New step presented from the Spanish partners (ANCCP, Gaia and UNED) of the ECoVEM project, European Centre of Vocational Excellence in Microelectronics, European Project inside the Erasmus + KA3 initiative - Dedicated VET Tools, Centres of Vocational Excellence nº 620101-EPP-1-2020-1-BG-EPPKA3-VET-COVE, presenting the 42 courses developed inside the project as a complete microelectronics engagement courses delivered by eleven of the project partners (Technical University of Sofia, SCAS, J-ArtEck Youth Education Center, SEMI, Exolaunch, IAL FVG, INES Formation, ANCCP, UNED, Cyprus Productivity Center and Romit LTD)

1. December 2023
Course
delivery inside
the ECoVEM
project

2. European Centre of Vocational Excellence
in Microelectronics
New step of the ECoVEM project, European Centre of Vocational
Excellence in Microelectronics, European Project inside the Erasmus +
KA3 initiative - Dedicated VET Tools, Centres of Vocational Excellence
nº 620101-EPP-1-2020-1-BG-EPPKA3-VET-COVE, presenting the 42
courses developed inside the project as a complete microelectronics
engagement courses delivered by eleven of the project partners
(Technical University of Sofia, SCAS, J-ArtEck Youth Education Center,
SEMI, Exolaunch, IAL FVG, INES Formation, ANCCP, UNED, Cyprus
Productivity Center and Romit LTD) https://courses-

3. European Centre of Vocational Excellence
in Microelectronics
https://ecovem.eu/ 620101-EPP-1-2020-1-BG-EPPKA3-VET-COVE
VET capable to train
people with life-long
capacity to self- regulate
learning, in order to adapt
continuously at rapidly
changing environments
European
Vocational
Education Area with
shared OERs,
improved virtual
mobility of students
and academic staff
and integrated
programmes of
study, training and
research
Efficient financial models for VET
including work-based and apprenticeship
and for investment in VET and applied
research
Raised role of VET in Smart
Specialisation Strategies
Implementation of the
advanced countries’ best
practices and approaches
to excellence in VET into
less advanced regions
More responsive
VET to the fast
changing skills
need of the labour
market
Higher employment of
graduates, better
opportunities for
research and
innovation of
enterprises

4. ECoVEM courses deliverables
WPs/Deliverables in ECoVEM
content development
• WP1 Preparation, TUS (BG)
• WP2 ECoVEM Cooperation Platform, SEMI
Europe (GE)
• WP3 Design of innovative VET, UNED (ES)
• WP4 Exploitation/Implementation of VET, INES
(FR)
• WP5 Quality Assurance, Exolaunch (GE)
• WP6 Dissemination, ECWT (NO)
• WP7 Governance Action Plan, BIA (BG)

5. European Centre of Vocational Excellence
in Microelectronics
Course
developer
partner
Number
of
courses
Language of
some courses
Mode of delivery
P01 TUS 9
English,
Bulgarian,
French
On-line (stand-alone), On-line (tutored), Work-
based training, On-site training, Hybrid on-site/on-
line
P03 SCAS 2 English On-line (stand-alone)
P05 J-
ArtEck
1 English
On-line (stand-alone), On-line (tutored)
P06 SEMI 3 English On-line (stand-alone)
P08
Exolaunch
4 English
On-line (stand-alone), On-line (tutored), Work-
based training, on-site training, Hybrid on-site/on-
line
P09 IAL
FVG
3 Italian
Work-based training, on-site training
P12 INES 3 English, French On-site training
P14 ANCCP 3 English, Spanish On-line (stand-alone), On-line (tutored)
P16 UNED 7 English On-line (stand-alone), On-line (tutored)
P17 CPC 2 English, Greek Work-based training, on-site training
P21 ROMIT 5 English
On-line (stand-alone), Work-based training, Hybrid
on-site/on-line

6. European Centre of Vocational Excellence
in Microelectronics
• Design and manufacture of PCB
• Microelectronics packaging technologies
• Integrated circuits design
• System design
• Fundamentals of microelectronics manufacturing
• Microelectronics for a greener economy
• Key competences and skills
• EQF 38
(VET 2, 3, 4 – B, M, PhD)
• ECTSs / ECVET points
• iVET, cVET, lifelong learning, training, re-training, up-training
• min. 1.250 hours / 20 courses / 40 modules
• Performance-Support Design / Work-Based Learning approach
hours modules courses
ALL courses 5.201 227 42
online + hybrid courses 2.393 166 30
onsite courses 2.808 61 12
PROPOSAL Expected 1.250 40 20

7. European Centre of Vocational Excellence
in Microelectronics
Title of course
category
Categor
y
Expected content Modules
Targeted EQF
Level
Provider
Duratio
n
(hours)
Design and
manufacture of
PCB
1
Training for the profile of
“technician” in PCB design and
fabrication, including design of
PCB, fabrication of boards,
mounting techniques as through
hole, surface mounting etc.
1.01. PCB Design, Assembling and Packaging EQF3 – EQF6
Technical University of Sofia
(TUS)
180
1.02. FPGA Design and Fabrication EQF5 – EQF7
Technical University of Sofia
(TUS)
150
1.03. Fabrication of Silicon Microsystems EQF5 – EQF7
Technical University of Sofia
(TUS)
120
1.04. Basics of microelectronics
manufacturing processes
EQF4 – EQF5 UNED 250
1.05. Design and fabrication of PCB EQF3 – EQF6 ROMIT LTD 60
Microelectronics
packaging
technologies
2
Training specialisation in mounting
and packaging of devices and
integrated circuits (IC), multichip
modules, systems in a package,
printed circuit boards covering
mounting techniques, assembling,
passivation, packaging of chips,
multichip modules, system in a
2.01. PCB Design, Assembling and
Packaging
EQF3 – EQF6
Technical University of Sofia
(TUS)
180
2.02. Microelectronics Packaging
Technologies
EQF4 – EQF7
Technical University of Sofia
(TUS)
180
2.03. Microelectronics for Space applications EQF4 – EQF6 Exolaunch 120
2.04. Basics of microelectronics
manufacturing processes
EQF4 – EQF5 UNED 250

8. Title of course
category
Categor
y
Expected content Modules
Targeted EQF
Level
Provider
Duratio
n
(hours)
Fundamentals of
microelectronics
manufacturing
3
Training for the profile of
“specialised technician” in
microelectronics manufacturing,
covering topics such as:
introduction to advanced materials,
processing equipment, production
process, packaging, testing.
3.01. PCB Design, Assembling and Packaging EQF3 – EQF6
Technical University of Sofia
(TUS)
180
3.02. Fabrication of Silicon Microsystems EQF5– EQF7
Technical University of Sofia
(TUS)
120
3.03. Microelectronics Packaging
Technologies
EQF4– EQF7
Technical University of Sofia
(TUS)
180
3.04. CMOS technology process EQF6– EQF7
Technical University of Sofia
(TUS)
80
3.05. Test Engineering for Automotive
Electronics
EQF6– EQF7
Technical University of Sofia
(TUS)
80
3.06. SEMI Standards Educational Series for
E10 and E79
EQF3 SEMI 4
3.07 Ultra-Pure Water & Liquid Chemicals
Quality Control Webinar
EQF3 SEMI 0.5
3.08. Voltage Sag for Manufacturing Fabs
Overview
EQF3 SEMI 4
3.09. Microelectronics for Space applications EQF4 – EQF6 Exolaunch 120
3.10. Bridge the Gap: Photovoltaic Systems EQF4 – EQF5 UNED 90
3.11. Foundations on Microelectronics EQF4 – EQF5 UNED 60
3.12 Basics of microelectronics manufacturing
processes
EQF4 – EQF5 UNED 250
European Centre of Vocational Excellence
in Microelectronics

9. Title of course
category
Categor
y
Expected content Modules
Targeted EQF
Level
Provider
Duratio
n
(hours)
Integrated
circuits desing
4
First specialisation in
microelectronics design covering
digital, analog or mixed-signal
circuits, (information processing and
storage, RF and microwaves,
sensors and actuators)
4.01. FPGA Design and Fabrication EQF5 – EQF7
Technical University of Sofia
(TUS)
150
4.02. Fabrication of Silicon Microsystems EQF5 – EQF7
Technical University of Sofia
(TUS)
120
4.03. Design of ICs with CADENCE EQF6 – EQF8
Technical University of Sofia
(TUS)
180
4.04. Circuit Training with Analog Devices
Alternating Current (CTAD-AC)
EQF3 – EQF5 ANCCP 25
4.05. Circuit Training with Analog Devices
Direct Current (CTAD-DC)
EQF3 – EQF5 ANCCP 25
4.06. Training in Electronic Circuits with
Analog Devices TECAD
EQF4 – EQF6 ANCCP 50
4.07. Task-oriented simulation with OrCAD
Pspice
EQF4 – EQF6 UNED 75
4.08. Foundations and Simulations on FPGAs EQF4 – EQF6 UNED 50
4.09. Computer modelling and simulation in
Analogue electronics
EQF6 ROMIT LTD 60
European Centre of Vocational Excellence
in Microelectronics

10. Title of course
category
Category Expected content Modules
Targeted EQF
Level
Provider
Duration
(hours)
System design 5
Second specialisation in
microelectronics design and
engineering with a focus on
Research & Innovation, covering
system-on-chip, system–in-package,
hardware/software co-design, test
of circuits and systems. Including
Electronic Design Automation
(Digital circuits design, Analog
circuits design, Hardware/software
co-design–embedded systems
design), Specialised processor
chips for edge computing, artificial
intelligence, and high-performance
applications.
5.01. FPGA Design and Fabrication EQF5 – EQF7
Technical University of Sofia
(TUS)
150
5.02. Fabrication of Silicon Microsystems EQF5 – EQF7
Technical University of Sofia
(TUS)
120
5.03. Design of ICs with CADENCE EQF6 – EQF8
Technical University of Sofia
(TUS)
180
5.04. Embedded Systems for Automotive
Industry
EQF6 – EQF7
Technical University of Sofia
(TUS)
80
5.05. C++ for Automotive Electronics EQF6 – EQF7
Technical University of Sofia
(TUS)
80
5.06. Microelectronics for Space applications EQF4 – EQF6 Exolaunch 120
5.07. Digital modeling and manufacturing
technician (digital maker)
EQF3 IAL FVG 1056
5.08. Digital modeling and manufacturing
technician (digital maker)
EQF4 IAL FVG 1056
5.09. Circuit Training with Analog Devices
Alternating Current (CTAD-AC)
EQF3 – EQF5 ANCCP 25
5.10. Circuit Training with Analog Devices
Direct Current (CTAD-DC)
EQF3 – EQF5 ANCCP 25
5.11. Training in Electronic Circuits with Analog
Devices TECAD
EQF4 – EQF6 ANCCP 50
5.12. Task-oriented simulation with OrCAD
Pspice
EQF4 – EQF6 UNED 75
5.13. Bridge the Gap: Photovoltaic Systems EQF4 – EQF5 UNED 90
5.14. Foundations and Simulations on FPGAs EQF4 – EQF6 UNED 50
5.15. Microprocessor systems EQF6 ROMIT LTD 60
5.16. Computer modelling and simulation in
European Centre of Vocational Excellence
in Microelectronics

11. European Centre of Vocational Excellence
in Microelectronics
Title of course
category
Categor
y
Expected content Modules
Targeted EQF
Level
Provider
Duratio
n
(hours)
Microelectronics
for greener
economy
6
Modules for design and fabrication
of photovoltaics, sensors or Internet
of Things (IoT) for smart streets, for
smart houses, electronic
components fabrication and
packaging for electric cars,
medical/health microelectronics,
smart sensors design and
fabrication as key elements of
intelligent sensor systems for
Industry 4.0, intelligent and energy-
efficient power electronics, etc.
6.01. Principle of photovoltaic (PV) cells and
the different PV cell technologies
EQF5 – EQF7 INES Formation 14
6.02. Manufacturing standard silicon
photovoltaic (PV) cells: Theory and
technological responses
EQF6 – EQF8 INES Formation 21
6.03. Fabrication, characterization and ageing
of photovoltaic modules: Theory and
technological responses
EQF6 – EQF8 INES Formation 14
6.04. Bridge the Gap: Photovoltaic Systems EQF4 – EQF5 UNED 90
6.05. Smart Industry and Circular Economy EQF4 – EQF6 UNED 50
6.06. Foundations and Simulations on FPGAs EQF4 – EQF6 UNED 50
6.07. Overview of Biotechnology and
Microelectronics from the Point of View of
Gender, Equality and People Integration
EQF3 – EQF5 UNED 50
6.08. Automotive electronics- Advanced ECU
systems (control and Microelectronics),
Architecture microelectronics of Telematics
control units (TECU) in vehicles
EQF6
CYPRUS PRODUCTIVITY
CENTER
130
6.09. PVTRIN Training and certification
scheme for technicians
EQF5
CYPRUS PRODUCTIVITY
CENTER
185
6.10. Introduction to Internet of Things EQF5 – EQF6 Romit LTD 60

12. European Centre of Vocational Excellence
in Microelectronics
Title of course
category
Categor
y
Expected content Modules
Targeted EQF
Level
Provider
Duratio
n
(hours)
Key competences
and transversal
skills
7
Training on transversal skills and
competences required by industry,
including innovation management,
entrepreneurship, teamwork in a
multidisciplinary team
7.01. Entrepreneurship and validation of prior
learning in electronics
EQF4 – EQF5
Student Computer Art
Society
75
7.02. Artificial Intelligence and Student Career
Development
EQF4 – EQF5
Student Computer Art
Society
75
7.03. Applied Intercultural Communication EQF3
J-ArtEck Youth Education
Center
90
7.04. Presentation Skills, Pitching EQF4 – EQF6 Exolaunch 90
7.05. Project Management EQF4 – EQF6 Exolaunch 50
7.06. Survival in the Labour Market EQF4 – EQF6 Exolaunch 50
7.07. The Entrepreneurial Mindset for
professional success
EQF3 – EQF4 IAL FVG 12
7.08. Smart Industry and Circular Economy EQF4 – EQF6 UNED 50
7.09. Overview of Biotechnology and
Microelectronics from the Point of View of
Gender, Equality and People Integration
EQF3 – EQF5 UNED 50

13. ECoVEM website
https://ecovem.eu/
https://courses-
ecovem.eu/

14. Courses Subjects
ECoVEM Shell – https://courses-ecovem.eu/
9
11
3
16
9
12
4
5
0 2 4 6 8 10 12 14 16 18
8. Key Competences & Transversal Skills
7. Microelectronics for greener economy and industrial…
6. Fundamentals of microelectronics manufacturing
5. System design
4. Integrated Circuits Design
3. Fundamentals of microelectronics manufacturing
2. Microelectronics packaging technologies
1. Design and manufacture of PCB
Courses by topic
Number of courses

15. Courses Contents Design
ECoVEM Shell – https://courses-ecovem.eu/
Course
developer
partner
Number of
courses
P01 TUS 9
P03 SCAS 2
P05 J-ArtEck 1
P06 SEMI 3
P08
Exolaunch
4
P09 IAL FVG 3
P12 INES 3
P14 ANCCP 3
P16 UNED 7
P17 CPC 2
P21 ROMIT 5

16. ECoVEM shell
 Courses
 Filtering
 Categories
 Author
 Analytics of arriving/departing
 Language, EQF, mode of delivery and
certification
https://courses-ecovem.eu/

17. ECoVEM shell
https://courses-ecovem.eu/

18. ECoVEM shell
https://courses-ecovem.eu/

19. UNED
Moodle ECoVEM
http://ecovem.ieectqai.uned.es/moodle2/

20. TUS
Moodle ECoVEM
http://moodle-tus.ecovem.eu/

21. TUS Courses (I)
Course title and Modules
(Moodle https://moodle-tus.ecovem.eu/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
PCB Design, Assembling and Packaging
180 9 x x x
• Main assembling and mounting techniques for PCB
• PCB design principles
• Design of PCB with Proteus
• Design of PCB with Kicad
• Design of PCB with Altium designer Fabrication of PCB, multilayer boards, vias – conductive and thermal
• Fabrication of PCB, multilayer boards, vias – conductive and thermal
• Design of the package with Solid Works
• Assembling of PCB
• Test of PCB
FPGA Design and Fabrication
150 7 x x x
• Introduction to FPGA
• Hardware Description Languages for FPGA Design
• FPGA development tools flow: specify, synthesize, simulate, compile, program and debug
• Configurable embedded processors and embedded software
• Use of soft-core and hard-core processors
• FPGA System engineering, software-hardware integration and testing
• IP development and incorporating 3rd-party IP
Fabrication of Silicon Microsystems
120 5 x x x x
• Introduction to piezo-resistive feedback
• Fabrication of microsystems
• Design aspects of microsystems’ prototyping
• Configurable embedded processors and embedded software
• Advanced applications of microsystems with piezo-resistive feedback

22. TUS Courses (and II)
Course title and Modules
(Moodle https://moodle-tus.ecovem.eu/
(Work-based https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Microelectronics Packaging Technologies
180 5 x x
• Wire Bonding
• Multi-chip modules (MCM)
• Single-chip packages
• Stack packaging technologies
• Packaging Levels and Heat Removal
Design of ICs with CADENCE
180 4 x x
• Introduction
• CAD tools for design of analogue and mixed-signal integrated circuits (CADENCE). Schematics
• CAD tools for design of analogue and mixed-signal integrated circuits (CADENCE). Simulation
• CAD tools for design of analogue and mixed-signal integrated circuits (CADENCE). Layout and Ensambly
Work-
based
training /
On-site
training
CMOS technology process
• Theoretical basis of testing
• MELEXIS-specific technological processes
• Practical assignments
80 3 x
Test Engineering for Automotive Electronics
• Theoretical basis of testing
• Bosch-specific/Automotive-specific test systems design and implementation
• Practical assignments
80 3 x
Embedded Systems for Automotive Industry
• Theoretical basis
• Bosch-specific/Automotive-specific
• Practical assignments
80 3 x
C++ for Automotive Electronics
• Theoretical basis of embedded C++
• Bosch-specific/Automotive-specific
• Practical assignments
80 3 x

23. SCAS & J-ArtEck Courses
Course title and Modules
SCAS (LearnPress https://elval.scas.bg/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Entrepreneurship and validation of prior learning in electronics
75 7 x
• Business ideas and selection of electronics sub-domain
• Needs analysis and market research
• Experience and team formation
• Important general competencies- financial and legal basics and ICT skills
• Planning, quality management and risk management
• Renewable resources and energy saving
• Validation of knowledge, skills and competencies of prior learning in electronics
Artificial Intelligence and Student Career Development
75 7 x
• Digital media literacy and critical thinking
• Labour market structure and dynamics
• How Artificial intelligence (AI) structure the provided information
• Dead professions and new ones with focus on technique and engineering
• Critical thinking and rating the information for career development
• Digital wellbeing
• Career development and AI during crises and pandemics
J-ArtEck Youth Education Center (Moodle, https://ecovem.ieectqai.uned.es/moodle2/)
Applied Intercultural Communication
90 5 x
• Introduction
• Basic Knowledge
• Cultural Dimensions
• Communication Styles
• Business Applications

24. SEMI Courses
Course title and Modules
(Vimeo https://www.semi.org/en/products-services/standards/step/equipment-performance-metrics)
(Vimeo https://discover.semi.org/ultrapure-water-webinar-registration.html)
(GoToWebinar https://www.semi.org/en/connect/events/voltage-sag-workshop-manufacturing-fabs
https://attendee.gotowebinar.com/recording/311095134940547073)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
SEMI Standards Educational Series for E10 and E79
4 4 x
• SEMI Metrics Global Technical Committee and Equipment Reliability, Availability, Maintainability, and Productivity (RAMP)
Standards Overview
• SEMI E10 RAM and Utilization Specification Standard Overview
• SEMI E79 RAM and Utilization Specification Standard Overview
• SEMI E10 RAM and Utilization Specification Standard Applications, Parts 1 and 2
Ultra-Pure Water & Liquid Chemicals Quality Control Webinar: SEMI Standards Enabling Proactive Yield Management for
Advanced Nodes - Particles Control 0.5 1 x
• SEMI Standards Enabling Proactive Yield Management for Advanced Nodes - Particles Control
Voltage Sag for Manufacturing Fabs Overview
4 8 x
• Introduction to the SEMI Voltage Sag Immunity Task Force Effort
• Regional Voltage Sags- Importance of Addressing Three-Phase Voltage Sags in SEMI F47
• Utility Dynamic VAR device fault response, fault mitigation techniques, and power quality measures addressed with
protection design
• Seeing it from both sides: The importance of Power Quality Metering at the utility and inside the Fab Distribution System
• Waveform captures of voltage sag events can be automatically analyzed by software to determine their source and impact
• Power Quality and Monitoring, What Does the Data Tell Us?
• SEMI F47 and Power Quality Perspectives and Considerations from a Tool OEM
• Power Supply Considerations and Standards for Voltage Sag Ride Through

25. Exolaunch Courses
Course title and Modules
(Moodle https://training.hedera.online/course/view.php?id=111 https://training.hedera.online/course/view.php?id=112
https://training.hedera.online/course/view.php?id=113 https://training.hedera.online/course/view.php?id=114)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Microelectronics for Space applications
120 5 x x x
• Introduction to Microelectronics for Space Applications - Satellite Technology
• Radiation Effects and Hardening of Microelectronics for Space Applications- Space Sensor Data Processing
• Design and Analysis of Microelectronic Circuits- Data Transmission
• Fabrication and Testing of Microelectronic Devices- System Design
• Design, Fabrication, and Testing
Presentation Skills, Pitching
90 5 x
• Understanding Effective Presentations
• Developing Engaging Presentations
• Delivering with Confidence and Presence
• Responding to Questions and Feedback
• Pitching and Applying Presentation Skills in Different Contexts
Project Management
50 5 x
• Employability introduction
• Gender, Race and Ethnicity in the Labour Market
• Social Media for Network and Center
• Internship and Work Integrated Learning
• Making the best use of technology for employability
Survival in the Labour Market
50 5 x
• Employability introduction
• Gender, Race and Ethnicity in the Labour Market
• Social Media for Network and Center
• Internship and Work Integrated Learning
• Making the best use of technology for employability

26. IAL FVG Courses
Course title and Modules
(https://www.ialweb.it/ https://www.lhofattoio.com/ https://www.effepi.fvg.it/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
The Entrepreneurial Mindset for professional success
12 2 x
• The Entrepreneurial Mindset
• Leadership skills
Digital modeling and manufacturing technician (digital maker)
1,056 6 x
• Realisation of Three-Dimensional Models
• Programming Machines
• Fabrication of Electronic Boaads
• Firmware Development
• Basic Skills
• Supplementary and Transversal Competences
Digital modeling and manufacturing technician (digital maker)
1,056 6 x
• Design of Microcontroller Devices to Project Specification
• Sensoric Evaluation Applied to the Project
• Firmware Development
• Prototype Production (CAD operation and 3D printing)
• Basic Skills
• Supplementary and Transversal Competences

27. INES Formation Courses
Course title and Modules
(https://www.ines-solaire.org/en/international/ecovem/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Principle of photovoltaic (PV) cells and the different PV cell technologies
14 6 x
• Photovoltaic electricity market status
• Basic Physics of photovoltaic cell
• The different PV cell technologies.
• PV module fabrication process and characterization
• CEA-INES research laboratories tour
• INES-PFE pedagogical platform tour
Manufacturing standard silicon photovoltaic (PV) cells: Theory and technological responses
21 9 x
• Understanding of the photovoltaic context
• Production and purification of solar grade silicon
• Crystallization and sawing of solar grade silicon
• The silicon photovoltaic cell
• Industrial manufacturing process for standard PV cells (PERC)
• Evolution of silicon PV technology: innovative architectures of silicon PV cells
• Future of PV technology: perovskite / silicon tandem cells
• CEA-INES research laboratories tour
• INES-PFE pedagogical platform tour
Fabrication, characterization and ageing of photovoltaic (PV) modules: Theory and technological responses
14 5 x
• Architecture of PV modules
• Materials and manufacturing process of PV modules
• Reliability and durability: accelerated ageing of PV modules
• CEA-INES research laboratories tour
• INES-PFE pedagogical platform tour

28. ANCCP Courses
Course title and Modules
(Moodle https://ecovem.ieectqai.uned.es/moodle2/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Circuit Training with Analog Devices Alternate Current (CTAD-AC)
25 4 x x
• What is Phase?
• Transient Response of RC Circuit
• Power and Power Factor in AC circuits
• Filters
Circuit Training with Analog Devices Direct Current (CTAD-DC)
25 4 x x
• Ohm's law
• Kirchhoff's Voltage and Current Laws
• Superposition
• Thevenin Equivalent Circuit
Training in Electronic Circuits with Analog Devices TECAD
50 5 x x
• Diodes
• Characteristics of transistors
• BJT and MOSFET transistor bias
• Amplifier with a transistor, and its integration in electronic circuits
• Operational amplifiers

29. Course title and Modules
(Moodle https://ecovem.ieectqai.uned.es/moodle2/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Task-oriented simulation with OrCAD Pspice
75 8 x x
• Methodology for computer aided design of electronic circuits
• Pspice A/D – signal sources, models of electronic components
• Voltage and current sources in pspice. Type of analysis
• DC analysis. DC sweep. Operating point
• Frequency analysis. AC sweep/noise
• Time domain (transient) analysis
• Parametric and statistical analysis
• Analyze system behavior of amplifier circuits. Simulation of generator circuits
Bridge the Gap: Photovoltaic Systems
90 6 x x x
• Solar Energy Fundamentals
• Fundamental Concepts in Photovoltaic Technology
• Components of a PV Systems: Controller
• Components of a PV Systems: Battery
• Components of a PV Systems: Inverter
Foundations on Microelectronics
60 7 x
• General Overview
• Foundations on Microelectronics
• Materials in Microelectronics
• Manufacturing Process
• Evolution and New Frontiers
• VISIR RL Overview
• Using VISIR Remote Laboratory
Smart Industry and Circular Economy
50 5 x x
• Basic concepts of smart industry and circular economy
• Smart Industry and technologies
• Smart and Personal cities
• Circular Economy relatives
• Energy efficiency and circular economy
UNED Courses (I)

30. UNED Courses (and II)
Course title and Modules
(Moodle https://ecovem.ieectqai.uned.es/moodle2/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Foundations and Simulations on FPGAs
50 4 x x x
• Introduction to FPGAs and Simulation tools
• Design with FPGAs
• Designing with Altera FPGAs
• Applications and practical work
Overview of Biotechnology and Microelectronics from the Point of View of Gender, Equality and People Integration
50 5 x x
• Microelectronics/Biotechnology and Green Technologies
• Microelectronics Digitalisation
• Microelectronics Gender Equality and Technology
• Microelectronics Artificial Intelligence
• Microelectronics Integration of People
Basics of microelectronics manufacturing processes
250 8 x x x
• Basic manufacturing processes overview
• Semiconductor materials
• Microelectronic measurement tools
• Silicon wafer manufacturing processes
• Cleanroom and vacuum technology
• Manufacturing processes
• Machinery, automation, and manufacturing utilities
• Standards, patents, and regulations

31. Cyprus Productivity Center Courses
Course title and Modules
(https://paideia-news.com/mesogeiako-institoyto-dieythynsis/2023/01/09/enarksi-dorean-programmaton-katartisis-apo-to-kepa/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Automotive electronics - Advanced ECU systems (control and Microelectronics) Architecture microelectronics of Telematics
control units (TECU) in vehicles
130 5 x
• Adas system operation in vehicle
• Principles of operation of cameras, Radar, lidar and sensors of Adas system
• TECU principle and theory
• Block diagram/ Components/ electronic flow diagram of TECU
• Sequence of trouble shooting /readings by using manufacture workshop manual
PVTRIN Training and Certification Scheme for Technicians
185 10 x
• EU and national RES Regulations and standards
• Fundamentals and basic principles
• Basic design principles
• BAPV and BIPV (Adapted and integrated to buildings)
• Installation sitework
• Case studies-best practices
• Measurement/commissioning, and Net Metering
• Maintenance and troubleshooting
• Quality management and customer service
• Visit to a PV Park

32. Course title and Modules
(Moodle https://moodle-tus.ecovem.eu/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Design and fabrication of PCB
60 4 x
• Introduction to Printed Circuit Boards (PCB)
• PCB design overview
• Creating of PCB based on electronic circuit by using EDA software
• Educational video materials
Microprocessor systems
60 5 x
• Introduction to Microprocessors
• Microprocessor interfaces
• Microprocessor programs and simulation
• System on Chip –SoC
• Arm processors
Computer modelling and simulation in Analogue electronics
60 5 x x
• Introduction to SPICE modelling and simulation
• LTSpice simulation of electronic circuits with P-N junction diodes
• LTSpice simulation of circuits with BJT and FET transistors
• LTSpice simulation of circuits with OP-AMPS
• Solar PV panel inverter simulation with LTSpice
ROMIT Courses (I)

33. Course title and Modules
(Moodle https://moodle-tus.ecovem.eu/)
Duration
(hours)
Module
s
Main Subject
Design
and
manufacture
of
PCB
Microelectronics
packaging
technologies
Fundamentals
of
microelectronics
manufacturing
Integrated
circuits
design
System
design
Microelectronics
for
a
greener
economy
Key
competences
and
transversal
skills
Introduction to Internet of Things (IoT)
60 7 x
• Introduction to IoT
• IoT hardware
• IoT wireless sensor nodes and networks
• IoT software, technology and protocols and standards
• IoT cloud platforms
• Project: IoT Temperature Based Fan Speed Control & Monitoring System
• IoT Electrical Energy meter
LoraWan technology
60 9 x
• Introduction to LoraWan technology
• Radio transmission and propagation
• Lora modulation(Physical Layer)
• The LoraWan protocol
• LoRaWAN end-devices (nodes)
• LoRaWAN networks and LoRaWAN servers
• Project: Connecting MKR WAN 1300 Arduino board to The Things Network
• Project: LoraWan temperature and humidity measurement sensor node
• Project: Seeeduino Xiao RFM 95 LoraWan sensor node
ROMIT Courses (and II)

34. At the end … go to the
courses
https://ecovem.eu/
https://courses-
ecovem.eu/


Read important information on
Microelectronics on the ECoVEM website

Filter the ECoVEM courses the
ECoVEM shell website
 Register in the ECoVEM partner
repository course and do the tasks /
modules / courses and win badges /
certificate
Repeat the times you would like
to learn more information on the
tasks / modules / courses of the
ECoVEM project
TSOP
Awarded to Plosada3 Prueba
Issued 14 March 2023, 1:35 PM
Issued by Cursos VISIR DIEECTQAI UNED
ECoVEM
Course Task-oriented simulation with OrCAD
Pspice
Badge Module 1
Criteria
• ALL of the following activities are
completed:
“Quiz – Task 1 – Quiz of content learning”
“Quiz – Task 1 – Quiz of simulation
exercises”

35. December 2023
Course
delivery inside
the ECoVEM
project