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Graduate Program in Electronics & Telecommunication
Professional Master
I. The Department
The Department of Electronics and Electrical Communication Engineering "EECE" of the
Faculty of Engineering, Cairo University with its 84 strong faculty staff members is by far
the largest and most prestigious ECE department in Egyptian and Middle Eastern
universities.
The EECE Department was the first to be accredited by the National Authority for Quality
Assurance and Accreditation of Education. It has produced over the years an impressive list
of community leaders in industry and government.
II. General Program Description
The Professional Masters in Electronics and Telecommunication is a three track, non thesis,
innovative program, conducted in close partnership with industry. Its uniqueness stems
from blending advanced engineering subjects with a comprehensive set of teachings in
management economics, finance and legislation to produce the industry leaders of
tomorrow. The professional nature of the program is emphasized by experimental work in
labs and through site visits.
III. Mission
The Professional Masters in Electronics and Telecommunication Engineering aims to
establish a standard-setting program in terms of curriculum design and pedagogical
approach, producing professionals tuned to the challenging needs of industry and capable
of coping with the rapid pace of change of the information and communication technology.
IV. Program Objectives
Providing the students with both basic and advanced scientific knowledge through a
comprehensive set of innovative courses.
Providing the students with a professional operational knowledge allowing them to
perform efficiently in their firms. This involves knowledge of relevant national and
international standards (ITU-IEEE, etc), civil and power engineering awareness,
environmental issues, facility management, … etc.
Introducing students to basic communication and soft skills involving reporting,
presentation, time and meeting management, negotiation skills … etc.
Providing the students with fundamentals of management, finance, strategic planning,
firm organization and governamce to facilitate their immersion in firm life and their
interaction with members of non-engineering departments.

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Informing the students about the major regulatory and legal principles governing their
profession and the bodies involved in the regulation process.
Introducing the students to issues of project management, technology management,
management of innovation and entrepreneurship.
Preparing the students for the major certificates delivered by relevant certification
institutions (WCET, ITIL, ETOM,CCNA … etc).
V. Admission Requirements
A BSc. Degree in Electronics and Telecommunications, Electrical, Computer or Biomedical
Engineering (depending on the chosen track) with a minimum grade of "Good" or its GPA
equivalent is a basic requirement for admission. Moreover, applicants will have to succeed
the written (and eventually oral) admission tests.
Admission is also subject to the general faculty requirements for graduate programs and, as
the number of seats is limited, it is subject to seat availability.
VI. Program Structure
The Professional Masters program in Electronics and Telecommunications comprises
three specializations (tracks).
- Telecommunication Networks.
- Electronics and MEMS Design.
- Embedded Systems.
The Program offers a comprehensive set of courses for each track in addition to a set
of non engineering courses.
The Program requires the successful completion of 30 credit hours divided as follows :
Engineering Courses 15 credit hours (5 courses)
Non Engineering Courses 9 credit hours (3 courses)
Masters Project 6 credit hours
The program of study can comprise a maximum of 6 credit hours from specializations
other than the chosen one. A faculty advisor is assigned to each student to help him in
planning the study program.
The project can only start after the successful completion of 9 credit hours. Its subject
has to be related to an industrial problem and has to be approved by the Professional
Masters scientific committee. The project is supervised simultaneously by two
supervisors: one academic and the second from industry.
Students have to successfully finish all required credit hours and the project in a
maximum of 3 years. The minimum duration for finalizing all the requirements for the
degree is a year and half.
VII. Course List
"Telecommunication Networks" Track

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ECP 601 Digital Communications.
ECP 602 Fundamentals of Telecommunications Networks.
ECP 603 Telecommunication Core Networks.
ECP 604 Optical Fiber Transmission Systems.
ECP 605 Microwave L.O.S Communication Systems.
ECP 606 Satellite Communication Systems.
ECP 607 Mobile Access Networks.
ECP 608 Fixed Wireline and Wireless Access Systems.
ECP 609 Optical Fiber Access Networks.
ECP 610 Multimedia Communications (VoIP, IPTV & IPV6).
ECP 611 Network Security.
ECP 612 Selected Topics in Telecommunications (1).
ECP 613 Selected Topics in Telecommunications (2).
ECP 614 Masters Project in Telecommunication Networks.
"Embedded Systems" Track
ECP 621 Embedded Software Development.
ECP 622 Embedded & Real Time Operation Ssytesms.
ECP 623 Computer Architecture.
ECP 624 Validation & Prototyping of Embedded Systems.
ECP 625 Communications for Embedded Systems.
ECP 626 Selected Topics in Embedded Systems (1).
ECP 627 Selected Topics in Embedded Systems (2).
ECP 628 Masters Project in Embedded Systems.
"Electronic & MEMS System Design" Track
ECP 631 Fundamentals of VLSI Design.
ECP 632 Digital IC Design.
ECP 633 Digital Subsystem Design.
ECP 634 Wireless Communications for Electronics Engineering.
ECP 635 Analogue Circuit Design.
ECP 636 Advanced Topics in RF/Millimeter Wave System.
ECP 637 Data Converters.
ECP 638 PLL and Clock Data Recovery.
ECP 639 MEMS Design.
ECP 640 MEMS Sensors & Actuators.
ECP 641 High Performance PCB Design.
ECP 642 CAD Verification Tools.
ECP 643 CAD Synthesis Tools.
ECP 644 Selected Topics in IC Design (1).
ECP 645 Selected Topics in MEMS Design (2).
ECP 646 Selected Topics in CAD (3).

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ECP 647 Masters Project in Electronics & MEMS System Design.
Non-Engineering Courses
ECP 661 Crash Course MBA.
ECP 662 Project Management.
ECP 663 Engineering Economics.
ECP 664 Telecommunication Regulation & Legislation.
ECP 665 Technology Management.
ECP 666 Innovation & Entrepreneurship.
ECP 667 Technical Writing & Communication Skills.
VIII. Fellowships
The program offers fellowships providing full or partial tuition waiver depending on merit.
Students benefiting from fellowships offered by industrial partners will be required to
subscribe to the fellowship conditions specified by the funding institution.
IX. Industry Partnership
This program has been conceived and conducted in partnership with the leading electronics
and telecommunication industrial firms as well as the concerned governmental agencies
and NGO's. This collaboration involves :
Collaboration in the design of curricula and the elaboration of course contents.
Participation in teaching of courses and in seminars.
Proposing project subjects and participation in their supervision.
Participation in the Masters steering committee responsible for follow-up, evaluation and
quality assessment and program funding and finance.
Ensuring accessibility to firm resources such as labs, documents, … etc.
Participation in funding of the Masters program.
The main partners of this program are Telecom Egypt, Vodafone Egypt, Mobinil, Etistalat
Misr, Systel Telecom, Valeo, Cisco, Mentor Graphics, ADCOM Egypt, Etisal … etc.
X. Course Description
"Telecommunication Networks" Track
ECP 601 Digital Communications.
Basics of baseband and passband digital communication systems. OFDM fundamentals,
advantages and disadvantages -Basics of MIMO technology and its use in modern wireless

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communication standards - Introduction to the concept of channel coding - Different types
of coding techniques : linear, convolutional and turbo codes - Channel Models: typical
urban (TU), 802.11 models, mobile TV channel models…etc. To Different implementation
flavors of communication receivers.
ECP 602 Fundamentals of Telecommunications Networks.
Networking concepts, technologies and standards - Advanced design and analysis - Data
transmission technologies - Telecom network architectures and standards, (LANs and
WLANs) - Packet switching, Internet routing and architecture - TCP/IP - Network security -
Advanced topics and mobile networks.
ECP 603 Telecommunication Core Networks.
Building Blocks for NGN. IP Networks. IP Network Convergence – IPV4 – IPV6 - Local IP
networks, Long IP networks, mobile IP networks. Global IP networks.
Multiservice Networks : Origins of multiservice ATM – NG multiservice. ATM Switching –
Multiprotocol Label Switching Networks Architecture – Frame mode and cell – mode
MPLS. (MPLS) – Multiservice Core and Edge Switching – Multiservice Provisioning
Platform (MSPP) – Multiservice Switching Platforms (MSPP).
MPLS based VPN : Architecture –Operation – Deployment.
ECP 604 Optical Fiber Transmission Systems.
Optical Fibers Systems Structures – EM wave propagation in OF – Attenuation -
Dispersion. Types and specifications. Mechanical properties – Cables Splices and
Connectors.
Semiconductor Optical Sources & Transmitters : LED & LASERS, Types and Structures,
power and spectral characteristics,modulation and modulation BW, ALC, Laser Module.
Photodetectors and Receivers : PIN & APD responsivity. Bandwidth. Types of receivers –
Receiver performance and sensitivity degradation.
Transmission system architectures, design and performance. Multichannel OF systems -
Optical Amplifiers – Dispersion Compensation – Long haul terrestrial and submarine
systems engineering and relevant ITU-T recommendations.
ECP 605 Microwave L.O.S Communication Systems.
Basic Structure – Frequency Plan – General characteristics of microwave L.O.S
communications transceivers – Antennas and Feeders - L.O.S EM wave propagation. Path
clearance – Fading.
Analogue and digital links : Signals – Modulation and Multiplexing – Noise – Distortion –
Interference – Power and selective fading effects. Diversity Techniques - Quality and
availabity objectives. Link budget – Link Operation and Management - Link Design and
Engineering – Relevant ITU recommendations.
ECP 606 Satellite Communication Systems.
Basic Principles – Satellite Dynamics - Orbital Parameters – Station Keeping – Basic
Antenna Parameters – EM wave propagation in space. Noise – Modulation and Coding –
Multiple Access Techniques - Link budget – Regulatory Aspects - Spatial Sector – Satellite
Communication Equipment – Ground Stations. Antenna system, TT&C system – Telecom

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equipment – VSAT – Operation and management – Intelsat System – Satellite Systems for
mobile communications.
ECP 607 Mobile Access Networks.
Fundamentals of GSM standard, network structure - Physical layer fundamentals - Medium
Access Layer fundamentals - Evolution to GPRS and EDGE. Fundamentals of CDMA
access systems, and Third Generation standards - 3G, UMTS, communication system
fundamentals, network structure - Physical layer fundamentals - Medium Access Layer
fundamentals. Evolution to HSDPA and HSUPA - OFDM and OFDMA access systems -
Long Term Evolution (LTE) standards - Network structure - Physical layer fundamentals -
Medium Access Layer fundamentals.
ECP 608 Fixed Wireline and Wireless Access Systems.
Local loop - Narrow band aggregation for E1- ISDN – BRI – PRI – SS7 - Frame relay.
DSL Types - ADSL : modem technology – multiplexing – data rates - ADSL2 & ADSL2+
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SHDSL – VDSL & VDSL2 – DSLAM - Ethernet over copper.
Wireless LAN : IEEE 802.11x standards (wifi) - 802.11 physical layer techniques : FHSS –
DSSS – OFDM.
Wireless personal area networks : Bluetooth, Ultra wideband, Fixed Wireless : LMDS &
MMDS.
ECP 609 Optical Fiber Access Networks.
Review of BB access networks – Economic Considerations.
PON architectures review – TDM versus WDM – Transmission in OF standard commercial
infrastructure – APON / B PON – GPON - EPON.
Optical technologies in PON outside plant and subscriber premises.
Transceivers for PON's. Ranging and Dynamic BW allocation. Protection architectures for
PON's – Optical characterization, Diagnosis and Performance Monitoring for PON's.
ECP 610 Multimedia Communications.
Basics of multimedia communications - Video, audio and speech CODECS - Voice over IP,
video streaming - real time video transmission - IPTV - Session Initiation Protocol (SIP).
Multimedia transmission over (3G,4G and Wifi)- H.264, H.265 standards.
ECP 611 Network Security.
Fundamentals of security and information assurance. Overview of the main concepts and
technologies used in the area of cryptography and network security. Concepts, standards
and protocols for mobile and wireless networks security. Intrusion detection systems,
intrusion prevention systems, anomaly detection, network forensics, ethical and legal issues
in information security. Overview of business issues of risk analysis and management of
resources.
ECP 612 Selected Topics in Telecommunications (1).
ECP 613 Selected Topics in Telecommunications (2).

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ECP 614 Masters Project in Telecommunication Networks.
"Embedded Systems" Track
ECP 621 Embedded Software Development.
Characteristics of Real-time/Embedded Software Development – C Revision – Arrays,
Pointers and Strings – Bit Manipulation & Hardware Access – Device Interaction &
Synchronization – Polling Devices – Interrupt Handling – Serial Peripheral Programming
– General Purpose IO (GPIO) – Dynamic Memory Management – Leaks and
Fragmentation – The C Pre-Processor – Macros – Conditional Compilation.
Platforms: Arduino or ARM platforms and Linux PCs.
ECP 622 Embedded & Real Time Operation Ssytesms.
Basic Features of Embedded/Real–Time Operating Systems – Tasks and Tasking –
Scheduling – Control of Shared Resources – Mutual Exclusion – Resource Contention and
Deadlocks – Intertask Communication – Memory Usage and Management –
Multiprocessors – Multicore and Multicomputer Systems – Boot Loaders and Memory
Segments – Overview of Some Embedded/RT OSs (e.g. VxWorks, uc–OS, Threadx) – Real-
Time Software Design With UML.
Platforms: ARM platforms with uc–OS and Linux PC’s.
ECP 623 Computer Architecture.
Processor architectures: RISC/CISC, DSP, VLIWs (including Transport Triggered
Architectures), and ASIPs – Code Generation Techniques – Code optimization – Branch
Prediction – Data and Instruction Memory Optimization – Memory Hierarchies – Energy–
efficient Design – Interfacing Processors and Peripherals – Multi-Processor System on
Chip – Details on Specific Popular Processors: ATMEL Microcontrollers – The ARM
Processor Family – TI or ADI DSP.
Platforms: TI/ADI DSP, Arduino, ARM
ECP 624 Validation & Prototyping of Embedded Systems.
Software Life Cycle – Design for Testability – The V Model – Unit Testing – System Level
Testing – Integration Testing – White box vs. Black box testing – Compliance, Feature,
Random and Collision Testing – Performance and Stress Testing – Issues in Real-time
Testing – Issues in Multi–processor Systems – Issues in Concurrent Processes –
Introduction to Formal Methods – Modeling Languages and Testability.
Platforms: Linux PC’s.
ECP 625 Communications for Embedded Systems.
Basics of Communications – Digital Transmission Techniques – Signal Encoding – Serial
Communication – Ethernet/Industrial Ethernet – MODBUS – CANopen – POFIBUS –
AUTOSAR – BACNet – IEEE 802.15.4 – Sockets Programming.

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ECP 626 Selected Topics in Embedded Systems (1).
ECP 627 Selected Topics in Embedded Systems (2).
ECP 628 Masters Project in Embedded Systems.
"Electronic & MEMS System Design" Track
ECP 631 Fundamentals of VLSI Design.
Introduction: Design levels, design approaches, design flow and testing problem. Evolution
of MOS transistor and MOST models, IC fabrication, Example IC process flows for CMOS
circuits and MEMS, Design rules, Fundamentals of layout, parasitic extraction, layout
analysis, Digital and Analog Layout techniques.
ECP 632 Digital IC Design.
Digital IC design flows. FPGA design flow. Static and dynamic Timing analysis. Clock
management. Standard cells design flow. Physical design for standard cell flow: Floor
planning, Power planning, Clock tree synthesis, physical verification.
Pre-requisite: Fundamentals of VLSI design, VHDL/Verilog HDL
ECP 633 Digital Subsystem Design.
Different architectures for design of digital subsystems and their performance features.
These subsystems include arithmetic circuits (adders, comparators, counters, multipliers,
..etc.). They also include memories (SRAM, DRAM, Read-only Memories, and serial access
memories).
ECP 634 Wireless Communications for Electronics Engineering.
Important issues in the design of wireless transceivers with an emphasis on implementation
- Channel modeling – Hardware options in the implementation of DSP functions –
baseband modulation and demodulation – channel coding and decoder design – FFT and
OFDM – multiple antenna systems – packet edge detection and synchronization
ECP 635 Analogue Circuit Design.
Analysis and optimized design of monolithic operational amplifiers, wide-band amplifiers,
transconductors, and current-conveyers. Continuous-time and switched-capacitor filters.
Differential circuits and common mode feedback techniques. Bandgap voltage references.
Comparators architectures and design.
ECP 636 Advanced Topics in RF/Millimeter Wave System.
Fundamental concepts of wireless system design and their impact on design trade-offs in
different transceiver architectures. RF transistor model. Passive matching networks. Noise
analysis and low-noise amplifier design. Mixer design techniques and the effects of
nonlinearity. Practical bias circuits for RF design. Phase noise and VCO design. Frequency
synthesizers design. Power amplifier design. Fundamentals of mm-Wave circuits.

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ECP 637 Data Converters.
Analysis and design of filters, sampling circuits, digital-to-analog converters systems and
circuits, Nyquist rate analog-to-digital converters, Oversampled analog-to-digital
converters, digital calibration for analog building blocks, Time-to-digital converter systems
and circuits.
ECP 638 PLL and Clock Data Recovery.
Introduction to Wire line Communications, Wire line Transmitter Design, Wire line
Receiver Design, Optical Transceiver Design, Clock & data recovery circuits & systems,
Introduction to Phase locked loops, Analysis of Phase locked loop systems, Phase Locked
loop building blocks. PLL types and orders, integer-N PLL system design, PLL linear
models, stability and phase noise optimization, PFD and charge pumps, VCOs, fractional-N
PLLs and Sigma-Delta modulators.
ECP 639 MEMS Design.
Introduction to MEMS revolution. MEMS/NEMS fabrication technologies: Bulk
micromachining, surface micromachining, High Aspect Ratio Microstructures. MEMS
process flow ( e.g. MUMPS technology). MEMS layout and simulation tools. Design project
including MEMS layout, and simulation (e.g., pressure sensor or accelerometer).
Pre or Co-requisite: Fundamentals of VLSI design
ECP 640 MEMS Sensors & Actuators.
Theory of operation of MEMS sensors and actuators. Various transduction mechanisms
(piezoelectric, thermoelectric, thermionic, piezoresistive ...etc.). Sensors: Motion sensors,
flow sensors, infrared detectors, Chemical sensors, and Biomedical sensors. Actuators:
Switches, ink jets heads, microphones, Micromirrors, and Biomedical actuators.
ECP 641 High Performance PCB Design.
Introduction to PCB design. PCB types. PCB fabrication. PCB design: Component library
management, Schematics capture, Place and Route, DRC, Silkscreen, Gerber file. PCB
simulation: parasitic extraction, Signal integrity. Hands-on experience with PCB CAD tools
is stressed.
ECP 642 CAD Verification Tools.
Introduction to CAD tools for IC design. Techniques and practical use of IC verification
tools at the Layout level, transistor level, discrete-event logic simulation, cycle-based logic
simulation, RTL and architectural simulation, equivalence checking, timing analysis, and
power estimation.
Pre-requisite: Fundamentals of VLSI design
ECP 643 CAD Synthesis Tools.
Introduction to CAD tools for IC design. Techniques and practical use of IC synthesis tools
at the Layout level, circuit level, logic level, and architectural level (high level synthesis).

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Pre-requisite: Fundamentals of VLSI design.
ECP 644 Selected Topics in IC Design (1).
ECP 645 Selected Topics in MEMS Design (2).
ECP 646 Selected Topics in CAD (3).
ECP 647 Masters Project in Electronics & MEMS System Design.
Non-Engineering Courses
ECP 661 Crash Course MBA.
Business Culture : Structure, Law, Types, Business Trends, Ethics, Economics.
Financial and Managerial Accounting, Financial Statement.
Financial Management, valuation and cost of capital, capital budgeting, long term financial
funding, managing working capital.
Management theory, goals and strategies, organistion structuring, leadership, controls.
Marketing definition, marketing plan, market analysis, product development, distribution
system.
ECP 662 Project Management.
Definition and history – Approaches : Traditional, Prince 2, Critical chain, Event chain,
Process based, Agile, Lean, Extreme, Benefits realization.
Process : Initiation, Planning and Design, Executing, Monitoring and Controlling, Closing
Control Systems.
Project managers and management types – management triangle – work breakdown
structure, management framework – International Standards – Project management
software.
ECP 663 Engineering Economics.
Engineering economic decisions, financial statements, cost concepts and behaviour.
Financial management and principle of investment - Present worth and rate of return
analysis. Depreciation, corporate taxes, cash flow and inflation project risk and
uncertainties, replacement decision, capital budgeting.
ECP 664 Telecommunication Regulation & Legislation.
Historical Evolution of telecommunication networks and services. Natural monopoly –
Liberalization, Regulation.
Telecommunication Law : Basic principles – National Telecommunication Regulatory
Authority – Licenses and permits. Spectrum management and licensing – Telecom Egypt -
National security and general mobilization – Sanctions.

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NTRA's roles structure and governance. Licensing process – Enforcement of free
competition – monitoring of quality of service. Frequency planning and interference
monitoring, numbering plan. Monitoring and approval of service pricing. Type approval.
ECP 665 Technology Management.
Technology Strategy, technology forecasting, technology roadmap, technology portfolio,
diffusion of innovation, capability maturity model, version control.
ECP 666 Innovation & Entrepreneurship.
The entrepreneurial revolution, the entrepreneurial process, opportunity recognition and
shaping, business model and strategy, entrepreneurial marketing. Founding team building,
Business planning process. Financing entrepreneurial ventures. Legal and tax issues,
patents and intellectual property. Entrepreneurial growth.
ECP 667 Technical Writing & Communication Skills.
The three parts of technical texts. Types of texts : letters, reports, proposals executive
summaries, memos, job description, CV. Selection key words, titles and subtitles. Editing,
revising and proof reading techniques. Basic types and patterns of argument. Electronic
word processing and technical writing.
Presentation planning. The communication process. Concept of thesis statement and ways
to develop it. Structuring a presentation. Rules for writing text charts. Design rules for
effective slides and charts. Writing titles. How to deal with a hostile audience, Elements of
an effective speech. Speech preparation as a process. Effective body language.
Leadership skills : motivation, delegation, meeting, management and negotiation skills,
decision making, team management … etc.

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XI. Application Form
Name :
Date of Birth :
Personal Address :
E-mail Address :
Telephone number :
University Degree :
• Specialization
• University
• Grade
• Date
Present Occupation
• Position
• Firm
• Date
• Institutional e-mail
• Institutional phone no.
Required Track
- Telecommunication Network
- Embedded System
- Electronic & MEMS Design
For more information on the program contact us on the following e-mail
ecpm@eng.cu.edu.eg.