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CNTFET
By
Sushmita Dandeliya
2014PIT108
Contents
Setbacks of MOSFETs
Introduction to CNTFETs
CNTFET working
Important aspects of CNTFET
Effect of diameter variation
Conclusion
Future Work
Setbacks of MOSFETs
• A MOSFET is a
• semiconductor device,
• most commonly used in the field of
VLSI Design, and
Power electronics.
• The scaling of MOSFET has been the driving force
towards the technological advancement, But
Continuous scaling include
– short channel effects
– high leakage current
– excessive process variation and
– reliability issues.
Impact of nanotechnology with time
Why CNTFET?
• As the size becomes smaller, scaling the silicon MOSFET
becomes harder.
• Requirement of high performance channel material.
• Mobility enhancement technology requirement.
Advantage of using CNTFET
 1-D ballistic transport of electrons and holes.
 High drive current and large transconductance.
 High temperature resilience and strong covalent bond.
CNT: The ideal transistor Material
• Carbon nanotubes (CNTs) were
discovered by Ijima in Japan in
1991.
• CNTs can be thought as rolled
up sheets of graphene.
• Electrical properties depends on
chirality or the direction of this
distortion.
• CNTs can be metallic or
semiconducting depending on
the chirality. Fig.1: Strip of grapheme sheet rolled up
into tube
Continued…
C= na1 +ma2
n, m = chirality parameter
a1 = a ( 3, 0)
a2 = a (
√3
2
,
√3
2
)
Where a= 0.142 Å bond length between two carbon atoms.
If n=m structure is armchair
If n or m-0 structure is zigzag
Nanotube diameter and chiral angles are given as
𝑑𝑡 =
√3𝑎𝑐−𝑐 𝑚2 + 𝑚𝑛 + 𝑛2
𝜋
𝜃 = tan−1
√3𝑛
2𝑚 + 𝑛
CNTFET Type
• Based on geometry
 Top Gate
 Bottom Gate
 Coaxial Gate
• Based on operation
 Schottky barrier
 MOSFET
Bottom gate CNTFET
• The first CNTFET was fabricated in 1998. These were simple
devices fabricated by depositing single-wall CNTs (synthesized
by laser ablation) from solution onto oxidized Si wafers which
had been prepatterned with gold or platinum electrodes.
• The devices displayed high on-state resistance of several MQ,
low transconductance (-1,,,) and no current saturation, and
they required high gate voltages (several volts) to turn them
on.
Top gate CNTFET
• The next generation of CNFET came in top-gated structure to
improve the device performance.
• This structure gives better out-turn than early structure. The
improvement comes from the scaling of the dimension and
the adoption of better device geometry as well as the device
performance .
Coaxial gate CNTFET
• Gate all around geometry.
• More electrostatic control over channel.
Working principle
• Basic principle operation of CNFET is the same as MOSFET
where electrons are supplied by source terminal and drain
terminal will collect these electrons .
• In other words, current is actually flowing from drain to
source terminal .
• Gate terminal controls current intensity in the transistor
channel and the transistor is in off state if no gate voltage is
applied.
SBCNTFET
• SB-CNFET works on the principle of direct tunneling through the Schottky
barrier at the source channel junction .
• The barrier width is controlled by the gate voltage and hence the
transconductance of the device depends on the gate voltage.
• At low gate bias, large barrier limits the current in the channel . As gate
bias is increased, it reduces the barrier width, which increases quantum
mechanical tunneling through the barrier , and therefore increases current
flow in transistor channel.
• In SBCNFET, the transistor action occurs by modulating the transmission
coefficient of the device.
MOSFET like CNTFET
• The structure of this device is slightly different than SB-CNFET since it used
heavily doped terminals instead of metal.
• This device is formed in order to overcome problems in SB-CNFET by
operating like normal MOSFET.
• This device operates on the principle of modulation the barrier height by
gate voltage application. The drain current is controlled by number of
charge that is induced in the channel by gate terminal.
How CNTFET works?
• Operation of CNTFET compared with Si-MOSFET
Continued….
Id/Vds curve
MOSFET CNTFET
Gc 5uF/cm2 2.4uF/cm2
Id 500uA/um 1500
uA/um
Mobility 7x10^6 cm/s 3.5x10^6 cm/s
Thermal velocity - 2 times of mosfet

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Carbon nanotube based Field Effect Transistor

  • 2. Contents Setbacks of MOSFETs Introduction to CNTFETs CNTFET working Important aspects of CNTFET Effect of diameter variation Conclusion Future Work
  • 3. Setbacks of MOSFETs • A MOSFET is a • semiconductor device, • most commonly used in the field of VLSI Design, and Power electronics. • The scaling of MOSFET has been the driving force towards the technological advancement, But Continuous scaling include – short channel effects – high leakage current – excessive process variation and – reliability issues.
  • 5. Why CNTFET? • As the size becomes smaller, scaling the silicon MOSFET becomes harder. • Requirement of high performance channel material. • Mobility enhancement technology requirement. Advantage of using CNTFET  1-D ballistic transport of electrons and holes.  High drive current and large transconductance.  High temperature resilience and strong covalent bond.
  • 6. CNT: The ideal transistor Material • Carbon nanotubes (CNTs) were discovered by Ijima in Japan in 1991. • CNTs can be thought as rolled up sheets of graphene. • Electrical properties depends on chirality or the direction of this distortion. • CNTs can be metallic or semiconducting depending on the chirality. Fig.1: Strip of grapheme sheet rolled up into tube
  • 7. Continued… C= na1 +ma2 n, m = chirality parameter a1 = a ( 3, 0) a2 = a ( √3 2 , √3 2 ) Where a= 0.142 Å bond length between two carbon atoms. If n=m structure is armchair If n or m-0 structure is zigzag Nanotube diameter and chiral angles are given as 𝑑𝑡 = √3𝑎𝑐−𝑐 𝑚2 + 𝑚𝑛 + 𝑛2 𝜋 𝜃 = tan−1 √3𝑛 2𝑚 + 𝑛
  • 8. CNTFET Type • Based on geometry  Top Gate  Bottom Gate  Coaxial Gate • Based on operation  Schottky barrier  MOSFET
  • 9. Bottom gate CNTFET • The first CNTFET was fabricated in 1998. These were simple devices fabricated by depositing single-wall CNTs (synthesized by laser ablation) from solution onto oxidized Si wafers which had been prepatterned with gold or platinum electrodes. • The devices displayed high on-state resistance of several MQ, low transconductance (-1,,,) and no current saturation, and they required high gate voltages (several volts) to turn them on.
  • 10. Top gate CNTFET • The next generation of CNFET came in top-gated structure to improve the device performance. • This structure gives better out-turn than early structure. The improvement comes from the scaling of the dimension and the adoption of better device geometry as well as the device performance .
  • 11. Coaxial gate CNTFET • Gate all around geometry. • More electrostatic control over channel.
  • 12. Working principle • Basic principle operation of CNFET is the same as MOSFET where electrons are supplied by source terminal and drain terminal will collect these electrons . • In other words, current is actually flowing from drain to source terminal . • Gate terminal controls current intensity in the transistor channel and the transistor is in off state if no gate voltage is applied.
  • 13. SBCNTFET • SB-CNFET works on the principle of direct tunneling through the Schottky barrier at the source channel junction . • The barrier width is controlled by the gate voltage and hence the transconductance of the device depends on the gate voltage. • At low gate bias, large barrier limits the current in the channel . As gate bias is increased, it reduces the barrier width, which increases quantum mechanical tunneling through the barrier , and therefore increases current flow in transistor channel. • In SBCNFET, the transistor action occurs by modulating the transmission coefficient of the device.
  • 14. MOSFET like CNTFET • The structure of this device is slightly different than SB-CNFET since it used heavily doped terminals instead of metal. • This device is formed in order to overcome problems in SB-CNFET by operating like normal MOSFET. • This device operates on the principle of modulation the barrier height by gate voltage application. The drain current is controlled by number of charge that is induced in the channel by gate terminal.
  • 15. How CNTFET works? • Operation of CNTFET compared with Si-MOSFET
  • 18.
  • 19. MOSFET CNTFET Gc 5uF/cm2 2.4uF/cm2 Id 500uA/um 1500 uA/um Mobility 7x10^6 cm/s 3.5x10^6 cm/s Thermal velocity - 2 times of mosfet