IEEE CPMT IMPACT Paper_2013_early preview

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IEEE CPMT IMPACT Paper_2013_early preview

  1. 1. TOPIC : Effects of Wire Type & Mold Compound on Wearout Reliability of Semiconductor flash Fineline BGA MAIN AUTHOR : C.L. Gan CO-AUTHORS : F.C. Classe, B.L. Chan, E.K. Ng, U. Hashim AFFILIATION : Spansion (Penang) Sdn Bhd Email : chong-leong.gan@spansion.com Paper Code: AS008-1 Date: Thurs, Oct 24, 2013
  2. 2. OUTLINE 1 INTRODUCTION, BACKGROUND OF THE STUDY, IMPORTANCE 2 EXPERIMENTAL MATRIX 3 WEAROUT MECHANISMS (HAST, TC) 4 WEAROUT RELIABILITY PLOTTING & SEM ANALYSIS (HAST, TC) 5 EFFECTS OF WIRE TYPE, EMC TYPE 6 CONCLUSION & FUTURE WORKS 7 QUESTION & ANSWER 2
  3. 3. Future Works • Wear out reliability knowledge based reliability testing, derivation of HAST Eaa, HTSL Eaa – To proliferate to Pd-doped Cu wire • IMC diffusion kinetics study for various wire types included Pd-doped Cu wire
  4. 4. 20
  5. 5. 21 The End Thank you for your listening! IMPACT 2013 Oct 22 (Tues) – 25 (Fri) Taipei Nangang Exhibition Hall

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