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IEEE CPMT IMPACT Paper_2013_early preview

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Effects of Wire Type and Mold Compound on Wearout Reliability of Fineline BGA Package in Microelectronics Packaging

2013 IEEE CPMT IMPACT Final Program

2013 IEEE CPMT impact conference agenda

Handout endnote x4

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Personal Information

Organization / Workplace

Spansion LLC

Occupation

MTS Package & Device Reliability

Industry

Electronics / Computer Hardware

About

Experience Engineer in semiconductor packaging and device reliability in semiconductor industry. Awarded with SMIEEE & RACI CChem in 2013.

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