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22/06/16 e-mail : pdisnei@gmail.com
Disnei Roberto Passoni
Production Engineer, Age 50 / Brazilian / Married / 2 sons
Mobile: +55 11 99171-6180 / Home: +55 11 4029-2670 / e-mail: pdisnei@gmail.com
skype: dispassoni / Linkedin: https://br.linkedin.com/in/disnei-passoni-70a43410
GOAL: Manufacturing - Engineering Management
EDUCATION
MBA – Industrial Management – FGV– Fundação Getúlio Vargas - 2005
Production Engineer Bachelor Degree – UNIMEP - 1996
Machines Design – FATEC – Faculdade Tecnológica de São Paulo - 1989
BACKGROUND
∴ Production Manager along last 10 years working for Taiwanese, North-American Semiconductor
and Electro-Electronic Companies responsible to manufacture PCs Motherboards,
Telecommunication Radio Base Boards (GSM & WCDMA technology) and Enclosure Cabinets
(Mechanical Build, Paint and Assembly), Point of Sales, Printers, Personal Computers
(Desktops/Notebooks/Tablets) and lately Electronic Components Packaging (DRAM/ eMMC/ eMCP/
MicroSD/ UFD) for PCs and smartphones application.
Responsible in Semiconductors Packaging Memories for all steps from Wafer Preparation (Back
Grinding, Laser Grooving and Wafer Saw), In Line area (Die Attach and Wire Bonders), Backend
area (Molding, Ball Mounter and Singulation), Final Test (Sorter, Burn-In, Speed and Functional
Tests), Final automated inspection and customized packing.
Responsible in Enclosure for all processes from the Automated Punching, Bending, Pressing,
Soldering (MIG/TIG), Automated Powder Coating, Final Assembly, Maintenance and Production
Planning.
Direct contribution to prepare annual Manufacturing Budget for top management approval (indirect
materials, losses control, direct and indirect labor, operational expenditures). Budget monitoring and
report in monthly basis for the top management.
Strong experience in Industrial Capacity (Labor and Machines) analysis/management versus Sales
demand and material availability, headcount capacity measurement & evaluation.
∴ Industrial & Process Engineer Manager along 6 years for Chinese, Brazilian-Japanese Companies
responsible for New Process and New Technologies implementation, Industrial New Product
Introduction, Continuous Improvement Process, Line Assembly Balance, Industrial Layout
Organization, Industrial Plant Expansion, Industrial Maintenance, Lean Manufacturing Coordinator
and Key Training Manager former, Quality Improvement Team, Teaching Lean Thinking and Key
Project Leader, DFM assembly developer for new TVs.
∴ Industrial Manager along 1 year for Brazilian-Japanese Company, responsible and coordination for
operational multidisciplinary team (IT, Quality, Maintenance, Engineering and Warehouse), Assembly
computers and Tablets.
∴ Industrial & Process Engineer along 4 years for Italian and North-American Electro-Electronic auto
parts Companies, responsible for process, Industrial Layout, Continuous Improvement, Standard
Operational Process, Quality System Adherence, Quality Improvements, Operational Training, New
Product Introduction and Method Standard.
∴ Time & Method & Process Technician along 12 years for Brazilian textile Company, define method
and time measurement for head count evaluation, productivity and performance calculation by
machine and workforce, industrial layout definition and process flow, direct and indirect workforce
measurement.
22/06/16 e-mail : pdisnei@gmail.com
ACCOMPLISHMENTS:
• Production implementation and startup at Semiconductor industry very complexes IC Memory
Packages eMMC 16GB and eMCP 4G4g/ 8G8g and 16G8g, responsible for end-to-end Wafer
Preparation, Dice Assembly, Soldering Wiring, Molding, Singulation, Test, Automated Inspection and
Packing area.
• Yield improved 0,5% in DRAM IC memory eliminating US$ 500,000/year scrap.
• Project, design, coordination and implementation of the industrial layout for a new automotive
electronic factory built in Hortolândia city (10.500 m²).
• Project, design, coordination and implementation of 5 new notebooks and netbooks assemble lines
with 40% capacity increase and productivity.
• Improvement process (productivity), engineering team achieved significant results with productivity
and capacity, increased 43% on desktop assemblies and 21% on notebook assembly (direct labor).
• New product implementation in automatic assembly line (SMT, manual assembly, tests, mechanical
assembly and integration).
• Training people in TPS concept/ Lean Thinking (VSM/SMED/Spaghetti/T&M/PDCA/5S/Kanban/…)
• Coordination of 3 teams in Manaus/Salvador/Cajamar for full PCs Manufacturing Plant transferring
from Salvador to Manaus accomplished according planned schedule and budget.
• “U” cell implementation at PCs and Auto Panel System Lines providing cycle time reduction and
increasing capacity and flexibility (Lean Production), process developing and transfer process
implementation.
• Strong knowledge for manpower sizing and equipment capacity loading evaluation, design POKA-
YOKE tools and FMEA.
• Head of project to improve cabinet integration processes, reducing required area from 300 m² to 120
m² with productivity increased from 40 cabinets/ day to 60 cabinets per day (2 shifts).
LANGUAGE
English = good conversation, reading and writing capalitie
PROFESSIONAL BACKGROUND
Feb/14 – Dec/15 SMART MODULAR TECHNOLOGY – PCBA Modules & Semicon Division
Sr Production Manager
North American Company, technology leader in design, development and deployment of
memories products (Integrated Circuits, SSD and Modules).
Responsible for full Semiconductor (Packaging) Production, 120 direct employees and 14
indirect (Supervisors, Leaders, Production Programmer and Indirect Material Controller),
operation 24h per day (3 shifts) and 6 days per week.
Oct/11 – Jan/14 SEMP TOSHIBA – STA & STI Division
Process Engineer Manager
Brazilian-Japanese Electronics Products Company (TVs, PCs, Audio System, DVD and
Mobile).
Responsible for New Technologies and New Processes Introduction in Manaus and Salvador
Plants.
In 2013 also, responsible for the Salvador Plant with 220 employees to assembly notebooks,
desktops and Tablets with multidisciplinary team (Engineering, IT, Quality, Warehouse,
Production Planning, Maintenance and Manufacturing). Responsible to coordinate full site
transference from Salvador to Manaus.
Responsible to provide training to Managers, Supervisors and Engineers in Lean Thinking /
Lean Manufacturing System.
22/06/16 e-mail : pdisnei@gmail.com
Feb/09 – Sep/11 FOXCONN – HP Customer Division (Jundiai)
Operational Excellence Manager
Chinese Electronic Manufacturing Services Company to produce, Personal Computers.
Responsible for Process and Industrial Engineering at the Business Unit dedicated to produce
PCs to HP customer, managing 8 engineers and 12 Technicians of Process and Maintenance.
Developed and implemented 5 new lines (Straight Line) with productivity increasing 43% in
desktops and 21% in notebooks, 50% capacity improvement.
Jan/07 – Dec/08 FLEXTRONICS – Infrastructure Division
Production Manager
North American Electronic Manufacturing Services Company, assembly Infrastructure for Large
Telecommunications Companies (Ericsson and Huawei).
Responsible for Electronic Boards Assembly and Enclosure Cabinets Assembly, direct team
with 180 employees, 3 Supervisors and 5 Leaders.
Head of the project in Shingijutsu week for capacity increase in Cabinets Assembly with
reduction area from 300m² to 120m² and 50% throughput rate increase.
Oct/00 – Jan/07 SANMINA-SCI – Electronic Division
Production Manager
North American Electronic Manufacturing Services Company to assemble electronic boards
and products like Computers, Servers, Printers, Intelligent Cards, Point of Sales Terminals,
Satellite Receivers, Telecommunication boards (GSM and WCDMA) and Radio Base Station
for mobile telecommunications.
First company to implement full Lead Free soldering process in Brazil. Responsible to
implement strong SMT monitoring process resulting 60% SMT performance increase (utilization
capacity).
Managing 400 direct employees with Supervisors, Leaders, Production Planning and Indirect
Material Controller working 24h/day and 6 days/week.
Jan/00 – Sep/00 MOTOROLA INDL – Mobile Division
Sr Process Engineer
North American Electronic Telecommunication Company to assemble mobile telephones.
Responsible for full SMT process for CDMA Boards with both pick & placers FUJI and
SIEMENS platforms.
Jan/97 – Dec/99 MAGNETI MARELLI – Electronic System Division
Process and Method Engineer
Italian Electronic Auto Parts, responsible for processes and methods for assembly Boards and
Final assembly of automotive products like Control Panel (Dashboard), Ignition Security
System, Electronic Fuel Damping, Sintering process and Serigraphy process. Experienced
Kanban implementation, Heijunka box with Fiat Cia, FMEA process, Quality System and
Quality process improvement.
Jun/84 – Dec/96 NOVIK S.A. / SANTISTA TÊXTIL S/A / PYROZZAR LTDA – Time &
Methods Analyst
COURSES
Development Management – Fundação Dom Cabral
Green Belt - Flextronics – 160 hours
Shingijutsu - Flextronics – 2 weeks
OSHAS / TL9000 / C.G.M. / VDA.6
REFA – Study Method and Workforce
ISVOR Fiat - T.M.C. 2 (M.T.M.) / Value Stream Map
F. Vanzolini - F.M.E.A. / T.P.M
LPC – Cooperative and Participative Leadership

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Resume_Disnei Passoni

  • 1. 22/06/16 e-mail : pdisnei@gmail.com Disnei Roberto Passoni Production Engineer, Age 50 / Brazilian / Married / 2 sons Mobile: +55 11 99171-6180 / Home: +55 11 4029-2670 / e-mail: pdisnei@gmail.com skype: dispassoni / Linkedin: https://br.linkedin.com/in/disnei-passoni-70a43410 GOAL: Manufacturing - Engineering Management EDUCATION MBA – Industrial Management – FGV– Fundação Getúlio Vargas - 2005 Production Engineer Bachelor Degree – UNIMEP - 1996 Machines Design – FATEC – Faculdade Tecnológica de São Paulo - 1989 BACKGROUND ∴ Production Manager along last 10 years working for Taiwanese, North-American Semiconductor and Electro-Electronic Companies responsible to manufacture PCs Motherboards, Telecommunication Radio Base Boards (GSM & WCDMA technology) and Enclosure Cabinets (Mechanical Build, Paint and Assembly), Point of Sales, Printers, Personal Computers (Desktops/Notebooks/Tablets) and lately Electronic Components Packaging (DRAM/ eMMC/ eMCP/ MicroSD/ UFD) for PCs and smartphones application. Responsible in Semiconductors Packaging Memories for all steps from Wafer Preparation (Back Grinding, Laser Grooving and Wafer Saw), In Line area (Die Attach and Wire Bonders), Backend area (Molding, Ball Mounter and Singulation), Final Test (Sorter, Burn-In, Speed and Functional Tests), Final automated inspection and customized packing. Responsible in Enclosure for all processes from the Automated Punching, Bending, Pressing, Soldering (MIG/TIG), Automated Powder Coating, Final Assembly, Maintenance and Production Planning. Direct contribution to prepare annual Manufacturing Budget for top management approval (indirect materials, losses control, direct and indirect labor, operational expenditures). Budget monitoring and report in monthly basis for the top management. Strong experience in Industrial Capacity (Labor and Machines) analysis/management versus Sales demand and material availability, headcount capacity measurement & evaluation. ∴ Industrial & Process Engineer Manager along 6 years for Chinese, Brazilian-Japanese Companies responsible for New Process and New Technologies implementation, Industrial New Product Introduction, Continuous Improvement Process, Line Assembly Balance, Industrial Layout Organization, Industrial Plant Expansion, Industrial Maintenance, Lean Manufacturing Coordinator and Key Training Manager former, Quality Improvement Team, Teaching Lean Thinking and Key Project Leader, DFM assembly developer for new TVs. ∴ Industrial Manager along 1 year for Brazilian-Japanese Company, responsible and coordination for operational multidisciplinary team (IT, Quality, Maintenance, Engineering and Warehouse), Assembly computers and Tablets. ∴ Industrial & Process Engineer along 4 years for Italian and North-American Electro-Electronic auto parts Companies, responsible for process, Industrial Layout, Continuous Improvement, Standard Operational Process, Quality System Adherence, Quality Improvements, Operational Training, New Product Introduction and Method Standard. ∴ Time & Method & Process Technician along 12 years for Brazilian textile Company, define method and time measurement for head count evaluation, productivity and performance calculation by machine and workforce, industrial layout definition and process flow, direct and indirect workforce measurement.
  • 2. 22/06/16 e-mail : pdisnei@gmail.com ACCOMPLISHMENTS: • Production implementation and startup at Semiconductor industry very complexes IC Memory Packages eMMC 16GB and eMCP 4G4g/ 8G8g and 16G8g, responsible for end-to-end Wafer Preparation, Dice Assembly, Soldering Wiring, Molding, Singulation, Test, Automated Inspection and Packing area. • Yield improved 0,5% in DRAM IC memory eliminating US$ 500,000/year scrap. • Project, design, coordination and implementation of the industrial layout for a new automotive electronic factory built in Hortolândia city (10.500 m²). • Project, design, coordination and implementation of 5 new notebooks and netbooks assemble lines with 40% capacity increase and productivity. • Improvement process (productivity), engineering team achieved significant results with productivity and capacity, increased 43% on desktop assemblies and 21% on notebook assembly (direct labor). • New product implementation in automatic assembly line (SMT, manual assembly, tests, mechanical assembly and integration). • Training people in TPS concept/ Lean Thinking (VSM/SMED/Spaghetti/T&M/PDCA/5S/Kanban/…) • Coordination of 3 teams in Manaus/Salvador/Cajamar for full PCs Manufacturing Plant transferring from Salvador to Manaus accomplished according planned schedule and budget. • “U” cell implementation at PCs and Auto Panel System Lines providing cycle time reduction and increasing capacity and flexibility (Lean Production), process developing and transfer process implementation. • Strong knowledge for manpower sizing and equipment capacity loading evaluation, design POKA- YOKE tools and FMEA. • Head of project to improve cabinet integration processes, reducing required area from 300 m² to 120 m² with productivity increased from 40 cabinets/ day to 60 cabinets per day (2 shifts). LANGUAGE English = good conversation, reading and writing capalitie PROFESSIONAL BACKGROUND Feb/14 – Dec/15 SMART MODULAR TECHNOLOGY – PCBA Modules & Semicon Division Sr Production Manager North American Company, technology leader in design, development and deployment of memories products (Integrated Circuits, SSD and Modules). Responsible for full Semiconductor (Packaging) Production, 120 direct employees and 14 indirect (Supervisors, Leaders, Production Programmer and Indirect Material Controller), operation 24h per day (3 shifts) and 6 days per week. Oct/11 – Jan/14 SEMP TOSHIBA – STA & STI Division Process Engineer Manager Brazilian-Japanese Electronics Products Company (TVs, PCs, Audio System, DVD and Mobile). Responsible for New Technologies and New Processes Introduction in Manaus and Salvador Plants. In 2013 also, responsible for the Salvador Plant with 220 employees to assembly notebooks, desktops and Tablets with multidisciplinary team (Engineering, IT, Quality, Warehouse, Production Planning, Maintenance and Manufacturing). Responsible to coordinate full site transference from Salvador to Manaus. Responsible to provide training to Managers, Supervisors and Engineers in Lean Thinking / Lean Manufacturing System.
  • 3. 22/06/16 e-mail : pdisnei@gmail.com Feb/09 – Sep/11 FOXCONN – HP Customer Division (Jundiai) Operational Excellence Manager Chinese Electronic Manufacturing Services Company to produce, Personal Computers. Responsible for Process and Industrial Engineering at the Business Unit dedicated to produce PCs to HP customer, managing 8 engineers and 12 Technicians of Process and Maintenance. Developed and implemented 5 new lines (Straight Line) with productivity increasing 43% in desktops and 21% in notebooks, 50% capacity improvement. Jan/07 – Dec/08 FLEXTRONICS – Infrastructure Division Production Manager North American Electronic Manufacturing Services Company, assembly Infrastructure for Large Telecommunications Companies (Ericsson and Huawei). Responsible for Electronic Boards Assembly and Enclosure Cabinets Assembly, direct team with 180 employees, 3 Supervisors and 5 Leaders. Head of the project in Shingijutsu week for capacity increase in Cabinets Assembly with reduction area from 300m² to 120m² and 50% throughput rate increase. Oct/00 – Jan/07 SANMINA-SCI – Electronic Division Production Manager North American Electronic Manufacturing Services Company to assemble electronic boards and products like Computers, Servers, Printers, Intelligent Cards, Point of Sales Terminals, Satellite Receivers, Telecommunication boards (GSM and WCDMA) and Radio Base Station for mobile telecommunications. First company to implement full Lead Free soldering process in Brazil. Responsible to implement strong SMT monitoring process resulting 60% SMT performance increase (utilization capacity). Managing 400 direct employees with Supervisors, Leaders, Production Planning and Indirect Material Controller working 24h/day and 6 days/week. Jan/00 – Sep/00 MOTOROLA INDL – Mobile Division Sr Process Engineer North American Electronic Telecommunication Company to assemble mobile telephones. Responsible for full SMT process for CDMA Boards with both pick & placers FUJI and SIEMENS platforms. Jan/97 – Dec/99 MAGNETI MARELLI – Electronic System Division Process and Method Engineer Italian Electronic Auto Parts, responsible for processes and methods for assembly Boards and Final assembly of automotive products like Control Panel (Dashboard), Ignition Security System, Electronic Fuel Damping, Sintering process and Serigraphy process. Experienced Kanban implementation, Heijunka box with Fiat Cia, FMEA process, Quality System and Quality process improvement. Jun/84 – Dec/96 NOVIK S.A. / SANTISTA TÊXTIL S/A / PYROZZAR LTDA – Time & Methods Analyst COURSES Development Management – Fundação Dom Cabral Green Belt - Flextronics – 160 hours Shingijutsu - Flextronics – 2 weeks OSHAS / TL9000 / C.G.M. / VDA.6 REFA – Study Method and Workforce ISVOR Fiat - T.M.C. 2 (M.T.M.) / Value Stream Map F. Vanzolini - F.M.E.A. / T.P.M LPC – Cooperative and Participative Leadership