During the CXL Forum at OCP Global Summit, Intel engineer Bhushan Chitlur explains how active memory works and provides and overview of Intel's solution for disaggregated memory tiering.
2. Exploring Heterogenous Memory Tiers
to Improve Performance and Lower
TCO
CXL Enabled Heterogeneous Active Memory
Tiering
3. Application’s use less memory than what is allocated to them
Background : The Datacenter Memory
Conundrum
Low Perf,
Low Cost,
High Capacity
Improve TCO by effective use of heterogenous Memory Tiers
Hot Pages
Cold
Pages
Warm
Pages
Best Perf,
High Cost,
Low Capacity
Credit - https://www.pdl.cmu.edu/ftp/NVM/tmo_asplos22.pdf
Cost of memory, compressed memory, and SSDs as a percentage of
compute infrastructure across hardware generations
8. • The time is right to explore Heterogenous memory tiering
• FPGAs are very well suited to support the varied requirements of active tiering
• Portfolio of technologies required for active tiering are available to build scalable
solutions
• Check out the Demo “Improve System Performance by Offloading Memory-Intensive
Kernel Features to CXL Type-2 Device” in Experience Center
Where to find additional information
• Intel Agilex® 7 FPGA I-Series FPGA Development Kit
https://www.intel.com/content/www/us/en/products/details/fpga/development-kits/agilex/agi027.html
• Intel CXL IP
https://www.intel.com/content/www/us/en/products/details/fpga/intellectual-property/interface-
protocols/cxl-ip.html
• Intel’s CXL products and solutions, contact, Pekon Gupta (pekon.gupta@intel.com)
Call to Action
11. [TRACK NAME]
• Sustainability
• Special Focus: Deployments
• Special Focus: Optical Connectivity
for AI Clusters
• Special Focus: Quantum
• Special Focus: Sustainable
Computational Infrastructure for AI
• TAP (Time Appliances Project)
• CE (Cooling Environments)
• Data Center Facilities (DCF) and Rack &
Power
• Edge
• Hardware Management with DC-SCM
• Networking
• Open System Firmware (OSF)
• Security
• Server
• Server: Composable Memory Systems
• Server: Open Chiplet Economy
• Storage
12. SERVER
NETWORKING STORAGE
DC FACILITIES HW MGMT
SECURITY
OPEN SYS FW
TIME
APPLIANCES
COOLING ENV
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SUSTAINABILI
TY
RACK &
POWER
TELCO
AI OPTICS
OPEN
CHIPLET
CMS
DEPLOYMENT
S
13. Click here to review OCP Trademark
Guidelines.
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