2013 IEEE CPMT IMPACT Conference Agenda (Oral Presentation)

1. Plenary Speech Special Session IAAC
Packaging Session PCB Session Poster Session
Day 1－October 22 (Tuesday)
13:30‐17:30 IAAC 2013 Opening & Meeting
Day 2－October 23 (Wednesday)
ROOM R 504 a+b+c
10:00‐10:20 Opening of IMPACT 2013
10:20‐11:10 Ricky Lee, President of the IEEE‐CPMT Board, HK
Topic: From MOOREfication to LEDification
11:10‐12:00 Dyi Chung Hu, Senior Vice President of Unimicron, Taiwan
Topic: The Challenges of IC Substrate in 3D Era
12:00‐13:30 Lunch & ALC Committee Meeting
13:30‐15:30 Panel Discussion‐ Sustainable Manufacture
Topic: Designing Electronic Products for Sustainable Manufacture
Chair: Dr. Charles E. Bauer & Dr. Shen‐Li Fu
15:30‐15:45 Poster Session (PCB) / Coffee Break
ROOM ROOM 504 a ROOM 504 b ROOM 503 ROOM 501
Session
【1】Advanced
Packaging (SPIL)
【2】IAAC‐ Global Business
Council
【3】Advanced Packaging I 【4】Advanced and
Emerging Technology
15:45‐16:15 Invited: EU153‐1
Andreas Ostmann(Fraunhofer)
Invited: US123‐1
Qiang Gao (Mflex)
16:15‐16:30 1 AS032‐1 1 TW085‐1
16:30‐16:45 2 EU083‐1 2 AS052‐1
16:45‐17:00 3 TW034‐1 3 TW145‐1
17:00‐17:15 4 TW064‐3 4 AS050‐1
17:15‐17:30 5 TW086‐1 5 TW087‐1
17:30‐17:45 6 TW124‐1 6 TW041‐1
17:45‐18:00 7 TW120‐1 7 TW122‐1
18:00‐20:00 TPCA Show & IMPACT‐IAAC 2013 Joint Reception & Award Ceremony (3F)
Day 3－October 24 (Thursday)
ROOM R504 b+c
09:30‐10:20 Yasumitsu Orii, Senior Manager of IBM Japan, JP
Topic: Next Generation Computer System for the Era of Big Data
ROOM ROOM 504 a ROOM 504 b ROOM 503 ROOM 501 ROOM 502
Session
【5】ICEP Japan Session 【6】3D Integration I 【7】Thermal Management I 【8】Modeling,
Simulation & Design I
【9】Green Materials &
Process
10:30‐11:00 Invited: AS082‐1
Chuan Seng TAN (NTU)
Invited: AS150‐1
Masaru Ishizuka (TPU)
Invited: US114‐1
Hong Shi (Altera)
Invited:
(BSEF)
11:00‐11:15 1 AS081‐1 1 TW141‐1 1 TW146‐1 1 TW023‐1
11:15‐11:30 2 TW028‐1 2 AS093‐1 2 TW135‐1 2 TW072‐1
11:30‐11:45 3 EU001‐1 3 TW099‐1 3 TW133‐1 3 AS020‐1
11:45‐12:00 4 TW030‐1 4 TW138‐1 4 TW038‐1 4 TW142‐1
12:00‐12:15 5 TW105‐1 5 TW074‐1 5 TW053‐1 5 TW098‐1
12:15‐12:30 6 TW049‐1 6 TW022‐1 6 TW137‐1 6 AS021‐1
12:30‐13:30 Lunch
ROOM R 504 b+c
13:30‐14:20 K.W.Paik, Professor of Materials Sci. & Eng., KAIST, KR
Topic: Recent Advances in Anisotropic Conductive Technology: Materials & Processing
ROOM ROOM 504 a ROOM 504 b ROOM 503 ROOM 501 ROOM 502
Session
【10】3D IC Forum 【11】Advanced Packaging
II
【12】Interconnections &
Nanotechnology
【13】Modeling,
Simulation & Design II
【14】Test & Quality
14:30‐15:00 Invited:
Michitaka Kimura
(Renesas)
Invited: US010‐1
Ning‐Cheng Lee (Indium)
Invited:
Chris Bailey (Greenwich)
Invited: TBD
15:00‐15:15 1 AS058‐1 1 AS008‐1 1 TW003‐1 1 TW025‐1
15:15‐15:30 2 TW064‐2 2 TW152‐1 2 TW056‐2 2 AS013‐1
15:30‐15:45 3 TW148‐1 3 TW014‐1 3 TW141‐2 3 TW091‐1
15:45‐16:00 Poster Session (Packaging) / Coffee Break
16:00‐16:15 4 TW036‐1 4 TW045‐1 4 TW141‐3 4 AS070‐1
16:15‐16:30 5 TW109‐1 5 TW132‐2 5 TW060‐1 5 TW151‐1
16:30‐16:45 6 TW089‐1 6 TW067‐1 6 TW088‐2 6 TW057‐1
16:45‐17:00 7 TW118‐1 7 TW127‐1 7 TW080‐1 7 TW055‐1
17:00‐17:15 8 TW119‐1 8 TW124‐2 8 TW092‐1 8 AS012‐1
17:15‐17:30 9 TW039‐1 9 TW047‐1 9 TW088‐1 9 TW136‐1
Day 4－October 25 (Friday)
ROOM R504 b+c
09:30‐10:20 Hamid R. Azimi, Director, Substrate & Die Embedding Technology Dept. of Intel, USA
Topic: Enabling Continuum Computing Thru Innovation in Packaging Substrate & Assembly
ROOM ROOM 504 a ROOM 504 b ROOM 503 ROOM 501 ROOM 502
Session 【15】iNEMI Reliability
Session
【16】3D Integration II 【17】LED & Thermal
Management
【18】Modeling,
Simulation & Design III
【19】HDI & Embedded
10:30‐11:00 Invited: TW064‐1
Vincent Wei (THEIL)
Invited:
Chien‐Yuh Yang (NCU)
Invited: TW029‐1
Charlie Lu (Altera)
Invited: US113‐1
Yung‐Yu Hsu (MC10)
11:00‐11:15 1 EU094‐1 1 EU156‐1 1 TW104‐1 1 US046‐1
11:15‐11:30 2 TW139‐1 2 AS101‐1 2 AS131‐1 2 US155‐1
11:30‐11:45 3 TW090‐1 3 TW004‐1 3 TW149‐1 3 TW033‐1
11:45‐12:00 4 TW108‐1 4 TW065‐1 4 TW048‐1 4 TW024‐1
12:00‐12:15 5 TW090‐2 5 TW132‐1 5 TW018‐1 5 TW157‐1
12:30‐13:30 Lunch / Closing Ceremony / Paper Award / Lucky Draw
12:30‐18:30 Plant Visit & Culture Tour (Only for Overseas Attendees)
(2013‐8‐6)

2. IMPACT-IAAC 2013
Type Date Session Paper Code Paper Title Author
Invited 23-Oct Session 3 EU153-1
A New Generation of Power Packaging Using
Embedding of Active Chip
AndreasOstmann
Oral 23-Oct Session 3 AS032-1
The Challenges of Power Rails Merger Option in a
Power Distribution Network Design
LI WERNCHEW
Oral 23-Oct Session 3 EU083-1
Non-Etching Adhesion Promoter for Dry Film for
Semi-additive Manufacturing – Advanced Dry Film
RamiHaidar
Oral 23-Oct Session 3 TW034-1 Heat-Resistance Study of Thermal Release Tape Chieh-YuanChi
Oral 23-Oct Session 3 TW064-3
A Miniature Crystal Package of Using DPC
Technology
VincentWei
Oral 23-Oct Session 3 TW086-1
ELECTROPLATING OF 111-ORIENTED NICKEL
USING 111-ORIENTATED NANO-TWINNED
Yi-ChengChu
Oral 23-Oct Session 3 TW124-1
Phase Evolution and Nanomechanical Properties of
Intermetallic Compounds in Solid-Liquid
Tsung-YunPai
Oral 23-Oct Session 3 TW120-1
Fabrication of nearly void-free Cu3Sn with
nanotwinned Cu in microbumps for 3D IC packaging
Wei-LanChiu
Invited 23-Oct Session 4 US123-1
FPC deformation and its implications for the high
frequency applications
Qiang Gao
Oral 23-Oct Session 4 TW085-1
On the Mechanical Behaviors of ACF-typed Ultra-
Thin-Chip-On-Flex Interconnect Technology Under
Chien-HaoMa
Oral 23-Oct Session 4 AS052-1 A Novel and Green Electroless Copper AndyChow
Oral 23-Oct Session 4 TW145-1
Study of Interfacial Reactions between Cu Substrate
and Lead-Free Solder with Low Solder Volume for
Ting-LiYang
Th E l ti f i ld bilit ti
Oral 23-Oct Session 4 AS050-1
The Evolution of organic solderability preservative
process in printed circuit board application
Kti HoTong
Oral 23-Oct Session 4 TW087-1
A NOVEL THROUGH-HOLE FILLING
TECHNOLOGY FOR NEXT GENERATION
Tao-ChiLiu
Oral 23-Oct Session 4 TW041-1
Cu Electroless Deposition by using Cu Nanoparticles
as Catalysts for a Printed Circuit Board Metallization
Yi-ChunChung
Oral 23-Oct Session 4 TW122-1
Reactive Wetting of Molten Ga solder on Poly-
crystalline, Single-crystalline and Pt-coated Cu
Yi-kaiKuo
Invited 24-Oct Session 6 AS082-1
Application of Low-k Dielectric as Liner in Cu-TSV
for Stress and Capacitance Control
Chuan SengTan
Oral 24-Oct Session 6 AS081-1
300 mm Wafer 3D Integration Technology using
Hybrid Wafer Bonding
KazuyukiHozawa
Oral 24-Oct Session 6 TW028-1
Effects of Overlaying Dielectric Layer and Its Local
Geometry on TSV-Induced KOZ in 3D IC
PuShanHuang
Oral 24-Oct Session 6 EU001-1
Thin Wafer Handling and Chip to Wafer Stacking
Technologies
Pauzenberger
Günter
Oral 24-Oct Session 6 TW030-1
Determination of the Equivalent Thermal
Conductivities of a Through Glass Via TGV Structure
Heng_ChiehChien
Oral 24-Oct Session 6 TW105-1
Intermetallic Compound Growth Behavior during
Multiple Reflows of Ni/SnAg/Ni and Cu/SnAg/Ni
Yuan-weiChang
Oral 24-Oct Session 6 TW049-1
The 3-D Parallel Processor applied to Matrix
Inversion
KarlCheng
Invited 24-Oct Session 7
Application of Heat Transfer Enhanced Fins in
Electronic Devices Cooling Systems
Chien-Yuh Yang
Oral 24-Oct Session 7 TW141-1
Thermal Characterization Improvement for High
Power Package on Package PoP
TingSu
(2013-7-31 v)

3. IMPACT-IAAC 2013
Type Date Session Paper Code Paper Title Author
Oral 24-Oct Session 7 AS093-1
Thermal Design Method of Printed Circuit Board with
Measured Effective Thermal Conductivity
DaijiKondo
Oral 24-Oct Session 7 TW099-1
Thermal Radiation Material for Electronic Devices
Applications
ShaYi-An
Oral 24-Oct Session 7 TW138-1
Microchannel Cold Plate for IGBT Power Electronics
Cooling
Jen-HauCheng
Oral 24-Oct Session 7 TW074-1
Interfacial Reactions in the Cu/In/Ni Sandwich
Couples at 280 °C
Yu-HsiangWang
Oral 24-Oct Session 7 TW022-1
The application of thermoelectric generator on cement
furnace
HsuCheng-Ting
Invited 24-Oct Session 8 US114-1
Packaging Technology and Design Enablement for
56Gbps Line Rate and 1Tb Data Path Markets
HongShi
Oral 24-Oct Session 8 TW146-1
Signal Enabler in High-speed System Design by
Using Hybrid Printed Circuit Board
ThonasSu
Oral 24-Oct Session 8 TW135-1
Analysis of LED Wire Bonding Process Using
Arbitrary Lagrangian-Eulerian and Explicit Time
Kuo-NingChiang
Oral 24-Oct Session 8 TW133-1
Analytical Deion of the Thermomechanical Stresses
around a Through-Silicon Copper Via
Sheng-TsaiWu
Oral 24-Oct Session 8 TW038-1
A Novel Decoupling Capacitor for Power Integrity
Application in High-Speed 3D-IC Package System
RobertSung
Oral 24-Oct Session 8 TW053-1
A New Detection Method for the Onset of PCB Pad
Cratering
GraverChang
Oral 24-Oct Session 8 TW137-1
Transition Behavior in Large Deflection of
Elastically-Bossed Unsymmetrically Layered Plate
Chun-FuChen
R li bilit E l ti ENEPIG Ult thi NiP d
Oral 24-Oct Session 9 TW023-1
Reliability Evaluation on ENEPIG, Ultrathin NiP, and
EPIG Surface Finishes in Soldering Applications
Shih-JuWang
Oral 24-Oct Session 9 TW072-1
Effective retardation of Sn-58Bi/Cu interfacial
reactions with minor Ga addition
Trong LanNguyen
Oral 24-Oct Session 9 AS020-1
An efficient rough vacuum chlorinated separation
method for recovery of indium from waste liquid
EnMa
Oral 23-Oct Session 9 TW142-1
High Frequency Substrate Materials with Highly
Thermal Resistance and Low Dielectric Properties
Feng-PoTseng
Oral 23-Oct Session 9 TW098-1
A SIMPLE PRINTABLE ETCHANT
FORMULATION FOR ETCHING
Shin-ShinWang
Oral 24-Oct Session 9 AS021-1
Powder Size Effect on Thermal Fatigue Property of
Sn-3.0Ag-0.5Cu Solder Joints in High Density LED
XinxinWang
Invited 24-Oct Session 11
Advanced packaging and high-data transmission
technology for “Smart Society＂
Michitaka Kimura
Oral 24-Oct Session 11 AS058-1
Analysis of Stress Buffer Effect of Polyimide for
Board Level Drop Test by a Finite Element Analysis
NobuhiroAnzai
Oral 24-Oct Session 11 TW064-2
Stress-Reduced Thick Copper Ceramic Substrate for
High Power Module Applications
VincentWei
Oral 24-Oct Session 11 TW148-1
The First MIT 600 V / 450 A IGBT Power Module
For EV / HEV Application
Tao-ChihChang
Oral 24-Oct Session 11 TW036-1
Grain Refinement of Solder Materials by Minor
Element Addition
Cheng KaiChung
Oral 24-Oct Session 11 TW109-1
EFFECTIVE 3DIC CHIP MODULE WARPAGE
WITH UF DESIGN BY ANALYTICAL METHOD
LIPAI YUAN
Oral 24-Oct Session 11 TW089-1
An Innovative Packaging Process for Low Power
Loss Solar Modules
HsinHsinHsieh
(2013-7-31 v)

4. IMPACT-IAAC 2013
Type Date Session Paper Code Paper Title Author
Oral 24-Oct Session 11 TW118-1
Effect of Ag Concentration on Ni-Sn Interfacial
Reaction for Micro joints
Jen-JuiYu
Oral 24-Oct Session 11 TW119-1
Necking of low-bump-height solder induced by
reactive wetting of solder on Au finishes in print
Chih ChiaHu
Oral 24-Oct Session 11 TW039-1
Periodic Pulse Reverse Cu Electroplating for Through
Hole Filling
Fang-YuShen
Invited 24-Oct Session 12 US010-1
A Novel Epoxy Flux On Solder Paste For High
Reliability POP Assembly
Ning-ChengLee
Oral 24-Oct Session 12 AS008-1
Effects of Wire Type and Mold Compound on
Wearout Reliability of Semiconductor Flash Fineline
GanChong Leong
Oral 24-Oct Session 12 TW152-1
High Performance Ag-Pd Alloy Bonding Wires for IC
and LED Packages
Hsing-HuaTSAI
Oral 24-Oct Session 12 TW014-1
An Efficient Evaluation Method for Packaging
Interconnection
CHIA YENLEE
Oral 24-Oct Session 12 TW045-1
Wet Processes for Glass Surface Metallization and Cu
Filling Through Glass Vias TGVs
Shao-PingShen
Oral 24-Oct Session 12 TW132-2
An Investigation on Nanoscale Bondability between
Cu-Al Intermetallic Compound
HSIANG-CHEN
HSU
Oral 24-Oct Session 12 TW067-1 A novel Ga-based TSV Interconnection with Pt UBM Hao-miaoChang
Oral 24-Oct Session 12 TW127-1
Electro-Thermal-Mechanical Modeling of Wire
Bonding Failures in IGBT
Huang-KangTseng
Oral 24-Oct Session 12 TW124-2
Chemical and Thermal Reductions of Carboxylate-
Protected Nanoparticle-based Ag Conductive Films
Tsung-YunPai
THERMOMIGRATION IN MICRO BUMPS OF
Oral 24-Oct Session 12 TW047-1
THERMOMIGRATION IN MICRO-BUMPS OF
THREE-DIMENSIONAL INTEGRATED CIRCUIT
Wei-NengHsu
Invited 24-Oct Session 13 Chris Bailey
Oral 24-Oct Session 13 TW003-1
Simulations and Characterizations for Stress
Reduction Designs in Wafer Level Chip Scale
Ming-CheHsieh
Oral 24-Oct Session 13 TW056-2
The Reliability Performance of Copper Wire Bonding
BGA Package by Way of HAST Methodology
DemLee
Oral 24-Oct Session 13 TW141-2 Investigation of Thin Package Warpage TingSu
Oral 24-Oct Session 13 TW141-3
Electrical Performance Study for High Speed Memory
Products
TingSu
Oral 24-Oct Session 13 TW060-1
IC-Package Co-design by Computational
Thermographics
Jui-HungChien
Oral 24-Oct Session 13 TW088-2
Simulation for Film Structure Impact Strength
Evaluation
Chih-MingShen
Oral 24-Oct Session 13 TW080-1
Design optimization for wafer level package
reliability by using artificial neural network
Po ChenLai
Oral 24-Oct Session 13 TW092-1
An Efficient and Effective Simulation Approach for
Solder Joint Reliability Prediction of Through-
LinSheng-Chuen
Oral 24-Oct Session 13 TW088-1
A New Edge Strength Evaluation Method and
Apparatus for Flexible Brittle Material
Chih-MingShen
Oral 24-Oct Session 14 TW025-1 Unusual IMC Growth in 3D-IC Solder Joints Cheng-EnHo
Oral 24-Oct Session 14 AS013-1
Joule Heating Effects on the Formation of
Thermomechanical Fatigue Cracks
YongZuo
(2013-7-31 v)

5. IMPACT-IAAC 2013
Type Date Session Paper Code Paper Title Author
Oral 24-Oct Session 14 TW091-1
Temperature-dependent failure mechanism of SnAg
solder joints with Cu under-bump-metallization after
Chung KuangLin
Oral 24-Oct Session 14 AS070-1
Remotely-Controlled Tensile Test of Copper-Cored
Lead-Free Solder Joint in Liquid Using Permanent
NaoyaTada
Oral 24-Oct Session 14 TW151-1
The Effect of Current Stressing on Grain Growth Tin
and Orientation
Yu-LungLin
Oral 24-Oct Session 14 TW057-1
Inhibition of Whisker Formation by Forming Uniform
Intermetallic Layer
Han-wenLin
Oral 24-Oct Session 14 TW055-1
Effect of grain orientations of Cu seed layers on the
growth of 111-oriented nanotwinned Cu
Chien-MinLiu
Oral 24-Oct Session 14 AS012-1
The Growth Behaviors of Whisker in Eutectic SnBi
Solder under High Temperature Isothermal Aging
SihanLiu
Oral 24-Oct Session 14 TW136-1
Investigation of the Characteristics and Impact
Energy of the Pneumatic Hammers Used in Highly
ChenYeong-Shu
Invited 25-Oct Session 16 TW064-1
Through-Ceramic Vias TCVs Interposer of Using
Direct Plated Copper Technology for 2.5DIC
VincentWei
Oral 24-Oct Session 16 EU094-1
FABRICATION, ELECTRICAL
CHARACTERIZATION AND RELIABILITY
PRADEEPDIXIT
Oral 24-Oct Session 16 TW139-1 Investigation of the process for Glass interposer Ching-KuanLee
Oral 24-Oct Session 16 TW090-1 Wafer Bonding Type Selection for 3D IC Designs Shih-HsuHuang
Oral 24-Oct Session 16 TW108-1
Strength Evaluation of Thin 3D-TSV Memory Chips
by Pin-on-Elastic-Foundation Test
PuShanHuang
T t Ri Mi i i ti th h Si lt
Oral 24-Oct Session 16 TW090-2
Temperature Rise Minimization through Simultaneous
Layer Assignment and Thermal Through-Silicon-Via
Shih-HsuHuang
Invited 25-Oct Session 17 TW029-1 Review on Silver Wire Bonding CharlieLu
Oral 24-Oct Session 17 EU156-1
Electro-Optical PCBs for Optical Interconnects in
Data Centers
MarikaImmonen
Oral 24-Oct Session 17 AS101-1
Analysis of Hot Spot Temperature in Power Si
MOSFET with Electro- thermal Analysis
RisakoKibushi
Oral 24-Oct Session 17 TW004-1
The Analysis of the Thermal Resistance Structure of
LEDs by Measuring Its Transient Temperature
Wei-KengLin
Oral 24-Oct Session 17 TW065-1
Implement of a Silicon-based LED Packaging Module
with Temperature Sensor
ChingfuTsou
Oral 24-Oct Session 17 TW132-1
Thermal Design for High Power Arrayed LED Heat-
Dissipating System
HSIANG-CHEN
HSU
Invited 25-Oct Session 18 AS150-1
A THERMAL DESIGN APPROACH FOR
NATURAL AIR COOLED ELECTRONIC
MasaruIshizuka
Oral 24-Oct Session 18 TW104-1 Finite Element Analysis for Shear Test of ubumps Hung-AnTeng
Oral 24-Oct Session 18 AS131-1
Fatigue strength around through hole in printed circuit
board
TakahiroKinoshita
Oral 24-Oct Session 18 TW149-1
On the Non-Polarity Effects of the Bi/Ni Interfaces
under Current Stressing
LiuYu-chen 
Oral 24-Oct Session 18 TW048-1
Three Dimensional Compression Molding Simulation
for Wafer Level Packaging
Chih-ChungHsu
Oral 24-Oct Session 18 TW018-1 Thermal and Thermo-Mechanical Simulations on Ben-JeLwo
(2013-7-31 v)

6. IMPACT-IAAC 2013
Type Date Session Paper Code Paper Title Author
Invited 25-Oct Session 19 US113-1
Multi-island platform for realization of wearable
electronics
Yung-YuHsu
Oral 25-Oct Session 19 US046-1
Integrated Metallization System for High Density
Interconnects and Modified Semi Additive processing
KeshengFeng
Oral 25-Oct Session 19 US155-1
Striking the Balance – Driving Increased Density
and Cost Reduction in Printed Circuit Board Designs
GaryLong
Oral 25-Oct Session 19 TW033-1
A Novel Cu Plating Formula for Filling Through
Holes
Jhih-JyunYan
Oral 25-Oct Session 19 TW024-1
Investigation of Through Hole Filling by Electrolytic
Cu Deposition Using Electron Backscatter
Hsin-HuiHua
Oral 25-Oct Session 19 TW157-1
Advanced Thin Copper Electroplating Process for
HDI Microvia Filling Application
Ming-YaoYen
Poster 23-Oct 15:30-15:45 AS002-1
Properties and interfacial microstructure of Sn-Zn-Ga
solder joint with rare earth Pr addition
YeHuan
Poster 23-Oct 15:30-15:45 AS016-1
Study on properties of Sn–9Zn–Ga solder bearing
Nd
XuePeng
Poster 23-Oct 15:30-15:45 AS054-1
Research of Carbon Conductive Treatment Direct
Plating Technology on PCB
ShiyouYu
Poster 23-Oct 15:30-15:45 TW100-1
Power density effect on the microstructures and
thermoelectric properties of p-type Bi-Sb-Te
ChenTai-Sheng
Poster 23-Oct 15:30-15:45 AS117-1
Design and Reliability Analysis of Voltage Reference
Circuit in 180 nm CMOS Process
YasuhiroTakahashi
Poster 23-Oct 15:30-15:45 TW015-1
A flame-retardant CCL composite made of
mCOC/glass/CNE with low dielectricity
LinYung-Tan
THE FAILURE INVESTIGATION OF THE
Poster 23-Oct 15:30-15:45 TW027-1
THE FAILURE INVESTIGATION OF THE
POLYMER BALL INTERCONNECT UNDER
Cheng-ChihChen
Poster 23-Oct 15:30-15:45 TW056-1
The Methodology to Monitor Gaseous Contamination
in Data Centers
DemLee
Poster 23-Oct 15:30-15:45 TW059-1
Anisotropic grain growth and crack propagation in
eutectic microstructure under cyclic temperature
Yu-ChunLiang
Poster 23-Oct 15:30-15:45 TW063-1 When “Signal＂ meets “Temperature＂ AlbertChen
Poster 23-Oct 15:30-15:45 TW129-1
Responses of the Environmental Stress Screening
System Activated by Different Combination of
Le HongChuong
Poster 23-Oct 15:30-15:45 TW103-1
PROCESS FEASIBILITY OF A NOVEL
DIELECTRIC MATERIAL IN A CHIP
Yu-weiHuang
Poster 23-Oct 15:30-15:45 AS026-1
Comparison of PEG6000 and EPE2900 as
suppressors in copper electroplating bath for microvia
NingXiao
Poster 23-Oct 15:30-15:45 AS037-1
Direct Deposition of Protective Ni Films on Cu
Circuits by Replacement Reaction
DongTian
Poster 23-Oct 15:30-15:45 AS043-1
Effect of Thiosulfate in Non-Cyanide Electroless
Gold Plating from the Sulfite
BingLi
Poster 23-Oct 15:30-15:45 EU112-1
Advanced Via Filling for improved Within-Unit
Distribution
HenningHuebner
Poster 23-Oct 15:30-15:45 TW140-1 Electroless Nickel deposition on the hybrid polyimide Yi-LingLo
Poster 23-Oct 15:30-15:45 US154-1
A High Reliability, Stress-Free Electroless Copper
Process for FPC, Polyimide and Rigid-Flex
WilliamBowerman
Poster 23-Oct 15:30-15:45 AS017-1
Study on Mussel-inspired Chemical Deposition of
Silver on the Surface of Polyimide Film for FPC
YanqingWang
(2013-7-31 v)

7. IMPACT-IAAC 2013
Type Date Session Paper Code Paper Title Author
Poster 23-Oct 15:30-15:45 AS017-2
Study on Mussel-Inspired Deposition of Copper on
the Surface and Hole of FR-4 Epoxy Glass Fiber
YanqingWang
Poster 23-Oct 15:30-15:45 TW005-1
OPTICALLY-INDUCED DIELECTROPHORETIC
TECHNOLOGY FOR PARTICLES
ChenHsiu-Hsiang
Poster 23-Oct 15:30-15:45 TW096-1
Investigation of Interfacial Reactions in the Sn/Fe-xNi
Couple
Yi- ShanLi
Poster 23-Oct 15:30-15:45 TW111-1
The Investigation of the Inkjet Printing Metallization
Technology on Flexible Substrate
Yan-YuNian
Poster 23-Oct 15:30-15:45 TW116-1
The Inkjet Printing of Catalyst Pd Ink for Selective
Metallization Apply to Product Antenna on PC/ABS
Po-ChiangWang
Poster 23-Oct 15:30-15:45 TW128-1
Surface Clean of Readily Oxidized Metals for
Interconnections with Organic Acid Vapor
Shang-KunHuang
Poster 24-Oct 15:45-16:00 TW011-1 WiFi SiP Module Using IPD Rx Balun Applications Hin-HanChuang
Poster 24-Oct 15:45-16:00 TW084-1
Cu Pillar Bump-on-Trace BoT Design for Ultra Low-
K Packaging
HaroldWu
Poster 24-Oct 15:45-16:00 TW097-1
TSV-less BSI-CIS Wafer-Level Package and Stacked
CIS Module
Zhi-ChengHsiao
Poster 24-Oct 15:45-16:00 TW102-1
Reflow Heat Source Impact on IMC formation of
micro bump interconnection for 3D package
Yi-ChianLiao
Poster 24-Oct 15:45-16:00 TW107-1
NDERFILL ADHESION ENHANCEMENT VIA
OPTIMIZATION OF PLASMA TREATMENT FOR
Chi TungYeh
Poster 24-Oct 15:45-16:00 TW066-1
Interfacial reacions between pure tin and electroplated
copper substrates fabricated using different formulas
WuJe-Yi
F ti f lt ti i t f i l l i th A
Poster 24-Oct 15:45-16:00 TW075-1
Formation of alternating interfacial layers in the Au-
12Ge/Ni joints
Ming-yuehTsai
Poster 24-Oct 15:45-16:00 TW143-1 Warpage study of power module WeiLi
Poster 24-Oct 15:45-16:00 TW031-1
Novel Assembly Framework of Bi-Layered Molding
Materials for 3D-ICs Packaging
LeeChang-Chun
Poster 24-Oct 15:45-16:00 TW040-1
Low Consumption of a Novel Accelerator in Cu
Electroplating Applied for Through Silicon Vias
Wan-YunHsiung
Poster 24-Oct 15:45-16:00 TW106-1
Effect of different SnAg thickness on interfacial
reactions in microbumps of Ni/SnAg/Cu
Yi SaHuang
Poster 24-Oct 15:45-16:00 EU156-2
Optical Backplane Demonstrator with 10Gbps Video
Transmission Link on Printed Circuit Board Using
Qian Xia
Poster 24-Oct 15:45-16:00 AS130-1
Precise intermetallic compound identification at the
interface between eutectic SnIn solder and Cu
Zhi-QuanLiu
Poster 24-Oct 15:45-16:00 TW035-1 Thermomigration of Ag in Pb-free SnAg solder joints MulaineShih
Poster 24-Oct 15:45-16:00 TW061-1
CU WIRE HAST FAIL MECHANISM
INVESTIGATION FOR BGA PACKAGE
Chih HungChang
Poster 24-Oct 15:45-16:00 TW068-1
Development of Automotive Products by using Cu
wire bonding on Active Pad Structure for ABCD
Hsin-EnCheng
Poster 24-Oct 15:45-16:00 TW077-1
Interfacial reaction in Cu/Pb-free solders/Co couples
during reflowing process
Shen ChangLee
Poster 24-Oct 15:45-16:00 TW095-1
Effect of Cu layer microstructures on Sn whisker
formation
IDiyatmika
Poster 24-Oct 15:45-16:00 TW125-1
Study of Microstructures and Peeling Test of Inner
Lead Bonding Joints
Chih-FanLin
(2013-7-31 v)

8. IMPACT-IAAC 2013
Type Date Session Paper Code Paper Title Author
Poster 24-Oct 15:45-16:00 TW009-1 Nugget Shape Control in Resistance Spot Welding P. S.Wei
Poster 24-Oct 15:45-16:00 TW042-1
Electrical Model Analysis Measurement of TSV to
TSV Coupling Capacitance
YangShiuan-hau
Poster 24-Oct 15:45-16:00 TW078-1 Molded Underfill for Flip Chip Package ChenYu-Kai
Poster 24-Oct 15:45-16:00 TW084-2
Bill of Material and Geometry of FCBGA Impacts on
Packaging Warpage
HaroldWu
Poster 24-Oct 15:45-16:00 TW132-3
Electrochemical Migration Failure on FR-4 PCB
Plated with Cu by Hygro-Thermo-Vapor Pressure
HSIANG-CHEN
HSU
Poster 24-Oct 15:45-16:00 TW147-1
Electrical Performance of Through Silicon Via TSV
and Print Circuit Board Through Hole
You-YiChen
Poster 24-Oct 15:45-16:00 TW076-1
Passive Cooling of a Pico Projector Having a Plate-
Fin Array
Jin-Cherngshyu
Poster 24-Oct 15:45-16:00 TW079-1
Study on thermal conductive BN/VGCF/polyimide
resin composites
ChinSi-Yi
Poster 24-Oct 15:45-16:00 TW121-1
Electrically Insulating and Thermal Conductive
Materials with Defect Controlled Graphene
Chen LungLin
Poster 24-Oct 15:45-16:00 TW126-1
An Analytical Model for Thermal Failure Analysis of
3D IC Packaging
Jia-ShenLan
Poster 24-Oct 15:45-16:00 TW134-1
Thermal Performance of a Loop Thermosyphon with
Fe3O4 based Nanofluid
HuangChun-Hsien
Poster 24-Oct 15:45-16:00 TW134-2
Study on Single Direction Circulation Flow In Closed
Loop Pulsating Heat Pipe
HuangChun-Hsien
Ch t i ti d f t d f k d
Poster 24-Oct 15:45-16:00 AS051-1
Characterization and performance study of packaged
micropump for drug delivery
Vinaya kumarK.B
Poster 24-Oct 15:45-16:00 AS073-1
Packaging of Polyvinylidene fluoride nasal sensor for
biomedical applications
RoopaManjunatha
Poster 24-Oct 15:45-16:00 TW007-1
Parameters Optimization of Electroporation Chip for
Gene Transfection
Yung-Chiang
Chung
Poster 24-Oct 15:45-16:00 AS019-1
Two-layer materials of polyethylene and a carbon
nanotube/cyanate ester composite with high dielectric
BinghaoWang
Poster 24-Oct 15:45-16:00 TW006-1
Thermal Stability of Hydrogen Annealed Aluminum
Doped Zinc Oxide Films Investigated by Thermal
Shang-ChouChang
Poster 24-Oct 15:45-16:00 TW062-1
Cu wire Development for Thin QFN Package using
Die Attach Film DAF
Ho-ChinHsieh
Poster 24-Oct 15:45-16:00 TW069-1
Film Over Wire FOW Selection for Copper Wire
Application
Ming-WeiLee
Poster 24-Oct 15:45-16:00 TW110-1
The investigation of dielectric properties
measurement method
Meng-ShengChen
Poster 24-Oct 15:45-16:00 TW115-1
Fabrication of Robust Polyaniline Thin Film
Electrodes on the Surface of Elastomeric
Kuan-HsunLi
Poster 24-Oct 15:45-16:00 TW115-2
Investigating the Influence of Various
Organosilanized Substrates and Dopant Species on
Kuan-HsunLi
Poster 24-Oct 15:45-16:00 TW144-1
High Thermal Conductivity Underfill study for fine
pitch Cu pillar bump
HuangHuei-Nuan
(2013-7-31 v)