2. UECC007 - LIC Course Contents
Unit 1 - Basics Of Operational Amplifiers
Unit 2 - Applications Of Operational Amplifiers
Unit 3 - Analog multiplier and PLL
Unit 4 - Analog to Digital and Digital to Analog
Converters
Unit 5 - Waveform Generators And Special Function
ICs
3. UECC007 - LIC Course Contents
List of Laboratory Experiments
1. Design, simulation and testing of inverting, non-inverting
and differential amplifiers, integrator, differentiator and
Schmitt trigger using op-amp.
2. Determination of frequency response of op-amp.
3. Design, simulation and testing of active filters using op-
amp.
4. Design, simulation and testing of Astable and Monostable
multivibrators using NE555 Timer.
5. DC power supply using LM317 and LM723.
6. PLL characteristics and its use as Frequency Multiplier.
7. Simulation of D/A and A/D converters (successive
approximation) using PSPICE and TINA simulator tool.
4. 1.Roy Choudary D. and Shail B. Jain, “Linear Integrated
circuits”, Fourth Edition, New Age International
Publishers, 2011.
2. Ramakant A. Gayakward, “Op-Amps and Linear
Integrated Circuits”, Fourth Edition, PHI, 2010.
3. Sergio Franco, “Design With Operational Amplifier And
Analog Integrated Circuits”, Fourth Edition, TMH, 2011.
4. William D. Stanely, “Operational Amplifiers with Linear
Integrated Circuits”, Pearson Education, 2004.
5. Gray and Meyer, “Analysis and Design of Analog
Integrated Circuits”, Wiley International, 5th edition 2009.
Reference
s:
5. What is a Discrete Circuit
Normally bipolar junction transistors, diodes
and field effect transistors are commonly used
electronics component in electronic circuit.
These components are interconnected along
with required resistors and capacitors to form
an electronic circuit. This type of circuit is
known as discrete circuit as each of the
components can be separated from the circuit
as when required.
6. What is an Integrated Circuit
Electronic circuit which are permanently
fabricated on a semiconductor wafer numbers
using diodes, transistors and capacitors etc.
As the components in this type of electronic
circuit are not separable that is integrated on
the semiconductor wafer, this circuit is
commonly referred as Integrated Circuit.
IC is also popularly known as chip or
microchip.
7. Def: The “Integrated Circuit “ or IC is a miniature, low
cost electronic circuit consisting of active and passive
components that are irreparably joined together on a
single crystal chip of silicon.
In 1958 Jack Kilby of Texas Instruments invented first IC
Integrated Circuit
9. Small size
Low cost
Less weight
Low supply voltages
Low power consumption
Highly reliable
Matched devices
Fast speed
Advantages:
10. Disadvantages
Because of its small size, IC is unable to
dissipate heat in required rate when current in
it increased. That is why ICs are often
damaged due to over current flowing through
them.
Inductors and Transformers cannot be
incorporated in ICs.
11. Types of Integrated Circuits
Analog IC
In this type of ICs, the input and output both signals
are continuous. The output signal level depends upon
the input signal level and the output signal level is a
linear function of input signal level.
Digital IC
The logic Gates, such as AND gate, OR gate, NAND
gate, XOR gate, flip flops, counters; microprocessors
are some well-known examples of digital ICs. These
ICs operate with binary data such as either 0 or 1.
Normally in digital circuit, 0 indicates 0 V and one
indicate +5 V
12. Classification of ICs based on
Manufacturing Process
Pn junction
isolation
Hybrid circuits
Integrated circuits
Dielectric
isolation
Monolithic circuits
Bipolar Uni polar
MOSFET JFET
Classification of ICs
Thick
&Thin film
13. Chip size and Complexity
Invention of Transistor (Ge) - 1947
Development of Silicon - 1955-1959
Silicon Planar Technology - 1959
First ICs, SSI (3- 30gates/chip) - 1960
MSI ( 30-300 gates/chip) - 1965-1970
LSI ( 300-3000 gates/chip) -1970-1975
VLSI (More than 3k gates/chip) - 1975
ULSI (more than one million active devices are integrated on single
chip)
14. SSI MSI LSI VLSI ULSI
< 100 active
devices
100-1000
active
devices
1000-
100000
active
devices
>100000
active
devices
Over 1
million
active
devices
Integrated
resistors,
diodes &
BJT’s
BJT’s and
Enhanced
MOSFETS
MOSFETS 8bit, 16bit
Microproces
sors
Pentium
Microproces
sors
16. Metal can Packages
The metal sealing plane is at the bottom over
which the chip is bounded
It is also called transistor pack
17. Dual-in-line Package
The chip is mounted inside a plastic or
ceramic case
The 8 pin Dip is called MiniDIP and also
available with 12, 14, 16, 20pins
18. Flat pack
The chip is enclosed in a rectangular ceramic
case
19. The metal can (TO)
Package
The Dual-in-Line (DIP)
Package
The Flat Package
Packages
20. Factors affecting selection of IC package
Relative cost
Reliability
Weight of the package
Ease of fabrication
Power to be dissipated
Need of external heat sink
21. Temperature Ranges
1. Military temperature range : -55o C to +125o C (-55o C to
+85o C)
2. Industrial temperature range: -20o C to +85o C (-40o C to
+85o C )
3. Commercial temperature range: 0o C to +70o C (0o C to +75o
C )
22. Manufacturer’s Designation for Linear ICs
Fairchild - µA, µAF
National Semiconductor - LM,LH,LF,TBA
Motorola - MC,MFC
RCA - CA,CD
Texas Instruments - SN
Signetics - N/S,NE/SE
Burr- Brown - BB
23. What is Linear Integrated
Circuit
A linear integrated circuit (linear IC) is a solid-
state analog device characterized by a
theoretically infinite number of possible
operating states. It operates over a continuous
range of input levels. In contrast, a digital IC
has a finite number of discrete input and
output states.
24. Types of Linear Integrated
Circuits
OP-amp
555 Timer
ADC
DAC
PLL
Power Supplies
Wave form generators and special function ICs
