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RADIATION HARDENED CHIPS
INTRODUCTION ,[object Object],[object Object],[object Object]
Problems caused by radiation   ,[object Object],[object Object],[object Object]
Major radiation damage sources   ,[object Object]
[object Object],[object Object]
[object Object],[object Object]
[object Object],[object Object]
Radiation effects on electronics   ,[object Object],[object Object]
[object Object],The effects can vary wildly depending on all the parameters - the type of radiation, total dose and the radiation flux, combination of types of radiation, and even the kind of the device load (operating frequency, operating voltage, actual state of the transistor during the instant it is struck by the particle)
Resultant Effects The "end-user" effects can be characterized in several groups :   ,[object Object],[object Object]
[object Object],[object Object]
[object Object],[object Object]
[object Object],[object Object]
[object Object],[object Object]
SEE Testing   ,[object Object]
    Radiation-hardening techniques   ,[object Object],[object Object],[object Object]
[object Object],[object Object]
[object Object],[object Object],[object Object]
[object Object],[object Object]
Nuclear hardness for telecommunication   In ,  telecommunication  the term  nuclear hardness  has the following meanings: 1.    An expression of the extent to which the performance of a system, facility, or device is expected to degrade in a given nuclear environment. 2.The physical attributes of a system or electronic component that will allow survival in an environment that includes nuclear radiation and electromagnetic pulse(EMP)
Radiation hardened chips are made by two methods              Radiation hardening by process (RHBP)            Radiation hardening by design (RHBD).    It has been demonstrated that RHBD techniques can provide immunity from total-dose and single-event effects in commercially produced circuits
Radiation Hardened Technology   A normal computer unless given proper shielding will not be able to work properly. Thus special types of chips- rad hard chips are used .     Rad Hard Electronics   It's an engineering challenge to develop space chips that perform many sensitive, vital functions while being robust enough to performing under severe conditions.
Rad-Hard SOI Process   Hardening" is realized through specific controls and patented process steps to minimize effects of radiation.   No Latchup  - SOI inherently eliminates latchup, which can occur in CMOS devices due to a parasitic condition in which at least one pnp junction Hardened Buried Oxide and Trench Isolation  - Rad-hard devices require hardening of the buried oxide and trench isolation to reduce charge induced by gamma rays
ADVANTAGES ,[object Object],[object Object],[object Object]
APPLICATIONS ,[object Object],[object Object],[object Object],[object Object]
CONCLUSION ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
REFERENCE ,[object Object],[object Object],[object Object],[object Object],[object Object]
THANK YOU

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RADIATION HARDENED CHIPS

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  • 20. Nuclear hardness for telecommunication In , telecommunication the term  nuclear hardness  has the following meanings: 1.   An expression of the extent to which the performance of a system, facility, or device is expected to degrade in a given nuclear environment. 2.The physical attributes of a system or electronic component that will allow survival in an environment that includes nuclear radiation and electromagnetic pulse(EMP)
  • 21. Radiation hardened chips are made by two methods           Radiation hardening by process (RHBP)          Radiation hardening by design (RHBD).   It has been demonstrated that RHBD techniques can provide immunity from total-dose and single-event effects in commercially produced circuits
  • 22. Radiation Hardened Technology A normal computer unless given proper shielding will not be able to work properly. Thus special types of chips- rad hard chips are used .     Rad Hard Electronics   It's an engineering challenge to develop space chips that perform many sensitive, vital functions while being robust enough to performing under severe conditions.
  • 23. Rad-Hard SOI Process Hardening" is realized through specific controls and patented process steps to minimize effects of radiation.   No Latchup  - SOI inherently eliminates latchup, which can occur in CMOS devices due to a parasitic condition in which at least one pnp junction Hardened Buried Oxide and Trench Isolation  - Rad-hard devices require hardening of the buried oxide and trench isolation to reduce charge induced by gamma rays
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