2015 RM2N Symposium Materials Science Center at UW-Madison
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The document describes several shared facilities at the University of Wisconsin - Madison College of Engineering that provide access to advanced instrumentation. It lists the Wisconsin Center for Applied Microelectronics, Soft Materials Laboratory, and Materials Science Center as the three main shared facilities. Each facility offers a range of instruments for microfabrication, imaging/analysis, and materials characterization that are open for all academic and industrial users to access. Contact information is provided for Jerry Hunter, the director of the shared research facilities.
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2015 RM2N Symposium Materials Science Center at UW-Madison
- 1. 1 UW – Madison College of Engineering Shared Facilities Jerry Hunter, Ph. D. Director of Research User Facilities (608) 263-1073, jerry.hunter@wisc.edu
- 2. 2 Materials Science Center Pictures Shared Instrument Facilities Wisconsin Center for Applied Microelectronics Soft Materials Laboratory Open to all users (industrial, academic, government, institutions, etc.) UW system schools get internal UW- Madison rate
- 3. 3 • Wisconsin Center for Applied Microelectronics – Micro and nano-fabrication facility – 10,000 sq. ft. cleanroom with 60 instruments College of Engineering Shared Facilities • Soft Materials Lab – Polymer characterization laboratory – 10 instruments • Materials Science Center – High end microscopy and microanalysis facility – 30 instruments Director: Jerry Hunter
- 5. 5 Fabrication Toolset • Lithography · Nikon NSR-2005i8A Stepper · Canon PLA-501 Contact Aligner · Suss MA6/BA6 double-sided aligner · Suss MJB-3 Contact Aligner · Suss MJB-3 Contact Aligner (with I.R. backside alignment) · Headway Photoresist Spinners · Solitec HMDS chamber · (3) Scanning Electron Microscopes with Nabity electron beam lithography (see microscopy in characterization section below) • Packaging – WestBond 747677 Wedge Wire Bonder – K+S 4124 Ball Wire Bonder – Karl Suss RA-120 Wafer Scribe – (2) MicroAutomation 1006 Wafer Saw – MEI-720 Die Attacher – Indium Evaporator (die bonding) – YES vacuum oven – Package annealer • Deposition – Ebeam Evaporator (metals) – CVC-601 DC Sputterer (metals) – Denton Discovery 24 Sputterer (RF & DC) – PlasmaTherm 74 PECVD (dielectrics) – Telemark Ebeam Evaporator (dielectrics) – Angstrom Ebeam Evaporator (metals) • Plasma Etch – PlasmaTherm 74 RIE/PECVD (deposition and etch of oxide, nitride on Si) – STS ICP Multiplex (Deep Silicon Etcher) – Unaxis 790 RIE (general purpose) – PlasmaTherm SLR 770 ECR (compound semiconductors) – PlasmaTherm 770 ICP (metals) – PlasmaTherm 790-2 ICP (general purpose) – YES Asher – Samco UV Ozone cleaner – SPTS Xetch E1 XeF2 vapor etch
- 6. 6 Fabrication Toolset • Assembly – EVG Wafer-Wafer Bonder – EVG Wafer-Wafer Bond Aligner – Tousimis Critical Point Dryer – Obducat NIL-25 Nano-imprinter – 400C Oven for polymers – Cooke polyimide vacuum oven • Wet Chemical – (2) General Purpose Wet Benches – HF Wet Bench – Piranha Wet Bench – Metal Etch Wet Bench – Nitride Strip Wet Bench – KOH / TMAH Wet Etch Bench – (3) Solvent Wet Benches – Spin Rinser-dryers • Thermal Processing – 4 stack MRL Phoenix Oxidation Tubes • wet/dry oxides – 4 stack MRL Phoenix Oxidation Tubes • diffusion/anneals – 4 Stack Tystar Furnace • LPCVD Nitride • LPCVD Polysilicon • LTO oxide • Thermal oxide – AG 610 RTA (contact anneal – compound semi) – Pre-furnace clean wet bench • Metrology Equipment – Tencor Flexus 2320 Film Stress Measurement – Rudolph Ellipsometer – Filmetrics Optical Film Thickness – (2)Tencor Alpha Step 200 Profilometers – Wild M420 Stereo Microscope – Several Inspection Microscopes – Wafer mapping four-point probe Dan Christensen Hal Gilles Srdjan MilicicQuinn LeonardHal Gilles Dan Christensen, WCAM manager Felix LuKurt Kupcho
- 7. 7 Imaging and Analysis Toolset Hysitron TriboIndenter Cameca Atom Probe Zeiss Auriga SEM/FIB Bruker D8 Discover XRD Aramis Confocal Raman Leo 1530 FESEM FEI Titan aberration corrected (S)TEM Thermo k-alpha XPS Advanced Rheometric Expansion System
- 8. 8 Imaging and Analysis Toolset • Microscopy – Zeiss Auriga 1540 XB Cross Beam (FIB + SEM) with Nabity electron beam lithography – (2) Leo 1530 SEMs with EDS (1) with EBSD and Nabity electron beam lithography – Leo 1550 VP SEM with EDS and Nabity electron beam lithography – Philips CM200UT TEM – FEI Tecnai 12 TEM – FEI Tecnai TF30 cryo-TEM – FEI Titan aberration corrected (S)TEM – Cameca 3000 X Si Atom Probe Microscope – Bruker MultiMode 8 AFM – Bruker Bioscope Catalyst AFM – Zeiss 510 Confocal microscope • Soft Materials Characterization – Q1000 Modulated Differential Scanning Calorimetry – Q500 Thermo Gravimetric Analysis – ARES LS2 Rheometer – RSA III Dynamic Mechanical Analyzer – Viscotek GPCmax Gel Permeation Chromatograph – Waters Gel Permeation Chromatograph – OCA 15/20 Contact Angle measurement tool – (2) Rudolph Auto EIII Ellipsometers – Thermo Scientific DXRxi Raman Imaging Microscope – Zetasizer Nano ZSP with Multi Purpose Titrator MPT-2
- 9. 9 Imaging and Analysis Toolset • Spectroscopy – Thermo K-Alpha XPS – Physical Electronics Phi 670 Scanning Auger – Zygo 6300 White light profilometer – Horiba Aramis Confocal MicroRaman – Horiba fluorolog spectrofluorometer – Nicolet NicPlan IR Microscope with Nicolet Magna 550 Fourier Transform Infrared spectrometer – PE spectrum 19 – UV/VIS/NIR spectrometer • Mechanical Test – Hysitron TI 950 TriboIndenter Nanoindenter – Hysitron PI 95 in-situ TEM Picoindenter • X-ray Analysis – Rigaku Small Angle X-ray scattering – STOE X-ray powder diffractometer – Bruker D8 Discover – XRD – Panalytical X’Pert Pro MRD -- XRD • Sample Preparation – Leica EM UC7 Cryo Ultramicrotome – FEI Vitrobot cryo vitrifier – Fischione 1040 NanoMill – Fischione 1050 TEM Mill – Fischione 1010 Low Angle Ion Mill Rick Noll, SEM & FIB Manager Julie Last, SPM & light microscopy Manager John Jacobs, Surface Science Manager Don Savage, X-Ray systems manager Alex Kvit, TEM Manager Anna Kiyanova SML manager Mike Efremov SML
- 10. 9 Imaging and Analysis Toolset • Spectroscopy – Thermo K-Alpha XPS – Physical Electronics Phi 670 Scanning Auger – Zygo 6300 White light profilometer – Horiba Aramis Confocal MicroRaman – Horiba fluorolog spectrofluorometer – Nicolet NicPlan IR Microscope with Nicolet Magna 550 Fourier Transform Infrared spectrometer – PE spectrum 19 – UV/VIS/NIR spectrometer • Mechanical Test – Hysitron TI 950 TriboIndenter Nanoindenter – Hysitron PI 95 in-situ TEM Picoindenter • X-ray Analysis – Rigaku Small Angle X-ray scattering – STOE X-ray powder diffractometer – Bruker D8 Discover – XRD – Panalytical X’Pert Pro MRD -- XRD • Sample Preparation – Leica EM UC7 Cryo Ultramicrotome – FEI Vitrobot cryo vitrifier – Fischione 1040 NanoMill – Fischione 1050 TEM Mill – Fischione 1010 Low Angle Ion Mill Rick Noll, SEM & FIB Manager Julie Last, SPM & light microscopy Manager John Jacobs, Surface Science Manager Don Savage, X-Ray systems manager Alex Kvit, TEM Manager Anna Kiyanova SML manager Mike Efremov SML