -214 -267.1 24 150 4.5 -140 -220 -265 17 200 4.5 -143 -222 -264 27 250 E -145 -232 -265 28 270 2 F -147 -231 -265 29 289.8 1 D -300 nA E2 V C V S1 100 SUNMOON UNIVERSITY 5 4.5 Scan Range (um) 150 100 50 100 200 300 400 500 Gap between elctrodes (um) 15
  • 16. Summary  Fabrication of thin Si membrane lens -> gap can be easily adjusted by selecting the proper Pyrex thickness.  MEMS process such as Deposition, DRIE, Etching, bonding etc.  Investigated the performance of a microcolumn depending on gap between lenses and operation mode  Source Lens Focusing mode : Larger scan range for narrow gap  Einzel Lens Focusing mode : Lower image quality with narrow gap due to the interference of electric field with deflector  Two Lens Focusing mode (use source and Einzel lens simultaneously) : Scan range of narrow gap lens is smaller than that of wide gap lens  For the optimized scan range and good image quality, adjustment of lens gap is required, tentatively 250 or 300 m. 16 SUNMOON UNIVERSITY