Introduction to IC

1. Introduction to Integrated Circuit
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Presented By
Y. Sravan Kumar, M.Tech, (Ph.D.)
Assistant Professor

2. Introduction to Integrated Circuit
What is an Integrated Circuit ?
 One or More Transistors along with passive components are
fabricated on a single silicon chip is know as Integrated
Circuit (IC).
 Integrated circuits are usually called ICs or chips.
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3. Introduction to Integrated Circuit
• Different Types of IC Packages
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4. Introduction to Integrated Circuit
• Evolution of logic complexity in IC
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Year Technology No. of
transistors
Example
1947-1950 Transistor 1 -
1951 -1960 Discrete Component 1 FET, Diode
1961 -1966 SSI
- Small scale integration
10 Logic Gates, Flip-flop
1967-1971 MSI
- Medium scale integration
100 – 1000 Counter, Multiplexer
1972-1980 LSI
- Large scale integration
1000 – 20,000 RAM, Microprocessor
1981 -1990 VLSI
- Very large scale integration
20,000 –
1,000,000
16 bits and 32 bits
Microprocessor
1990-2000 ULSI
- Ultra large scale integration
1,000,000 –
10,000,000
Graphic microprocessor
2000 -
nowadays
GSI
- Giga scale integration
> 10,000,000 -

5. MOSFET TECHNOLOGY
• MOSFET transistor was first proposed and patented by Lilienfeld
(Canada) in 1925 and Heil (England) in 1935.
• The devices was not successfully demonstrated for several years
but only became important in mid and late 1960s.
• Initially semiconductor research had focussed in developing the
bipolar transistor, because they have problems in fabricating
MOSFETs, particularly with the insulating oxide layers.
• Now the technology is one of the most widely used
semiconductor techniques and become one of the principle
elements in integrated circuit technology today.
• Their performance has enabled power consumptions in ICs to be
reduced and enabled the portable gadgets to become a reality.
• As a result of this the MOSFET is the most widely used form of
transistor in existence today.
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6. Moore’s Law
•In 1965, Gordon Moore (Co-Founder of
Intel) predicted that the number of
transistors per chip will grow exponentially
with time.
•He predicted that :
 the transistor density will double
every 18-24 months
the chip performance will double
every 18-24 months
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7. Moore’s Law
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1965: Cost vs time Moore’s law 1960-1975

8. Moore’s Law
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9.  Fan-out – number of load gates
connected to the output of the
driving gate.
o gates with large fan-out are slower
 Fan-in – the number of inputs to
the gate.
o gates with large fan-in are bigger
and slower
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10. Performance
• The performance of a digital circuit is
expressed by the propagation delay and
the power consumption of a gate.
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11. •The propagation delay, tp of a gate defines
how quickly it responds to a change at its
input(s).
• It expresses the delay experienced by a
signal when passing through a gate.
• It is measured between the
50% transition points of the
input and output waveforms.
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14. • Power consumption: how much energy is consumed
per operation and how much heat the circuit dissipates.
– supply line sizing (determined by peak power)
Ppeak = Vdd ipeak
– battery lifetime (determined by average power dissipation)
p(t) = v(t)i(t) = Vddi(t)
Pavg= 1/T ∫ p(t) dt = Vdd/T ∫ idd(t) dt
– packaging and cooling requirements
• Two important components: static and dynamic
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15. • Propagation delay and the power consumption of a
gate are related – when a gate operates at high
speed, it will consume more power.
speed , propagation delay , power consumption
• Propagation delay is (mostly) determined by the
speed at which a given amount of energy can be
stored on the gate capacitors.
– the faster the energy transfer (higher power dissipation) the
faster the gate.
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