9-Axis MEMS IMU Technology and Patent Infringement Risk Analysis : STMicroelectronics (LSM9DS0), Bosch Sensortec (BMX055), InvenSense (MPU-9250)
Take the benefits of KnowMade and System Plus Consulting combined added value for highlighting potential risks of patent infringement.
Motion sensing combo sensor is a very hot topic, both in terms of market potential and competition among the players. The growth of the applications of 6 and 9 degrees of freedom (DoF) devices is both pushing the leaders (STMicroelectronics, Bosch Sensortec and InvenSense) and their challengers (AKM, Kionix, mCube, Freescale, Alps, KionixâŚ) to develop innovative technical and manufacturing solutions, and, in parallel of course, to have the right patents to protect their inventions. What are the similarities and the differences in term of technical and manufacturing choices at the devices level ? What is the related patent situation?
For the first time, Knowmade (specialized in patent analysis) and System Plus Consulting (specialized in reverse engineering and reverse costing) are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks of patent infringement between STMicroelectronics, Bosch Sensortec and InvenSense in the field of 9 axis MEMS inertial measurement units (IMU). As the 9 axis IMUs are just starting to be adopted by the market, it is the right time now to understand what could happen between these 3 companies and how to differentiate patents and claims compared to the leaders.
2012 was seen by many as a turnkey year for consumer combo sensors (6 and 9 axis sensors). Since then, many developments have occurred and the market acceptance of combo solutions has been extremely quick. According to Yole DĂŠveloppement, the combo sensor market is estimated to be $446M in 2013, growing to $1.97B in 2018. This represents 21% of the global inertial consumer market in 2013, and will grow to an impressive 66% by 2018. In this playground, STMicroelectronics (ST), Bosch Sensortec (Bosch) and InvenSense are the 3 market leaders in the inertial consumer sensors with more than 50% of market share.
More information on that report at http://www.i-micronews.com/reports/9-Axis-MEMS-IMU-Patent-Infringement-Risk-Analysis/1/456/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
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Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Competitive Intelligence Report on âHeads-up Displayâ by DexPatentCaroline Charumathy
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Competitive Intelligence Report by DexPatent gives you a thorough and comprehensive analysis of all patents published, granted or expired by companies, startups, inventors or universities across the world during Jan 2019. This Exclusive report provides you patent and technology insights which help you to take direct decisions relating to R&D alignment, licensing or acquisition.
To get in-depth analysis of innovations and opportunities relating to Heads-up Display, Please contact us at linda@dexpatent.com.
MarketResearchReprots.com has announced the addition of âForecast of Global Semiconductor Inspection Equipment Players Market 2023â research report to their offering. See more at- http://mrr.cm/w3C
Power Packaging Technology Trends and Market ExpectationsMarketResearch.com
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An overview of Power Packaging Technology Trends and Market Expectations report. In this report you will find detailed descriptions of standard power module packaging designs. There are special focuses on each part: substrate, thermal interface materials, baseplate, encapsulation, die attach and interconnection. Both technological and marketing points of view are considered. Technological innovations are presented, and market metrics and forecasts are given for each part.
First consumer application in the Intel Core 8th Generation i7-8809G, the worldâs first On-Package CPU and GPU with High Bandwidth Memory.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/intels-embedded-multi-die-interconnect-bridge-emib/
Apple iPhone 12 series mmWave 5G Chipset and Antennasystem_plus
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A study of the complete first generation of the 5G millimeter-wave chipset for Appleâs phones including custom antenna, front-end module and antenna-on-package.
More information : https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/
Fan-In Packaging: Business update 2016 Report by Yole DeveloppementYole Developpement
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Fan-In: A steady growth platform awaiting disruption
The Fan-In Packaging platform has been a successful and steadily growing platform for over a decade. It remains appealing as an inherently unmatched combination of smallest package form factor and low cost. Due to these features, historically it found penetration in form driven handsets and tablets and has maintained growth within these devices. It is estimated that more than 90% of Fan-In packages today are found in the mobile segment. With respect to Fan-In adoption, in todayâs high end smartphones already more than 30% of all packages are Fan-In packages. Therefore, Fan-In packaging spread in the sweet spot mobile segment continues.
While the Fan-In packaging growth pace until now could be described as steady and stable, the global semiconductor market shifts and rising uncertainty over future applications will inevitably impact the outlook of Fan-In packaging as well. The smartphone market leading Fan-In adoption is maturing, with smartphone unit growth dropping from 35% in 2013 to 8% in 2016 and forecasted at 6% by 2020. While the trend is not favourable in terms of high growth expectations, smartphones are still expected to be the leading semiconductor driver with more than 2 billion units in 2020.
Primary Fan-In devices are WiFi/BT combos, transceivers, PMIC and DC/DC converters (~50% of total production) followed by a variety of analog/digital/mixed signal devices including MEMS and image sensors. The biggest challenge the Fan-In platform will be facing in the future is functional integration of devices into SiP form. Figure below indicates the impact of SiP growth on Fan-In unit production, decreasing the overall CAGR from 9% to 6%. A detailed analysis of SiP growth is performed in the report.
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
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Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Competitive Intelligence Report on âHeads-up Displayâ by DexPatentCaroline Charumathy
Â
Competitive Intelligence Report by DexPatent gives you a thorough and comprehensive analysis of all patents published, granted or expired by companies, startups, inventors or universities across the world during Jan 2019. This Exclusive report provides you patent and technology insights which help you to take direct decisions relating to R&D alignment, licensing or acquisition.
To get in-depth analysis of innovations and opportunities relating to Heads-up Display, Please contact us at linda@dexpatent.com.
MarketResearchReprots.com has announced the addition of âForecast of Global Semiconductor Inspection Equipment Players Market 2023â research report to their offering. See more at- http://mrr.cm/w3C
Power Packaging Technology Trends and Market ExpectationsMarketResearch.com
Â
An overview of Power Packaging Technology Trends and Market Expectations report. In this report you will find detailed descriptions of standard power module packaging designs. There are special focuses on each part: substrate, thermal interface materials, baseplate, encapsulation, die attach and interconnection. Both technological and marketing points of view are considered. Technological innovations are presented, and market metrics and forecasts are given for each part.
First consumer application in the Intel Core 8th Generation i7-8809G, the worldâs first On-Package CPU and GPU with High Bandwidth Memory.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/intels-embedded-multi-die-interconnect-bridge-emib/
Apple iPhone 12 series mmWave 5G Chipset and Antennasystem_plus
Â
A study of the complete first generation of the 5G millimeter-wave chipset for Appleâs phones including custom antenna, front-end module and antenna-on-package.
More information : https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/
Fan-In Packaging: Business update 2016 Report by Yole DeveloppementYole Developpement
Â
Fan-In: A steady growth platform awaiting disruption
The Fan-In Packaging platform has been a successful and steadily growing platform for over a decade. It remains appealing as an inherently unmatched combination of smallest package form factor and low cost. Due to these features, historically it found penetration in form driven handsets and tablets and has maintained growth within these devices. It is estimated that more than 90% of Fan-In packages today are found in the mobile segment. With respect to Fan-In adoption, in todayâs high end smartphones already more than 30% of all packages are Fan-In packages. Therefore, Fan-In packaging spread in the sweet spot mobile segment continues.
While the Fan-In packaging growth pace until now could be described as steady and stable, the global semiconductor market shifts and rising uncertainty over future applications will inevitably impact the outlook of Fan-In packaging as well. The smartphone market leading Fan-In adoption is maturing, with smartphone unit growth dropping from 35% in 2013 to 8% in 2016 and forecasted at 6% by 2020. While the trend is not favourable in terms of high growth expectations, smartphones are still expected to be the leading semiconductor driver with more than 2 billion units in 2020.
Primary Fan-In devices are WiFi/BT combos, transceivers, PMIC and DC/DC converters (~50% of total production) followed by a variety of analog/digital/mixed signal devices including MEMS and image sensors. The biggest challenge the Fan-In platform will be facing in the future is functional integration of devices into SiP form. Figure below indicates the impact of SiP growth on Fan-In unit production, decreasing the overall CAGR from 9% to 6%. A detailed analysis of SiP growth is performed in the report.
Broadcom AFEM-8072 â Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
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The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
The worldâs first single-chip radar (76 - 81 GHz) in a System-on-Chip.
Ahead of its competitors in RFCMOS applications, Texas Instruments (TI) has begun manufacturing highly integrated radar sensor chips - the latest of which is the AWR1642. But rather than integrating all transmitters, receivers, and local oscillators in a single chip, TI went further and integrated a microcontroller unit (MCU) and a digital signal processor (DSP) on the same chip.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/awr1642-77-79-ghz-rfcmos-radar-chipset-from-texas-instruments/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
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Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the worldâs largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between Chinaâs IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is Chinaâs #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of Chinaâs semiconductor ecosystem and discusses in detail the countryâs advanced packaging market. This report will also describe Chinaâs semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese governmentâs approach to developing Chinaâs IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in Chinaâs fast-growing IC ecosystem, particularly in advanced packaging.
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
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The first MMIC FEM targeting 5G base stations and terminals using a 0.15Âľm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Bulk GaN Substrate Market 2017 Report by Yole DeveloppementYole Developpement
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Optoelectronics applications are driving the bulk GaN substrate market
Optoelectronics applications, particularly GaN-based laser diodes and GaN-on-GaN LEDs, are expected to drive the bulk GaN susbtrate market from 2016 - 2022.
Specific to the laser diode market, the Blu-ray segment, which in the past was the GaN-based laser industryâs main driver, continues to decline. In recent years, a much greater percentage of movies were viewed via streaming than on optical discs, and in many cases flash memory is replacing optical discs and magnetic storage. The current crop of mobile phones, netbooks, tablets, and even laptops lack a Blu-ray/DVD/CD drive. UHD Blu-rayâs recent development is expected to have only a novelty effect on sales - not enough to reverse the general downward trend we will see in the coming years. However, decreasing Blu-ray demand is expected to be offset by nascent, growing segments like projectors (office projector, mobile pico projector, head-up display (HUD), etc.) and automotive lighting, leading to new growth opportunities for bulk GaN substrates.
In the LED market, improvements in GaN substrate manufacturing have lowered substrate prices enough for various niche LED applications. In addition to Soraa (US) and Panasonic (JP), this seems to have revived the interest of other LED manufacturers which are beginning to seriously consider using GaN substrates for either spotlighting or automotive lighting. New GaN-on-GaN LED players are expected in the market in the coming years.
For more information, please visit our website: http://www.i-micronews.com/reports.html
First self-made SoC for advanced driving in Tesla Driver Assist Autopilot 3.0
More : https://www.systemplus.fr/reverse-costing-reports/tesla-ubq01b0-fsd-chip/
Microsoft - Holographic Lens from Hololens 2system_plus
Â
See-through holographic display for mixed reality smartglasses.
More on : https://www.systemplus.fr/reverse-costing-reports/microsoft-holographic-lens-from-hololens-2/
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reve...Yole Developpement
Â
orvo started as a supplier for Appleâs iPhone with the first iPhone 3G. Since then Apple has been integrating Qorvoâs Module in its flagship. In iPhone 6s series, Apple integrates Qorvoâs LTE High Band Front-End Module.
The merge of Triquint and RFMD in Qorvo formed a top competitor in wireless communication specially in SMR BAW filter.
Located on the main board of the Apple iPhone 6s Plus smartphone, the Qorvo TQF6405 is a complete Front-End Module for high band LTE application. The component is made with several filter dies, assembled on a coreless PCB substrate. It integrates many technology like copper pillar, SMR-BAW filter, proprietary of Qorvo.
All dies present in the component uses TriQuint's proven front-side Cu/Sn pillar technology (Cu-Flipâ˘) for simplified assembly and low interconnect inductance, allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
Specific air cavities are made around each resonator before copper pillar fabrication to preserve any losses.
More information on that report at http://www.i-micronews.com/reports.html
EPCâs 70 V ePower stage with separate and independent high and low side control inputs.
More information: https://www.systemplus.fr/reverse-costing-reports/epc2152-half-bridge-monolithic-gan-ic/
Worldâs first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
Continental, Veoneer, ZF, Valeo, Bosch, Aptiv, Denso, Ainstein: Discover the technologies used in the main Radar Systems and Chipsets.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/automotive-radar-comparison-2018/
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Ainstein T-79: Automotive 79GHz Short Range Radarsystem_plus
Â
A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
GaN-on-Silicon Transistor Comparison 2018 Structural, Process & Costing Repor...Yole Developpement
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Dive deep into the technology and cost of GaN-on-silicon HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments.
More information on that report at https://www.i-micronews.com/report/product/gan-on-silicon-transistor-comparison-2018.html
NVIDIAâs new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.
More information: https://www.systemplus.fr/reverse-costing-reports/nvidia-a100-ampere-gpu/
Motion sensing combo sensor is a very hot topic, both in terms of market potential and competition among the players. The growth of the applications of 6 and 9 degrees of freedom (DoF) devices is both pushing the leaders (STMicroelectronics, Bosch Sensortec and InvenSense) and their challengers (AKM, Kionix, mCube, Freescale, Alps, KionixâŚ) to develop innovative technical and manufacturing solutions, and, in parallel of course, to have the right patents to protect their inventions. What are the similarities and the differences in term of technical and manufacturing choices at the devices level ? What is the related patent situation?
OBJECTIVES OF THE REPORT
⢠Find the technical and manufacturing process similarities and differences of LSM9DS0, BMX055 and MPU-9250 9-axis IMU components.
⢠Identify key patents held by STMicroelectronics, Bosch Sensortec and InvenSense, and related to the target product features.
⢠Find the link between patented technological solutions and marketed products.
⢠Identify the potential infringing parties and help to find evidence of use.
⢠Identify potential risks of patent infringement and identify the patents which require a more in depth legal assessment.
KEY FEATURES OF THE REPORT
⢠Deep insight on technology data and manufacturing processes
⢠Comparative studies of product features (similarities & differences)
⢠Key patents related to the target product features per company
⢠Cross analysis of potential patent infringement risks
⢠Excel database with all patents analyzed in the report
Boschâs first 6-Axis IMU for Automotive Application combining 3-Axis Gyroscope and 3-Axis Accelerometer
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The SMI130 combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a 4.5x3.0mm LGA packages which is AEC-Q100 qualified for automotive applications. The measurement range of the yaw rate sensor can be adjusted in up to five steps between ¹125°/s and ¹2000°/s; the acceleration sensor offers four different measurement ranges between ¹2g and ¹16g.
The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.
The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.
The SMI130 is designed for non-safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.
More information on that report at http://www.i-micronews.com/reports.html
Broadcom AFEM-8072 â Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
Â
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
The worldâs first single-chip radar (76 - 81 GHz) in a System-on-Chip.
Ahead of its competitors in RFCMOS applications, Texas Instruments (TI) has begun manufacturing highly integrated radar sensor chips - the latest of which is the AWR1642. But rather than integrating all transmitters, receivers, and local oscillators in a single chip, TI went further and integrated a microcontroller unit (MCU) and a digital signal processor (DSP) on the same chip.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/awr1642-77-79-ghz-rfcmos-radar-chipset-from-texas-instruments/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Â
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the worldâs largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between Chinaâs IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is Chinaâs #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of Chinaâs semiconductor ecosystem and discusses in detail the countryâs advanced packaging market. This report will also describe Chinaâs semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese governmentâs approach to developing Chinaâs IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in Chinaâs fast-growing IC ecosystem, particularly in advanced packaging.
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
Â
The first MMIC FEM targeting 5G base stations and terminals using a 0.15Âľm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Bulk GaN Substrate Market 2017 Report by Yole DeveloppementYole Developpement
Â
Optoelectronics applications are driving the bulk GaN substrate market
Optoelectronics applications, particularly GaN-based laser diodes and GaN-on-GaN LEDs, are expected to drive the bulk GaN susbtrate market from 2016 - 2022.
Specific to the laser diode market, the Blu-ray segment, which in the past was the GaN-based laser industryâs main driver, continues to decline. In recent years, a much greater percentage of movies were viewed via streaming than on optical discs, and in many cases flash memory is replacing optical discs and magnetic storage. The current crop of mobile phones, netbooks, tablets, and even laptops lack a Blu-ray/DVD/CD drive. UHD Blu-rayâs recent development is expected to have only a novelty effect on sales - not enough to reverse the general downward trend we will see in the coming years. However, decreasing Blu-ray demand is expected to be offset by nascent, growing segments like projectors (office projector, mobile pico projector, head-up display (HUD), etc.) and automotive lighting, leading to new growth opportunities for bulk GaN substrates.
In the LED market, improvements in GaN substrate manufacturing have lowered substrate prices enough for various niche LED applications. In addition to Soraa (US) and Panasonic (JP), this seems to have revived the interest of other LED manufacturers which are beginning to seriously consider using GaN substrates for either spotlighting or automotive lighting. New GaN-on-GaN LED players are expected in the market in the coming years.
For more information, please visit our website: http://www.i-micronews.com/reports.html
First self-made SoC for advanced driving in Tesla Driver Assist Autopilot 3.0
More : https://www.systemplus.fr/reverse-costing-reports/tesla-ubq01b0-fsd-chip/
Microsoft - Holographic Lens from Hololens 2system_plus
Â
See-through holographic display for mixed reality smartglasses.
More on : https://www.systemplus.fr/reverse-costing-reports/microsoft-holographic-lens-from-hololens-2/
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reve...Yole Developpement
Â
orvo started as a supplier for Appleâs iPhone with the first iPhone 3G. Since then Apple has been integrating Qorvoâs Module in its flagship. In iPhone 6s series, Apple integrates Qorvoâs LTE High Band Front-End Module.
The merge of Triquint and RFMD in Qorvo formed a top competitor in wireless communication specially in SMR BAW filter.
Located on the main board of the Apple iPhone 6s Plus smartphone, the Qorvo TQF6405 is a complete Front-End Module for high band LTE application. The component is made with several filter dies, assembled on a coreless PCB substrate. It integrates many technology like copper pillar, SMR-BAW filter, proprietary of Qorvo.
All dies present in the component uses TriQuint's proven front-side Cu/Sn pillar technology (Cu-Flipâ˘) for simplified assembly and low interconnect inductance, allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
Specific air cavities are made around each resonator before copper pillar fabrication to preserve any losses.
More information on that report at http://www.i-micronews.com/reports.html
EPCâs 70 V ePower stage with separate and independent high and low side control inputs.
More information: https://www.systemplus.fr/reverse-costing-reports/epc2152-half-bridge-monolithic-gan-ic/
Worldâs first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
Continental, Veoneer, ZF, Valeo, Bosch, Aptiv, Denso, Ainstein: Discover the technologies used in the main Radar Systems and Chipsets.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/automotive-radar-comparison-2018/
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Ainstein T-79: Automotive 79GHz Short Range Radarsystem_plus
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A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
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Dive deep into the technology and cost of GaN-on-silicon HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments.
More information on that report at https://www.i-micronews.com/report/product/gan-on-silicon-transistor-comparison-2018.html
NVIDIAâs new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.
More information: https://www.systemplus.fr/reverse-costing-reports/nvidia-a100-ampere-gpu/
Motion sensing combo sensor is a very hot topic, both in terms of market potential and competition among the players. The growth of the applications of 6 and 9 degrees of freedom (DoF) devices is both pushing the leaders (STMicroelectronics, Bosch Sensortec and InvenSense) and their challengers (AKM, Kionix, mCube, Freescale, Alps, KionixâŚ) to develop innovative technical and manufacturing solutions, and, in parallel of course, to have the right patents to protect their inventions. What are the similarities and the differences in term of technical and manufacturing choices at the devices level ? What is the related patent situation?
OBJECTIVES OF THE REPORT
⢠Find the technical and manufacturing process similarities and differences of LSM9DS0, BMX055 and MPU-9250 9-axis IMU components.
⢠Identify key patents held by STMicroelectronics, Bosch Sensortec and InvenSense, and related to the target product features.
⢠Find the link between patented technological solutions and marketed products.
⢠Identify the potential infringing parties and help to find evidence of use.
⢠Identify potential risks of patent infringement and identify the patents which require a more in depth legal assessment.
KEY FEATURES OF THE REPORT
⢠Deep insight on technology data and manufacturing processes
⢠Comparative studies of product features (similarities & differences)
⢠Key patents related to the target product features per company
⢠Cross analysis of potential patent infringement risks
⢠Excel database with all patents analyzed in the report
Boschâs first 6-Axis IMU for Automotive Application combining 3-Axis Gyroscope and 3-Axis Accelerometer
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The SMI130 combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a 4.5x3.0mm LGA packages which is AEC-Q100 qualified for automotive applications. The measurement range of the yaw rate sensor can be adjusted in up to five steps between ¹125°/s and ¹2000°/s; the acceleration sensor offers four different measurement ranges between ¹2g and ¹16g.
The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.
The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.
The SMI130 is designed for non-safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.
More information on that report at http://www.i-micronews.com/reports.html
Industryâs first Custom-Programmable System-in-Package 9-Axis Motion Sensor
Like its competitor InvenSense, BOSCH Sensortec has unveiled a programmable all-in-one motion sensor for robotics, gaming, and household IoT devices, touted as the industryâs first custom-programmable 9-axis motion sensor. Â
The BMF055 is a new version of the BOSCH Sensortec 9-axis device (3-axis Gyroscope + 3-axis Accelerometer + 3-axis Magnetometer), with a MCU included in the package. Compared to the stand-alone sensor hub, this new approach eliminates a package and reduces system-level power. This device integrates six-chip in a complex System-in-Package.
The sensor hub combines a 14-bit accelerometer, a 16-bit gyroscope, and a geomagnetic sensor with a 32-bit ARM Cortex M0+ core. Compared to rivals, BOSCH Sensortec targets a broader range of customer applications with a high precision-sensor and dedicated MCU.
With BOSCH Sensortecâs approach, the MEMS sensor and the ASIC are fabricated separately. Final assembly entails wire bonding of all parts . The BMF055 is shipped in a 5.8x3.2x1.15mm LGA package, a footprint thatâs larger than the competition.
This report features a detailed technology and cost comparison with the leading-edge sensor hub from InvenSense, highlighting the different choices from the two different designers.
More information on that report at http://www.i-micronews.com/reports.html
Sample MEMS Microphone Technology and Patent Infringement Risk AnalysisKnowmade
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The MEMS Microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. According to Yole DĂŠveloppement, the market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing new players. Knowles is the dominant player with 61% market shares in 2013 and 58% in 2014. A decrease is again expected in the next years with new challengers entering the market: STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies and InvenSense(Analog Devices).
The global market share of these 6 players account for more than 80% of MEMS Microphone market in 2014. These players are all developing innovative technical and manufacturing solutions and, in parallel of course, the right patents to protect their inventions.
In a patent infringement action, the potential sales volume plays a major role for assessing the damage award. Thereby, this study is naturally focused on the last MEMS Microphone components supplied by these market leaders and challengers: Knowles (S1157, iPhone 5S/6), ST/OMRON (MP45DT01), AAC/Infineon (SR595, iPhone 5S/6), InvenSense/ADI (ICS-43432).
This raises interesting questions: What are the similarities and the differences in term of technical and manufacturing choices at the devices level? What is the related patent situation? Knowmade and System Plus Consulting are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks
of patent infringement between Knowles, STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies, Analog Devices and InvenSense in the field of MEMS Microphone. As the MEMS Microphone market is growing very fast, it is the right time now to understand what could happen between these companies and how to differentiate patents and claims compared to the other players.
KEY FEATURES OF THE REPORT
⢠Deep insight on technology data and manufacturing processes
⢠Comparative studies of product features
⢠Key patents related to the target product features per company
⢠Cross analysis of potential patent infringement risks
⢠Excel database with all patents analyzed in the report
OBJECTIVES OF THE REPORT
⢠Find the technical and manufacturing process similarities and differences of S1157, MP45DT01, SR595 and ICS-43432 MEMS Microphones.
⢠Identify key patents held by Knowles,STMicroelectronics, OMRON, AAC
Technologies, Infineon Technologies,Analog Devices and InvenSense, and
related to the target product features.
⢠Find the link between patentedtechnological solutions and marketed products.
⢠Discover the potential infringing parties and help to find evidence of use.
⢠Understand potential risks of patent infringement and identify the patents
which require a more in depth legal assessment.
MEMS microphone Patent Infringement April 2015 report published by Yole Devel...Yole Developpement
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MEMS Microphone
Knowles, STMicroelectronics/OMRON, AAC Technologies/Infineon Technologies, InvenSense/Analog Devices
Market growth, challenged leader : patent battle can start
NOW ITâS TIME FOR PATENT BATTLE IN MEMS MICROPHONE BUSINESS
The MEMS Microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. According to Yole DĂŠveloppement, the market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing new players. Knowles is the dominant player with 61% market shares in 2013 and 58% in 2014. A decrease is again expected in the next years with new challengers entering the market: STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies and InvenSense(/ Analog Devices).
The global market share of these 6 players account for more than 80% of MEMS Microphone market in 2014. These players are all developing innovative technical and manufacturing solutions and, in parallel of course, the right patents to protect their inventions.
In a patent infringement action, the potential sales volume plays a major role for assessing the damage award. Thereby, this study is naturally focused on the last MEMS Microphone components supplied by these market leaders and challengers: Knowles (S1157, iPhone 5S/6), ST/OMRON (MP45DT01), AAC/Infineon (SR595, iPhone 5S/6), InvenSense/ADI (ICS-43432).
This raises interesting questions: What are the similarities and the differences in term of technical and manufacturing choices at the devices level? What is the related patent situation? Knowmade (specialized in patent analysis) and System Plus Consulting (specialized in reverse engineering and reverse costing) are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks of patent infringement between Knowles, STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies, Analog Devices and InvenSense in the field of MEMS Microphone. As the MEMS Microphone market is growing very fast, it is the right time now to understand what could happen between these companies and how to differentiate patents and claims compared to the other players.
This report provides an overview of technology data and manufacturing process of S1157, MP45DT01, SR595 and ICS-43432 MEMS Microphone components.
A comparative study of the technology and manufacturing process of these MEMS Microphone components has been performed in order to highlight the technical similarities and differences of the product features.
More information on that report at http://www.i-micronews.com/reports.html
Fairchildâs first consumer IMU manufactured using a completely new bulk micro machining process and interconnection structure.
Fairchild enters the market of combo sensors, and particularly 6-axis IMU, with its first consumer IMU bundled with Fairchild's high-performance 9-axis sensor fusion algorithms, XKF3â˘, and on-chip AttitudeEngine⢠motion processor.
Fairchild is presenting a product completely different than other devices on the market, from size, manufacturing process and cost point of view.
Fairchild proposes a 3.3x3.3x1mm device, a footprint increased by 18% when compared with the latest STMicroelectronics and Bosch 6-axis IMU.
The device presents one ASIC and one MEMS die stacked on 2 layers PCB and connected by wire bonding. The electrical connections in the MEMS structure are performed by TSV which allows a better utilization of the space and a larger gyroscope and accelerometer areas.
On the process side, new techniques has been introduced in the MEMS fabrication. The MEMS die is manufactured by bulk micromachining on three wafers bonded together by eutectic and direct bonding.
The FIS1100 targets wearable sensors for sports, fitness, and health; pedestrian navigation; autonomous robots; and virtual and augmented reality.
The report includes a detailed technology and cost comparison with STâs new generation LSM6DS3 and with leading edge 6-Axis IMUs from Bosch Sensortec (BMI160) and InvenSense (MPU-6500).
The first MEMS IMU (3-Axis Gyro + 3-Axis Accelero on the same die) from Maxim Integrated (Maxim) in industry thinnest 3x3x0.83mm package
With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.
The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.
Assembled in a LGA 3.0x3.0x0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.
The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.
Discover all the details in the report!
Portable, Continuous and Laboratory Instrumentation for monitoring air, water and process streams for a wide range of industrial hygiene, environmental and analytical applications.
Discover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!)
After being integrated in the latest Appleâs iPhone in 2013, Bosch is now the top MEMS supplier according to Yoleâs Top 30 MEMS Ranking 2014. This strong growth is both due to the consumer and automotive businesses of Bosch.
With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS accelerometers. This size reduction has been made possible by the use of Through-Silicon Vias (TSVs) in the ASIC, enabling a WLCSP package. All the manufacturing steps are realized at the wafer-level. This is the first introduction of a MEMS component with TSV Via-Middle process.
The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring extremely small form factors.
The report is including a detailed technical and cost comparison with state of the art MEMS accelerometers from STMicroelectronics and mCube.
Discover all the details in the report: http://www.i-micronews.com/reports/Bosch-Sensortec-BMA355-3-Axis-MEMS-Accelerometer/1/452/
Fingerprint Cardsâ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
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The worldâs first capacitive fingerprint successfully integrated under glass, in collaboration with TPK
Fingerprint Cards AB (FPC), a leader in capacitive fingerprint technology, has over the last year equipped a large number of smartphones worldwide. One of its biggest clients, Huawei, traditionally integrates the latest technology in its flagship model every year. With the integration of the FPC1268 in the Huawei Mate 9 Pro and the Huawei P10 series, FPC has introduced a new kind of capacitive fingerprint integration: one that can be successfully integrated under glass. This technology, developed in collaboration with TPK, aims to be the new low-cost solution for fingerprint scanner integration.
Following the Mate 9 Pro, the Huawei P10 is the latest smartphone to feature the capacitive fingerprint completely hidden behind the cover glass. The sensor is located under the home button in the deviceâs front, under a unique TPK-developed glass cover that allows for new, highly attractive designs like the ultrasonic fingerprint.
Using the same process as FPCâs previous flagship product, the 1025, the integration no longer requires wire bonding but instead a specific TSV designed by an identified OSAT and based on Tesseraâs WLCSP solution. While previously used for CIS integration, this is the first time it has been used for fingerprint. Along with the ASIC, the fingerprint is integrated into an LGA package which is soldered on a flex PCB and covered by TPKâs specially-designed glass.
Thanks to conductive layers, TPKâs solution allows for the precise detection and identification of the fingerprint under glass. Everything is packaged in a metal ring that forms part of the home button.
This report provides a complete analysis of chip fabrication and package processes, along with a cost estimate. Also included is a comparison with FPCâs previous capacitive fingerprint generation, the FPC1025, and Qualcommâs new ultrasonic fingerprint, the Sense ID.
More information on that report at http://www.i-micronews.com/reports.html
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...Yole Developpement
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Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avagoâs power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avagoâs LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Appleâs Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avagoâs Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
More information on that report at http://www.i-micronews.com/reports.html
La Bretagne sur Eurosatory Les 15 entreprises bretonnes qui exposent sur le salon Eurosatory sont reprĂŠsentatives de lâensemble de la filière, tant dans leurs activitĂŠs que dans leur profil. Il sâagit de PME dĂŠveloppant des expertises de pointe dans des domaines variĂŠs tels que, lâĂŠlectronique embarquĂŠe, les systèmes de tĂŠlĂŠcommunications, les ĂŠquipements de sĂŠcuritĂŠ, les matĂŠriaux innovants. Bien que de taille modeste, elles sont pour la plupart prĂŠsentes Ă lâinternational aux cĂ´tĂŠs de leurs clients, donneurs dâordre dâenvergure nationale ou mondiale. Elles se caractĂŠrisent ĂŠgalement par leur engagement dans lâinnovation et la recherche autour de projets Ă vocation duale.
CEPA
DETI
ENAG
GEIM
INPIXAL
INTERFACE CONCEPT
ISDE
PROLANN
QUARTZ PRECISION / KING GONG
SECURE-IC
SENSUP
STACEM
SYRLINKS
TECKNISOLAR
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The Metaverse is popularized in science fiction, and now it is becoming closer to being a part of our daily lives through the use of social media and shopping companies. How can businesses survive in a world where Artificial Intelligence is becoming the present as well as the future of technology, and how does the Metaverse fit into business strategy when futurist ideas are developing into reality at accelerated rates? How do we do this when our data isn't up to scratch? How can we move towards success with our data so we are set up for the Metaverse when it arrives?
How can you help your company evolve, adapt, and succeed using Artificial Intelligence and the Metaverse to stay ahead of the competition? What are the potential issues, complications, and benefits that these technologies could bring to us and our organizations? In this session, Jen Stirrup will explain how to start thinking about these technologies as an organisation.
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Â
Clients donât know what they donât know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clientsâ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
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In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
Elevating Tactical DDD Patterns Through Object CalisthenicsDorra BARTAGUIZ
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After immersing yourself in the blue book and its red counterpart, attending DDD-focused conferences, and applying tactical patterns, you're left with a crucial question: How do I ensure my design is effective? Tactical patterns within Domain-Driven Design (DDD) serve as guiding principles for creating clear and manageable domain models. However, achieving success with these patterns requires additional guidance. Interestingly, we've observed that a set of constraints initially designed for training purposes remarkably aligns with effective pattern implementation, offering a more âmechanicalâ approach. Let's explore together how Object Calisthenics can elevate the design of your tactical DDD patterns, offering concrete help for those venturing into DDD for the first time!
SAP Sapphire 2024 - ASUG301 building better apps with SAP Fiori.pdfPeter Spielvogel
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Building better applications for business users with SAP Fiori.
⢠What is SAP Fiori and why it matters to you
⢠How a better user experience drives measurable business benefits
⢠How to get started with SAP Fiori today
⢠How SAP Fiori elements accelerates application development
⢠How SAP Build Code includes SAP Fiori tools and other generative artificial intelligence capabilities
⢠How SAP Fiori paves the way for using AI in SAP apps
A tale of scale & speed: How the US Navy is enabling software delivery from l...sonjaschweigert1
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Rapid and secure feature delivery is a goal across every application team and every branch of the DoD. The Navyâs DevSecOps platform, Party Barge, has achieved:
- Reduction in onboarding time from 5 weeks to 1 day
- Improved developer experience and productivity through actionable findings and reduction of false positives
- Maintenance of superior security standards and inherent policy enforcement with Authorization to Operate (ATO)
Development teams can ship efficiently and ensure applications are cyber ready for Navy Authorizing Officials (AOs). In this webinar, Sigma Defense and Anchore will give attendees a look behind the scenes and demo secure pipeline automation and security artifacts that speed up application ATO and time to production.
We will cover:
- How to remove silos in DevSecOps
- How to build efficient development pipeline roles and component templates
- How to deliver security artifacts that matter for ATOâs (SBOMs, vulnerability reports, and policy evidence)
- How to streamline operations with automated policy checks on container images
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
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Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...
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9-Axis MEMS IMU Technology and Patent Infringement Risk Analysis published by Yole Developpement
1. 1
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
9-Axis MEMS IMU
Technology and Patent
Infringement Risk Analysis
STMicroelectronics LSM9DS0 / Bosch SensortecBMX055 / InvenSenseMPU-9250
2405 route des Dolines, 06902 Sophia Antipolis, France
Tel: +33 489 89 16 20
Web: http://www.knowmade.com
21 rue La NouĂŤBras de Fer, 44200 Nantes, France
Tel: +33 240 18 09 16
Web: http://www.systemplus.fr
2. 2
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
ďKnowmadehasdevelopedmethodologiestoidentifypatentsrelatedtoproductfeatures.
ďBycombiningtheirtechnicalknowledge,processflowunderstandingandpatentsearch,SystemPlusConsultingandKnowmadeareabletoprovideaclearlinkbetweenpatentsandmarketedproducts.
ďIn-depthanalysisofthelinksbetweentechnologyandpatentsprovidedinthisreportwillleadtounderstandingproductfeaturesandrelatedpatents,andtohighlightthepotentialrisksofpatentinfringement.
A New Type of Report
Reverse Engineering and Process Analysis
Patent Search and Infringement Risk Analysis
Knowmade& System Plus Consulting
New Reports
â˘Teardown & Reverse engineering
â˘Technology and manufacturing analysis
â˘Patent search
â˘Link between technology and patent
â˘Evidence of use
â˘Risks of patent infringement
â˘Full searchable patent database
Forthefirsttime,Knowmade(specializedinpatentanalysis)andSystemPlusConsulting(specializedinreverseengineeringandreversecosting)arejoiningtheiruniqueaddedvalueinordertocombinedtechnologyandmanufacturinganalysiswithpatentclaimsunderstandinginordertohighlighttherisksofpatentinfringement.
3. 3
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
The Authors
â˘HeadquarteredinSophiaAntipolis,France,Knowmadeisspecializedinanalysisofpatentsandscientificresearchfindings.Weprovidepatentsearch,IPlandscape,patentvaluation,IPduediligence,freedom-to-operate,IPcompetitionanalysis,scientificliteraturelandscape,scientificstateoftheart,technologyscouting,technologytransfer,alertsandupdates.Ourserviceofferconsistsofcustomstudies,analysisreports,on-demandtrackingandstrategyconsulting.Knowmadecombinesinformationsearchservices,scientificexpertise,powerfulanalyticsandvisualizationtools,andproprietarymethodologiesforanalyzingpatentsandscientificinformation.WithasolidfocusonMicroelectronics,CompoundSemiconductors,LED,MEMS, NanotechnologyandBiotechnology,Knowmadesupportsresearchlaboratories,industrialcompaniesandinvestorsintheirbusinessdevelopment.
â˘HeadquarteredinNantes,France,SystemPlusConsultingisspecializedintechnologyandcostanalysisofelectroniccomponentsandsystemsinthefieldsofIntegratedCircuits,PowerDevicesandModules,MEMS&Sensors,LED,ImageSensors,Packagingincludingwaferlevel,ElectronicBoardsandSystems.Thecompanyofferscustomreversecostinganalyses, standardreversecostingreportsandcostingtools.TheseanalysesareusedbyPurchasingDepartmentstomeasuretheirsuppliersâcoststructure,R&DDepartmentstoconfirmtechnologicalchoicesdependingontheirimpactoncosts, andBenchmarking/MarketingDepartmentstomonitortheproductsonthemarket.
Disclaimer:KnowmadeandSystemPlusConsultingareresearchfirmsthatprovidetechnicalanalysisandopinions.Theydonotprovideanyinsightanalysesorcounselregardinglegalaspectsorthevalidityofanyindividualpatent.Theresearch,technicalanalysisand/orworkcontainedhereinisnotalegalopinionandshouldnotbeconstruedassuch.
5. 5
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Scope of the Study(1/2)
â˘Thisreportprovidesatechnologyandpatentinfringementriskanalysisofthenewest9-AxisMEMSIMUsuppliedbySTMicroelectronics,BoschSensortecandInvenSense.
â˘Thisreportdoesnotprovidedetailedclaimchartsandlegalopinionsregardingpatentinfringements.Therisksofpatentinfringementhighlightedinthisreportrequiremorein- depthlegalassessmentstobeconfirmed.
STMicroelectronics
LSM9DS0
Bosch Sensortec
BMX055
InvenSense
MPU-9250
The comparative study is focused on following product features
ďźBonding Process: Al-GeEutectic Bonding.
ďźAccelero/Gyro on a Single Chip: Multiple sealed cavities with different pressures.
ďźSensing Area: Gyro Single Structure.
ďźHybrid MEMS: Vertically integrated electronics and wafer-scale hermetic packaging.
ďźMicromachinedlayers: Silicon Nitride as protective layer.
6. 6
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Scope of the Study(2/2)
Motionsensingcombosensorisaveryhottopic,bothintermofmarketpotentialandcompetitionamongtheplayers.Thegrowthoftheapplicationsof6and9degreesoffreedom(DoF)devicesisbothpushingtheleaders(STMicroelectronics,BoschSensortecandInvensense)andtheirchallengers(AKM,Kionix,mCube,Freescale,Alps,KionixâŚjusttonameafew)todevelopinnovativetechnicalandmanufacturingsolutions,and,inparallelofcourse,tohavetherightpatentstoprotecttheirinventions. Butwhatarethesimilaritiesandthedifferencesintermoftechnicalandmanufacturingchoicesatthedeviceslevelandwhatistherelatedpatentsituation?
ThisreporthighlighttherisksofpatentinfringementbetweenSTMicroelectronics,BoschSensortecandInvensenseinthefieldof9axisMEMSinertialmeasurementunits(IMU).Asthe9axisIMUsarejuststartingtobeadoptedbythemarket,itistherighttimenowtounderstandwhatcouldhappenbetweenthese3companiesandhowtodifferentiatepatentsandclaimscomparedtotheleaders.
2012wasseenbymanyasaturnkeyyearforconsumercombosensors(6and9axissensors).Sincethen,manydevelopmentshaveoccurred,andthemarketacceptanceofcombosolutionshasbeenextremelyquick.AccordingtoYoleDĂŠveloppement,thecombosensormarketisestimatedtobe$446Min2013,growingto$1.97Bin2018.Thisrepresents21%oftheglobalinertialconsumermarketin2013,andwillgrowtoanimpressive66%by2018.Inthisplayground,STMicroelectronics,BoschSensortecandInvenSensearethe3marketleadersintheinertialconsumersensorswithmorethan50%ofmarketshare.
Inapatentinfringementaction,thepotentialsalesvolumeplaysamajorroleforassessingthedamageaward.Moreover,thereexistsahistoryofpatentdisputesbetweenthese3leadingplayers.
TheLSM9DS0,BMX055andMPU-9250arethenewest9-axisMEMSIMUfromSTMicroelectronics,BoschSensortecandInvenSenserespectively.Thesedevicescontaina3-axisgyroscope,a3-axisaccelerometeranda3-axismagnetometer.
Thisreportisfocusedonsomeaspectspresentingsimilarfeaturesbetweenthe3selectedproductsandrevealedbythereverseengineeringperformedbySystemPlusConsulting.Theseproductfeaturesaremainlyrelatedtoaccelero/gyrodieandtheyarenotrelatedtothemagnetometerortheASIC.
7. 7
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Key Features of the Report
ďThisreportprovidesadeepinsightontechnologydataandmanufacturingprocesses(teardownanalysis)ofLSM9DS0,BMX055andMPU-92509-axisIMUcomponents,andcomparativestudiesofproductfeatures(similarities&differences).
ďItprovidespatentsrelatedtothetargetproductfeaturesandheldbySTMicroelectronics,BoschSensortecandInvenSense.
ďItprovidesdiscussionsonthepotentialpatentinfringementrisksbycomparingrelevantpatentclaimelementstothetargetproductfeaturesandmanufacturingprocesses.
ďThisreportalsoprovidesanextensiveExceldatabasewithallpatentsanalyzedinthisstudy(60+patentfamiliescomposedof200+patents).Thisdatabaseallowsmulti-criteriasearches:
-Patentpublicationnumber
-Hyperlinkstotheoriginaldocuments
-Prioritydate
-Title
-Abstract
-PatentAssignees
-Legalstatusofthepatent
ďśDisclaimer:Thisreportdoesnotprovideanyinsightanalysesorcounselregardinglegalaspectsorthevalidityofanyindividualpatent.KnowmadeandSystemPlusConsultingareresearchfirmsthatprovidetechnicalanalysisandopinions.Theresearch,technicalanalysisand/orworkcontainedhereinisnotalegalopinionandshouldnotbeconstruedassuch.
8. 8
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Objectives of the Report
â˘ProvideanoverviewoftechnologydataandmanufacturingprocessofLSM9DS0,BMX055andMPU-92509-axisIMUcomponentssuppliedbySTMicroelectronics,BoschSensortecandInvenSenserespectively.
â˘FindthetechnicalandmanufacturingprocesssimilaritiesanddifferencesofLSM9DS0, BMX055andMPU-92509-axisIMUcomponents.
â˘IdentifykeypatentsheldbySTMicroelectronics,BoschSensortecandInvenSense,andrelatedtothetargetproductfeaturesandmanufacturingprocesses.
â˘Findthelinkbetweenpatentedtechnologicalsolutionsandmarketedproducts.
â˘Identifythepotentialinfringingparties,andhelptofindevidenceofuse.
â˘Identify potential risks of patent infringement, and identify the patents which require a more in depth legal assessment.
9. 9
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
â˘Packageisanalyzedandmeasured.
â˘Thediesareextractedinordertogetoveralldata:dimensions,mainblocks,padnumberandpinout,diemarking.
â˘Setupofthemanufacturingprocess.
â˘PatentsareextractedfromQuestel-Orbitworldwidepatentdatabasebyusingkeyword-basedqueries.
â˘Theselectionofrelevantpatentsisdonemanuallybyexpertreviewofthesubject-matterofinventions.
â˘Thepatentsaremanuallycategorizedregardingtheselectedproductfeatures.
â˘Thesimilaritiesanddifferencesoftargetofproductsareidentified(productfeaturesandmanufacturingprocesses).
â˘AsetofproductfeaturesandmanufacturingprocessesisselectedregardingtheirinterestintermsofIPstudy.
â˘Thelinksbetweenthepatentedtechnologiesandthetargetproductfeaturesareestablished.
â˘Thepotentialinfringingpartiesofthetargetproductareidentified,andthepotentialrisksofpatentinfringementsarediscussed.
Methodology
Patent Search
Infringement Risks
Teardown Analysis
Comparative Study
10. 10
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
MEMS Gyro & Accelerometer Structure
COMPANY 1
COMPANY 2
COMPANY 3
Product 1
Product 2
Product 3
11. 11
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
MEMS Gyro & Accelerometer Sensing Area
COMPANY 1
COMPANY 2
COMPANY 3
Product 1
Product 2
Product 3
12. 12
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
MatrixProduct Features/Patent Portfolio
13. 13
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Al-GeBonding
Patent Identification
CompanyX
14. 14
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Al-Ge Bonding
Patent Application Timeline
2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
Note:Thedatacorrespondingtotheyears2012-2014maynotbecompletesinceasignificantnumberofpatentapplicationsfiledduringtheseyearsmightnothavebeenpublishedyet.
Earliestapplication date of the patent family
XXXXXXXXXXXXXX
DEXXXXXXXXXXX
WO, EP (granted), TW
XXXXXXXXXXXX
DEXXXXXXXXXX
DEXXXXXXXXXXX
EP, US
Relevant patent family
Relatedpatent family
USXXXXXX(granted)
WO, EP, KR (granted), CN, US (granted)
XXXXXXXX (granted)
XXXXXXXX(granted)
XXXXXXXX(granted)
XXXXXXXXX(granted)
XXXXXXXXXX
DEXXXXXXXXXXXXX
XXXXXXX(granted)
USXXXXXXXXXX
USXXXXXX(granted)
USXXXXXX(granted)
XXXXXXXXXX (granted)
XXXXXXX(granted)
Knowmade, 2014
CompanyA
CompanyB
15. 15
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Multiple cavities with different pressures
Patent Infringement Risk
15
16. 16
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Multiple cavities with different pressures
Patent Infringement Risk
Product 1
Intellectual Property (IP) rights
highly likely
infringement
Company1
Company2
17. 17
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Multiple cavities with different pressures
Main IP Competitors
18. 18
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Summary of Patent Infringement Risks
Product A
HybridMEMS
(CMOS-MEMS)
SiNprotective layers
(MicromachinedLayers)
Multiple Cavities
(Accelero/Gyro Single Chip)
Multiple Cavities
(Accelero/Gyro Single Chip)
Al-Ge Bonding
(Sealing Process)
GyroSingle Structure
(Sensing Area)
GyroSingle Structure
(Sensing Area)
Al-Ge Bonding
(Sealing Process)
Unlikely
infringement
Likely
infringement
Highly likely
infringement
Potential risk of patent infringement
Knowmade, 2014
CompanyA
Patents A
Product B
CompanyB
Patents B
Product C
CompanyC
Patents C
19. 19
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
Excel Patent Database with all patents analyzed in the report
Morethan60patentfamiliescomposedofmorethan200patents.
Thisdatabaseallowsmulti-criteriasearchesandincludespatentpublicationnumber,hyperlinkstotheoriginaldocuments,prioritydate,title,abstract,patentassignees,legalstatusforeachmemberofthepatentfamily.
20. 20
Copyrights Š KnowMadeSARL and System Plus Consulting SARL. All rights reserved.
PAYMENT
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BANK INFO: HSBC, 1 place de la Bourse,
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Bank code: 30056, Branchcode: 00170
Account No: 0170 200 1565 87,
SWIFT or BIC code: CCFRFRPP,
IBAN: FR76 3005 6001 7001 7020 0156 587
RETURN ORDER BY
⢠FAX: +33 (0)472 83 01 83
⢠MAIL: YOLE DĂVELOPPEMENT, Le Quartz,
75 Cours Emile Zola, 69100 Villeurbanne/Lyon âFrance
SALES CONTACTS
⢠North America: David Jourdan -jourdan@yole.fr
⢠Asia: Takashi Onozawa -onozawa@yole.fr
⢠Europe & RoW: Jean-Christophe Eloy -eloy@yole.fr
⢠Korea: Hailey Yang -yang@yole.fr
⢠General: info@yole.fr
(1) Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
Sept 4, 2014
PRODUCT ORDER
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For price in dollars, please use the dayâs exchange rate. All
reports are delivered electronically in PDF format at payment reception. For French customer, add 20% for VAT.
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Name( Mr/Ms/Dr/Pr): ________________________
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ORDER FORM
9-Axis MEMS IMU (STMicroelectronics, Bosch Sensortec, InvenSense)
Technology and Patent Infringement Risk Analysis
I hereby accept Yole DĂŠveloppementâsTerms and Conditions of Sale(1)
Signature:
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TERMS AND CONDITIONS OF SALES (1/2)
. Definitions: âAcceptanceâ: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is donebysigning the purchase order which mentions âI hereby accept YoleâsTerms and Conditions of Saleâ.
âBuyerâ: Any business user (i.e. any person acting in the course of its business activities, for its business needs) enteringinto the following general conditions to the exclusion of consumers acting in their personal interests.
âContracting Partiesâ or âPartiesâ: The Seller on the one hand and the Buyer on the other hand.
âIntellectual Property Rightsâ (âIPRâ) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights.
âLicenseâ: For the reports and databases, 2 different licenses are proposed. The buyer has to choose one license:
⢠One user license: one person at the company can use the report.
⢠Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included.
⢠Corporate license: purchased under âAnnual Subscriptionâ program, the report can be used by unlimited users within the company. Joint-Ventures are not included.
âProductsâ: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio⌠to be bought either on aunit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronewsand a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.
âSellerâ: Based in Lyon (France headquarters), YoleDĂŠveloppementis a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yoleworks worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
1. Scope
1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller.ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by anyduly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions âI hereby accept YoleâsTerms and Conditions of Saleâ. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from thedate of order, to be sent either by email or to the Buyerâs address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
-within [1] month from the order for Products already released; or
-within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavoursto inform the Buyer of an indicative release date and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via anemail/password. If the Productâs electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. AnyProduct returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyerâs risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yolemay offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by chequepayable to YoleDĂŠveloppement, credit card or by electronic transfer to the following account:
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Account n°: 0170 200 1565 87
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To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of downpayments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refiof the ÂŤBCEÂť + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database,tool...) are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
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TERMS AND CONDITIONS OF SALES (2/2)
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products forits business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Sellerâs website or the Products, or any information provided on the website, or inthe Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller.In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating ordestructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Sellerâs IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
-Information storage and retrieval systems;
-Recordings and re-transmittals over any network (including any local area network);
-Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
-Posting any Product to any other online service (including bulletin boards or the Internet);
-Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of thecompanies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Sellerfor the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for anycompensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employeesand agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.